Power conversion device

Abstract

The utility model provides a power conversion device. The power conversion device comprises a housing; the partition plate is arranged in the shell and divides the space in the shell into a first containing cavity and a second containing cavity, and a communicating hole is formed in the partition plate so as to communicate the first containing cavity with the second containing cavity; the power semiconductor device is mounted in the second accommodating cavity; at least part of the first heat dissipation device is installed in the first containing cavity, and the first heat dissipation device makes contact with the power semiconductor device at the communicating hole; at least part of the second heat dissipation device is installed in the second containing cavity, and the second heat dissipation device makes contact with the first heat dissipation device at the communicating hole; the first fan is mounted in the second accommodating cavity; the second fan is mounted in the second accommodating cavity; the first fan discharges air towards the first side of the second containing cavity, the second fan discharges air towards the second side of the second containing cavity, and the first side and the second side are arranged oppositely or form a preset angle. According to the structure, the heat dissipation efficiency of the power conversion equipment can be improved while the overall layout is not influenced.

Description

Technical Field

[0001] This application relates to the field of energy technology, and more specifically, to a power conversion device. Background Technology

[0002] In the relevant solutions, the heat dissipation efficiency of the power conversion equipment is relatively low. In order to improve the performance of the power conversion equipment, its heat dissipation efficiency needs to be further improved.

[0003] Therefore, improving the heat dissipation efficiency of power conversion equipment has become an urgent problem to be solved. Utility Model Content

[0004] The present invention aims to at least solve the technical problem of low heat dissipation efficiency of power conversion devices in the prior art or related technologies.

[0005] Therefore, the first objective of this invention is to provide a power conversion device.

[0006] To achieve the above objectives, embodiments of this utility model provide a power conversion device, comprising: a housing; a partition disposed within the housing, dividing the space within the housing into a first receiving cavity and a second receiving cavity, the partition having a connecting hole to connect the first receiving cavity and the second receiving cavity; a power semiconductor device installed in the second receiving cavity; a first heat dissipation device at least partially installed in the first receiving cavity and in contact with the power semiconductor device at the connecting hole; a second heat dissipation device at least partially installed in the second receiving cavity and in contact with the first heat dissipation device at the connecting hole; a first fan installed in the second receiving cavity; and a second fan installed in the second receiving cavity; wherein the first fan exhausts air towards a first side of the second receiving cavity, and the second fan exhausts air towards a second side of the second receiving cavity, the first side and the second side being opposite sides or the first side and the second side forming a preset angle.

[0007] The power conversion device provided by this utility model can specifically be an inverter or an energy storage converter. The power conversion device includes a housing, inside which a partition is provided, forming two independent first and second accommodating cavities. The first accommodating cavity, also called a heat dissipation cavity, primarily serves to dissipate heat from the components in the second accommodating cavity. The second accommodating cavity, also called a power cavity, primarily houses and installs power devices such as power semiconductor devices, capacitors, electronic devices, and magnetic devices. A first heat dissipation device is installed in the first accommodating cavity, possibly partially installed within a connecting hole. The power semiconductor devices are installed in the second accommodating cavity and in contact with the first heat dissipation device, allowing heat from the power semiconductor devices to be transferred to and dissipated by the first heat dissipation device. A second heat dissipation device is partially or completely installed in the second accommodating cavity and also in contact with the first heat dissipation device, allowing heat from the second heat dissipation device to be transferred to and dissipated by the first heat dissipation device. A first and a second fan are installed in the second accommodating cavity to circulate air within it, thus transferring heat from the second accommodating cavity to the second heat dissipation device, which then dissipates the heat. By setting up a second heat dissipation device, the heat of the high-temperature gas inside the second housing cavity can be effectively transferred to the outside, so that the interior of the second housing cavity can also dissipate heat. Moreover, since this setting only requires the addition of a small second heat dissipation device, it will not affect the overall structural layout of the power conversion equipment. In this way, the heat dissipation efficiency of the power conversion equipment can be improved without affecting the overall layout, especially the heat dissipation efficiency of the second housing cavity (power cavity).

[0008] In this design, the first fan exhausts air towards a first side, and the second fan exhausts air towards a second side. The first and second sides are different sides. For example, the first and second sides can be opposite each other or at an angle. This structure ensures that the first and second fans exhaust air in different directions; they do not exhaust air in the same direction. Specifically, the second fan can be installed separately, positioned close to the second heat dissipation device to ensure effective airflow through the second heat dissipation device. Alternatively, the first and second fans can be installed simultaneously, allowing them to work together to create internal airflow and enhance the heat dissipation effect of the second heat dissipation device.

[0009] In this design, the first and second fans have opposite airflow directions, meaning they discharge air towards each other, for example, at a 180° angle. This arrangement is more conducive to air convection and circulation. Of course, the first and second fans can also be set to a 90° angle.

[0010] In any of the above embodiments, optionally, the first fan and the second fan are staggered relative to each other along the height direction of the power conversion device.

[0011] In this embodiment, the first fan and the second fan are staggered in height, that is, one of the first fan and the second fan is installed at a higher position and the other is installed at a lower position. In this way, the first fan and the second fan can make more airflow circulate, so that more air can participate in the heat exchange process with the second heat dissipation device, which can improve the heat dissipation efficiency of the second heat dissipation device.

