Material taking mechanism with cleaning function and processing device

By designing a material handling mechanism with cleaning function, and utilizing the combination of air blowing structure, scraper and chip suction structure, the problem of low cleaning efficiency of stamping dies is solved, realizing rapid cleaning of waste chips in stamping dies and continuous material processing, thereby improving the overall processing efficiency.

CN224254068UActive Publication Date: 2026-05-19HONGFUJIN PRECISION ELECTRONICS ZHENGZHOU
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HONGFUJIN PRECISION ELECTRONICS ZHENGZHOU
Filing Date
2025-04-03
Publication Date
2026-05-19

AI Technical Summary

Technical Problem

In existing technologies, the cleaning efficiency of stamping dies is low, which affects the material processing efficiency.

Method used

Design a material handling mechanism with cleaning function, including an air blowing structure, a scraper and a chip suction structure, and a vacuum generator to achieve simultaneous cleaning of stamping dies and material placement, ensuring that waste chips are quickly and cleanly removed.

Benefits of technology

It improves the cleaning efficiency and material processing efficiency of stamping dies, ensuring that waste chips inside the die are quickly and cleaned up, thus avoiding damage to the next material.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a material taking mechanism with a cleaning function and a machining device. The material taking mechanism with the cleaning function is used for taking out materials located at a feeding position and then conveying the materials to a machining mold. The material taking mechanism with the cleaning function comprises a connecting base, a material taking assembly and a cleaning assembly. The material taking assembly is connected to the connecting base, and the material taking assembly is configured to take out the materials located at the feeding position; the cleaning assembly is connected to the connecting base, the cleaning assembly comprises an air blowing structure, a scraping plate and a scrap suction structure, the air blowing structure is configured to blow air towards residual scraps on the machining mold, and the scraping plate can move on the surface of the machining mold so as to push the residual scraps on the machining mold to move; the scrap suction structure is configured to suck scraps pushed by the scraper blade.
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Description

Technical Field

[0001] This application relates to the field of product processing technology, and in particular to a material handling mechanism and processing device with a cleaning function. Background Technology

[0002] When materials are processed in the processing workshop using molds, small debris often accumulates inside the molds, such as stamping dies, after processing. To prevent this debris from damaging subsequent materials, the stamping dies need to be cleaned after processing. Current cleaning methods mostly employ air knives to clean the stamping dies, which is noisy and inefficient, affecting material processing efficiency. Utility Model Content

[0003] This application provides a material handling mechanism and processing device with a cleaning function to solve the problem of low mold cleaning efficiency of stamping dies in the known art, which affects the processing efficiency of materials.

[0004] This application provides a material handling mechanism with a cleaning function, used to remove material located at the loading position and transport it to the processing mold; the material handling mechanism with a cleaning function includes a connecting seat, a material handling component, and a cleaning component; the material handling component is connected to the connecting seat and is configured to remove the material located at the loading position; the cleaning component is connected to the connecting seat and includes an air blowing structure, a scraper, and a chip suction structure; the air blowing structure is configured to blow air toward residual waste chips on the processing mold; the scraper is movable on the surface of the processing mold to push the residual waste chips on the processing mold to move; the chip suction structure is configured to suck up the waste chips pushed by the scraper.

[0005] In one possible implementation, during the process of the material being transported from the loading position to the processing mold by the material handling component, the material moves at least along a first direction, and along the first direction, the cleaning component is located on the side of the material handling component closer to the processing mold.

[0006] In one possible implementation, along the first direction, the blowing structure is located on the side of the chip suction structure away from the material handling component, and the scraper is located on the side of the chip suction structure close to the material handling component.

[0007] In one possible implementation, the chip removal structure includes a collection box with a collection chamber inside, the collection chamber being connected to a vacuum generating device; along a second direction, the collection box has a collection port on the side near the processing mold, the collection port being connected to the collection chamber, and the waste chips can enter the collection chamber from the collection port.

[0008] In one possible implementation, along the second direction, the recycling bin has an installation groove on the side near the processing mold, and along the first direction, the installation groove is located on the side of the recycling port near the material taking component, and the scraper portion is located within the installation groove, and the second direction intersects the first direction.

[0009] In one possible implementation, the blowing structure includes a blowing box, which is connected to the side of the recycling bin away from the material taking assembly along the first direction;

[0010] The air blowing box has an air chamber connected to an air supply component. An air blowing port is provided on one side of the air blowing box, which is connected to the air chamber and is oriented towards the processing mold.

