Electronic package
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SILICONWARE PRECISION IND CO LTD
- Filing Date
- 2025-06-11
- Publication Date
- 2026-05-15
Smart Images
Figure CN224250168U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a packaging structure, and more particularly to an electronic package with an optical engine (OE) module. Background Technology
[0002] Co-packaged optics (CPO) technology combines electronic integrated circuits and photonic integrated circuits to form an optical engine chip, which can reduce energy consumption and increase data transmission bandwidth. It is an emerging technology that is still being continuously improved.
[0003] Figures 1A to 1E This is a cross-sectional schematic diagram of a method for manufacturing an existing semiconductor package using co-packaging optics technology.
[0004] First, such as Figure 1A As shown, multiple light engine chips 11 in a large-format form are fabricated on wafer 10. Each light engine chip 11 has an integrated lens 111 for receiving input light signals.
[0005] like Figure 1B As shown, the multiple light engine chips 11 are subjected to a dicing process to obtain individually separated light engine chips 11.
[0006] like Figure 1C As shown, a fiber array unit (FAU) 13 is bonded to a light engine chip 11 by an adhesive 12, and the light engine chip 11 can receive light signals 14 from the FAU 13 through a lens 111 to form a semiconductor package 1.
[0007] However, the aforementioned dicing process may contaminate or damage the lens 111, thereby reducing the yield of the semiconductor package 1.
[0008] Additionally, the FAU 13 integrated into the light engine chip 11 may be misaligned and not aligned with the lens 111. In this case, it is necessary to... Figure 1D As shown, tool 17 is used to physically remove adhesive 12 and FAU 13 to re-bond FAU 13 to the light engine chip 11. However, this may damage the surface of the light engine chip 11, such as... Figure 1E As shown.
[0009] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0010] To address the aforementioned problems, this application provides an electronic package including a light engine module, a protective layer, an adhesive layer, and an optical connector. The protective layer is disposed on the light engine module. The adhesive layer is disposed on the protective layer. The optical connector is bonded to the protective layer through the adhesive layer.
[0011] This application also provides a method for manufacturing an electronic package, comprising: providing a plurality of light engine modules manufactured in a large-format form; forming a protective layer on the plurality of light engine modules; performing a dicing process on the plurality of light engine modules together with the protective layer; and then performing the following steps on each of the light engine modules with the protective layer: removing the protective layer on the light engine module; and bonding an optical connection element to the light engine module by an adhesive layer.
[0012] This application also provides a method for manufacturing an electronic package, comprising: providing a light engine module; forming a protective layer on the light engine module; and bonding an optical connection element to the protective layer via an adhesive layer.
[0013] This application adds a protective layer to the light engine module to prevent damage or contamination of the optical area of the light engine module during the dicing process or other processes, or to prevent damage to the light engine module when removing the adhesive layer and optical connection elements bonded to the light engine module, thereby improving the yield of electronic packaging components. Attached Figure Description
[0014] Figures 1A to 1E This is a cross-sectional schematic diagram of the manufacturing process of existing semiconductor packages.
[0015] Figures 2A to 2E This is a cross-sectional schematic diagram of the first embodiment of the manufacturing method of the electronic package of this application.
[0016] Figures 3A to 3D This is a cross-sectional schematic diagram of the second embodiment of the manufacturing method of the electronic package of this application.
[0017] Explanation of reference numerals in the attached figures
[0018] 1 Semiconductor package
[0019] 10 wafers
[0020] 11 Light Engine Chips
[0021] 111 Lens
[0022] 12 Adhesive Materials
[0023] 13 Fiber optic array units
[0024] 14 light signal
[0025] 17 Tools
[0026] 2,3 Electronic Packages
[0027] 20 wafers
[0028] 21 Light Engine Module
[0029] 211 Optical Area
[0030] 212 Optical Components
[0031] 213 Photonic Components
[0032] 214 Electronic Components
[0033] 22 Protective Layer
[0034] 221 Opening
[0035] 23 Adhesive layer
[0036] 24 Optical Connectors
[0037] 241 light signal
[0038] 27. Tools. Detailed Implementation
[0039] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0040] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, terms such as "above," "below," "one," "first," and "second" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0041] Figures 2A to 2E This is a cross-sectional schematic diagram of the first embodiment of the manufacturing method of the electronic package of this application.
[0042] First, such as Figure 2A As shown, multiple light engine modules 21 are provided in a large-format form. The large-format light engine modules 21 are fabricated on a wafer 20.
[0043] The light engine module 21 can be a light engine chip or other integrated package structure containing optical elements, photonic elements, and electronic elements. Each light engine module 21 has an optical region 211. The optical region 211 is used to receive input light signals.
[0044] like Figure 2B As shown, a protective layer 22 is formed on the plurality of light engine modules 21. The protective layer 22 may be an insulating thin film material. For example, the protective layer 22 may be coated on the light engine modules 21.
