Germanium wafer cleaning machine for germanium diode processing

Abstract

The germanium wafer cleaning machine for germanium diode machining comprises a cleaning box, one side of the cleaning box is fixedly connected with a fixing frame, the outer side wall of the fixing frame is fixedly connected with a transverse plate, and a water drainage pipe is arranged on the cleaning box. The utility model belongs to the technical field of germanium diode cleaning, and particularly relates to a germanium wafer cleaning machine for germanium diode processing, which solves the problems that the cleaning efficiency of germanium diodes is lower, more residual liquid is left after cleaning, and the cleaning effect of cleaning liquid is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of germanium diode cleaning technology, and in particular relates to a germanium wafer cleaning machine for germanium diode processing. Background Technology

[0002] A germanium diode is a diode made of germanium. Semiconductor diodes are used in almost all electronic circuits, playing an important role in many circuits. They are one of the earliest semiconductor devices and have a wide range of applications.

[0003] In the processing of germanium diodes, the germanium diodes need to be cleaned. However, the cleaning efficiency of conventional cleaning equipment is low, and a lot of residual liquid remains after cleaning, which greatly reduces the cleaning effect of the cleaning solution. Utility Model Content

[0004] The technical problem to be solved by this invention is that the cleaning efficiency of germanium diodes is low and there is a lot of residual liquid after cleaning, which reduces the cleaning effect of the cleaning solution.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a germanium wafer cleaning machine for germanium diode processing, comprising a cleaning tank, a fixing frame fixedly connected to one side of the cleaning tank, a horizontal plate fixedly connected to the outer side wall of the fixing frame, a drain pipe provided on the cleaning tank, and further comprising...

[0006] A placement component, located on a horizontal plate, is used for placing germanium sheets;

[0007] The cleaning unit, located inside the cleaning chamber, is used for cleaning germanium wafers.

[0008] Furthermore, the placement assembly includes a hydraulic rod, a connecting plate, a fixing column, a swaying plate, a base frame, a base column, and a placement box, wherein:

[0009] The hydraulic rod penetrates vertically through the horizontal plate and is fixedly connected to it. The connecting plate is fixedly connected to the free end of the hydraulic rod. The fixed column is fixedly connected to the bottom of the connecting plate and is arranged in a ⊥ shape and symmetrically distributed in pairs. The swaying plate penetrates vertically through the fixed column and is slidably connected to it. The base frame is fixedly connected to the bottom of the swaying plate and is symmetrically distributed in pairs. The bottom column is fixedly connected to the bottom of the base frame. The placement box is fixedly connected to the lower end of the bottom column and has an open top.

[0010] Furthermore, the cleaning assembly includes an ultrasonic generator and a filter plate. The ultrasonic generator is fixedly installed at the bottom of the cleaning tank, and the filter plate is fixedly connected between the inner walls of the cleaning tank and located on top of the ultrasonic generator.

[0011] Furthermore, the cleaning assembly also includes a vibration motor, which is fixedly mounted on the top of the shaking plate. A spring is sleeved on the fixed column, and its two ends are fixedly connected between the connecting plate and the shaking plate.

[0012] Furthermore, a cover plate is vertically slidably provided on the bottom column, and a threaded block is threadedly connected to the bottom column and located above the cover plate. Two symmetrically distributed magnetic blocks are fixedly connected to the top of the cover plate, and an adsorption block is provided on the bottom wall of the base frame, which corresponds to and adsorbs the magnetic blocks.

[0013] Furthermore, a guide rod is fixedly connected to the top of the connecting plate, and its upper end vertically penetrates the horizontal plate and is slidably connected to it. A diagonal brace is fixedly connected between the horizontal plate and the fixing frame. The bottom of the placement box is designed with a mesh-like perforation.

[0014] The beneficial effects of this utility model after adopting the above structure are as follows:

[0015] (1) Press down the cover plate to separate the adsorption block and the magnetic block until it covers the placement box, and then screw the threaded block to make it stick tightly to the top of the cover plate to prevent the germanium diode from leaving the placement box during the cleaning process;

[0016] (2) Immerse the placement box in the cleaning solution and use an ultrasonic generator to ultrasonically clean the germanium diodes in the placement box.

[0017] (3) The operation of the vibration motor can cause the movable plate to vibrate on the fixed column under the deformation of the spring, shaking off the residual cleaning liquid.

