Heat dissipation assembly and circuit module

Abstract

The utility model provides a heat dissipation assembly and a circuit module. The heat dissipation assembly comprises a substrate which is provided with a first surface and a second surface which are oppositely arranged, and the first surface is in contact with a heat source; the flat heat pipe is parallel to the substrate; the flat heat pipe comprises a first outer wall connected with the second surface, a second outer wall opposite to the first outer wall, and a plurality of side walls connected with the first outer wall and the second outer wall; a sealing cavity is defined by the first outer wall, the second outer wall and the side walls, and phase change liquid is contained in the sealing cavity; and the radiating fins are connected with the second outer wall. According to the substrate, heat generated by a heat source can be evenly distributed, the heat of the substrate is absorbed through the flat heat pipes, the flat heat pipes generate gas-liquid phase change to transfer the heat to the cooling fins, and then heat dissipation is completed through the cooling fins. The flat heat pipes are arranged on the substrate in parallel and cannot form an included angle with the substrate to generate a bent part, so that the heat transfer efficiency of the flat heat pipes can be ensured, the area of the radiating fins is increased, and the radiating efficiency is improved.

Description

Technical Field

[0001] This disclosure relates to the field of chip manufacturing, and in particular to a heat dissipation component and circuit module. Background Technology

[0002] With the rapid development of artificial intelligence (AI), AI smart computing cards (hereinafter referred to as smart computing cards) will play an important role. Typically, the increase in computing power of smart computing cards is accompanied by an increase in power consumption, which will pose new challenges to heat dissipation technology.

[0003] Typically, smart computing cards can use downdraft active cooling technology. This technology uses heat pipes with bends, which reduces heat transfer efficiency and the heat exchange area of ​​the heat sink fins, resulting in poor heat dissipation. Summary of the Invention

[0004] This disclosure provides a heat dissipation component and circuit module to realize the setting of a flat heat pipe parallel to the substrate in the heat dissipation component, to ensure the heat transfer efficiency of the flat heat pipe, and thereby improve the heat dissipation efficiency of the heat dissipation component.

[0005] In a first aspect, this disclosure provides a heat dissipation assembly, comprising: a substrate having a first surface and a second surface disposed opposite to each other, wherein the first surface is in contact with a heat source; a flat heat pipe disposed parallel to the substrate; wherein the flat heat pipe comprises: a first outer wall connected to the second surface, a second outer wall disposed opposite to the first outer wall, and a side wall connecting the first outer wall and the second outer wall; wherein the first outer wall, the second outer wall, and the side wall enclose a sealed cavity containing a phase change fluid; and heat dissipation fins connected to the second outer wall.

[0006] In some embodiments, the area of ​​the cross-section of the flat heat pipe along the first direction is smaller than the area of ​​the cross-section of the flat heat pipe along the second direction, wherein the first direction is the direction of travel from the first outer wall to the second outer wall, and the second direction is perpendicular to the first direction.

[0007] In some embodiments, the length of the heat dissipation fins in the second direction is positively correlated with the length of the flat heat pipe in the second direction, wherein the second direction is the length direction of the flat heat pipe.

[0008] In some embodiments, the flat heat pipe includes a plurality of flat heat pipes; the plurality of flat heat pipes are spaced apart in a third direction, and the width of the heat dissipation fins in the third direction is greater than or equal to the width of the plurality of flat heat pipes in the third direction; wherein, the third direction is perpendicular to the second direction.

[0009] In some embodiments, a first groove is formed on the second surface; the projection of the flat heat pipe toward the substrate falls into the projection of the first groove toward the substrate; the flat heat pipe is at least partially accommodated in the first groove in a first direction and is connected to the first groove.

[0010] In some embodiments, the heat dissipation fins include: a base plate connected to a second outer wall; and a plurality of individual fins connected to the base plate, wherein the plurality of individual fins are arranged at intervals along a second direction; the second direction is perpendicular to a first direction, and the first direction is the direction of travel from the first outer wall to the second outer wall.

[0011] In some embodiments, a second groove is formed on the surface of the base plate facing the flat heat pipe; the projection of the flat heat pipe toward the heat dissipation fins falls into the projection of the second groove toward the heat dissipation fins; the flat heat pipe is at least partially accommodated in the second groove in a first direction and is connected to the second groove.

[0012] In some embodiments, the flat heat pipe includes: a first segment, a second segment, and a third segment connected sequentially along a second direction; wherein the length of the substrate in the second direction is less than the length of the flat heat pipe in the second direction, and the first outer wall of the second segment is connected to the second surface; the length of the heat dissipation fins in the second direction is greater than the length of the second segment in the second direction, and the second outer walls of the first, second, and third segments are connected to the heat dissipation fins.

[0013] In some embodiments, the length of the third segment in the second direction is greater than the length of the first segment in the second direction; the heat dissipation assembly further includes: a bracket connected to the second outer wall within the third segment; in the first direction, the mounting height of the flat heat pipe on the bracket is the same as the mounting height of the flat heat pipe on the substrate.

[0014] In a second aspect, embodiments of this disclosure provide a circuit module comprising: a circuit board, a heat dissipation assembly as described in any of the first aspects, and a plurality of connectors; wherein a die is mounted on the circuit board; each of the plurality of connectors fixes a substrate in the heat dissipation assembly and the circuit board in a fixed connection; and the die is in contact with a first surface of the substrate.

