Acoustic musical instrument array type pickup

Abstract

The utility model relates to a sound pickup technology for an acoustic musical instrument, in particular to an array type sound pickup for the acoustic musical instrument, which comprises an integral array type sound pickup set consisting of a plurality of single sound pickups with different sizes. The single sound pick-up is formed by arranging a piezoelectric ceramic piece in an open type stamping aluminum alloy cavity shell, and the surface of the piezoelectric ceramic piece is covered with 0.3-0.5 mm silicone rubber for sealing. The sound pick-up is installed on a frequency resonance point of a sound production panel in the original sound musical instrument through a flexible double faced adhesive tape. The sound pick-up frequency range and the signal intensity can be expanded in the physical level by combining sound pick-ups with different sizes. The sound pickup device picks up the sound of the acoustic musical instrument with high quality, and provides a high-quality acoustic solution for the acoustic musical instrument in the fields of stage performance, studio recording and the like.

Description

Technical Field

[0001] This utility model relates to the field of acoustic musical instrument sound pickup technology, specifically to a pickup structure for picking up sound signals from acoustic musical instruments. Background Technology

[0002] Currently, the market primarily uses four methods for pickuping acoustic musical instruments (acoustic guitars, cajons, and various plucked string instruments): microphones, piezoelectric pickups, patch pickups, and electromagnetic pickups. Microphone pickups are highly demanding in terms of their operating environment. Due to environmental limitations, multiple microphones are often needed to capture the full range of an instrument's sonic characteristics. Furthermore, different microphone placements will result in completely different sonic characteristics, making it difficult to consistently reproduce the instrument's sound. This makes them challenging to use in stage and performance environments. Piezoelectric and electromagnetic pickups, due to their physical limitations, cannot accurately reproduce the instrument's inherent sonic characteristics.

[0003] Current piezoelectric ceramic pickups use one, two, or three identical piezoelectric ceramic discs to pick up the vibration signals from the instrument's soundboard. The piezoelectric ceramic discs are encapsulated in a sealed casing. This type of pickup has very low frequency response and sensitivity, weak output signals, a narrow frequency response range for picking up instruments, high dependence on external amplifiers, and cannot fully reproduce the inherent tonal characteristics of acoustic instruments. Summary of the Invention

[0004] This invention relates to an array pickup that can efficiently reproduce the timbre characteristics of acoustic musical instruments.

[0005] This invention consists of multiple individual microphones of different sizes combined to pick up high-frequency, mid-frequency, and low-frequency signals of musical instruments, and then outputs the high-frequency, mid-frequency, and low-frequency signals of musical instruments in any combination as needed.

[0006] This invention combines and installs multiple individual pickups of different sizes according to the frequency response range of the musical instrument, which can control the frequency response range of the musical instrument in terms of physical structure and obtain excellent musical instrument sound signals.

[0007] The single-unit pickup structure of this utility model is an open lightweight resonant cavity pickup structure with a hollow cylindrical shape.

[0008] First, the piezoelectric ceramic sheet for welding the wire is bonded to the bottom layer of the stamped aluminum alloy hollow shell, and then the wire is led out from the side of the shell.

[0009] Furthermore, 0.3~0.5 mm of flexible silicone rubber is potted into the aluminum alloy cavity to prevent oxidation of the piezoelectric ceramic sheet and increase the stability of the cavity.

[0010] Furthermore, the single pickup is fixed to the resonant point of the instrument's internal soundboard using flexible double-sided tape. The lightweight resonating cavity combined with this installation method can improve the pickup's sensitivity and reduce the suppression of the instrument's soundboard vibration.

[0011] Furthermore, pickups of different sizes are installed at the resonant points of the high-frequency, mid-frequency, and low-frequency panels of the instrument. Small pickups (15~25 mm) pick up high frequencies, while medium and large pickups (30~38 mm) pick up mid and low frequencies. The combination of pickup arrays of different sizes enables high-sensitivity full-frequency pickup of the instrument's original sound signal, fully reflecting the inherent sound characteristics of the acoustic instrument.

[0012] This invention eliminates the need for external audio signal amplifiers to amplify instrument signals in multiple stages. Instead, the output signal can be connected to a DI box to convert to a balanced signal or directly to a mixing console or audio equipment that supports high-impedance signals. This can meet various needs such as live sound reinforcement and recording in various performance scenarios.

[0013] This invention solves the problems of frequency response range and audio signal strength of musical instruments from a physical structure perspective. The system has a simple and efficient structure, reducing the complexity of acoustic instrument pickup processing. Since it eliminates the need to install an audio amplification module on the instrument itself, it also reduces the damage to the instrument caused by installing a pickup.

