Multicolor integrated LED packaging support structure

Abstract

The utility model relates to the technical field of LED packaging, in particular to a multicolor integrated LED packaging support structure which comprises a substrate body, six independent bowls and twelve electrically isolated pins, a rectangular heat dissipation bonding pad is arranged on the top face of the substrate body, and the rectangular heat dissipation bonding pad is fixedly connected with the substrate body through metal brazing; the six independent bowl cups are arranged on the top face of the substrate body in a rectangular shape, and the independent bowl cups and the substrate body are of an integrated injection molding structure. Two pins in each group correspond to one independent bowl cup, the pins are arranged on the bottom surface of the substrate body in a crossed manner, and the pins are electrically isolated from the substrate body through an insulating adhesive layer. The specification of the substrate body is 6 * 6 mm, the area of the rectangular heat dissipation bonding pad on the substrate body is larger than or equal to 4 * 5 mm, the Sn-Ag-Cu alloy plating layer at the bottom has good heat conduction performance, heat generated when the LED chip works can be rapidly dissipated, and junction temperature is effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, specifically to a multi-color integrated LED packaging bracket structure. Background Technology

[0002] Currently, traditional multicolor LED devices on the market mainly use discrete LED component combinations or single-cup multi-chip structures, which have many drawbacks:

[0003] 1) Integrating multiple discrete LED components results in a larger device size and uneven light color mixing, which affects the lighting effect;

[0004] 2) The single-bowl structure is prone to color crosstalk, resulting in impure output light color;

[0005] 3) Insufficient heat dissipation will lead to luminous efficacy decay during operation and reduce the lifespan of the LED;

[0006] 4) The complex pin layout not only increases the difficulty of soldering, but also affects the soldering yield.

[0007] To address the issues raised above, we propose a multi-color integrated LED packaging bracket structure. Utility Model Content

[0008] The purpose of this invention is to provide a multi-color integrated LED packaging bracket structure to solve the problems mentioned in the background art.

[0009] To achieve the above objectives, this utility model provides the following technical solution:

[0010] Multi-color integrated LED packaging bracket structure, including:

[0011] The substrate body has a rectangular heat dissipation pad on its top surface, and the rectangular heat dissipation pad is fixedly connected to the substrate body by metal brazing.

[0012] Six independent bowls are arranged in a rectangular shape on the top surface of the substrate body, and the independent bowls and the substrate body are an integral injection molded structure.

[0013] The substrate has 12 electrically isolated pins, with each group of 2 pins corresponding to one independent cup. The pins are arranged crosswise on the bottom surface of the substrate body, and the pins are electrically isolated from the substrate body through an insulating adhesive layer.

[0014] Preferably, each individual bowl / cup has a chip carrier platform at its bottom, and the chip carrier platform has wire grooves around its perimeter. The chip carrier platform is fixedly connected to the inner wall of the individual bowl / cup by injection molding. The wire grooves penetrate the side wall of the individual bowl / cup and are electrically connected to the corresponding pins. The chip carrier platform and the wire grooves are used to accommodate one LED chip.

[0015] Preferably, the bottom of the rectangular heat dissipation pad is provided with a Sn-Ag-Cu alloy plating layer.

[0016] Preferably, the sidewalls of the individual bowls and cups fit tightly together.

[0017] Preferably, when the pins are arranged in a cross pattern, the projection areas of adjacent pins partially overlap.

[0018] Preferably, the substrate body is made of ceramic insulating material.

[0019] Preferably, the inner wall of the individual bowl / cup is provided with a reflective coating.

[0020] Preferably, the pins are made of copper alloy.

[0021] Preferably, the thickness of the rectangular heat dissipation pad is 0.5-1mm.

[0022] Preferably, the edge of the substrate body is provided with a positioning groove, and the positioning groove and the substrate body are integrally formed.

[0023] Compared with the prior art, the beneficial effects of this utility model are:

[0024] The substrate body of this invention adopts a 6×6mm specification, and the rectangular heat dissipation pad on it has an area of ​​≥4×5mm. The Sn-Ag-Cu alloy coating on the bottom has good thermal conductivity, which can quickly dissipate the heat generated by the LED chip during operation and effectively reduce the junction temperature.

[0025] The present invention has six independent bowls arranged in a 2×3 matrix on the substrate body. The size of each bowl is 2.5×1.6mm and the depth is controlled between 0.8-1.2mm. This design ensures that each bowl can hold 3-5 LED chips and reduces color crosstalk. The bowls are tightly connected, which makes the light of different colors more uniform when mixed.

[0026] This invention features 12 electrically isolated pins arranged in groups of two, corresponding to one bowl. This staggered arrangement increases the heat dissipation area and optimizes the pin layout, facilitating soldering and improving soldering yield. The chip carrier inside the bowl is used to fix the LED chip, while the wire groove provides space for the wires, making the circuit connection more organized.

[0027] In practical applications, LED chips of different colors are placed on the chip carrier platform of each bowl or cup, and connected to the corresponding pins through wires in the wire groove to achieve independent control of 6 colors of light. The package bracket has a compact structure and good heat dissipation performance, which can meet the needs of multi-color light in various occasions. Attached Figure Description

[0028] Figure 1 This is a front structural diagram of the present invention;

[0029] Figure 2 This is a schematic diagram of the 6-cup support structure of this utility model;

[0030] Figure 3 This is a schematic diagram of the back structure of this utility model. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Please see Figure 1-3 Multi-color integrated LED packaging bracket structure, including:

[0033] The substrate body 101 has a size of 6×6mm and a rectangular heat dissipation pad 102 on its top surface. The total area of ​​the rectangular heat dissipation pad 102 is ≥4×5mm, and the rectangular heat dissipation pad 102 is fixedly connected to the substrate body 101 by metal brazing.