[0012] In any of the above embodiments, optionally, an opening communicating with the second receiving cavity is provided on one side of the outer casing, and the opening can be opened and closed. The first receiving cavity is located on the other side of the second receiving cavity opposite to the opening. Specifically, the opening can be provided on the front side of the outer casing, and the first receiving cavity can be located on the rear side of the second receiving cavity. That is, the first receiving cavity and the second receiving cavity are arranged in a front-rear direction.

[0013] In any of the above embodiments, optionally, the first fan is disposed near one of the two sides of the second receiving cavity that are disposed opposite each other in the width direction, and the second fan is disposed near the other side of the two sides of the second receiving cavity that are disposed opposite each other in the width direction.

[0014] In this embodiment, the width of the second receiving cavity is in the left-right direction of the power conversion device. The first fan and the second fan are horizontally positioned on the left and right sides of the second receiving cavity, meaning they are positioned relatively close to the edges. This increases the effective range of the first and second fans, allowing for air circulation in most areas of the second receiving cavity, thus improving heat dissipation. Specifically, the first fan can be located on the upper left side of the second receiving cavity, and the second fan can be located on the middle right side of the second receiving cavity.

[0015] In any of the above embodiments, optionally, the second heat dissipation device is located on the air outlet side of the second fan, and the second fan can deliver air to the second heat dissipation device; or the second heat dissipation device is located on the air inlet side of the second fan, and the second fan can draw air from the second heat dissipation device.

[0016] In this embodiment, the second fan directs airflow through the second heat dissipation device. To ensure that more gas in the second receiving cavity passes through the second heat dissipation device when the second fan is operating, the second heat dissipation device can be positioned on the outlet side (positive pressure side) of the second fan to direct airflow through it via positive pressure. Alternatively, the second heat dissipation device can be positioned on the inlet side (negative pressure side) of the second fan to direct airflow through it via negative pressure suction. The specific installation position of the second fan can be rationally determined based on the structural layout of the second receiving cavity. This structure, placing the second heat dissipation device close to the second fan, allows more gas in the second receiving cavity to pass through it, thus improving the heat dissipation efficiency of the second receiving cavity.

[0017] In any of the above embodiments, the power conversion device may optionally include: a guide air duct disposed between the second fan and the second heat dissipation device, wherein the second fan supplies air to the second heat dissipation device through the guide air duct, or the second heat dissipation device draws air through the guide air duct.

[0018] In this embodiment, by guiding the airflow, the force of the second fan drawing air from or sending air to the second heat dissipation device can be increased, so that more air generated by the second fan can flow through the second heat dissipation device. This can enhance the heat exchange effect between the gas in the second cavity and the second heat dissipation device, and improve the heat dissipation efficiency of the second heat dissipation device on the second cavity.

[0019] In any of the above embodiments, optionally, the second receiving cavity includes a first sidewall and a second sidewall disposed along the height direction of the power conversion device, and the first fan is disposed close to the first sidewall. Further, the power conversion device also includes a baffle plate installed within the second receiving cavity, located on the air inlet side of the first fan, and the baffle plate is located along the height direction on the side of the first fan away from the first sidewall; the power conversion device also includes a bus capacitor disposed between the baffle plate and the first sidewall, and located on the air inlet side of the first fan.

[0020] In this embodiment, the height direction can specifically refer to the height direction of the power conversion device. The first and second side walls of the second receiving cavity are the bottom and top walls of the second receiving cavity, respectively. The first fan can be positioned close to the top or bottom wall of the second receiving cavity, meaning the first fan is offset from the center along the height direction. The baffle, part of the inner wall of the second receiving cavity, and the first fan can enclose a space for accommodating the bus capacitor. With this structure, by providing a baffle for blocking airflow on one side of the bus capacitor, an air duct can be formed between the bus capacitor and the first fan. Through this air duct, the suction force of the first fan from the bus capacitor can be increased, thereby increasing the airflow speed near the bus capacitor, improving the heat exchange effect between the bus capacitor and the air, and thus improving the heat dissipation effect of the first fan on the bus capacitor.

[0021] In any of the above embodiments, optionally, the outer casing is provided with an air inlet and an air outlet communicating with the first receiving cavity, and the power conversion device further includes: a third fan, installed in the first receiving cavity, for allowing air from outside the outer casing to enter the first receiving cavity through the air inlet, and after passing through the first heat dissipation device, to be discharged through the air outlet.

[0022] In this embodiment, external cold air enters the first receiving cavity (also called the heat dissipation cavity) through the air inlet, and then exchanges heat with the components (such as the first heat dissipation device) inside the first receiving cavity to cool the components inside the first receiving cavity. The hot air after heat exchange can be discharged outside the first receiving cavity through the air outlet, thus carrying away the heat inside the first receiving cavity and achieving heat dissipation of the first receiving cavity.

[0023] In any of the above embodiments, optionally, the power conversion device further includes: a first power inductor and a second power inductor, the first power inductor and the second power inductor being installed in the first receiving cavity and located on the airflow path formed by the third fan, and the first power inductor and the second power inductor being located on both sides of the first heat dissipation device along the height direction of the power conversion device, and being spaced apart from the first heat dissipation device.

[0024] In this embodiment, the third fan can dissipate heat from the first power inductor and the second power inductor. To ensure effective heat dissipation of the first and second power inductors, the first and second power inductors can be respectively positioned on both sides of the first heat dissipation device along the height direction.