[0015] The advantages of the technical solution provided in this disclosure compared with the prior art are as follows:

[0016] In this disclosure, the substrate is in contact with the heat source. The thermal conductivity of the substrate allows for the uniform distribution of heat generated by the heat source. Then, a flat heat pipe connected to the substrate absorbs the heat, resulting in a gas-liquid phase change that transfers the heat to the heat dissipation fins. Finally, the heat dissipation fins exchange heat with the air to complete the heat dissipation. The flat heat pipe is arranged parallel to the substrate, without forming an angle or bend. This facilitates rapid flow of gas and liquid within the flat heat pipe, improving its heat transfer efficiency. Furthermore, it avoids bends that reduce the contact area between the heat dissipation fins and the flat heat pipe, thereby enhancing the efficiency of the heat dissipation assembly in cooling the heat source.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0019] Figure 1 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present disclosure;

[0020] Figure 2 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present disclosure;

[0021] Figure 3 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present disclosure;

[0022] Figure 4 This is a schematic diagram of the structure of an aluminum fin provided in an embodiment of the present disclosure;

[0023] Figure 5 This is an exploded view of a heat dissipation component provided in an embodiment of the present disclosure;

[0024] Figure 6 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present disclosure;

[0025] Figure 7 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present disclosure;

[0026] Figure 8 This is a schematic diagram of the structure of a circuit module provided in an embodiment of the present disclosure;

[0027] Figure 9 A temperature cloud map of a circuit module provided in an embodiment of this disclosure;

[0028] Figure 10 Temperature cloud map of a circuit module provided in an embodiment of this disclosure. Detailed Implementation

[0029] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses consistent with some aspects of this disclosure as detailed in the appended claims.

[0030] To illustrate the technical solutions described in this disclosure, specific embodiments are provided below.

[0031] With the rapid development of artificial intelligence, the rise of large language models has attracted global attention. In this technological revolution, intelligent computing cards will play a crucial role. Typically, the increase in computing power of intelligent computing cards is accompanied by an increase in power consumption. Currently, the peak power consumption of several intelligent computing card manufacturers is approaching 450W (watts). However, in order to meet the requirements of the high-speed serial computer expansion bus standard (Peripheral Component Interconnect Express, PCIe), the peripheral size of intelligent computing cards is limited to a certain range, resulting in limited heat dissipation space and posing new challenges to heat dissipation technology.

[0032] In some embodiments, Figure 1 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present disclosure. See also: Figure 1 As shown, the intelligent computing card can adopt a downdraft active cooling technology. This technology requires the corresponding heat dissipation component 10 of the intelligent computing card to adopt a design scheme of "vapor chamber + heat pipe + aluminum fins". Among them, the vapor chamber 11 can achieve rapid temperature uniformity. One end of the heat pipe 12 is flattened and contacts the vapor chamber 11, while the other end is connected with dozens of independent aluminum fins 13 through fin-through technology or reflow soldering technology, thereby increasing the heat dissipation area for forced convection cooling. However, the above heat dissipation scheme has problems such as complex processing, the heat pipe 12 has a bent section and the aluminum fins 13 cannot be set in the bent section, resulting in a reduced heat dissipation area, and the heat transfer efficiency of the heat pipe 12 is reduced, resulting in poor heat transfer effect at the far end of the heat pipe. Therefore, improvements are needed.

[0033] In some embodiments, Figure 2 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present disclosure. Figure 3 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present disclosure. See also: Figures 2 to 3As shown, the heat dissipation assembly 10 may include a heat spreader 11, a heat pipe 12, and aluminum fins 13. The middle portion of the heat pipe 12 is flattened, with one side of the middle portion contacting the heat spreader 11 and the other side having aluminum fins 13. Simultaneously, the first end of the heat pipe 12 passes through a portion of the aluminum fins 13, and the second end of the heat pipe 12 passes through another portion of the aluminum fins 13. It is evident that a first bend is formed between the middle portion of the heat pipe 12 and its first end, and a second bend is formed between the middle portion of the heat pipe 12 and its second end. The aluminum fins 13 cannot be installed at the locations of the first and second bends. Figure 4 This is a schematic diagram of the structure of an aluminum fin provided in an embodiment of this disclosure. Figure 4 (a) in the middle shows Figures 2 to 3 The aluminum fins 13 corresponding to the middle part of the heat pipe 12, Figure 4 (b) in the middle shows Figures 2 to 3 The aluminum fins 13 correspond to the middle portion of the heat pipe 12. See also... Figure 4 It can be seen that the aluminum fin 13 corresponding to the middle part of the heat pipe 12 has a downward folded edge 131, and the aluminum fin 13 corresponding to the first end and the second end of the heat pipe 12 has a through hole 132 through which the heat pipe 12 passes, but does not have a downward folded edge 131.

