Lightweight three-dimensional heat transfer device

Abstract

The utility model discloses a light-weight three-dimensional heat transfer device which comprises an evaporator, a condenser and a plurality of pipe bodies communicated with the evaporator and the condenser, and a plurality of fins are arranged on the pipe bodies. The structure is simple, the implementation process is simple and convenient, and mass production is easy; the volume of the condensation channel is increased, the internal refrigerant liquid level can be increased, and then the temperature of an upper heat source in the gravity direction in a multi-heat-source scene is lowered; the gravity direction of the condenser is higher than that of the evaporator, and liquid backflow is smoother; the small and dense grooves are adopted in the pipe body, so that condensed liquid can flow back to the evaporator more smoothly, the problem that when the interior of the pipe body is occupied by a gas phase and a liquid phase at the same time, liquid backflow is not smooth is effectively solved, and heat exchange efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic heat dissipation technology, and in particular to a lightweight three-dimensional heat transfer device. Background Technology

[0002] In the field of electronics, devices or instruments are needed to promptly transfer the heat generated by electronic devices such as processors and servers during operation to avoid affecting their normal functioning. With the rapid development of electronics, the heat dissipation of electronic devices is increasing, making heat dissipation a more prominent issue. Current technologies often employ sealed working fluids with gas-liquid two-phase conversion to significantly improve the heat dissipation performance of heat sinks, and this has been further extended to three-dimensional two-phase heat dissipation. For example, a copper three-dimensional vapor chamber consists of a copper vapor chamber and copper heat pipes, with the inner cavities of the vapor chamber and heat pipes connected. This copper three-dimensional vapor chamber can not only transfer heat concentrated on the heat-generating components to the vapor chamber but also directly transfer heat to heat pipes at different heights. It extends the heat diffusion process from two-dimensional to three-dimensional, allowing for more efficient heat transfer to the heat pipes and ultimately to the air. Another solution is the aluminum three-dimensional thermosiphon heat sink, which typically has channels inside the aluminum heat sink base and channels inside the aluminum heat dissipation fins. These two channels are then connected and sealed with a refrigerant. During use, the aluminum heat sink base contacts the heat-generating components, and the phase change of the refrigerant rapidly transfers heat to the heat dissipation fins for dissipation.

[0003] However, the high density of copper three-dimensional heat spreaders results in heavy and expensive radiators; while aluminum three-dimensional thermosiphon radiators suffer from complex processing technology, low production yield, and high cost. Utility Model Content

[0004] The technical problem to be solved by this utility model embodiment is to provide a lightweight three-dimensional heat transfer device to simplify the structure and improve heat dissipation efficiency.

[0005] To address the aforementioned technical problems, this utility model proposes a lightweight three-dimensional heat transfer device, including an evaporator, a condenser, and several tubes connecting the evaporator and the condenser. The tubes are provided with several fins, and the inner wall of the tubes is provided with several grooves.

[0006] Furthermore, the evaporator is composed of an evaporator base plate and an evaporator cover plate, the condenser is composed of a condenser bottom plate and a condenser cover plate, and the tube body is disposed on the evaporator base plate.

[0007] Furthermore, the condenser is provided with several channels, wherein the volume of the upper channel of the condenser is larger than the volume of the lower channel.

[0008] Furthermore, the evaporator is equipped with a support column, and the tube body abuts against the support column.

[0009] Furthermore, the tube body is a straight tube.

[0010] Furthermore, the pipe body is a bent pipe.

[0011] Furthermore, when the device is placed vertically, the condenser is higher than the evaporator.

[0012] Furthermore, the relationship between the size of the trench and the surface tension and dynamic viscosity of the working fluid satisfies the following formula:

[0013] ;

[0014] Among them, D h The equivalent hydraulic diameter of the groove inside the pipe; K is a constant; σ is the surface tension of the working fluid; η is the dynamic viscosity of the working fluid; ΔT is the temperature difference between the evaporator and the condenser. L The length of the pipe groove. Q This represents the heat flux density.

[0015] The beneficial effects of this utility model are as follows: the structure of this utility model is simple, the implementation process is simple, and it is easy to mass-produce; this utility model increases the volume of the condensation channel, which can increase the internal refrigerant liquid level, thereby reducing the temperature of the upper heat source in the direction of gravity in multi-heat source scenarios; the tube body of this utility model adopts fine grooves, so that the condensed liquid can flow back to the evaporator more smoothly. The condenser of this utility model is higher than the evaporator in the direction of gravity, and the liquid return is smoother, effectively solving the problem of poor liquid return when the tube body is occupied by both gas and liquid phases at the same time, and improving heat exchange efficiency. Attached Figure Description

[0016] Figure 1 This is a structural diagram of a lightweight three-dimensional heat transfer device according to an embodiment of the present invention.

[0017] Figure 2 This is a cross-sectional view of the tube body according to an embodiment of the present invention.

[0018] Figure 3 This is a cross-sectional view of a lightweight three-dimensional heat transfer device according to an embodiment of the present invention.

[0019] Figure 4 This is a front view of the condenser cover plate according to an embodiment of the present utility model.

[0020] Figure 5 This is a structural diagram of the tube body according to another embodiment of the present invention.