[0025] In any of the above embodiments, optionally, one of the air inlet and the air outlet is disposed near the top of the first receiving cavity along the height direction of the power conversion device, and the other of the air inlet and the air outlet is disposed near the bottom of the first receiving cavity; or the air inlet is disposed at the part of the first receiving cavity opposite to the partition, and the third fan is disposed between the air inlet and the first heat dissipation device, and is capable of discharging air toward the first heat dissipation device; the air outlet includes a first air outlet and a second air outlet, the first air outlet is disposed on one side of the first heat dissipation device along the height direction of the power conversion device, and the second air outlet is disposed on the other side of the first heat dissipation device along the height direction of the power conversion device.

[0026] In this embodiment, an air inlet and an air outlet can be respectively provided near the top and bottom of the first receiving cavity (also called a heat dissipation cavity), so that external cold air can flow along the height direction of the power conversion device. In this scheme, a third fan can be set between the air inlet and a power inductor (specifically a first power inductor or a second power inductor) located near the air inlet. This allows the airflow entering from the air inlet to first pass through a power inductor, then sequentially through the third fan, the first heat dissipation device, and the other power inductor, and finally be discharged from the air outlet.

[0027] In another specific embodiment, the air inlet is located in the middle of the back of the first receiving cavity (specifically, on the side of the first receiving cavity opposite to the partition), and the third fan is located on the side of the first heat dissipation device away from the partition, that is, the third fan and the partition are located opposite each other on both sides of the first heat dissipation device. In this embodiment, external air enters from the middle of the back of the first receiving cavity, passes laterally through the first heat dissipation device, and then splits into two parts along the height direction. One part of the airflow flows upward along the height direction through a power inductor and is discharged from one of the air outlets (such as the first air outlet), while the other part of the airflow flows downward along the height direction through another power inductor and is discharged from another air outlet (such as the second air outlet).

[0028] In any of the above embodiments, optionally, the first heat dissipation device includes: a first heat dissipation component, which contacts the power semiconductor device at the connecting hole and is used to dissipate heat from the power semiconductor device; and a second heat dissipation component, which contacts the second heat dissipation device at the connecting hole and is used to dissipate heat from the second receiving cavity; wherein the first heat dissipation component and the second heat dissipation component are the same heat dissipation component, or the first heat dissipation component and the second heat dissipation component are independently arranged.

[0029] In this embodiment, a large heat dissipation device can be used to dissipate heat from the power semiconductor device and the second heat dissipation device. In this case, the first heat dissipation device and the second heat dissipation device are the same heat dissipation device, making the external heat dissipation components a single unit. To dissipate heat from the power semiconductor device and the second heat dissipation device separately, the first heat dissipation device can be configured as two independent heat dissipation devices (i.e., the first heat dissipation device and the second heat dissipation device). This allows the heat dissipation of the second heat dissipation device to be independent of the heat dissipation device of the power semiconductor device, making the arrangement of the second heat dissipation device more flexible.

[0030] The connecting hole can be one large hole or two small holes. For example, when the first heat sink and the second heat sink are the same heat sink, the connecting hole can be set as one large hole. When the first heat sink is configured as two independent first heat sinks and second heat sinks, a connecting hole can be set for each of the first and second heat sinks.

[0031] In any of the above embodiments, the power conversion device may optionally include an inverter and / or an energy storage converter. That is, both the inverter and the energy storage converter can use the heat dissipation structure proposed in this application for heat dissipation.

[0032] Additional aspects and advantages of this invention will become apparent in the description that follows, or may be learned by practice of this invention. Attached Figure Description

[0033] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0034] Figure 1 This is one of the structural schematic diagrams of the power conversion device after the cover is opened in the embodiments of this utility model;

[0035] Figure 2 This is a schematic diagram of the structure of the power conversion device in an embodiment of this utility model, after hiding the circuit board and the components above it.

[0036] Figure 3 This is the second schematic diagram of the power conversion device after the cover is opened in an embodiment of this utility model;

[0037] Figure 4 yes Figure 3 Cross-sectional view along the AA direction;

[0038] Figure 5 yes Figure 3 Cross-sectional view along the middle BB direction;

[0039] Figure 6 This is one of the partial structural schematic diagrams of the power conversion device in the embodiments of this utility model;

[0040] Figure 7 This is a second partial structural schematic diagram of the power conversion device in an embodiment of this utility model;

[0041] Figure 8 This is the third partial structural schematic diagram of the power conversion device in the embodiments of this utility model;

[0042] Figure 9 This is the fourth partial structural schematic diagram of the power conversion device in the embodiments of this utility model.

[0043] in, Figures 1 to 9 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0044] 10. Enclosure, 101. Outer shell, 1012. Air inlet, 1014. Air outlet, 10142. First air outlet, 10144. Second air outlet, 1016. First side wall, 1018. Second side wall, 102. Partition, 1022. Connecting hole, 104. First receiving cavity, 106. Second receiving cavity, 201. Second fan, 202. First fan, 30. Second heat dissipation device, 40. First heat dissipation device, 402. First heat sink, 404. Second heat sink, 50. Baffle, 60. Power semiconductor device, 702. Bus capacitor, 704. Electronic device, 706. Magnetic device, 801. First power inductor, 802. Second power inductor, 90. Third fan, 11. Air duct. Detailed Implementation

[0045] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0046] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0047] The following reference Figures 1 to 9 This application describes the power conversion device provided in the embodiments of the present application.

