Multi-layer board pressing and positioning structure

By setting composite positioning posts on the inner core of the multilayer board and using plastic rods and metal layers to form a cap, the problem of poor alignment effect of multilayer board pressing is solved, the alignment accuracy and positioning strength are improved, and the production efficiency and product quality are increased.

CN224249935UActive Publication Date: 2026-05-15CHIN POON CHANGSHU ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHIN POON CHANGSHU ELECTRONICS CO LTD
Filing Date
2025-04-02
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

The existing multilayer board lamination alignment effect is poor, and the fixing structure of the riveting machine/hot melt machine has problems such as short rivet chips and copper PAD affecting the layout utilization rate and limited alignment ability.

Method used

The composite positioning post consists of a plastic rod and a metal layer. The plastic rod has rivet holes at both ends, which are heated and pressurized to form a cap, fixing the inner core board of the multilayer board and ensuring alignment accuracy and positioning strength.

Benefits of technology

This improved the alignment accuracy between layers of multilayer boards, increased production efficiency and product quality, avoided rivet hole problems, and enhanced fixing strength.

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Abstract

The utility model provides a multilayer board press fit positioning structure, and relates to the technical field of multilayer board press fit, the multilayer board press fit positioning structure comprises multilayer board inner layer core boards which are arranged in an aligned and stacked mode, riveting holes are formed in the multilayer board inner layer core boards, composite positioning columns are arranged in the riveting holes, and each composite positioning column is composed of a plastic rod and a metal layer wrapping the outer side of the plastic rod; the utility model has the advantages that the structure is simple, the design is reasonable, the inner-layer core plates of the multi-layer plate are arranged in an alignment and stacking way, the alignment accuracy of the multi-layer plate is ensured, and meanwhile, the composite positioning columns are arranged in the riveting holes, so that the production efficiency is improved, and the production cost is reduced. Wherein the metal layer can ensure the positioning strength, and the plastic rod is heated, pressurized and melted up and down to form a cap for fixing the multi-layer board, so that the inner core board of the multi-layer board can be better fixed, the alignment precision among the layers in the pressing process is ensured, and the production efficiency and the product quality are improved.
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Description

Technical Field

[0001] This application relates to the field of multilayer board lamination technology, and more specifically, to a multilayer board lamination positioning structure. Background Technology

[0002] As modern electronic products become increasingly complex in their electrical characteristics and the resulting high requirements for power supply and signal transmission, the number of layers on PCBs is increasing in manufacturing processes, thus creating requirements for multilayer board fixing methods.

[0003] The existing multilayer board lamination and alignment uses a riveting machine / hot melt machine to fix the inner core. This fixing structure has the following disadvantages: ① The riveting structure is prone to riveting debris, which can cause internal shortness, and the riveting holes contain chemicals that need to be removed. In addition, the loose pin method of riveting has limited alignment capability; ② The hot melt method requires copper pads of a certain size for hot melting, which affects the layout utilization rate. In addition, the loose pin method of hot melt pre-stack has limited alignment capability.

[0004] Therefore, this application aims to provide a multilayer board pressing and positioning structure to better solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a multilayer board pressing and positioning structure that can solve the technical problem of poor alignment effect of multilayer board pressing.

[0006] This application provides a multilayer board pressing and positioning structure, including an inner core board of multilayer boards stacked in alignment. The inner core board of multilayer boards has a riveting hole, and a composite positioning post is provided in the riveting hole. The composite positioning post is composed of a plastic rod and a metal layer covering the outside of the plastic rod. The two ends of the plastic rod extend out of the riveting hole and are heated and pressed from above and below to form a cap to fix the inner core board of multilayer boards.

[0007] Furthermore, the metal layer is configured as a metal collar.

[0008] Furthermore, the height of the metal collar does not exceed the height of the riveting hole.

[0009] Furthermore, the thickness of the metal collar is set to 1 / 8 to 1 / 10 of the diameter of the plastic rod.

[0010] Furthermore, the plastic rod is made of heat-resistant, high-strength plastic material such as a solid PEek rod.

[0011] Furthermore, the riveting hole is located at the center of the inner core board of the multilayer board.

[0012] Furthermore, the diameter of the riveting hole is set to 2.0 mm.

[0013] Furthermore, the outer diameter of the composite positioning post is matched with the diameter of the riveting hole.

[0014] The beneficial effects of this utility model are:

[0015] This utility model provides a multilayer board pressing and positioning structure, including an inner core board of a multilayer board stacked in alignment. The inner core board has riveting holes, and a composite positioning post is provided within each riveting hole. The composite positioning post consists of a plastic rod and a metal layer covering the outside of the plastic rod. Both ends of the plastic rod extend out of the riveting holes and are heated and pressed from above and below to form a cap, thus fixing the inner core board of the multilayer board. This utility model has a simple structure and reasonable design. By stacking the inner core boards of the multilayer board in alignment, the alignment accuracy between the multilayer boards is ensured. Simultaneously, the composite positioning post in the riveting hole, with its metal layer ensuring positioning strength, and the plastic rod melting under heating and pressure to form a cap for fixing the multilayer board, achieves better fixation of the inner core board of the multilayer board. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 These are schematic diagrams of the structure in some embodiments of this utility model;

[0018] Figure 2 This is a schematic diagram of the hot-pressing process for forming the cap in some embodiments of the present invention;

[0019] Figure 3 This is a schematic diagram of the composite positioning column in some embodiments of the present invention;

[0020] Figure 4 for Figure 3 A structural diagram from another perspective.