[0011] In one possible implementation, along the first direction, the air blowing box has an inclined surface on the side away from the recycling box, and along the first direction, the inclined surface extends obliquely from the side away from the material taking component toward the processing mold to the side of the inclined surface near the material taking component, and the air blowing port is provided on the inclined surface.

[0012] In one possible implementation, the material handling assembly includes a material handling seat and a suction member, the material handling seat being connected to the connecting seat, the suction member being connected to the material handling seat, and the suction member being configured to pick up the material.

[0013] In one possible implementation, the material handling mechanism with cleaning function further includes a first moving device, which is tractively connected to the connecting seat and is used to drive the connecting seat to move at least along a first direction.

[0014] This application also provides a processing apparatus, including a feeding device, a processing mold, a discharging device, and the aforementioned material handling mechanism with a cleaning function. The material handling mechanism with a cleaning function is used to transport the material at the feeding device to the processing mold, and the discharging device is used to remove the material that has been processed at the processing mold.

[0015] The material handling mechanism with cleaning function of this application has both a material handling component and a cleaning component connected to a connecting base. This allows the movement of the connecting base to synchronously move both the material handling component and the cleaning component. When materials need to be transported to the processing mold for processing, the cleaning component first cleans the mold, and then the material is placed on the mold by the material handling component. This achieves continuous operation of waste removal and material placement, improving processing efficiency. Furthermore, the cleaning component consists of an air blowing structure, a scraper, and a chip suction structure. These structures work together to ensure rapid and thorough cleaning of waste within the processing mold, thereby improving cleaning efficiency and effectiveness. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the processing apparatus of this application in one embodiment.

[0017] Figure 2 This is a schematic diagram of the material handling mechanism with cleaning function in one embodiment of the present application.

[0018] Figure 3 This is a schematic diagram of a portion of the structure of the material handling mechanism with cleaning function in one embodiment of this application.

[0019] Figure 4 This is a schematic diagram of the cleaning component in one embodiment of the material handling mechanism with cleaning function of this application.

[0020] Figure 5 for Figure 4 A cross-sectional view of the material handling mechanism with cleaning function along the V-V direction.

[0021] Figure 6 for Figure 4 A cross-sectional view of the material handling mechanism with cleaning function along the VI-VI direction.

[0022] Explanation of main component symbols: 200, processing device; 100, material handling mechanism with cleaning function; X, first direction; Z, second direction; Y, third direction; P, inclined surface; 1, loading position; 2, material; 10, loading device; 11, processing table; 12, processing component; 20, stamping component; 30, processing mold; 40, unloading device; 50, first moving device; 60, connecting seat; 70, material handling component; 71, material handling seat; 72, suction component; 80, cleaning component; 81, air blowing structure; 811, air blowing box; 812, air blowing port; 813, air chamber; 82, scraper; 83, chip suction structure; 831, recovery box; 8311, recovery port; 8312, recovery chamber; 8313, mounting groove; 832, air circuit connector.

[0023] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0024] The following description will refer to the accompanying drawings to provide a more complete picture of the present application. The drawings illustrate exemplary embodiments of the present application. However, the present application may be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present application thorough and complete, and to fully convey the scope of the present application to those skilled in the art. Similar reference numerals denote the same or similar components.

[0025] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the application. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to also include the plural forms. Furthermore, when used herein, “comprising” and / or “including” and / or “having,” integers, steps, operations, components, and / or components, but does not exclude the presence or addition of one or more other features, regions, integers, steps, operations, components, and / or groups thereof.

[0026] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. Furthermore, unless expressly defined herein, terms such as those defined in a general dictionary should be interpreted as having the same meaning as they have in the relevant art and in the content of this application, and will not be interpreted as having an idealized or overly formal meaning.

[0027] The specific embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0028] like Figures 1 to 3 As shown, this embodiment provides a material handling mechanism 100 with a cleaning function, used to remove material 2 from the loading position 1 and transport it to the processing mold 30. The processing mold 30 can be a stamping mold or other mold, and the material 2 can be a material such as aluminum that can be stamped. After the material 2 completes the stamping operation in the stamping mold, waste debris generated during processing will remain in the stamping mold. The waste debris needs to be cleaned in time to avoid damaging the next material 2 placed into the stamping mold for processing. The material handling mechanism 100 with a cleaning function includes a connecting seat 60, a material handling component 70, and a cleaning component 80.