[0048] like Figures 1 to 9 As shown, an embodiment of this utility model provides a power conversion device, including a housing 101, a partition 102, a first heat dissipation device 40, a second heat dissipation device 30, a power semiconductor device 60, a first fan 202, and a second fan 201. The partition 102 is disposed within the housing 101, dividing the space within the housing 101 into a first receiving cavity 104 and a second receiving cavity 106. A connecting hole 1022 is provided on the partition 102 to connect the first receiving cavity 104 and the second receiving cavity 106. The power semiconductor device 60 is installed within the second receiving cavity 106. The first heat dissipation device 40 is at least partially installed within the first receiving cavity 104 and is in direct or indirect contact with the power semiconductor device 60 at the connecting hole 1022. The first heat dissipation device 40 and the power semiconductor device 60 can be in direct contact, or thermal conductive adhesive can be provided between them to enhance heat conduction. The second heat dissipation device 30 is at least partially installed within the second receiving cavity 106 and is in direct or indirect contact with the first heat dissipation device 40 at the connecting hole 1022. Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the first fan 202 is installed within the second receiving cavity 106. The second fan 201 is also installed within the second receiving cavity 106. Further, the first fan 202 faces a first side of the second receiving cavity 106 (e.g., Figure 2 Air is discharged from the left side of the second receiving cavity 106, and the second fan 201 is directed toward the second side of the second receiving cavity 106 (e.g., the left side). Figure 2 Air is discharged from the right side of the second accommodating cavity 106. The first side and the second side are opposite to each other or the first side and the second side are at a preset angle (the angle is greater than 0 and less than 180°).

[0049] The power conversion device provided by this utility model can be specifically an inverter or an energy storage converter. The power conversion device includes a housing 101, within which a partition 102 is provided. The partition 102 separates two independent accommodating cavities: a first accommodating cavity 104 and a second accommodating cavity 106. The first accommodating cavity 104, also called a heat dissipation cavity, primarily serves to dissipate heat from the components within the second accommodating cavity 106. The second accommodating cavity 106, also called a power cavity, primarily accommodates and mounts power semiconductor devices 60, capacitors (bus capacitors 702), electronic devices 704, and magnetic devices 706, among other power devices. A first heat dissipation device 40 is installed within the first accommodating cavity 104, and can be partially installed within the connecting hole 1022. The power semiconductor device 60 is installed within the second accommodating cavity 106 and is in contact with the first heat dissipation device 40. In this way, the heat from the power semiconductor device 60 can be transferred to the first heat dissipation device 40 and dissipated through it. The second heat dissipation device 30 is partially or entirely installed inside the second receiving cavity 106 and is also in contact with the first heat dissipation device 40. The heat from the second heat dissipation device 30 can be transferred to the first heat dissipation device 40 and dissipated through it. The first fan 202 and the second fan 201 are installed inside the second receiving cavity 106 to circulate the air within it. This allows the heat inside the second receiving cavity 106 to be transferred to the second heat dissipation device 30 via the air, and then dissipated by the second heat dissipation device 30 and the first heat dissipation device 40. By setting up the second heat dissipation device 30, the heat of the high-temperature gas inside the second receiving cavity 106 can be effectively transferred to the outside, enabling heat dissipation within the second receiving cavity 106 as well. Furthermore, since this setup only requires adding a small second heat dissipation device 30, it does not affect the overall structural layout of the power conversion equipment. Therefore, it improves the heat dissipation efficiency of the power conversion equipment, especially the heat dissipation efficiency of the second receiving cavity 106 (power cavity), without affecting the overall layout.

[0050] In one specific embodiment, the outer casing 101 includes a first housing, which forms a second receiving cavity 106. A heat dissipation shroud can be disposed on the outside of the first housing, forming the first receiving cavity 104 together with the housing. In this embodiment, the partition is the wall of the first housing.

[0051] In one specific embodiment, the outer casing 101 includes a second box or cabinet, and a partition is provided inside the second box or cabinet to divide the second box or cabinet into two cavities.

[0052] Furthermore, the first heat dissipation device 40 includes a substrate, and the power semiconductor device 60 is directly or indirectly attached to the substrate. The second heat dissipation device 30 is directly or indirectly attached to the substrate. Furthermore, the first heat dissipation device 40 also includes heat dissipation structures such as heat dissipation fins.

[0053] In this configuration, the first fan 202 exhausts air towards a first side, while the second fan 201 exhausts air towards a second side. The first and second sides are different sides. For example, they can be opposite each other or at an angle. This structure ensures that the airflow directions of the first fan 202 and the second fan 201 are different; they do not exhaust air in the same direction. Specifically, the second fan 201 can be installed alone, positioned close to the second heat dissipation device 30 to allow the hot airflow from the second receiving cavity 106 to effectively pass through it. Alternatively, the first fan 202 and the second fan 201 can be installed simultaneously, allowing them to work together to create internal circulating turbulence, thus enhancing the heat dissipation effect of the second receiving cavity 106.

