Pot bottom temperature sensing device

Abstract

The utility model discloses a temperature sensing device at the bottom of a pot. The temperature sensing device comprises a support, a temperature sensor, a temperature sensing cover arranged at the upper end of the support in a sleeving mode and an elastic mechanism. Wherein the temperature sensing head of the temperature sensor is arranged in the temperature sensing cover, and the elastic force of the elastic mechanism enables the temperature sensing head of the temperature sensor to abut against the inner wall of the top of the temperature sensing cover. The temperature sensing device can measure the temperature of the bottom of the cooker, the temperature sensing head of the temperature sensing device is firm in installation and high in reliability, and effective contact can be kept, so that the detection precision and the response speed are improved.

Description

Technical Field

[0001] This utility model relates to the field of household appliance technology, specifically to a temperature sensing device for the bottom of a pot. Background Technology

[0002] Electric heating equipment, such as electric stoves, electric pressure cookers, rice cookers, and slow cookers, connects to a power source via an external cable. It utilizes external power to heat the heating element, and features simple structure, lightweight design, cleanliness, and high automation. With the continuous development and improvement of electric heating equipment, temperature sensors installed at the bottom of the pot can measure the temperature of the pot's bottom, allowing for temperature control during the cooking process.

[0003] Existing electric heating devices, such as the utility model patent with authorization publication number CN204427780U, disclose a heating plate assembly for an electric hot pot and an electric hot pot having the same. The heating plate assembly includes a heat-conducting plate and a temperature detection component. The heat-conducting plate is located below the bottom wall of the inner pot of the electric hot pot, and has a protrusion on the heat-conducting plate that is recessed away from the bottom wall of the inner pot, defining a cavity between the protrusion and the bottom wall of the inner pot. The temperature sensing end of the temperature detection component extends upward from the lower part of the heat-conducting plate into the cavity and contacts the bottom wall of the inner pot. The temperature detection component includes a housing, which defines a receiving space with an open lower end, and the upper end of the housing is configured as the temperature sensing end; and a temperature sensing element, one end of which extends into the receiving space and contacts the top wall of the receiving space. The above-mentioned heating plate assembly can make the temperature detected by the temperature sensing end closer to the actual temperature of the inner pot. However, the above-mentioned heating plate assembly still has the following shortcomings:

[0004] The temperature sensing component of the heating plate assembly is installed in the housing space. The temperature sensing component cannot be well fixed in the housing. When the temperature detection assembly is in use, the temperature sensing component is easy to fall out of the housing space or the temperature sensing component is displaced, resulting in poor contact with the housing, low detection accuracy, poor reliability and slow response speed. Utility Model Content

[0005] The purpose of this invention is to overcome the above-mentioned problems and provide a temperature sensing device for the bottom of a cookware. This device can measure the temperature of the bottom of the cookware. The temperature sensing head of the device is firmly installed, highly reliable, and can maintain effective contact, thereby improving the detection accuracy and response speed.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] A temperature sensing device for the bottom of a cookware includes a support, a temperature sensor, a temperature sensing cover fitted on the upper end of the support, and an elastic mechanism; wherein, the temperature sensing head of the temperature sensor is disposed inside the temperature sensing cover, and the elastic force of the elastic mechanism causes the temperature sensing head of the temperature sensor to press against the top inner wall of the temperature sensing cover.

[0008] The working principle of the temperature sensing device on the bottom of the aforementioned cookware is as follows:

[0009] During operation, the top outer wall (upper surface) of the temperature sensing cover is in direct contact with the bottom of the pot. The temperature of the pot bottom can be transferred to the temperature sensing cover, and the temperature sensor's sensing head detects the temperature of the temperature sensing cover, thus reflecting the temperature of the pot bottom. Under the elastic force of the elastic mechanism, the temperature sensor's sensing head is always in close contact with the top inner wall of the temperature sensing cover, making the sensing head firmly installed and highly reliable. This allows for effective contact between the sensing head and the temperature sensing cover, thereby improving detection accuracy and response speed.

[0010] In a preferred embodiment of this utility model, the elastic mechanism includes a compression spring and a pad assembly disposed inside the temperature sensing cover. The upper end of the compression spring acts on the pad assembly, and the lower end of the compression spring acts on the bracket. The compression spring is used to push the pad assembly to press the temperature sensor's sensing head against the top inner wall of the temperature sensing cover. Through the elastic force of the compression spring, the temperature sensor's sensing head is always pressed against the top inner wall of the temperature sensing cover. The pad assembly, acting as an intermediate component, pushes the temperature sensor's sensing head, making it easier for the compression spring to apply its elastic force to the pad assembly, facilitating the installation and connection of the compression spring. Since the temperature sensor's sensing head is a flexible structure, direct contact with the compression spring can easily cause deformation.