[0014] The pickup of this invention can obtain high-quality musical instrument audio signals by amplifying the signal by 15~25dB, thus meeting various amplification needs. Attached Figure Description

[0015] To clearly illustrate this utility model, the accompanying drawings will be described below.

[0016] Figure 1 This is a schematic diagram of the complete assembly structure of this utility model. Figure 1 Numbers 11, 12, 13, 14, and 15 represent single-unit pickups of different sizes.

[0017] Figure 2 This is an exploded view of the single-unit pickup in this utility model. Figure 2 The following components are selected: 1. Encapsulated silicone rubber layer; 2. Piezoelectric ceramic sheet; 3. Signal lead; 4. Open-type lightweight aluminum alloy shell; 5. Flexible double-sided adhesive.

[0018] Figure 3 This is a schematic diagram of the overall structure of the single-unit pickup in this utility model. Figure 3 Number of components: 6. Signal lead, 7. Piezoelectric ceramic sheet, 8. Open-type lightweight aluminum alloy housing. Detailed Implementation

[0019] First, determine the frequency range of the instrument. It is recommended to use 30-38 mm pickups for the 60-300 Hz frequency range and 10-25 mm pickups for frequencies above 300 Hz. It is suggested that there should be 1-2 more pickups for the high frequency range than for the mid and low frequency range to ensure signal strength. The number of individual pickups should be determined according to the frequency range of the instrument.

[0020] Determining the pickup installation location: Spread fine sand evenly on the vibrating surface of the instrument and tap the instrument cavity. The sand at the resonant point will be vibrated and moved to the non-resonant position. The optimal installation location can be determined based on the distribution of the sand.

[0021] Fabrication of a single pickup: (1) Make a 0.8~1mm wire hole on the side of the open stamped aluminum alloy cavity shell; (2) Weld the wire to the positive and negative poles of the piezoelectric ceramic sheet, and apply adhesive to the bottom surface of the piezoelectric ceramic sheet; (3) Pass the wire through the aluminum alloy cavity shell from the inside to the outside, and then bond the piezoelectric ceramic sheet to the center of the bottom side inside the aluminum alloy cavity shell; (4) Then inject encapsulating silicone rubber into the cavity, spread the adhesive flat, and keep the thickness at 0.3~0.5 mm; (5) Install flexible double-sided tape of the corresponding size on the bottom of the aluminum alloy cavity shell.

[0022] Pickup signal grouping: It is recommended to group the high-frequency pickups into one group and the mid-low frequency pickups into another group, and output them through a 6.5mm three-pin audio jack in a dual-channel configuration. Alternatively, the high-frequency, mid-frequency, and low-frequency signals can be combined into one output signal as needed, but this reduces the flexibility of later EQ equalization adjustments. Alternatively, the high-frequency, mid-frequency, and low-frequency signals can be output independently, which provides more flexible later EQ processing, but increases the output complexity.

[0023] Pickup installation: Each pickup is fixed to the resonant point of the instrument's internal sound panel with flexible double-sided tape. The flexible double-sided tape can reduce the vibration suppression of the instrument's resonant point and provide better signal feedback.

Claims

1. An array-type microphone device, characterized in that: An array pickup is composed of multiple individual pickups of different sizes (11, 12, 13, 14, 15) to pick up high-frequency, mid-frequency, and low-frequency signals of the instrument, and can be combined and output arbitrarily according to requirements. Each individual pickup includes an open lightweight aluminum alloy shell, a piezoelectric ceramic sheet is bonded to the bottom layer of the aluminum alloy cavity shell, signal leads are led out from the side of the shell, the aluminum alloy cavity is filled with 0.3~0.5 mm flexible silicone rubber, and flexible double-sided adhesive is set at the bottom of the shell to fix the individual pickup to the instrument's soundboard.

2. The array-type microphone device according to claim 1, characterized in that: Small-sized pickups pick up high frequencies, while medium and large-sized pickups pick up mid and low frequencies.

3. The array-type microphone device according to claim 1, characterized in that: The high-frequency band requires 1 to 2 more pickups than the mid- and low-frequency band.

4. The array-type microphone device according to claim 1, characterized in that: The aluminum alloy hollow shell has 0.8~1 mm wire holes on its side.

5. The array-type microphone device according to claim 1, characterized in that: The thickness of the potting silicone rubber layer is 0.3~0.5 mm.

6. The array-type microphone device according to claim 1, characterized in that: The output signal of the array pickup is connected to a DI box to convert to a balanced signal or directly to a mixing console or audio equipment with a port that supports high impedance signals.

Images