[0034] Understandable. Figures 2 to 4 The heat dissipation component 10 shown can be understood as a "heat pipe heat dissipation solution," which has at least the following shortcomings:

[0035] 1. Heat pipe 12 has bends, which reduce its heat transfer efficiency and result in poor heat transfer at its distal ends (such as the first and second ends mentioned above). Experiments show that when the bending angle of heat pipe 12 is 0-45°, the maximum heat transfer from the middle to the distal end will decrease by 10%; when the bending radius is 9-10 mm, the maximum heat transfer from the middle to the distal end will decrease by 10%; and when there are more than two bends, the maximum heat transfer from the middle to the distal end will decrease by more than 10%.

[0036] 2. Insufficient heat dissipation area. On the one hand, the irregular trajectory of the bent part of the heat pipe 12 makes it impossible to install the aluminum fins 13, thus reducing the heat dissipation area; on the other hand, the aluminum fins 13 corresponding to the first and second ends of the heat pipe 12 do not have a lower folded edge 131, which sacrifices the heat dissipation area to some extent.

[0037] 3. Complex heat sink manufacturing. The middle section of the heat pipe 12 needs to be flattened before contacting the heat spreader 11. The two ends need to be bent and twisted before connecting dozens of independent aluminum fins 13 using either fin-through or reflow soldering techniques. Fin-through technology uses an interference fit to embed the heat pipe 12 into the aluminum fins 13, requiring very high tolerances. Furthermore, due to the difference in thermal expansion coefficients between the copper heat pipe 12 and the aluminum fins 13, gaps may form between the copper and aluminum after prolonged use, causing the originally tightly connected aluminum fins 13 to loosen, resulting in decreased heat dissipation efficiency. While reflow soldering provides a more secure and tight connection, it is a longer process and more expensive.

[0038] To address the problems in "heat pipe cooling solutions," this disclosure provides a heat dissipation component and circuit module. This allows for the placement of flat heat pipes parallel to the substrate within the heat dissipation component, ensuring the heat transfer efficiency of the flat heat pipes and thereby improving the overall heat dissipation efficiency of the heat dissipation component. In one embodiment, the heat dissipation component in this disclosure can be understood as a "novel heat pipe cooling solution."

[0039] In a first aspect, embodiments of this disclosure provide a heat dissipation component. Figure 5 This is an exploded structural diagram of a heat dissipation component provided in an embodiment of this disclosure. Figure 6 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present disclosure. Figure 7 This is a schematic diagram of a heat dissipation assembly provided in an embodiment of this disclosure. See also... Figures 5 to 7 As shown, the heat dissipation assembly 10 includes: a substrate 14, a flat heat pipe 15, and heat dissipation fins 16. The substrate 14 may have a first surface and a second surface disposed opposite to each other, the first surface being in contact with the heat source. The substrate 14 is used to rapidly dissipate heat generated by the heat source to achieve a uniform temperature effect.

[0040] In some embodiments, the heat source may be an electronic component such as a chip or a die.

[0041] In some embodiments, the substrate 14 may be a heat spreader made of materials such as stainless steel or aluminum alloy; or, the substrate 14 may be a copper substrate made of copper material; or, the substrate 14 may be an aluminum substrate made of aluminum material; or, the substrate 14 may be a hybrid substrate in which copper blocks are embedded in an aluminum substrate.

[0042] In some embodiments, the flat heat pipe 15 is arranged parallel to the substrate 14. For example, when the substrate 14 is horizontally arranged, the flat heat pipe 15 is also horizontally arranged. The flat heat pipe 15 may include: a first outer wall 151 and a second outer wall 152 arranged opposite to each other, and one or more sidewalls connecting the first outer wall 151 and the second outer wall 152. The first outer wall 151 may be connected to the second plane of the substrate 14. That is, the flat heat pipe 15 is also connected to the second plane through the first outer wall 151, so that the flat heat pipe 15 and the substrate 14 are stacked.

[0043] In one embodiment, there is one sidewall, and the first and second ends of the sidewall can be connected to form an annular structure. The first opening of the annular structure is covered by the first outer wall 151, and the second opening is covered by the second outer wall 152, thereby forming a sealed cavity by the first outer wall 151, the second outer wall 152, and the sidewall. In another embodiment, there are multiple sidewalls, which can be connected end to end to form an annular structure. The first opening of the annular structure is covered by the first outer wall 151, and the second opening is covered by the second outer wall 152, thereby forming a sealed cavity by the first outer wall 151, the second outer wall 152, and the multiple sidewalls.

[0044] In one embodiment, a flat heat pipe 15 can be obtained by pressing a heat pipe that is sealed at both ends. In one embodiment, the two outer walls of the flat heat pipe 15 arranged along the pressing direction can be a first outer wall 151 and a second outer wall 152.

[0045] In some embodiments, the flat heat pipe 15 is used to conduct heat generated by the heat source to the heat dissipation fins. Therefore, the flat heat pipe 15 can be made of a metal material with good thermal conductivity, but this disclosure is not limited to this embodiment. In one embodiment, the flat heat pipe 15 can be a copper pipe made of copper material.