[0018] (4) The filter plate can filter impurities in the cleaning solution, and the discharged cleaning solution can be reused, saving resources. Attached Figure Description

[0019] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0020] Figure 1 This is a schematic diagram of the overall structure of a germanium wafer cleaning machine for germanium diode processing proposed in this utility model;

[0021] Figure 2 This is a front view of a germanium wafer cleaning machine for germanium diode processing according to the present invention;

[0022] Figure 3 This is a three-dimensional structural diagram of a germanium wafer cleaning machine for germanium diode processing proposed in this utility model;

[0023] Figure 4This is a side view of a germanium wafer cleaning machine for germanium diode processing proposed in this utility model;

[0024] Figure 5 A cross-sectional view of a germanium wafer cleaning machine for germanium diode processing proposed in this utility model. Figure 1 ;

[0025] Figure 6 A cross-sectional view of a germanium wafer cleaning machine for germanium diode processing proposed in this utility model. Figure 2 .

[0026] In the attached diagram: 1. Cleaning tank, 2. Fixing frame, 3. Horizontal plate, 4. Drain pipe, 5. Hydraulic rod, 6. Connecting plate, 7. Fixing column, 8. Shaking plate, 9. Base frame, 10. Base column, 11. Placement box, 12. Ultrasonic generator, 13. Filter plate, 14. Vibration motor, 15. Cover plate, 16. Threaded block, 17. Magnetic block, 18. Adsorption block, 19. Guide rod, 20. Diagonal brace, 21. Spring. Detailed Implementation

[0027] like Figure 1-2 As shown, a germanium wafer cleaning machine for germanium diode processing includes a cleaning tank 1, a fixing frame 2 fixedly connected to one side of the cleaning tank 1, a horizontal plate 3 fixedly connected to the outer side wall of the fixing frame 2, a drain pipe 4 provided on the cleaning tank 1, and also includes a placement component and a cleaning component.

[0028] like Figure 1-4 As shown, to facilitate the placement of germanium diodes, a placement assembly is mounted on a horizontal plate 3 for placing germanium wafers. The placement assembly includes a hydraulic rod 5, a connecting plate 6, a fixing post 7, a swaying plate 8, a base frame 9, a bottom post 10, and a placement box 11. The hydraulic rod 5 vertically penetrates the horizontal plate 3 and is fixedly connected to it. The connecting plate 6 is fixedly connected to the free end of the hydraulic rod 5. The fixing post 7 is fixedly connected to the bottom of the connecting plate 6 and is arranged in a ⊥ shape, symmetrically distributed in pairs. The swaying plate 8 vertically penetrates the fixing post 7 and is slidably connected to it. The base frame 9 is fixedly connected to the bottom of the swaying plate 8 and is symmetrically distributed in pairs. The bottom post 10 is fixedly connected to the bottom of the base frame 9. The placement box 11 is fixedly connected to the lower end of the bottom post 10, and its top is open.

[0029] To prevent the germanium diode from leaving the placement box 11 during the cleaning process, a cover plate 15 is vertically slidable on the bottom post 10. A threaded block 16 is threadedly connected to the bottom post 10 and is located above the cover plate 15. Two symmetrically distributed magnetic blocks 17 are fixedly connected to the top of the cover plate 15. An adsorption block 18 is provided on the bottom wall of the base frame 9 and corresponds to the magnetic blocks 17 and is attracted to them.

[0030] like Figure 1-6As shown, in order to improve the cleaning effect of germanium diodes, a cleaning assembly is set inside the cleaning chamber 1 for cleaning germanium wafers. The cleaning assembly includes an ultrasonic generator 12 and a filter plate 13. The ultrasonic generator 12 is fixedly installed at the bottom of the cleaning chamber 1, and the filter plate 13 is fixedly connected between the inner walls of the cleaning chamber 1 and located on top of the ultrasonic generator 12. The cleaning assembly also includes a vibration motor 14, which is fixedly installed on the top of the shaking plate 8. A spring 21 is sleeved on the fixing column 7, and its two ends are fixedly connected between the connecting plate 6 and the shaking plate 8.

[0031] The top of the connecting plate 6 is fixedly connected to the guide rod 19, and its upper end vertically penetrates the horizontal plate 3 and is slidably connected to it. The horizontal plate 3 and the fixing frame are fixedly connected to the diagonal brace 20. The bottom of the placement box 11 is set with a mesh hollow design.