[0029] For ease of reading, this application introduces a first direction X, a second direction Z, and a third direction Y to describe the embodiments of this application. The first direction X, the second direction Z, and the third direction Y can be three non-parallel straight lines in space; further, the first direction X, the second direction Z, and the third direction Y can be three mutually perpendicular directions in a three-dimensional coordinate system (a three-dimensional Cartesian coordinate system). In subsequent embodiments, the first direction X is described as the X-axis direction of the three-dimensional coordinate system, the second direction Z is the Z-axis direction of the three-dimensional coordinate system, and the third direction Y is the Y-axis direction of the three-dimensional coordinate system.

[0030] The material handling component 70 is connected to the connecting base 60. The material handling component 70 is configured to remove the material 2 located at the loading position 1. The material handling component 70 can remove the material 2 from the loading position 1 by suction or clamping, and then the material 2 can be sent to the processing mold 30 by moving the material handling component 70. The cleaning component 80 is connected to the connecting base 60. The cleaning component 80 includes an air blowing structure 81, a scraper 82, and a chip suction structure 83. The air blowing structure 81 is configured to blow air towards the residual waste chips on the processing mold 30 to clean the waste chips from the protruding structures such as the positioning protrusions on the processing mold 30, thereby cleaning the waste chips from the protruding structures that the scraper 82 cannot directly clean. The scraper 82 can move on the surface of the processing mold 30 to move the residual waste on the surface of the processing mold 30, and can push the waste to gather at the chip suction structure 83. The chip suction structure 83 is configured to suck up the waste pushed by the scraper 82, thereby recovering the waste gathered by the scraper 82.

[0031] Thus, the material handling mechanism 100 with cleaning function of this application, with the material handling component 70 and the cleaning component 80 both connected to the connecting seat 60, enables the synchronous movement of the material handling component 70 and the cleaning component 80 when the connecting seat 60 moves. Therefore, when the material 2 needs to be transported to the processing mold 30 for processing, the processing mold 30 can be cleaned first by the cleaning component 80, and then the material 2 can be placed on the processing mold 30 by the material handling component 70. This allows for the continuous execution of the waste removal action and the placement of the material 2 on the processing mold 30, improving processing efficiency. Furthermore, the cleaning component 80 consists of an air blowing structure 81, a scraper 82, and a chip suction structure 83. These structures work together to perform the cleaning operation, ensuring that the waste inside the processing mold 30 is quickly and thoroughly cleaned, thereby improving cleaning efficiency and effectiveness.

[0032] Please combine Figures 1 to 3 In one embodiment, during the process of the material 2 located at the loading position 1 being transported by the material 70 to the processing mold 30, the material 2 moves at least along the first direction X. Along the first direction X, the cleaning component 80 is located on the side of the material 70 close to the processing mold 30.

[0033] Specifically, the material handling mechanism 100 with cleaning function also includes a first moving device 50. The first moving device 50 is drively connected to the connecting seat 60 and is used to drive the connecting seat 60 to move at least along the first direction X.

[0034] The first moving device 50 is a multi-degree-of-freedom manipulator, located between the loading position 1 and the processing mold 30 along the first direction X. The connecting seat 60 is a long strip structure, and is arranged along the first direction X. The driving end of the first moving device 50 is connected to one end of the connecting seat 60, so that the first moving device 50 can drive the connecting seat 60 to move in multiple directions, including the first direction X, the second direction Z, and the third direction Y.

[0035] The cleaning component 80 is connected to the end of the connecting seat 60 away from the first moving device 50, and the material picking component 70 is connected approximately to the middle position of the connecting seat 60. When the first moving device 50 drives the connecting seat 60 to move along the first direction X toward the processing mold 30, the cleaning component 80 first moves to the processing mold 30 to clean the processing mold 30. After the cleaning component 80 completes the cleaning, the material picking component 70 moves to the processing mold 30 and then places the material 2 at the processing mold 30.

[0036] Please combine Figure 3 In one embodiment, the material handling assembly 70 includes a material handling seat 71 and a suction member 72. The material handling seat 71 is connected to the connecting seat 60, and the suction member 72 is connected to the material handling seat 71. The suction member 72 is configured to pick up material 2. The suction member 72 is a component such as a negative pressure suction cup, and the suction member 72 is connected to a vacuum generating device to perform vacuum treatment on the suction member 72, thereby causing the material 2 to be picked up by the suction member 72 under negative pressure.