[0046] In some embodiments, the sealed cavity formed by the first outer wall 151, the second outer wall 152, and the sidewalls can contain a phase change fluid. It is understood that a phase change fluid is a working medium that undergoes a phase change (i.e., changes from liquid to gas and then back to liquid) during the operation of the flat heat pipe 15. This working medium can play a role in transferring heat within the flat heat pipe 15. Its working principle can include: when one end of the flat heat pipe 15 is heated, the liquid (liquid phase change fluid) in the sealed cavity rapidly evaporates to produce vapor (gaseous phase change fluid). The vapor flows to the other end under the influence of a small pressure difference within the flat heat pipe 15, releasing heat and re-condensing into liquid. The liquid then flows back to the heated end through capillary force within the pipe, and this cycle continues, transferring heat from one end of the flat heat pipe 15 to the other. The end of the flat heat pipe 15 where the liquid is heated and turns into vapor can be an evaporation section, and the other end where the vapor condenses into liquid can be a condensation section.

[0047] In some embodiments, a suitable phase change fluid can be selected and placed inside the flat heat pipe 15, depending on the operating temperature and environment; this disclosure does not limit this. In one embodiment, the phase change fluid can be water, a refrigerant, etc. The refrigerant can be Freon, tetrafluoroethane (HCR134a), etc.

[0048] In some embodiments, a capillary structure is also formed within the sealed cavity of the flat heat pipe 15. The capillary structure is used to improve the flow efficiency of the liquid within the flat heat pipe 15. After the vapor condenses into liquid, the liquid can quickly flow back to the heated end through the capillary force generated by the capillary structure, thereby improving the heat transfer efficiency of the flat heat pipe 15.

[0049] Understandably, the sealed cavity of the flat heat pipe 15 is not connected to the outside air, so that the phase change liquid inside the sealed cavity will not evaporate or leak, thus ensuring that the flat heat pipe 15 can be used stably for a long time.

[0050] In some embodiments, the first outer wall 151 of the flat heat pipe 15 is connected to the second surface of the substrate 14, and the second outer wall 152 of the flat heat pipe 15 is connected to the heat dissipation fins 16.

[0051] Understandably, the first outer wall 151 of the flat heat pipe 15, connected to the second surface, can absorb heat from the substrate 14 and transfer this heat to the phase change liquid within the sealed cavity, causing the phase change liquid to undergo a gas-liquid phase change. This heat is then transferred to the heat dissipation fins 16 via the second outer wall 152 of the flat heat pipe 15. Simultaneously, the flat heat pipe 15 is arranged parallel to the substrate 14, avoiding any angle with the substrate and thus preventing bends. This avoids poor heat transfer efficiency caused by bends, ensuring efficient heat transfer from the evaporation section to the condensation section of the flat heat pipe 15. Furthermore, the entire flat heat pipe 15 can be connected to the heat dissipation fins 16, which increases the contact area between the flat heat pipe 15 and the heat dissipation fins 16, thereby increasing the heat dissipation area and improving heat dissipation efficiency.

[0052] It is understood that the connection method between the first outer wall 151 and the second surface, and the connection method between the second outer wall 152 and the heat dissipation fins 16, can be selected according to actual needs, and this application embodiment does not limit this.

[0053] In some embodiments, the first outer wall 151 of the flat heat pipe 15 is connected to the second surface of the substrate 14 by welding. In some embodiments, the heat dissipation fins 16 are connected to the second outer wall 152 of the flat heat pipe 15 by welding.

[0054] In some embodiments, one or more flat heat pipes 15 may be provided in the heat dissipation assembly 10 according to the actual heat dissipation requirements and the space occupied by the heat dissipation assembly 10. This disclosure does not limit this. In one embodiment, the extension directions of the multiple flat heat pipes 15 may be different. In one embodiment, the extension direction of the flat heat pipe 15 may change when it extends, that is, the flat heat pipe 15 may be bent at a certain angle. However, in order not to reduce the heat transfer efficiency of the flat heat pipe 15, the bend should not be too large, and the bend design should be designed to make the heat dissipation fins 16 heat up more evenly.

[0055] In some embodiments, the material forming the heat dissipation fins 16 can be set according to actual needs, and this disclosure does not limit this.

[0056] In this embodiment, the substrate is in contact with the heat source. The thermal conductivity of the substrate allows for uniform distribution of the heat generated by the heat source. Then, a flat heat pipe connected to the substrate absorbs the heat, resulting in a gas-liquid phase change that transfers the heat to the heat dissipation fins. Finally, the heat is dissipated by exchanging heat with the air through the heat dissipation fins. The flat heat pipe is arranged parallel to the substrate, avoiding any angles or bends. This facilitates rapid flow of gas and liquid within the flat heat pipe, improving its heat transfer efficiency. Furthermore, the absence of bends reduces the contact area between the heat dissipation fins and the flat heat pipe, thereby enhancing the efficiency of the heat dissipation assembly in cooling the heat source. Additionally, the flat heat pipe is simple to manufacture, has low processing costs, and increases the heat transfer area, effectively improving heat dissipation performance.

[0057] See also some possible implementations. Figures 5 to 7 As shown, the area of ​​the cross-section of the flat heat pipe 15 along the first direction is smaller than the area of ​​the cross-section of the flat heat pipe 15 along the second direction, wherein the first direction is the direction of travel from the first outer wall 151 to the second outer wall 152, and the second direction is perpendicular to the first direction.