[0011] Preferably, the pad assembly includes an upper pad, a middle pad, and a lower pad arranged from top to bottom; the top of the temperature sensing cover has a downward-opening receiving cavity; the upper pad has a first vertical through hole communicating with the receiving cavity; a first gap is provided between the upper pad and the lower pad; a second gap is provided between the side wall of the middle pad and the support; a third gap is provided between the middle pad and the lower pad; and a second vertical through hole is provided on the lower pad; the first vertical through hole, the first gap, the second gap, the third gap, and the second vertical through hole are sequentially connected to form a wiring channel; the wire of the temperature sensor is arranged along the wiring channel, and the temperature sensing head is located in the receiving cavity and connected to the wire; the upper end of the compression spring acts on the lower pad. By setting three pads, namely the upper pad, the middle pad, and the lower pad, the wire of the temperature sensor can be well fixed, thereby ensuring that the temperature sensing head of the temperature sensor will not be displaced. Combined with the elastic force of the compression spring, the wire can be well fixed and the temperature sensing head can be pressed against the temperature sensing cover.

[0012] Preferably, the first vertical through hole is located in the middle of the upper pad, and the second vertical through hole is located in the middle of the lower pad. This is intended to create multiple bends in the wires of the temperature sensor along the wiring channel, effectively improving the installation stability of the wires, increasing the friction area, and providing a certain self-locking effect. Combined with the clamping action of the compression spring, this ensures a more stable and reliable installation of the temperature sensor head.

[0013] Preferably, the pad assembly includes an upper pad and a lower pad distributed vertically; the top of the temperature sensing cover has a downward-opening receiving cavity; a fourth gap communicating with the receiving cavity is provided between the side wall of the upper pad and the support; a fifth gap is provided between the upper pad and the lower pad; and a third vertical through hole is provided in the middle of the lower pad; the fourth gap, the fifth gap, and the third vertical through hole are connected to form a wiring channel; the wire of the temperature sensor is arranged along the wiring channel and extends into the receiving cavity; the temperature sensing head is located in the receiving cavity and connected to the wire; the upper end of the compression spring acts on the lower pad. By setting two pads, the upper and lower pads, the wire of the temperature sensor can be well fixed, forming a curved wiring method, thereby ensuring that the temperature sensing head of the temperature sensor will not shift. Combined with the elasticity of the compression spring, the wire can be well fixed and the temperature sensing head can be pressed against the temperature sensing cover.

[0014] Preferably, the pad assembly includes an upper pad and a lower pad distributed vertically; the top of the temperature sensing cover has a downward-opening receiving cavity; a fourth gap communicating with the receiving cavity is provided between the side wall of the upper pad and the bracket; a fifth gap is provided between the upper pad and the lower pad; and a third vertical through hole is provided in the middle of the lower pad; the fourth gap, the fifth gap, and the fifth gap are sequentially connected; there are two fourth gaps; the temperature sensor has two wires; both wires extend vertically upward together into the third vertical through hole, then bend horizontally towards each other into the fifth gap, then bend vertically upward separately into the two fourth gaps, and then bend horizontally towards each other into the receiving cavity and connect to the temperature sensing head. That is, the temperature sensing head is connected to two wires, and the routing of the two wires is symmetrical. This is to further ensure the stability of the wire connection; the multiple bends and symmetrical arrangement provide a certain self-locking effect, further improving the installation reliability of the temperature sensor.

[0015] Preferably, the bracket is a cross-shaped bracket, and the lower end of the cross-shaped bracket is provided with a positioning groove for fixing the wire of the temperature sensor; four spatial channels are formed on the cross-shaped bracket, and the wire of the temperature sensor is routed in one of the spatial channels. The purpose is that the cross-shaped bracket structure is simpler, saves materials, and thus saves costs; after the upper section of the temperature sensor wire is arranged along the routing channel, the lower section of the wire is routed along one of the spatial channels and then wound in the positioning groove; the positioning groove plays a positioning role for the wire, which can stably and reliably fix the wire on the bracket.