[0045] like Figure 2C As shown, the multiple light engine modules 21, together with the protective layer 22, are subjected to a dicing process to obtain multiple individually distributed light engine modules 21. After dicing, each light engine module 21 retains a portion of the original protective layer 22, meaning it is covered by a portion of the original protective layer 22. Each light engine module 21 includes an optical element 212, a photonic element 213, and an electronic element 214, wherein the photonic element 213 is optically connected to the optical element 212, and the electronic element 214 is electrically connected to the photonic element 213.
[0046] The optical element 212 is a light-transmitting medium material, and the optical element 212 may be an optical adhesive or a lens, or the optical element 212 may include an optical adhesive or a lens. The aforementioned optical region 211 is a lens or an optical structure that can transmit light, that is, the region of the optical element 212 used to receive the input light signal.
[0047] Photonic element 213 can be a photonic integrated circuit or a photonic chip, which can be used to receive the optical signal received by optical element 212 through optical region 211 and convert the optical signal into an electrical signal, and then electronic element 214 can receive and process the electrical signal.
[0048] Electronic component 214 may be an active component, a passive component, or a combination thereof, and the active component may be, for example, an integrated circuit or a semiconductor wafer, while the passive component may be, for example, a resistor, a capacitor, an inductor, or a combination thereof.
[0049] Next, each optical engine module 21 after the order is cut can be executed as follows: Figure 2D and Figure 2E The manufacturing steps are shown.
[0050] like Figure 2D As shown, the protective layer 22 on the light engine module 21 is removed.
[0051] like Figure 2E As shown, the optical connector 24 is bonded to the optical engine module 21 via an adhesive layer 23 to form the electronic package 2. The optical connector can be a fiber optic array unit (FAU) or other components that can be used to connect optical fibers. The adhesive layer 23 can be a UV-curable adhesive (UV adhesive) or other adhesive materials.
[0052] The optical region 211 of the optical element 212 can be used to receive the optical signal 241 from the optical connector 24, and the optical signal 241 can come from the optical fiber to which the optical connector 24 is connected.
[0053] The first embodiment of this application described above includes setting a removable protective layer 22 on the light engine module 21 before the cut-out process, so as to avoid contamination or damage to the optical area 211 during the cut-out process, thereby improving the yield of the electronic package 2.
[0054] Figures 3A to 3D This is a cross-sectional schematic diagram of the second embodiment of the manufacturing method of the electronic package of this application.
[0055] The manufacturing method in this embodiment continues as follows: Figures 2A to 2C The method of preparation is shown. For example... Figure 2C As shown, after obtaining the separate light engine module 21 and its protective layer 22, then as... Figure 3A As shown, an opening 221 is formed through the protective layer 22, exposing the optical region 211. The exposed optical region 211 can then receive input light signals. For example, the opening 221 can be formed using exposure and patterning processes.
[0056] like Figure 3B As shown, the optical connector 24 is bonded to the protective layer 22 via the adhesive layer 23 to form the electronic package 3.
[0057] The optical signal 241 transmitted by the optical connector 24 is received by the optical region 211 of the optical engine module 21 through the opening 221. Therefore, both the optical connector 24 and the opening 221 must be aligned with the optical region 211. If at least one of the optical connector 24 and the opening 221 is misaligned and not aligned with the optical region 211, then... Figure 3C As shown, tool 27 is used to physically remove the adhesive layer 23 from the optical connector 24 in order to reattach the optical connector 24 to the light engine module 21. This may damage the protective layer 22, such as... Figure 3D As shown, since the protective layer 22 covers the light engine module 21, the adhesive layer 23 is prevented from directly contacting the light engine module 21. When it is necessary to perform actions such as... Figure 3C The removal shown can prevent damage to the light engine module 21.
[0058] In summary, this application adds a protective layer 22 to the light engine module 21 to prevent damage or contamination of the optical area 211 of the light engine module 21 during the slitting process or other processes, or to prevent damage to the light engine module 21 when removing the adhesive layer 23 and the optical connection element 24, thereby improving the yield of the electronic package 2,3.
[0059] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An electronic package, characterized in that, include: Light engine module; A protective layer is provided on the light engine module; An adhesive layer is provided on the protective layer; as well as The optical connection element is bonded to the protective layer through the adhesive layer.
2. The electronic package as described in claim 1, characterized in that, The optical engine module is provided with an optical area for receiving optical signals from the optical connector.
3. The electronic package as described in claim 2, characterized in that, The protective layer has an opening that extends through the protective layer and exposes the optical area, so that the optical area can receive the light signal.
4. The electronic package as described in claim 1, characterized in that, The light engine module includes: Optical elements for receiving optical signals from the optical connector; Photonic element, optical connection of the optical element; and Electronic components, electrically connected to the photonic component.
5. The electronic package as described in claim 4, characterized in that, The optical element has an optical region for receiving the optical signal.
6. The electronic package as described in claim 4, characterized in that, The optical element is made of a light-transmitting medium material.