[0058] Understandably, the first direction is the direction of travel from the first outer wall 151 to the second outer wall 152. The first direction can also be understood as the stacking direction of the substrate 14, the flat heat pipe 15, and the heat dissipation fins 16. The second direction is perpendicular to the first direction and can be any direction parallel to the second plane. Since the flat heat pipe 15 has a cross-sectional area along the first direction that is smaller than that along the second direction, the width of the flat heat pipe 15 in the first direction is smaller than its width in the second direction. The flat heat pipe 15 is wider in the direction parallel to the second plane, thereby increasing the contact area between the flat heat pipe 15 and the second plane, thus increasing the heat dissipation area and improving heat dissipation efficiency.

[0059] It should be noted that the first direction, second direction, and third direction in different embodiments refer to the same direction. That is, the first direction is the stacking direction of the substrate, flat heat pipe, and heat dissipation fins, the second direction is perpendicular to the first direction, and the third direction is perpendicular to both the second and first directions.

[0060] See also some possible implementations. Figures 5 to 7 As shown, the length of the heat dissipation fins 16 in the second direction is positively correlated with the length of the flat heat pipe 15 in the second direction. The second direction is the length direction of the flat heat pipe 15.

[0061] Understandably, the flat heat pipe 15 in the heat dissipation assembly 10 can extend along the second direction, thus giving the flat heat pipe 15 a certain length in the second direction, i.e., the second direction is the length direction of the flat heat pipe 15. Simultaneously, the length of the heat dissipation fins 16 in the second direction can be positively correlated with the length of the flat heat pipe 15 in the second direction, allowing the length of the heat dissipation fins 16 to increase according to the length of the flat heat pipe 15 in the second direction. This increases the heat dissipation area between the flat heat pipe 15 and the heat dissipation fins 16, ensuring heat dissipation efficiency.

[0062] In some embodiments, the length of the heat dissipation fins 16 in the second direction is greater than or equal to the length of the flat heat pipe 15 in the second direction. In some embodiments, the length of the heat dissipation fins 16 in the second direction is slightly less than the length of the flat heat pipe 15 in the second direction.

[0063] In this embodiment of the present disclosure, the length of the heat dissipation fins in the second direction can be adjusted according to the length of the flat heat pipe in the second direction, thereby improving the flexibility of the heat dissipation assembly.

[0064] See also some possible implementations. Figures 5 to 7 As shown, the heat dissipation assembly 10 has multiple flat heat pipes 15. In addition to all extending along the second direction, the multiple flat heat pipes 15 can also be arranged at intervals in a third direction. The width of the heat dissipation fins 16 in the third direction is greater than or equal to the width of the multiple flat heat pipes 15 in the third direction. The third direction is perpendicular to the second direction.

[0065] Understandably, the second direction can be any direction parallel to the second plane, and the third direction can be a direction perpendicular to the second direction. Multiple flat heat pipes 15 can be arranged at intervals in the third direction, thereby making the heat dissipation fins 16 more evenly heated in the third direction. Simultaneously, the width of the heat dissipation fins 16 in the third direction can be greater than or equal to the width occupied by the multiple flat heat pipes 15 in the third direction. This allows the width of the heat dissipation fins 16 in the third direction to increase according to the width occupied by the multiple flat heat pipes 15 in the third direction, and ensures that the heat dissipation fins 16 completely cover the second outer wall 152 of the flat heat pipes 15 in the third direction, thereby increasing the heat dissipation area.

[0066] In this embodiment, the heat dissipation fins completely cover the second outer wall of the flat heat pipe in the third direction, thereby increasing the heat dissipation area.

[0067] See also some possible implementations. Figures 5 to 7 As shown, a first groove can be formed on the second surface of the substrate 14 facing the flat heat pipe 15. The projection of the flat heat pipe 15 toward the substrate 14 falls within the projection of the first groove toward the substrate 14, thereby allowing the flat heat pipe 15 to be fitted into the first groove and connected to the second surface of the substrate 14 through connection with the first groove. Furthermore, the first groove can have a predetermined depth in a first direction, so that the flat heat pipe 15 can be at least partially accommodated in the first groove in the first direction.

[0068] In one embodiment, when the depth of the first groove in the first direction is equal to the thickness of the flat heat pipe 15 in the first direction, the flat heat pipe 15 can be completely accommodated within the first groove in the first direction. In another embodiment, when the depth of the first groove in the first direction is less than the thickness of the flat heat pipe 15 in the first direction, the flat heat pipe 15 can be partially accommodated within the first groove in the first direction.

[0069] In one embodiment, when the flat heat pipe 15 is fully accommodated in the first groove in the first direction, the heat dissipation fins 16 are in contact with the substrate 14.

[0070] In some embodiments, the number of first grooves can be set according to the number of flat heat pipes 15, and this disclosure does not limit this. In one embodiment, there is one first groove and one flat heat pipe 15, and one flat heat pipe 15 is accommodated in the first groove. In one embodiment, there is one first groove and multiple flat heat pipes 15, and multiple flat heat pipes 15 are accommodated in the same first groove. In one embodiment, there are multiple first grooves and multiple flat heat pipes 15, and each of the multiple first grooves can accommodate one or more flat heat pipes 15.

[0071] In some embodiments, when the flat heat pipe 15 is housed in the first groove, the sidewall of the flat heat pipe 15 is in contact with the groove wall of the first groove, thereby increasing the contact area between the substrate 14 and the flat heat pipe 15 and improving the heat transfer efficiency.