[0037] Along the first direction X, the material picker 71 is approximately connected to the middle position of the connecting seat 60, and the material picker 71 is connected to the bottom end face of the connecting seat 60. The material picker 71 can be detachably connected to the connecting seat 60 by means of bolts or other components.

[0038] Along the second direction Z, the suction element 72 is connected to the side of the picking seat 71 away from the connecting seat 60. The number of suction elements 72 is set to four, and the four suction elements 72 are roughly rectangularly distributed, and the four suction elements 72 are located at the four corners of the picking seat 71 to ensure the stability of the suction element 72 in picking up the material 2.

[0039] It is understood that in other embodiments, the number of suction components 72 may also be three or other numbers. The specific number and distribution of suction components 72 can be selected according to actual design requirements, and no specific restrictions are imposed in this application.

[0040] In addition, in other embodiments, the material picking component 70 may employ a gripping device such as a gripper cylinder, meaning that the material picking component 70 may also pick up the material 2 by means of gripping the material 2. The specific material picking method of the material picking component 70 is not specifically limited in this application.

[0041] Please combine Figures 3 to 5 In one embodiment, along the first direction X, the blowing structure 81 is disposed on the side of the chip suction structure 83 away from the material picking component 70, and the scraper 82 is disposed on the side of the chip suction structure 83 close to the material picking component 70.

[0042] When the connecting seat 60 moves toward the processing mold 30 along the first direction X, the blowing structure 81 first blows high-pressure gas onto the processing mold 30. On the one hand, it can blow away the waste debris on the positioning protrusions and other protruding structures on the processing mold 30. On the other hand, it can loosen the waste debris on the processing mold 30 that is difficult to be pushed by the scraper 82, making it easier for the scraper 82 to clean.

[0043] Along the first direction X, the chip suction structure 83 is located on the side of the scraper 82 near the processing mold 30. When the scraper 82 moves from the edge of the processing mold 30 near the loading position 1 toward the processing mold 30, the scraper 82 pushes the waste chips on the surface of the processing mold 30 and moves them together, eventually gathering the waste chips. This allows the gathered waste chips to be uniformly recycled through the chip suction structure 83 after being gathered, thereby improving the recycling efficiency.

[0044] Please combine Figures 3 to 5 In one embodiment, the dust collection structure 83 includes a collection box 831, which is arranged along a third direction Y. The collection box 831 has a collection chamber 8312, which is connected to a vacuum generator to perform a vacuuming operation on the collection chamber 8312. The vacuum generator can simultaneously connect the collection chamber 8312 and the suction component 72 via air paths, allowing both the collection box 831 and the suction component 72 to be vacuumed by the same vacuum generator. Furthermore, a solenoid valve is used to control the air path opening and closing, which reduces costs.

[0045] Along the second direction Z, the recycling box 831 has a recycling port 8311 on the side near the processing mold 30. The recycling port 8311 is connected to the recycling chamber 8312, and the waste can enter the recycling chamber 8312 from the recycling port 8311.

[0046] In this embodiment, multiple recycling chambers 8312 are provided, all located within a recycling box 831. Along the third direction Y, the multiple recycling chambers 8312 are arranged at intervals. Correspondingly, multiple recycling ports 8311 are provided, and each recycling port 8311 corresponds one-to-one with a recycling chamber 8312. Each recycling port 8311 is connected to its corresponding recycling chamber 8312, allowing for the selection of an appropriate number of recycling ports 8311 to operate based on the width of the processing mold 30 along the third direction Y, thereby reducing processing costs.

[0047] Furthermore, the chip suction structure 83 also includes multiple air connectors 832 connected along the second direction Z to the side of the recovery box 831 away from the processing mold 30. The number of air connectors 832 is the same as the number of recovery chambers 8312, and each air connector 832 is connected to its corresponding recovery chamber 8312. The vacuum generator is connected to the multiple air connectors 832, and solenoid valves can be installed on each connecting pipe to control the opening and closing of the pipe.

[0048] In this embodiment, along the second direction Z, the recycling bin 831 has an installation groove 8313 on the side near the processing mold 30. Along the first direction X, the installation groove 8313 is located on the side of the recycling port 8311 near the material handling assembly 70, and the scraper 82 is partially located within the installation groove 8313. The scraper 82 can be made of a material with a certain degree of elasticity, such as a soft rubber strip, to avoid damaging the processing mold 30 when the scraper 82 moves on the surface of the processing mold 30.