[0016] Preferably, the upper end of the bracket is provided with a mounting groove, and the compression spring is disposed in the mounting groove, wherein the lower end of the compression spring acts on the bottom of the mounting groove. By providing a mounting groove, the installation of the elastic mechanism is facilitated, thereby making the structure more compact; after the upper section of the temperature sensor wire is arranged along the wiring channel, the lower section of the wire passes through the mounting groove and then runs along one of the spatial channels.

[0017] Preferably, the lower end of the temperature sensing cover is connected to the bracket via a fastening structure. The fastening structure includes multiple fastening hooks at the lower end of the temperature sensing cover, a fastening step in the middle of the bracket connected to the fastening hooks, multiple slots at the lower end of the temperature sensing cover, and a limiting part in the middle of the bracket that engages with the slots. In this structure, the fastening hooks and fastening steps effectively fix the temperature sensing cover to the bracket. The fastening hooks and fastening steps are mainly used for vertical riveting of the temperature sensing cover. The limiting part extends into the slots, and the slots, in conjunction with the limiting part, enable circumferential positioning of the temperature sensing cover. This provides reliable constraint on all degrees of freedom of the temperature sensing cover, ensuring it is securely fixed to the bracket.

[0018] Preferably, the material of the temperature sensing cover is a high thermal conductivity material, including but not limited to aluminum, copper, or stainless steel. Aluminum, copper, and stainless steel are all high thermal conductivity materials, which can effectively transfer the temperature of the bottom of the pot to the temperature sensor.

[0019] Preferably, the materials of the bracket and the pad assembly are high-temperature resistant insulating materials, including but not limited to mica sheets or ceramics.

[0020] Preferably, the high-temperature resistant insulating material is mica sheet. Mica sheet material can withstand temperatures above 400℃, is low in cost, has good manufacturability, ensures insulation while also having good heat resistance, and can effectively prevent heat from the temperature sensing cover from being transferred to other components. It has the advantages of being inexpensive and easy to process.

[0021] Preferably, the temperature sensor is a thermocouple sensor; the wires of the temperature sensor are provided with a protective sleeve, the protective sleeve being resistant to high temperatures above 400°C, and its material is glass fiber. Thermocouple sensors have many advantages, such as simple structure, convenient manufacturing, wide measurement range, high accuracy, low inertia, and easy long-distance transmission of output signals.

[0022] Compared with the prior art, the present invention has the following advantages:

[0023] 1. In the temperature sensing device of this utility model, the temperature sensing head of the temperature sensor is always in close contact with the top inner wall of the temperature sensing cover under the elastic force of the elastic mechanism, so that the temperature sensing head is firmly installed and highly reliable, and can achieve effective contact between the temperature sensing head and the temperature sensing cover, thereby improving the detection accuracy and response speed.

[0024] 2. The temperature sensing device in this utility model uses the elastic force of the elastic mechanism to fix the temperature sensor, which solves the problem that the parts will deform if riveting is used for fixing during the manufacturing process. The temperature sensing device of this utility model adopts an elastic mechanism, which makes the temperature sensing device have the characteristic of floating and is very easy to install. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the first specific embodiment of a temperature sensing device for the bottom of a cookware according to the present invention.

[0026] Figure 2 This is a three-dimensional structural diagram of a temperature sensing device for the bottom of a cookware according to the present invention, which omits the temperature sensor.

[0027] Figure 3 This is a cross-sectional view of a cookware bottom temperature sensing device in this utility model, omitting the temperature sensor.

[0028] Figure 4 This is a partial cross-sectional view of a temperature sensing device for the bottom of a cookware according to the present invention, omitting the temperature sensor.

[0029] Figure 5 This is an exploded view of a temperature sensing device for the bottom of a cookware according to this utility model.

[0030] Figure 6 This is a cross-sectional view of the bracket and temperature sensing cover in this utility model.

[0031] Figure 7 This is a three-dimensional structural diagram of a temperature sensing device for the bottom of a cookware according to the present invention, omitting the temperature sensing cover and some temperature sensors.

[0032] Figure 8 This is a partial cross-sectional view of a second specific embodiment of a temperature sensing device for the bottom of a cookware according to the present invention.

[0033] Figure 9 This is a partial cross-sectional view of a third specific embodiment of a temperature sensing device for the bottom of a cookware according to the present invention. Detailed Implementation

[0034] To enable those skilled in the art to fully understand the technical solution of this utility model, the present utility model will be further described below in conjunction with the embodiments and accompanying drawings, but the implementation of this utility model is not limited thereto.