[0032] In practical use, the germanium diode to be cleaned is placed in the placement box 11. Then, the cover plate 15 is pressed down to separate the adsorption block 18 and the magnetic block 17 until they cover the placement box 11. Then, the threaded block 16 is screwed on to make it fit tightly against the top of the cover plate 15, preventing the germanium diode from leaving the placement box 11 during the cleaning process. An appropriate amount of cleaning fluid is added into the cleaning tank 1. The hydraulic rod 5 is extended to immerse the placement box 11 in the cleaning fluid. Then, the ultrasonic generator 12 is turned on to perform ultrasonic cleaning on the germanium diode in the placement box 11. After cleaning, the hydraulic rod 5 is retracted to close the placement box 11. After removing the diode from the cleaning solution, turn on the vibration motor 14. The shaking plate 8 vibrates on the fixed column 7 under the deformation of the spring 21, shaking off the remaining cleaning solution. Then, twist the threaded block 16 in the opposite direction and put it on the cover plate 15 until the adsorption block 18 and the magnetic block 17 are attracted to each other, so that the germanium diode in the box 11 can be taken out. The filter plate 13 can filter the impurities in the cleaning solution, and the discharged cleaning solution can be reused to save resources. When cleaning the germanium diode, the vibration motor 14 can also be turned on to make the shaking plate 8 vibrate, thereby improving the cleaning effect of the germanium diode.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents. In conclusion, if those skilled in the art, inspired by this description, design similar structural methods and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A germanium wafer cleaning machine for germanium diode processing, comprising a cleaning tank (1), a fixing frame (2) fixedly connected to one side of the cleaning tank (1), a horizontal plate (3) fixedly connected to the outer side wall of the fixing frame (2), and a drain pipe (4) provided on the cleaning tank (1), characterized in that: Also includes A placement component is provided on a horizontal plate (3) for placing germanium sheets; The cleaning assembly is located inside the cleaning chamber (1) and is used for cleaning germanium sheets.

2. The germanium wafer cleaning machine for processing germanium diodes according to claim 1, characterized in that: The placement assembly includes a hydraulic rod (5), a connecting plate (6), a fixed column (7), a swaying plate (8), a base frame (9), a base column (10), and a placement box (11), wherein: The hydraulic rod (5) passes vertically through the horizontal plate (3) and is fixedly connected to it. The connecting plate (6) is fixedly connected to the free end of the hydraulic rod (5). The fixed column (7) is fixedly connected to the bottom of the connecting plate (6) and is arranged in a ⊥ shape and is symmetrically distributed in pairs. The swaying plate (8) passes vertically through the fixed column (7) and is slidably connected to it. The base frame (9) is fixedly connected to the bottom of the swaying plate (8) and is symmetrically distributed in pairs. The bottom column (10) is fixedly connected to the bottom of the base frame (9). The placement box (11) is fixedly connected to the lower end of the bottom column (10) and its top is open.

3. The germanium wafer cleaning machine for processing germanium diodes according to claim 2, characterized in that: The cleaning assembly includes an ultrasonic generator (12) and a filter plate (13). The ultrasonic generator (12) is fixedly installed at the bottom of the cleaning tank (1), and the filter plate (13) is fixedly connected between the inner walls of the cleaning tank (1) and is located on top of the ultrasonic generator (12).

4. The germanium wafer cleaning machine for processing germanium diodes according to claim 3, characterized in that: The cleaning assembly also includes a vibration motor (14), which is fixedly installed on the top of the shaking plate (8). A spring is sleeved on the fixed column (7), and its two ends are fixedly connected between the connecting plate (6) and the shaking plate (8).

5. The germanium wafer cleaning machine for processing germanium diodes according to claim 3, wherein: A cover plate (15) is vertically slidably provided on the bottom column (10). A threaded block (16) is threadedly connected to the bottom column (10) and is located above the cover plate (15). Two symmetrically distributed magnetic blocks (17) are fixedly connected to the top of the cover plate (15). An adsorption block (18) is provided on the bottom wall of the base frame (9) and corresponds to the magnetic block (17) and is adsorbed to it.

6. The germanium wafer cleaning machine for processing germanium diodes according to claim 2, wherein: The top of the connecting plate (6) is fixedly connected to a guide rod (19), and its upper end vertically penetrates the horizontal plate (3) and is slidably connected to it. A diagonal brace (20) is fixedly connected between the horizontal plate (3) and the fixing frame (2). The bottom of the placement box (11) is set with a mesh-like hollow design.

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