[0054] In this design, the air outlet directions of the first fan 202 and the second fan 201 are opposite, meaning they outlet air towards each other; for example, the air outlet directions of the first fan 202 and the second fan 201 are at 180°. This arrangement is more conducive to air convection circulation. Of course, the air outlet directions of the first fan 202 and the second fan 201 can also be set at 90°.

[0055] In any of the above embodiments, optionally, as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the first fan 202 and the second fan 201 are offset from each other along the height direction of the power conversion device.

[0056] In this embodiment, the first fan 202 and the second fan 201 are staggered in height, that is, one of the first fan 202 and the second fan 201 is installed at a higher position and the other is installed at a lower position. In this way, the first fan 202 and the second fan 201 can make more airflow circulate, so that more air can participate in the heat exchange process with the second heat dissipation device 30, which can improve the heat dissipation efficiency of the second heat dissipation device 30.

[0057] In any of the above embodiments, optionally, as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, an opening communicating with the second receiving cavity 106 is provided on one side of the outer casing 101, and the opening can be opened and closed. The first receiving cavity 104 is provided on the other side of the second receiving cavity 106 opposite to the opening. Specifically, the opening can be provided on the front side of the outer casing 101, and the first receiving cavity 104 can be provided on the rear side of the second receiving cavity 106. That is, the first receiving cavity 104 and the second receiving cavity 106 are arranged in the front-back direction.

[0058] In any of the above embodiments, optionally, as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the first fan 202 is disposed near one of the two sides of the second receiving cavity 106 that are opposite each other in the width direction, and the second fan 201 is disposed near the other side of the two sides of the second receiving cavity 106 that are opposite each other in the width direction.

[0059] In this embodiment, the width direction of the second receiving cavity 106 is the left-right direction of the power conversion device. The first fan 202 and the second fan 201 are arranged horizontally on the left and right sides of the second receiving cavity 106, that is, the first fan 202 and the second fan 201 are arranged relatively close to the edge. This can increase the effective range of the first fan 202 and the second fan 201, so that the gas in most areas of the second receiving cavity 106 can circulate, thus better dissipating heat from the second receiving cavity 106. Specifically, the first fan 202 can be arranged on the upper left side of the second receiving cavity 106, and the second fan 201 can be arranged on the middle right side of the second receiving cavity 106.

[0060] Specifically, the first fan 202 may be located on the upper left side of the second receiving cavity 106, and the second fan 201 may be located on the middle right side of the second receiving cavity 106.

[0061] In any of the above embodiments, optionally, as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the second fan 201 can be positioned close to the second heat dissipation device 30 to ensure that the hot airflow from the second receiving cavity 106 can effectively pass through the second heat dissipation device 30. To ensure that more gas in the second receiving cavity 106 passes through the second heat dissipation device 30 when the second fan 201 is operating, the second heat dissipation device 30 can be positioned on the outlet side (positive pressure side) of the second fan 201, so that airflow passes through the second heat dissipation device 30 via positive pressure air delivery. The second heat dissipation device 30 can also be... Figure 8As shown, the second fan 201 is positioned on the air intake side (negative pressure side) to draw airflow through the second heat dissipation device 30 via negative pressure suction. The specific installation position of the second fan 201 can be rationally set according to the structural layout of the second receiving cavity 106. This structure, by placing the second heat dissipation device 30 close to the second fan 201, allows more gas in the second receiving cavity 106 to pass through the second heat dissipation device 30, thus improving the heat dissipation efficiency of the second receiving cavity 106.

[0062] In any of the above embodiments, optionally, as Figure 6 and Figure 8 As shown, the power conversion device also includes a guide air duct 11. The guide air duct 11 is disposed between the second fan 201 and the second heat dissipation device 30. The second fan 201 delivers air to the second heat dissipation device 30 through the guide air duct 11, or the second heat dissipation device 30 draws air through the guide air duct 11.

[0063] In this embodiment, the guiding air duct 11 can increase the force of the second fan 201 in drawing air from or sending air to the second heat dissipation device 30, so that more air generated by the second fan 201 can flow through the second heat dissipation device 30. This can enhance the heat exchange effect between the gas in the second receiving cavity 106 and the second heat dissipation device 30, and improve the heat dissipation efficiency of the second heat dissipation device 30 on the second receiving cavity 106.

[0064] In any of the above embodiments, optionally, as Figures 1 to 4 As shown, the second receiving cavity 106 includes a first sidewall 1016 and a second sidewall 1018 arranged along the height direction, and the first fan 202 is disposed near the first sidewall 1016. Further, the power conversion device also includes a baffle 50, which is installed inside the second receiving cavity 106, located on the air inlet side of the first fan 202, and the baffle 50 is located along the height direction on the side of the first fan 202 away from the first sidewall 1016; the power conversion device also includes a bus capacitor 702, which is disposed between the baffle 50 and the first sidewall 1016, and located on the air inlet side of the first fan 202.