[0035] Example 1

[0036] See Figures 1-7 This embodiment discloses a temperature sensing device for the bottom of a cookware, including a support 1, a temperature sensor 2, a temperature sensing cover 3 sleeved on the upper end of the support 1, and an elastic mechanism; wherein, the temperature sensor 2 includes a wire 2-2 and a temperature sensing head 2-1 connected to the wire 2-2; the temperature sensing head 2-1 of the temperature sensor 2 is disposed inside the temperature sensing cover 3, and the elastic force of the elastic mechanism causes the temperature sensing head 2-1 of the temperature sensor 2 to press against the top inner wall (lower surface) of the temperature sensing cover 3.

[0037] See Figures 1-7 The elastic mechanism includes a compression spring 4 and a pad assembly 5 disposed inside the temperature sensing cover 3. The upper end of the compression spring 4 acts on the pad assembly 5, and the lower end of the compression spring 4 acts on the bracket 1. The compression spring 4 is used to push the pad assembly 5 to press the temperature sensing head 2-1 of the temperature sensor 2 against the top inner wall of the temperature sensing cover 3. Through the elastic force of the compression spring 4, the temperature sensing head 2-1 of the temperature sensor 2 can always be pressed against the top inner wall of the temperature sensing cover 3. By using the pad assembly 5 as an intermediate component to push the temperature sensing head 2-1 of the temperature sensor 2, it is easier for the compression spring 4 to apply its elastic force to the pad assembly 5, which facilitates the installation and connection of the compression spring 4. Since the temperature sensing head 2-1 of the temperature sensor 2 is a soft structure, it is easy to deform if it comes into direct contact with the compression spring 4.

[0038] See Figures 1-7The pad assembly 5 includes an upper pad 51, a middle pad 52, and a lower pad 53 arranged from top to bottom; the top of the temperature sensing cover 3 is provided with a downward-opening receiving cavity 6; the upper pad 51 is provided with a first vertical through hole 7 communicating with the receiving cavity 6; a first gap 8 is provided between the upper pad 51 and the lower pad 53; a second gap 9 is provided between the side wall of the middle pad 52 and the bracket 1; a third gap 10 is provided between the middle pad 52 and the lower pad 53; and a second vertical through hole 11 is provided on the lower pad 53; the first vertical through hole 7, the first gap 8, the second gap 9, the third gap 10, and the second vertical through hole 11 are sequentially connected to form a wiring channel; the wire 2-2 of the temperature sensor 2 is arranged along the wiring channel; the temperature sensing head 2-1 is located in the receiving cavity 6 and connected to the wire 2-2; and the upper end of the compression spring 4 acts on the lower pad 53. By setting three pads—upper pad 51, middle pad 52, and lower pad 53—the wire 2-2 of the temperature sensor 2 can be securely fixed, thus ensuring that the temperature sensing head 2-1 of the temperature sensor 2 will not shift. Combined with the elastic force of the compression spring 4, the wire 2-2 can be firmly fixed, and the temperature sensing head 2-1 is pressed against the temperature sensing cover 3. Specifically, the wire 2-2 extends vertically upward into the second vertical through hole 11, bends horizontally after reaching the third gap 10, then bends vertically upward into the second gap 9, then bends horizontally into the first gap 8, and finally bends vertically downward into the first vertical through hole 7, connecting with the temperature sensing head 2-1 located in the receiving cavity 6.

[0039] See Figures 1-7 The first vertical through hole 7 is located in the middle of the upper pad 51, and the second vertical through hole 11 is located in the middle of the lower pad 53. The purpose is to create multiple bends in the wire 2-2 of the temperature sensor 2 along the wiring channel, effectively improving the installation stability of the wire 2-2 of the temperature sensor 2, increasing the friction area, and achieving a certain self-locking effect. Combined with the clamping action of the compression spring 4, this ensures a more stable and reliable installation of the temperature sensor head 2-1.