[0072] In this embodiment of the present disclosure, after the first groove is formed on the second surface, the flat heat pipe can be partially accommodated in the first groove in the first direction. This can reduce the distance between the heat dissipation fins and the substrate, improve the compactness of the heat dissipation structure, and increase the contact area between the substrate and the flat heat pipe, thereby improving the heat transfer efficiency.

[0073] See also some possible implementations. Figures 5 to 7 As shown, the heat dissipation fins 16 include a base plate 161 and a plurality of individual fins 162 connected to the base plate 161. Here, the base plate 161 is parallel to the flat heat pipe 15 and the second outer wall 152, and is connected to the second outer wall 152 of the flat heat pipe 15. One end of the plurality of individual fins 162 can be connected to the base plate 161, and the other end can extend in a direction away from the flat heat pipe 15.

[0074] In some embodiments, a plurality of individual fins 162 may extend along a first direction, thereby making the plurality of individual fins 162 perpendicular to the base plate 161. In some embodiments, the plurality of individual fins 162 may be arranged at intervals along a second direction. This facilitates adjusting the number of individual fins 162 according to the length of the base plate 161 in the second direction, and also allows each individual fin 162 to receive heat transferred by the plurality of flat heat pipes 15 when the heat dissipation assembly 10 includes a plurality of flat heat pipes 15, thereby improving the uniformity of heat dissipation of the heat dissipation assembly 10. Here, the second direction is perpendicular to the first direction, and the first direction is the direction of travel from the first outer wall to the second outer wall.

[0075] In one embodiment, the individual fin 162 and the base plate 161 are simultaneously fabricated using an integral molding process. In another embodiment, the individual fin 162 is connected to the base plate 161 using a welding process.

[0076] Understandably, when each individual fin 162 is connected to the base plate 161, the base plate 161 can be considered as forming the lower folded edge of the individual fin 162. Through this lower folded edge, the heat dissipation fin 16 increases the contact area with the flat heat pipe 15, thereby improving heat transfer efficiency.

[0077] In some embodiments, the materials forming the base plate 161 and the individual fin 162 can be the same; or, the materials forming the base plate 161 and the individual fin 162 can be different. In one embodiment, the individual fin 162 can be a metal plate. The base plate 161 can be a metal plate. In some embodiments, the structure of the individual fin 162 is set according to actual usage requirements, and this disclosure does not limit this. In one embodiment, the individual fin 162 can be a metal plate. In one embodiment, the individual fin 162 can be a metal tube.

[0078] In this embodiment, the heat dissipation fins contact the second outer wall of the flat heat pipe through the base plate, thereby increasing the heat transfer area between the heat dissipation fins and the flat heat pipe and improving the heat transfer efficiency.

[0079] See also some possible implementations. Figures 5 to 7 As shown, a second groove 163 can be formed on the surface of the base plate 161 facing the flat heat pipe 15; and the projection of the flat heat pipe 15 toward the heat dissipation fins 16 falls within the projection of the second groove 163 toward the heat dissipation fins 16, thereby allowing the flat heat pipe 15 to be fitted into the second groove 163, and to be connected to the base plate 161 of the heat dissipation fins 16 through connection with the second groove 163. Furthermore, the second groove 163 can have a preset depth in the first direction, thereby allowing the flat heat pipe 15 to be at least partially accommodated within the second groove 163 in the first direction.

[0080] In one embodiment, when the depth of the second groove 163 in the first direction is equal to the thickness of the flat heat pipe 15 in the first direction, the flat heat pipe 15 can be completely accommodated within the second groove 163 in the first direction. In another embodiment, when the depth of the second groove 163 in the first direction is less than the thickness of the flat heat pipe 15 in the first direction, the flat heat pipe 15 can be partially accommodated within the second groove 163 in the first direction.

[0081] In one embodiment, when the flat heat pipe 15 is fully accommodated within the second groove 163 in the first direction, the heat dissipation fins 16 are in contact with the substrate 14.

[0082] In some embodiments, the width of the second groove in the third direction is equal to the width of the plurality of flat heat pipes 15 in the third direction, thereby allowing the plurality of flat heat pipes 15 to be accommodated within the second groove 163.

[0083] In some embodiments, when the flat heat pipe 15 is housed in the second groove 163, the sidewall of the flat heat pipe 15 is in contact with the groove wall of the second groove 163, thereby increasing the contact area between the heat dissipation fins 16 and the flat heat pipe 15 and improving the heat transfer efficiency.

[0084] In this embodiment of the present disclosure, after the second groove is formed on the base plate, the flat heat pipe can be partially accommodated in the second groove in the first direction. This can reduce the distance between the heat dissipation fins and the substrate, improve the compactness of the heat dissipation structure, and increase the contact area between the heat dissipation fins and the flat heat pipe, thereby improving the heat transfer efficiency.