[0065] In this embodiment, the height direction can specifically refer to the height direction of the power conversion device. The first sidewall 1016 and the second sidewall 1018 of the second receiving cavity 106 are the bottom wall and top wall of the second receiving cavity 106, respectively. The first fan 202 can be disposed near the top wall or the bottom wall of the second receiving cavity 106, that is, the first fan 202 is disposed off-center along the height direction. The baffle 50, the inner wall of the second receiving cavity 106 near the first side, and the first fan 202 can form a space for accommodating the bus capacitor 702. With this structure, by providing a baffle 50 for blocking airflow on one side of the bus capacitor 702, an air duct can be formed between the bus capacitor 702 and the first fan 202. Through this air duct, the suction force of the first fan 202 from the bus capacitor 702 can be increased, thereby increasing the airflow speed near the bus capacitor 702, improving the heat exchange effect between the bus capacitor 702 and the air, and thus improving the heat dissipation effect of the first fan 202 on the bus capacitor 702.

[0066] In any of the above embodiments, optionally, as Figure 5 As shown, the outer casing 101 is provided with an air inlet 1012 and an air outlet 1014 communicating with the first receiving cavity 104. The power conversion device also includes a third fan 90, which is installed in the first receiving cavity 104 and is used to allow air from outside the outer casing 101 to enter the first receiving cavity 104 through the air inlet 1012, and after passing through the first heat dissipation device 40, to be discharged through the air outlet 1014.

[0067] In this embodiment, external cold air enters the first receiving cavity 104 (also called the heat dissipation cavity) through the air inlet 1012, and then exchanges heat with the components (such as the first heat dissipation device 40) inside the first receiving cavity 104, thereby cooling the components inside the first receiving cavity 104. The hot air after heat exchange is discharged outside the first receiving cavity 104 through the air outlet 1014, thus carrying away the heat inside the first receiving cavity 104 and achieving heat dissipation of the first receiving cavity 104.

[0068] In any of the above embodiments, optionally, as Figure 5 As shown, the power conversion device further includes a first power inductor 801 and / or a second power inductor 802. When both the first power inductor 801 and the second power inductor 802 are present, they are installed within the first receiving cavity 104 and located on the airflow path formed by the third fan 90. Further, the first power inductor 801 and the second power inductor 802 are located on opposite sides of the first heat dissipation device 40 along the height direction of the power conversion device, and are spaced apart from the first heat dissipation device 40.

[0069] In this embodiment, the third fan 90 can dissipate heat from the first power inductor 801 and the second power inductor 802. To ensure effective heat dissipation of the first power inductor 801 and the second power inductor 802, the first power inductor 801 and the second power inductor 802 can be respectively disposed on both sides of the first heat dissipation device 40 along the height direction.

[0070] In any of the above embodiments, optionally, as Figure 5 As shown, one of the air inlet 1012 and the air outlet 1014 is disposed near the top of the first receiving cavity 104 along the height direction of the power conversion device, and the other of the air inlet 1012 and the air outlet 1014 is disposed near the bottom of the first receiving cavity 104; or as shown Figure 9 As shown, the air inlet 1012 is located on the part of the first receiving cavity 104 opposite to the partition 102. The third fan 90 is located between the air inlet 1012 and the first heat dissipation device 40 and can exhaust air toward the first heat dissipation device 40. The air outlet 1014 includes a first air outlet 10142 and a second air outlet 10144. The first air outlet 10142 is located on one side of the first heat dissipation device 40 along the height direction of the power conversion device, and the second air outlet 10144 is located on the other side of the first heat dissipation device 40 along the height direction of the power conversion device.

[0071] In this embodiment, an air inlet 1012 and an air outlet 1014 can be respectively provided near the top and bottom of the first receiving cavity 104 (also called a heat dissipation cavity), so that external cold air can flow along the height direction of the power conversion device. In this scheme, the third fan 90 can be disposed between the air inlet 1012 and a power inductor (specifically the first power inductor 801 or the second power inductor 802) disposed near the air inlet 1012. This allows the airflow entering from the air inlet 1012 to first pass through a power inductor, then sequentially pass through the third fan 90, the first heat dissipation device 40 and the other power inductor, and finally be discharged from the air outlet 1014.

[0072] In another specific embodiment, the air inlet 1012 is located in the middle of the back of the first receiving cavity 104 (specifically, on the side of the first receiving cavity 104 opposite to the partition 102), and the third fan 90 is located on the side of the first heat dissipation device 40 away from the partition 102, that is, the third fan 90 and the partition 102 are opposite to each other on both sides of the first heat dissipation device 40. In this embodiment, external air enters from the middle of the back of the first receiving cavity 104, passes laterally through the first heat dissipation device 40, and then splits into two parts along the height direction. One part of the airflow flows upward along the height direction through a power inductor and is discharged from one of the air outlets 1014 (e.g., the first air outlet 10142), while the other part of the airflow flows downward along the height direction through another power inductor and is discharged from another air outlet 1014 (e.g., the second air outlet 10144).

[0073] in, Figure 3 , Figure 5 and Figure 9 The arrows in the diagram indicate the direction of airflow.

[0074] In any of the above embodiments, optionally, as Figure 7 As shown, the first heat dissipation device 40 includes: a first heat dissipation component 402, which contacts the power semiconductor device 60 at the connecting hole 1022 and is used to dissipate heat from the power semiconductor device 60; and a second heat dissipation component 404, which contacts the second heat dissipation device 30 at the connecting hole 1022 and is used to dissipate heat from the second receiving cavity 106. The first heat dissipation component 402 and the second heat dissipation component 404 may be the same heat dissipation component, or the first heat dissipation component 402 and the second heat dissipation component 404 may be independently arranged.