[0021] The reference numerals in the attached figures are as follows:

[0022] Multilayer board inner core board 1, riveting hole 2, composite positioning post 3, plastic rod 4, metal layer 5, cap 6, hot pressing mechanism-A. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0028] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] See Figures 1-4As shown, the multilayer board pressing and positioning structure described in this embodiment includes an inner core board 1 of a multilayer board stacked in alignment. The inner core board 1 of the multilayer board is provided with a riveting hole 2. A composite positioning post 3 is provided in the riveting hole 2. The composite positioning post 3 is composed of a plastic rod 4 and a metal layer 5 covering the outside of the plastic rod 4. The two ends of the plastic rod 4 extend out of the riveting hole 2 and are heated and pressed from above and below to form a cap 6, which fixes the inner core board 1 of the multilayer board.

[0030] This embodiment has a simple structure and reasonable design. By stacking and aligning the inner core board 1 of the multilayer board, the alignment accuracy between the layers of the multilayer board is ensured. At the same time, a composite positioning post 3 is set in the riveting hole 2. The metal layer 5 in the post ensures its positioning strength. The plastic rod 4 is melted by heating and pressing from the top and bottom to form a cap 6 that fixes the multilayer board, thereby achieving better fixation of the inner core board 1 of the multilayer board and ensuring the alignment accuracy between the layers during the pressing process, thereby improving production efficiency and product quality.

[0031] In this embodiment, the alignment and stacking of the inner core board 1 of the multilayer board can be achieved by CCD alignment and stacking to improve the alignment accuracy between layers, reduce the alignment deviation of the composite positioning post 1 implanted at the back end, and thus ensure positioning accuracy.

[0032] In some specific embodiments, the metal layer 5 is configured as a metal collar.

[0033] Specifically, the height of the metal collar does not exceed the height of the rivet hole 2.

[0034] Specifically, the thickness of the metal collar is set to 1 / 8 to 1 / 10 of the diameter of the plastic rod 4.

[0035] Specifically, the plastic rod 4 is a solid peek rod.

[0036] In this embodiment, the metal layer 5 is specifically shown as a metal collar, which can be easily fitted onto the outside of the plastic rod 4. The height of the metal collar is set to not exceed the height of the riveting hole 2, mainly to avoid affecting the hot pressing process. The plastic rod 4 extends from both ends of the inner core board 1 of the multilayer board and is hot-melted to better form the fixing cap 6. In specific applications, the cap 6 can be formed by hot pressing for 5-10 seconds. A solid PEEK rod, i.e., a solid polyetheretherketone rod, is used. It has good dimensional stability and high fracture toughness, and is not easily broken when subjected to impact or vibration, which can ensure the reliability of fixing the inner core board 1 of the multilayer board. In other embodiments, it can also be selectively set as a heat-resistant high-strength plastic material.

[0037] In some embodiments, the riveting hole 2 is located at the center of the inner core board 1 of the multilayer board.

[0038] Specifically, the diameter of the riveting hole 2 is set to 2.0 mm.

[0039] Specifically, the outer diameter of the composite positioning post 3 is matched with the diameter of the riveting hole 2.

[0040] This embodiment specifically shows the setting position and diameter of the riveting hole 2, so as to reduce the board edge and improve the board edge utilization while ensuring positioning strength. In addition, this embodiment uses a composite positioning post 3, which eliminates the need to remove the rivet and avoids the dry film being suspended, thereby improving the processing yield of multilayer boards.

[0041] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A multi-layer plate pressing and positioning structure, characterized in that: The product includes a multilayer core board with a stacked arrangement. The multilayer core board has a riveting hole and a composite positioning post in the riveting hole. The composite positioning post is composed of a plastic rod and a metal layer covering the outside of the plastic rod. The two ends of the plastic rod extend out of the riveting hole and are heated and pressed from above and below to form a cap to fix the multilayer core board.

2. The multi-layer plate pressing and positioning structure according to claim 1, characterized in that: The metal layer is configured as a metal collar.

3. The multi-layer plate pressing and positioning structure according to claim 2, characterized in that: The height of the metal collar does not exceed the height of the riveting hole.

4. The multi-layer plate pressing and positioning structure according to claim 2, characterized in that: The thickness of the metal collar is set to 1 / 8 to 1 / 10 of the diameter of the plastic rod.

5. The multi-layer plate pressing and positioning structure according to claim 1, characterized in that: The plastic rod is made of solid PEek rod material.

6. The multi-layer plate pressing and positioning structure according to claim 1, characterized in that: The riveting hole is located at the center of the inner core of the multilayer board.

7. The multi-layer plate pressing and positioning structure according to claim 1, characterized in that: The diameter of the rivet hole is set to 2.0 mm.

8. The multi-layer plate pressing and positioning structure according to claim 7, characterized in that: The outer diameter of the composite positioning post is set to match the diameter of the riveting hole.