[0085] See also some possible implementations. Figures 5 to 7 As shown, the flat heat pipe 15 may include a first segment 153, a second segment 154, and a third segment 155 connected sequentially along a second direction. The length of the substrate 14 in the second direction is less than the length of the flat heat pipe 15 in the second direction, allowing the first outer wall 151 within the second segment 154 to connect with the second surface. It is understood that the second segment 154 of the flat heat pipe 15 is connected to the substrate 14, and the second segment 154 can be an evaporation segment. The first segment 153 and the third segment 155 connected to the second segment 154 can be condensation segments. That is, after the liquid in the second segment 154 absorbs heat and evaporates, the vapor can flow to the first segment 153 and the third segment 155 respectively. After condensation through the first segment 153 and the third segment 155, the liquid can flow back to the second segment 154. Here, a dual gas-liquid circulation can be formed inside the flat heat pipe 15, thereby improving the heat transfer efficiency of the flat heat pipe 15.

[0086] In some embodiments, the length of the heat dissipation fin 16 in the second direction is greater than the length of the second segment 154 in the second direction, and the second outer wall 152 within the first segment 153, the second segment 154, and the third segment 155 is connected to the heat dissipation fin 16. It is understood that the heat dissipation fin 16 can increase the contact area with the flat heat pipe 15 by connecting the evaporation section and the condensation section of the flat heat pipe 15, thereby improving efficiency.

[0087] In the embodiments disclosed herein, the substrate, flat heat pipe, and heat dissipation fins have reasonable relative dimensions, thereby optimizing the heat dissipation components.

[0088] See also some possible implementations. Figures 5 to 7 As shown, the length of the third segment 155 in the second direction is greater than the length of the first segment 153 in the second direction. In order to keep the flat heat pipe 15 in a horizontal state, the heat dissipation assembly 10 may also include a bracket 17, which can support the flat heat pipe 15 by connecting with the second outer wall 152 inside the third segment 155, so that in the first direction, the mounting height of the flat heat pipe 15 on the bracket 17 is the same as the mounting height of the flat heat pipe 15 on the substrate 14.

[0089] In some embodiments, the connection between the bracket 17 and the flat heat pipe 15 can be realized according to actual needs, and this disclosure does not limit this.

[0090] In some embodiments, the support 17 may include a support rod 171 and a plurality of support columns 172; the extension direction of the support rod 171 may be a third direction, and the width of the support rod 171 in the third direction is equal to the width of the heat dissipation fins 16 in the third direction. One side of the support rod 171 may be connected to the second outer wall 152 of the flat heat pipe 15, and the other side of the support rod 171 may be connected to the plurality of support columns 172. In one embodiment, the plurality of support columns 172 are arranged at intervals along the third direction.

[0091] In this embodiment of the disclosure, the bracket is used to keep the flat heat pipe in a horizontal position, thereby helping to better transfer heat from the inside of the flat heat pipe to the end of the flat heat pipe and improving the uniformity of heat dissipation.

[0092] Secondly, embodiments of this disclosure provide a circuit module. Figure 8 This is a schematic diagram of a circuit module provided in an embodiment of this disclosure. See also... Figures 5 to 8 As shown, the circuit module 20 includes: a circuit board, a heat dissipation assembly 10 as described in any embodiment of the first aspect, and a plurality of connectors 21; wherein a die is mounted on the circuit board. Each of the plurality of connectors 21 fixes the substrate 14 in the heat dissipation assembly 10 and the circuit board, such that the die contacts the first surface of the substrate 14. It is understood that during installation, the connector 21 can pass through the substrate 14 in the heat dissipation assembly 10 and then through the circuit board to fix the heat dissipation assembly 10 and the circuit board. Here, the die should face the direction of the heat dissipation assembly 10. The die can act as a heat source. After the die contacts the first surface of the substrate 14 in the heat dissipation assembly 10, the heat generated by the die can be transferred to the substrate 14, the flat heat pipe 15, and the heat dissipation fins 16, thereby achieving heat dissipation.

[0093] In some embodiments, a circuit board, also referred to as a circuit board substrate or substrate, refers to a bare circuit board, the circuit board before components are soldered.

[0094] In some embodiments, a bare die, also known as a chip die, refers to a chip before it is packaged; it is a small piece cut from a silicon wafer using a laser. A complete integrated circuit is contained within a bare die; each bare die is an independent functional chip. Because bare dies are made of semiconductor materials, primarily silicon, they are relatively fragile and easily damaged under significant external force. Therefore, the connector 21 can be an elastic connector, thereby fixing the substrate 14 and the circuit board in the heat dissipation assembly 10 in a secure connection. This ensures that the pressure between the substrate 14 and the bare die is neither too high, damaging the bare die, nor too low, reducing the heat dissipation effect.

[0095] In some embodiments, the substrate 14 is provided with mounting holes, and the connector 21 connects the heat dissipation assembly 10 and the circuit board through the mounting holes. It should be noted that the flat heat pipe 15 and heat dissipation fins 16 are not provided at the location of the mounting holes.

[0096] In some embodiments, the connector 21 may include a screw, an elastic element sleeved around the screw, and a nut. It is understood that the screw passes through the substrate 14 in a first direction, the elastic element sleeved around the screw abuts against the substrate 14, and then, after the screw continues to pass through the circuit board in the first direction, it can be threadedly connected to the nut, thereby achieving a fixed connection between the heat dissipation assembly 10 and the circuit board.