[0040] See Figures 1-7After the upper section of the wire 2-2 of the temperature sensor 2 is arranged along the wiring channel, the lower section of the wire runs along the side of the bracket 1 and is then wrapped around the lower end of the bracket 1. Specifically, the bracket 1 is a cross-shaped bracket, and the lower end of the cross-shaped bracket is provided with a positioning groove 18 for fixing the wire 2-2 of the temperature sensor 2; four spatial channels are formed on the cross-shaped bracket, and the wire 2-2 of the temperature sensor 2 runs in one of the spatial channels. The purpose is that the cross-shaped bracket structure is simpler, saves materials, and thus saves costs; after the upper section of the wire 2-2 of the temperature sensor 2 is arranged along the wiring channel, the lower section of the wire 2-2 runs along one of the spatial channels and is then wrapped around the positioning groove 18; the positioning groove 18 plays a positioning role for the wire 2-2, which can stably and reliably fix the wire 2-2 on the bracket 1.

[0041] See Figures 1-7 The upper pad 51, middle pad 52 and lower pad 53 are each provided with four U-shaped grooves 17. The four U-shaped grooves 17 are installed in conjunction with the cross-shaped bracket. The purpose is to play a certain positioning and guiding role for the upper pad 51, middle pad 52 and lower pad 53, and to ensure the stability of the connection between the upper pad 51, middle pad 52 and lower pad 53.

[0042] See Figures 1-7 The upper end of the bracket 1 is provided with a mounting groove 1-1, and the compression spring 4 is disposed in the mounting groove 1-1, wherein the lower end of the compression spring 4 acts on the bottom of the mounting groove 1-1. By providing the mounting groove 1-1, the installation of the elastic mechanism is facilitated, thereby making the structure more compact. After the upper section of the wire 2-2 of the temperature sensor 2 is arranged along the wiring channel, the lower section of the wire 2-2 passes through the mounting groove 1-1 and runs along one of the spatial channels. The space between the side wall of the middle pad 52 and the side wall of the mounting groove 1-1 forms the second gap 9.

[0043] See Figures 1-7 The lower end of the temperature sensing cover 3 is connected to the bracket 1 via a fastening structure. This fastening structure includes multiple fastening hooks 12 at the lower end of the temperature sensing cover 3, a fastening step 13 in the middle of the bracket 1 connected to the fastening hooks 12, multiple slots 19 at the lower end of the temperature sensing cover, and a limiting part 20 in the middle of the bracket that engages with the slots 19. In this structure, the fastening hooks 12, in conjunction with the fastening step 13, effectively fix the temperature sensing cover 3 to the bracket 1. The fastening hooks 1-2, in conjunction with the fastening step 13, are mainly used for vertical riveting and fixing of the temperature sensing cover 3. The limiting part 20 extends into the slots 19, and the slots 19, in conjunction with the limiting part 20, enable circumferential positioning of the temperature sensing cover 3. This provides reliable constraint on all degrees of freedom of the temperature sensing cover 3, ensuring that the temperature sensing cover 3 is securely fixed to the bracket 1.

[0044] See Figures 1-7 In this embodiment, there are two snap-fit ​​hooks 12 and two corresponding snap-fit ​​steps 13. The two snap-fit ​​hooks 12 are arranged opposite to each other, and there are two slots 19 and two corresponding limiting parts 20, which are also arranged opposite to each other. By setting the above structure, the installation is very symmetrical, the force is balanced, and the structure is compact.

[0045] See Figures 1-7 The temperature sensing cover 3 is made of a high thermal conductivity material, including but not limited to aluminum, copper, or stainless steel. Aluminum, copper, and stainless steel are all high thermal conductivity materials, which can effectively transfer the temperature of the bottom of the pot to the temperature sensor 2.

[0046] See Figures 1-7 The materials used for the bracket 1 and the pad assembly are all high-temperature resistant insulating materials, including but not limited to mica sheets or ceramics. The bracket 1, upper pad 51, middle pad 51, and lower pad 53 all require materials resistant to temperatures above 400°C. In this embodiment, the high-temperature resistant insulating material is mica sheet. That is, the bracket 1 is a mica sheet bracket, and the upper pad 51, middle pad 51, and lower pad 53 are all mica sheet pads. Mica sheet material can withstand temperatures above 400°C, is low in cost, has good manufacturability, ensures insulation while also having good heat resistance, effectively preventing heat transfer from the temperature sensing cover 3 to other components. It has the advantages of being inexpensive and easy to process.

[0047] See Figures 1-7 The temperature sensor 2 is a thermocouple sensor; a protective sleeve 2-3 is provided on the wire 2-2 of the temperature sensor 2. The protective sleeve 2-3 is resistant to high temperatures above 400℃ and is made of glass fiber material. Thermocouple sensors have many advantages, such as simple structure, convenient manufacturing, wide measurement range, high accuracy, low inertia, and easy long-distance transmission of output signals.