[0034] Six independent cups 103 are arranged in a 2×3 matrix on the top surface of the substrate body 101. The size of each independent cup 103 is 2.5×1.6mm and the depth is 0.8-1.2mm. The independent cups 103 and the substrate body 101 are integral injection molded structures.

[0035] There are 12 electrically isolated pins 104, with 2 pins in each group corresponding to 1 independent cup 103. The pins 104 are arranged crosswise on the bottom surface of the substrate body 101, and the pins 104 are electrically isolated from the substrate body 101 through an insulating adhesive layer.

[0036] Each individual bowl 103 has a chip carrier platform 105 at its bottom. The chip carrier platform 105 has wire grooves 106 around its perimeter. The chip carrier platform 105 is fixedly connected to the inner wall of the individual bowl 103 by injection molding. The wire grooves 106 penetrate the side wall of the individual bowl 103 and are electrically connected to the corresponding pins 104. The chip carrier platform 105 and the wire grooves 106 are used to accommodate 3-5 LED chips 107.

[0037] The bottom of the rectangular heat sink 102 is provided with a Sn-Ag-Cu alloy coating, which is attached to the bottom surface of the rectangular heat sink 102 by an electroplating process.

[0038] The side walls of the six individual bowls 103 fit together tightly, and the adjacent individual bowls 103 are connected by an integrated injection molding to form a seamless connection structure.

[0039] When the pins 104 are arranged in a cross pattern, the projection areas of adjacent pins 104 partially overlap, and the pins 104 are electrically connected to the conductive lines on the bottom surface of the substrate body 101 through the rectangular heat dissipation pad 102.

[0040] The substrate body 101 is made of ceramic insulating material, and the rectangular heat dissipation pad 102 is a copper metal plate. The copper metal plate is embedded in the top surface of the substrate body 101 and fixed by brazing.

[0041] The inner wall of the independent bowl 103 is provided with a reflective coating. The reflective coating is attached to the inner wall of the independent bowl 103 by a vapor deposition process. The reflective coating is insulated from the structure of the independent bowl 103.

[0042] The pin 104 is made of copper alloy. The top of the pin 104 extends to the top surface of the substrate body 101 and forms a solder connection point with the wire groove 106 in the independent cup 103.

[0043] The rectangular heat dissipation pad 102 has a thickness of 0.5-1mm, and the bottom surface of the rectangular heat dissipation pad 102 is flush with the bottom surface of the substrate body 101 to increase the heat dissipation contact area.

[0044] The edge of the substrate body is provided with a positioning groove, which is integrally formed with the substrate body 101 and is used for mechanical positioning during packaging.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-color integrated LED packaging bracket structure, characterized in that, include: The substrate body (101) has a rectangular heat dissipation pad (102) on its top surface, and the rectangular heat dissipation pad (102) is fixedly connected to the substrate body (101) by metal brazing. Six independent bowls (103) are arranged in a rectangular shape on the top surface of the substrate body (101), and the independent bowls (103) and the substrate body (101) are an integral injection molded structure; Twelve electrically isolated pins (104) are provided, with each group of two pins corresponding to one independent bowl (103). The pins (104) are arranged crosswise on the bottom surface of the substrate body (101), and the pins (104) are electrically isolated from the substrate body (101) through an insulating adhesive layer.

2. The multi-color integrated LED packaging bracket structure according to claim 1, characterized in that, Each individual bowl (103) has a chip carrier platform (105) at its bottom. The chip carrier platform (105) has wire grooves (106) around its perimeter. The chip carrier platform (105) is fixedly connected to the inner wall of the individual bowl (103) by injection molding. The wire grooves (106) penetrate the side wall of the individual bowl (103) and are electrically connected to the corresponding pins (104). The chip carrier platform (105) and the wire grooves (106) are used to accommodate 3-5 LED chips (107).

3. The multi-color integrated LED packaging bracket structure according to claim 1, characterized in that, The bottom of the rectangular heat dissipation pad (102) is provided with a Sn-Ag-Cu alloy coating.

4. The multi-color integrated LED packaging bracket structure according to claim 1, characterized in that, The sidewalls of the six individual bowls (103) fit together tightly.

5. The multi-color integrated LED packaging bracket structure according to claim 1, characterized in that, When the pins (104) are arranged in a cross pattern, the projection areas of adjacent pins (104) partially overlap.

6. The multi-color integrated LED packaging bracket structure according to claim 1, characterized in that, The substrate body (101) is made of ceramic insulating material.

7. The multi-color integrated LED packaging bracket structure according to claim 1, characterized in that, The inner wall of the independent bowl (103) is provided with a reflective coating.

8. The multi-color integrated LED packaging bracket structure according to claim 1, characterized in that, The pin (104) is made of copper alloy.

9. The multi-color integrated LED packaging bracket structure according to claim 1, characterized in that, The thickness of the rectangular heat dissipation pad (102) is 0.5-1mm.

10. The multi-color integrated LED packaging bracket structure according to claim 1, characterized in that, The edge of the substrate body is provided with a positioning groove, and the positioning groove and the substrate body (101) are integrally formed.

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