[0021] Figure 6 This is a structural diagram of a lightweight three-dimensional heat transfer device according to another embodiment of the present invention.

[0022] Explanation of icon numbers

[0023] Evaporator 10, evaporator base plate 11, evaporator cover plate 12, support column 13, condenser 20, condenser base plate 21, condenser cover plate 22, channel 23, tube body 30, fins 31, groove 32. Detailed Implementation

[0024] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other. The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] In this embodiment of the invention, directional indicators (such as up, down, left, right, front, back, etc.) are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indicators will also change accordingly.

[0026] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0027] Please refer to Figures 1-6 The lightweight three-dimensional heat transfer device of this utility model embodiment includes an evaporator, a condenser, and a tube.

[0028] The tube body consists of several sections, connecting the evaporator and condenser. Preferably, the tube bodies are arranged in parallel. Each tube body has several fins, preferably arranged in parallel. The fins contact the tube body and conduct heat. In practice, multiple parts are assembled by brazing, and then refrigerant is added after welding.

[0029] The evaporator is used to contact the heat source. After absorbing heat, the working fluid inside the evaporator changes from liquid to gas and enters the tube body and condenser. Part of the refrigerant inside the tube body dissipates heat from the tube body to the fins, thus lowering its temperature and causing it to change from gas to liquid, flowing back to the evaporator along the grooves in the tube body. A portion of the gas enters the condenser, where it changes from gas to liquid, then flows back to the bottom (relative to gravity) and is then drawn into the evaporator by the capillary structure of the tube body grooves. The fins increase the heat dissipation area, dissipating the heat transferred from the tube body.

[0030] In one embodiment, the evaporator consists of an evaporator base plate and an evaporator cover plate, and the condenser consists of a condenser base plate and a condenser cover plate. The tube is mounted on the evaporator base plate to ensure smooth liquid return. One end of the tube is connected to the evaporator base plate, and the other end is connected to the condenser base plate.

[0031] In one embodiment, the condenser has several channels, wherein the diameter of the channels in the upper part of the condenser is larger than that of the channels in the lower part. The evaporator has a support column, and the tube body abuts against the support column.

[0032] In one embodiment, the pipe is a straight pipe. The inner wall of the straight pipe has several grooves. The groove structure of the pipe allows for smoother liquid return, and the pipe's close contact with the evaporator's support column also prevents the returning liquid from being blocked by a large amount of outward-flowing gas, allowing it to flow back more smoothly to the evaporator's bottom plate.

[0033] In one embodiment, the tube is a bent tube. When the device is placed vertically, the condenser is higher than the evaporator. The inner wall of the bent tube has several grooves. When the condenser is higher than the evaporator, gravity helps the condensed liquid working fluid to naturally flow back to the evaporator, eliminating the need for an additional pump or capillary structure. This invention features a simple structure, high reliability, and improved heat transfer efficiency (reduced backflow resistance).

[0034] The tube body of this invention is designed with a series of parallel and dense grooves inside, which can act like capillaries, allowing the returning liquid to be quickly conducted within the tube body.

[0035] In one embodiment, the tube body can also be circular, polygonal, or flat.

[0036] In one implementation, the relationship between the size of the trench and the surface tension and dynamic viscosity of the working fluid satisfies the following formula:

[0037] ;

[0038] Among them, D h The equivalent hydraulic diameter of the groove inside the pipe; K is a constant, approximately 1 / 7; σ is the surface tension of the working fluid; η is the dynamic viscosity of the working fluid; ΔT is the temperature difference between the evaporator and the condenser. L The length of the pipe groove. Q The heat flux density is [value missing]. The groove design of this invention allows for smoother return of the working fluid and higher heat dissipation efficiency.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A lightweight three-dimensional heat transfer device, comprising an evaporator and a condenser, characterized in that, It also includes several tubes connecting the evaporator and the condenser, the tubes having several fins; and the inner wall of the tubes having several grooves. The evaporator consists of an evaporator base plate and an evaporator cover plate, and the condenser consists of a condenser bottom plate and a condenser cover plate. The tube body is disposed on the evaporator base plate.

2. The lightweight three-dimensional heat transfer device as described in claim 1, characterized in that, The condenser has several channels, wherein the volume of the upper channel of the condenser is larger than the volume of the lower channel.

3. The lightweight three-dimensional heat transfer device as described in claim 1, characterized in that, The evaporator is equipped with a support column, and the tube body is aligned with and abuts against the support column.

4. The lightweight three-dimensional heat transfer device as described in claim 1, characterized in that, The pipe body is a straight pipe.

5. The lightweight three-dimensional heat transfer device as described in claim 1, characterized in that, The pipe body is a bent pipe.

6. The lightweight three-dimensional heat transfer device as described in claim 5, characterized in that, When the device is placed vertically, the condenser is higher than the evaporator.

7. The lightweight three-dimensional heat transfer device as described in claim 1, characterized in that, The relationship between the size of the trench and the surface tension and dynamic viscosity of the working fluid satisfies the following formula: ； Among them, D h The equivalent hydraulic diameter of the groove inside the pipe; K is a constant; σ is the surface tension of the working fluid; η is the dynamic viscosity of the working fluid; ΔT is the temperature difference between the evaporator and the condenser. L The length of the pipe groove. Q This represents the heat flux density.

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