[0048] See Figures 1-7 The working principle of the temperature sensing device on the bottom of the aforementioned cookware is as follows:

[0049] During operation, the top outer wall (upper surface) of the temperature sensing cover 3 is in direct contact with the bottom of the pot. The temperature of the bottom of the pot can be transferred to the temperature sensing cover 3. The temperature sensing head 2-1 of the temperature sensor 2 detects the temperature of the temperature sensing cover 3, thus reflecting the temperature of the bottom of the pot. Under the elastic force of the elastic mechanism, the temperature sensing head 2-1 of the temperature sensor 2 is always in close contact with the top inner wall of the temperature sensing cover 3, making the temperature sensing head 2-1 firmly installed and highly reliable. This allows the temperature sensing head 2-1 to make effective contact with the temperature sensing cover 3, thereby improving the detection accuracy and response speed.

[0050] Example 2

[0051] See Figure 8The other structures in this embodiment are the same as those in Embodiment 1, except that the pad assembly 5 includes an upper pad 51 and a lower pad 53 distributed vertically; the top of the temperature sensing cover 3 is provided with a downward-opening receiving cavity 6; a fourth gap 14 communicating with the receiving cavity 6 is provided between the side wall of the upper pad 51 and the bracket 1; a fifth gap 15 is provided between the upper pad 51 and the lower pad 53; and a third vertical through hole 16 is provided in the middle of the lower pad 53; the fourth gap 14, the fifth gap 15, and the third vertical through hole 16 are connected to form a wiring channel; the wire 2-2 of the temperature sensor 2 is arranged along the wiring channel and extends into the receiving cavity 6; the temperature sensing head 2-1 is located in the receiving cavity 6 and connected to the wire 2-2; and the upper end of the compression spring 4 acts on the lower pad 53. By setting two pads, upper pad 51 and lower pad 53, the wire 2-2 of the temperature sensor 2 can be well fixed, forming a curved wiring pattern. This ensures that the temperature sensing head 2-1 of the temperature sensor 2 will not shift. Combined with the elastic force of the compression spring 4, the wire 2-2 can be well fixed, and the temperature sensing head 2-1 can be pressed against the temperature sensing cover 3. Specifically, the wire 2-2 extends vertically upward into the third vertical through hole 16, then bends horizontally into the fifth gap 15, then bends vertically upward into the fourth gap 14, and then bends horizontally into the receiving cavity 6 to connect with the temperature sensing head 2-1.

[0052] Example 3

[0053] See Figures 1-7 The other structures in this embodiment are the same as those in Embodiment 1. The difference is that a vertical wire hole can be set at the center of the bracket 1. After the upper section of the wire 2-2 of the temperature sensor 2 is arranged along the wiring channel, the lower section of the wire 2-2 passes through the mounting groove 1-1 and then comes out through the vertical wire hole. Setting a vertical wire hole makes the wiring simpler and more compact.

[0054] Example 4

[0055] See Figure 9 The other structures in this embodiment are the same as those in Embodiment 2, except that there are two fourth gaps 14, and two wires 2-2 for the temperature sensor 2. Both wires 2-2 extend vertically upwards into the third vertical through-hole 16, then bend horizontally towards each other into the fifth gap 15, then bend vertically upwards into the two fourth gaps 14 respectively, and finally bend horizontally towards each other into the receiving cavity 6 and connect to the temperature sensing head 2-1. That is, the temperature sensing head 2-1 is connected to the two wires 2-1, and the routing of the two wires 2-2 is symmetrical. This is to further ensure the connection stability of the wires 2-2. The multiple bends and symmetrical arrangement achieve a certain self-locking effect, further improving the installation reliability of the temperature sensor 2.

[0056] The above are preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited to the above content. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present utility model shall be considered equivalent substitutions and shall be included within the protection scope of the present utility model.

Claims

1. A temperature sensing device for the bottom of a cookware pot, characterized in that, It includes a bracket, a temperature sensor, a temperature-sensing cover fitted on the upper end of the bracket, and an elastic mechanism; wherein, the temperature sensing head of the temperature sensor is disposed inside the temperature-sensing cover, and the elastic force of the elastic mechanism causes the temperature sensing head of the temperature sensor to press against the top inner wall of the temperature-sensing cover.