[0097] In one embodiment, Figure 9 Temperature cloud map of a circuit module provided in an embodiment of this disclosure. Figure 10 A temperature cloud map of a circuit module provided in an embodiment of this disclosure. Figure 9 The image shows the temperature cloud map of the circuit module in the "heat pipe cooling solution". It can be seen that its temperature range is 45-82.4℃. Figure 10 The image shows the temperature cloud map of the circuit module in the "novel heat pipe cooling solution," indicating a temperature range of 45-78.3℃. The results show that the chip temperature in the circuit module of the "heat pipe cooling solution" is 82.4℃ (i.e., TPU = 82.4℃), while the chip temperature in the "novel heat pipe cooling solution" is 78.2℃ (i.e., TPU = 78.2℃). This demonstrates that the heat dissipation component in the "novel heat pipe cooling solution" can better transfer heat from the chip's heat source to the more distant condensation section, maximizing the utilization of the heat sink fins and reducing the chip junction temperature by approximately 5 degrees Celsius. Furthermore, the heat dissipation component in the "novel heat pipe cooling solution" can reduce manufacturing costs while ensuring heat dissipation, which is of significant importance for product development and design.

[0098] In this embodiment, the substrate in the heat dissipation assembly contacts the bare die on the circuit board. The thermal conductivity of the substrate allows for the uniform distribution of heat generated by the bare die. Then, a flat heat pipe connected to the substrate absorbs the heat, resulting in a gas-liquid phase change that transfers the heat to the heat dissipation fins. Finally, the heat is dissipated by the heat dissipation fins exchanging heat with the air. The flat heat pipe is arranged parallel to the substrate, avoiding any angle or bends. This facilitates rapid flow of gas and liquid within the flat heat pipe, improving its heat transfer efficiency. Furthermore, the avoidance of bends reduces the contact area between the heat dissipation fins and the flat heat pipe, thereby enhancing the efficiency of the heat dissipation assembly in cooling the heat source.

[0099] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0100] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A heat dissipation component, characterized in that, include: The substrate has a first surface and a second surface disposed opposite to each other, wherein the first surface is in contact with a heat source; A flat heat pipe is arranged parallel to the substrate; The flat heat pipe includes: a first outer wall connected to the second surface, a second outer wall disposed opposite to the first outer wall, and a side wall connecting the first outer wall and the second outer wall; the first outer wall, the second outer wall, and the side wall enclose a sealed cavity, and the sealed cavity contains a phase change liquid; Heat dissipation fins are connected to the second outer wall.

2. The heat dissipation assembly according to claim 1, characterized in that, The area of ​​the flat heat pipe's cross-section along the first direction is smaller than the area of ​​the flat heat pipe's cross-section along the second direction, wherein the first direction is the direction of travel from the first outer wall to the second outer wall, and the second direction is perpendicular to the first direction.

3. The heat dissipation assembly according to claim 1, characterized in that: The length of the heat dissipation fins in the second direction is positively correlated with the length of the flat heat pipe in the second direction, wherein the second direction is the length direction of the flat heat pipe.

4. The heat dissipation assembly according to claim 3, characterized in that, The flat heat pipe includes multiple flat heat pipes; The plurality of flat heat pipes are arranged at intervals in a third direction, and the width of the heat dissipation fins in the third direction is greater than or equal to the width of the plurality of flat heat pipes in the third direction; wherein, the third direction is perpendicular to the second direction.

5. The heat dissipation assembly according to claim 1, characterized in that, A first groove is formed on the second surface; the projection of the flat heat pipe toward the substrate falls into the projection of the first groove toward the substrate; The flat heat pipe is at least partially housed within the first groove in a first direction and is connected to the first groove.

6. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation fins include: The base plate is connected to the second outer wall; Multiple individual fins connected to the base plate, wherein the multiple individual fins are arranged at intervals along a second direction, the second direction being perpendicular to a first direction, the first direction being the direction of travel from the first outer wall to the second outer wall.

7. The heat dissipation assembly according to claim 6, characterized in that, A second groove is formed on the surface of the base plate facing the flat heat pipe; the projection of the flat heat pipe toward the heat dissipation fins falls into the projection of the second groove toward the heat dissipation fins. The flat heat pipe is at least partially housed within the second groove in the first direction and is connected to the second groove.

8. The heat dissipation assembly according to claim 1, characterized in that, The flat heat pipe includes: a first section, a second section, and a third section connected sequentially along a second direction; Wherein, the length of the substrate in the second direction is less than the length of the flat heat pipe in the second direction, and the first outer wall in the second segment is connected to the second surface; The length of the heat dissipation fin in the second direction is greater than the length of the second segment in the second direction, and the second outer wall of the first segment, the second segment and the third segment is connected to the heat dissipation fin.

9. The heat dissipation assembly according to claim 8, characterized in that, The length of the third segment in the second direction is greater than the length of the first segment in the second direction; The heat dissipation component also includes: The bracket is connected to the second outer wall within the third segment; In the first direction, the mounting height of the flat heat pipe on the support is the same as the mounting height of the flat heat pipe on the substrate.

10. A circuit module, characterized in that, include: Circuit board, heat dissipation assembly as described in any one of claims 1 to 9, and a plurality of connectors; The circuit board has a die mounted on it; each of the plurality of connectors fixes the substrate and the circuit board in the heat dissipation assembly; the die is in contact with the first surface of the substrate.

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