[0075] In this embodiment, a large heat dissipation device can be used to dissipate heat from the power semiconductor device 60 and the second heat dissipation device 30. In this case, the first heat dissipation component 402 and the second heat dissipation component 404 are the same heat dissipation component, making the external heat dissipation components a single unit. In order to dissipate heat from the power semiconductor device 60 and the second heat dissipation device 30 separately, the first heat dissipation device 40 can be configured as two independent heat dissipation components (i.e., the first heat dissipation component 402 and the second heat dissipation component 404). This allows the heat dissipation of the second heat dissipation device 30 to be independent of the heat dissipation device of the power semiconductor device 60, making the arrangement of the second heat dissipation device 30 more flexible.

[0076] The connecting hole 1022 can be one large hole or two small holes. For example, when the first heat sink 402 and the second heat sink 404 are the same heat sink, the connecting hole 1022 can be set as one large hole. When the first heat sink 40 is configured as two independent first heat sinks 402 and second heat sinks 404, a connecting hole 1022 can be set for each of the first heat sinks 402 and the second heat sink 404.

[0077] In any of the above embodiments, the power conversion device may optionally include an inverter and / or an energy storage converter. That is, both the inverter and the energy storage converter can use the heat dissipation structure proposed in this application for heat dissipation.

[0078] The following describes a specific heat dissipation structure for the cavity of a power conversion device.

[0079] In related solutions, the structure for heat dissipation in the sealed cavity of power conversion equipment typically involves installing a turbulence fan inside the sealed cavity. The heat from the electronic components inside the cavity is first transferred to the air within the cavity, then to the walls of the sealed cavity, and finally, the outer walls of the sealed cavity transfer the heat to the external environment through natural convection and thermal radiation. This heat dissipation method has relatively low efficiency.

[0080] The purpose of this embodiment is to solve the problem of low heat dissipation efficiency in sealed cavities, improve heat dissipation efficiency, and thus effectively increase the volumetric power density of the product. While solving the problem of low heat dissipation efficiency in sealed cavities, it avoids the significant structural changes or reduced product reliability that can occur with other heat exchange devices.

[0081] The key improvement of this embodiment is that: a fan is set in the middle of the right side of the internal cavity, and an internal heat sink is set on the left or right side of the fan. The internal heat sink is in contact with the external heat sink, and the right fan blows air to the left; a fan is set in the upper left corner of the internal cavity, which forms an air duct with the capacitor baffle and blows air to the right, creating a negative pressure on the left side, which drives the air flow around the capacitor.

[0082] According to the heat dissipation structure provided in this application, a small heat sink is added to the external heat sink substrate, which can effectively transfer the heat of the high-temperature gas inside the cavity to the outside without affecting the overall structural layout; a fan is set on the right or left side of the internal heat sink, blowing air to the left, which can not only make the hot air flow through the internal heat sink, but also form an internal circulation turbulence with the upper left fan, enhancing the heat dissipation effect of the cavity; the left fan and the capacitor baffle form an air duct, which can improve the heat dissipation capacity of the capacitor.

[0083] This embodiment designs a heat dissipation structure for the cavity of a power conversion device, the structure of which is as follows: Figures 1 to 5 As shown. Among them,

[0084] The power conversion device includes a front enclosure (enclosure 10), which is surrounded by multiple front enclosure shells (shells 101). At least two internal fans (first fan 202 and second fan 201) are installed inside the front enclosure. The internal fans are located in the middle right side of the front enclosure, and an internal heat sink (second heat dissipation device 30) is installed at the air outlet of the internal fans. An internal fan is located in the upper left side of the front enclosure, and a capacitor baffle (baffle 50) is installed at the air inlet of the internal fans. The capacitors are located in the area surrounded by the capacitor baffle and the front enclosure shells, forming an air duct with the internal fans. Electronic devices 704, magnetic devices 706, power semiconductor devices 60, etc., are also arranged in the front enclosure. An external air duct is located outside the front enclosure, having at least one air inlet 1012 and at least one air outlet 1014, as well as at least one set of power inductors (e.g., first power inductor 801 and second power inductor 802), an external fan (third fan 90), and an external heat sink (second heat dissipation device 30). Power semiconductor devices are directly or indirectly attached to an external heat sink substrate, and internal heat sinks are directly or indirectly attached to an external heat sink substrate.

[0085] During operation, the electronic components, magnetic components, and capacitors in the front enclosure generate heat, which is transferred to the air inside the cavity. An internal fan blows air to the right, using a baffle to circulate air within the capacitors, thus cooling them. An internal fan also blows air to the left, drawing in or expelling hot air through an internal heat sink, which then transfers the heat to an external heat sink, thereby lowering the temperature inside the front enclosure. The internal fans alternately blow air in opposite directions, creating a circulating turbulence that effectively dissipates heat from the heat-generating components in the front enclosure.

[0086] An external fan in the external air duct is positioned between the power inductor and the external heat sink. It blows air upwards, using suction to cool the power inductor. The cool air then blows into the external heat sink, carrying away the heat generated by the power semiconductor device and the heat transferred from the internal heat sink. The cool air then cools the power inductor again before flowing out from the external air duct outlet. It then flows over the top of the front enclosure, further cooling the front enclosure.