2. The temperature sensing device for the bottom of a cookware according to claim 1, characterized in that, The elastic mechanism includes a compression spring and a pad assembly disposed inside the temperature sensing cover. The upper end of the compression spring acts on the pad assembly, and the lower end of the compression spring acts on the bracket. The compression spring is used to push the pad assembly to press the temperature sensor head against the top inner wall of the temperature sensing cover.

3. The temperature sensing device for the bottom of a cookware according to claim 2, characterized in that, The pad assembly includes an upper pad, a middle pad, and a lower pad arranged from top to bottom; the top of the temperature sensing cover has a downward-opening receiving cavity; the upper pad has a first vertical through hole communicating with the receiving cavity; a first gap is provided between the upper pad and the lower pad; a second gap is provided between the side wall of the middle pad and the support; a third gap is provided between the middle pad and the lower pad; and a second vertical through hole is provided on the lower pad; the first vertical through hole, the first gap, the second gap, the third gap, and the second vertical through hole are sequentially connected to form a wiring channel; the wire of the temperature sensor is arranged along the wiring channel, and the temperature sensing head is located in the receiving cavity and connected to the wire; the upper end of the compression spring acts on the lower pad.

4. The temperature sensing device for the bottom of a cookware according to claim 3, characterized in that, The first vertical through hole is located in the middle of the upper pad, and the second vertical through hole is located in the middle of the lower pad.

5. The temperature sensing device for the bottom of a cookware according to claim 2, characterized in that, The pad assembly includes an upper pad and a lower pad distributed vertically; the top of the temperature sensing cover has a downward-opening receiving cavity; a fourth gap communicating with the receiving cavity is provided between the side wall of the upper pad and the support; a fifth gap is provided between the upper pad and the lower pad; and a third vertical through hole is provided in the middle of the lower pad; the fourth gap, the fifth gap, and the third vertical through hole are connected to form a wiring channel; the wire of the temperature sensor is arranged along the wiring channel and extends into the receiving cavity; the temperature sensing head is located in the receiving cavity and connected to the wire; and the upper end of the compression spring acts on the lower pad.

6. The temperature sensing device for the bottom of a cookware according to claim 2, characterized in that, The pad assembly includes an upper pad and a lower pad distributed vertically; the top of the temperature sensing cover has a downward-opening receiving cavity; a fourth gap communicating with the receiving cavity is provided between the side wall of the upper pad and the support; a fifth gap is provided between the upper pad and the lower pad; a third vertical through hole is provided in the middle of the lower pad; the fourth gap, the fifth gap, and the fifth gap are connected sequentially; there are two fourth gaps; the temperature sensor has two wires; the two wires extend vertically upward together into the third vertical through hole, then bend horizontally towards each other into the fifth gap, then bend vertically upward respectively into the two fourth gaps, then bend horizontally towards each other into the receiving cavity and connect to the temperature sensing head.

7. A temperature sensing device for the bottom of a cookware according to any one of claims 3-6, characterized in that, The bracket is a cross-shaped bracket; the lower end of the cross-shaped bracket is provided with a positioning groove for fixing the wires of the temperature sensor; four spatial channels are formed on the cross-shaped bracket, and the wires of the temperature sensor are routed in one of the spatial channels; the upper end of the bracket is provided with a mounting groove, and the compression spring is set in the mounting groove, wherein the lower end of the compression spring acts on the bottom of the mounting groove.

8. The temperature sensing device for the bottom of a cookware according to claim 1, characterized in that, The lower end of the temperature sensing cover is connected to the bracket via a fastening structure. The fastening structure includes multiple fastening hooks at the lower end of the temperature sensing cover, a fastening step in the middle of the bracket and connected to the fastening hooks, multiple slots at the lower end of the temperature sensing cover, and a limiting part in the middle of the bracket that cooperates with the slots.

9. The temperature sensing device for the bottom of a cookware according to claim 1, characterized in that, The material of the temperature sensing cover is a high thermal conductivity material including but not limited to aluminum, copper, or stainless steel; the material of the bracket and pad assembly is a high temperature resistant insulating material including but not limited to mica sheets or ceramics.

10. A temperature sensing device for the bottom of a cookware according to any one of claims 3-6, characterized in that, The temperature sensor is a thermocouple sensor; the wires of the temperature sensor are provided with a protective sleeve, which is resistant to high temperatures above 400°C and is made of glass fiber material.

Images