[0087] Figure 6 This is a schematic diagram of another power conversion device. An air duct (guide air duct 11) can be set between the internal fan and the internal heat sink to force more air generated by the internal fan to flow through the internal heat sink, thereby enhancing the heat exchange effect of the front casing.

[0088] Figure 7This is a schematic diagram of another power conversion device. The external heat sink can be divided into two parts (first heat sink 402 and second heat sink 404). The external heat sink is used to dissipate heat for the power semiconductor device and to dissipate heat for the internal heat sink. Separating the external heat sinks allows the combination of the internal and external heat sinks to be freed from the limitation of the corresponding heat sink for the power semiconductor device, making the arrangement more flexible.

[0089] Figure 8 This is a schematic diagram of another power conversion device. The internal fan can also be placed in front of the internal radiator, blowing air to the left, drawing hot air from the front enclosure through the internal radiator for heat exchange. Alternatively, air ducts can be added to force even more hot air through the internal radiator.

[0090] Figure 9 This is a schematic diagram of another power conversion device. The external air duct can also adopt a rear air intake method, that is, the external fan is located at the back of the external air duct and blows air to the right, so that the cold air flows directly into the external heat sink, and then flows upward and downward to cool the power inductor, and finally flows out from the air outlet. The air outlet can be located on the side and front of the external air duct.

[0091] In the description of this specification, the terms "connection," "installation," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0092] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0093] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A power conversion device, characterized in that, include: shell; A partition is disposed inside the outer shell, dividing the space inside the outer shell into a first receiving cavity and a second receiving cavity. The partition is provided with a connecting hole to connect the first receiving cavity and the second receiving cavity. A power semiconductor device is mounted in the second receiving cavity; A first heat dissipation device is at least partially installed in the first receiving cavity and contacts the power semiconductor device at the connecting hole; The second heat dissipation device is at least partially installed in the second receiving cavity and contacts the first heat dissipation device at the connecting hole; The first fan is installed inside the second receiving cavity; The second fan is installed inside the second receiving cavity; The first fan blows air toward the first side of the second cavity, and the second fan blows air toward the second side of the second cavity. The first side and the second side are opposite to each other or the first side and the second side are at a preset angle.

2. The power conversion device according to claim 1, characterized in that, The first fan and the second fan are offset from each other along the height direction of the power conversion device; and / or The first fan is disposed near one of the two sides of the second receiving cavity that are opposite each other along the width direction, and the second fan is disposed near the other side of the two sides of the second receiving cavity that are opposite each other along the width direction.

3. The power conversion device according to claim 1, characterized in that, The second heat dissipation device is located on the exhaust side of the second fan, and the second fan can blow air to the second heat dissipation device; or The second heat dissipation device is located on the air intake side of the second fan, and the second fan can draw air from the second heat dissipation device.

4. The power conversion device according to claim 3, characterized in that, Also includes: An airflow guide is provided between the second fan and the second heat dissipation device. The second fan delivers air to the second heat dissipation device through the airflow guide, or the second heat dissipation device draws air through the airflow guide.

5. The power conversion device according to claim 1, characterized in that, The second receiving cavity includes a first sidewall and a second sidewall disposed along the height direction of the power conversion device. The first fan is disposed close to the first sidewall. The power conversion device also includes a baffle plate, which is installed in the second receiving cavity and located on the air inlet side of the first fan. The baffle plate is located on the side of the first fan away from the first sidewall along the height direction. The power conversion device further includes a bus capacitor, which is disposed between the baffle and the first sidewall and located on the air inlet side of the first fan.

6. The power conversion device according to any one of claims 1 to 5, characterized in that, The outer casing is provided with an air inlet and an air outlet communicating with the first receiving cavity, and the power conversion device further includes: The third fan is installed inside the first receiving cavity to allow air from outside the housing to enter the first receiving cavity through the air inlet, pass through the first heat dissipation device, and then be discharged through the air outlet.

7. The power conversion device according to claim 6, characterized in that, Also includes: A first power inductor and a second power inductor are installed in the first receiving cavity and located on the airflow path formed by the third fan. The first power inductor and the second power inductor are respectively located on both sides of the first heat dissipation device and are spaced apart from the first heat dissipation device.

8. The power conversion device according to claim 6, characterized in that, One of the air inlet and the air outlet is disposed near the top of the first receiving cavity along the height direction of the power conversion device, and the other of the air inlet and the air outlet is disposed near the bottom of the first receiving cavity; or The air inlet is located at the position where the first receiving cavity is opposite to the partition. The third fan is located between the air inlet and the first heat dissipation device and can exhaust air toward the first heat dissipation device. The air outlet includes a first air outlet and a second air outlet. The first air outlet is located on one side of the first heat dissipation device along the height direction of the power conversion device, and the second air outlet is located on the other side of the first heat dissipation device along the height direction of the power conversion device.

9. The power conversion device according to any one of claims 1 to 5, characterized in that, The first heat dissipation device includes: The first heat sink contacts the power semiconductor device at the through hole and is used to dissipate heat from the power semiconductor device. The second heat sink is in contact with the second heat sink at the connecting hole and is used to dissipate heat from the second receiving cavity; Wherein, the first heat sink and the second heat sink are the same heat sink, or the first heat sink and the second heat sink are independently arranged.

10. The power conversion device according to any one of claims 1 to 5, characterized in that, The power conversion equipment includes an inverter and / or an energy storage converter.

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