[0049] The mounting groove 8313 extends parallel to the third direction Y. The top of the scraper 82 is located within the mounting groove 8313, and the portion of the scraper 82 within the mounting groove 8313 is fixedly connected to the recycling bin 831. The bottom end of the scraper 82 protrudes from the mounting groove 8313 and extends beyond the bottom surface of the recycling bin 831, so that when the scraper 82 moves on the surface of the processing mold 30, the recycling bin 831 will not contact the processing mold 30, thus avoiding damage to the processing mold 30 caused by the recycling bin 831.

[0050] Please combine Figures 4 to 6 In one embodiment, the air blowing structure 81 includes an air blowing box 811 connected to the side of the recycling bin 831 away from the material handling assembly 70 along a first direction X. Along a third direction Y, the air blowing box 811 is connected approximately at the middle of the recycling bin 831, so that the airflow from the air blowing box 811 can flow evenly to both sides along the third direction Y.

[0051] The air blowing box 811 contains an air chamber 813, which is connected to an air supply assembly that provides high-pressure gas to the air chamber 813. An air blowing port 812 is located on one side of the air blowing box 811, positioned along a third direction (Y). The air blowing port 812 connects to the air chamber 813 and faces the processing mold 30. The air blowing port 812 has a small width; when the high-pressure gas is blown out through the air blowing port 812, it forms an air knife, thereby improving the airflow's cleaning effect on waste materials.

[0052] In this embodiment, along the first direction X, the side of the air blowing box 811 away from the recycling box 831 is provided with an inclined surface P. Along the first direction X, the inclined surface P extends obliquely from the side away from the material taking component 70 toward the processing mold 30 to the side of the inclined surface P close to the material taking component 70. The air blowing port 812 is provided on the inclined surface P so that the air blowing port 812 is set at an angle, and the airflow blown out from the air blowing port 812 is also set at an angle relative to the surface of the processing mold 30, further improving the cleaning effect of the airflow on the waste.

[0053] like Figure 1 As shown, this embodiment also provides a processing device 200, including a feeding device 10, a processing mold 30, a discharging device 40, and the aforementioned material handling mechanism 100 with cleaning function. The material handling mechanism 100 with cleaning function is used to transport the material 2 at the feeding device 10 to the processing mold 30, and the discharging device 40 is used to remove the material 2 that has been processed at the processing mold 30. The discharging device 40 can be composed of a multi-degree-of-freedom robot and a negative pressure suction cup, etc., so as to pick up the material 2 and transport it to other workstations.

[0054] The feeding device 10 includes a processing table 11 and a processing component 12, and the processing device 200 also includes a stamping component 20. Along the first direction X, the processing table 11 and the unloading device 40 are spaced apart on opposite sides of the stamping component 20. The processing mold 30 is placed on the stamping station of the stamping component 20. The processing table 11 is used to place the material 2 to be processed. The processing component 12 can be a processing robot capable of processing the material 2 placed on the processing table 11. The processing table 11 has a feeding position 1. After the material 2 is processed at the feeding position 1, the material 2 is picked up by a cleaning mechanism 100 and transported to the processing mold 30. After the material 2 completes the stamping operation at the processing mold 30, the unloading device 40 removes the stamped material 2.

[0055] The specific embodiments of this application have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that various changes and substitutions can be made to the specific embodiments of this application without departing from the scope of this application. All such changes and substitutions fall within the scope defined by this application.

Claims

1. A material handling mechanism with a cleaning function, used to remove material located at the loading position and transport it to the processing mold; characterized in that, The material handling mechanism with cleaning function includes: Connector; A material handling assembly connected to the connecting seat, the material handling assembly being configured to remove the material located at the feeding position; A cleaning assembly connected to the connecting seat, the cleaning assembly including an air blowing structure, a scraper, and a chip suction structure, the air blowing structure being configured to blow air toward residual waste chips on the processing mold, the scraper being movable on the surface of the processing mold to push the residual waste chips on the processing mold to move, and the chip suction structure being configured to suck up the waste chips pushed by the scraper.

2. The material handling mechanism with cleaning function as described in claim 1, characterized in that, During the process of the material being transported from the loading position to the processing mold by the material handling component, the material moves at least along a first direction, and along the first direction, the cleaning component is located on the side of the material handling component closer to the processing mold.

3. The material handling mechanism with cleaning function as described in claim 2, characterized in that, Along the first direction, the air blowing structure is located on the side of the chip suction structure away from the material taking component, and the scraper is located on the side of the chip suction structure close to the material taking component.

4. The material handling mechanism with cleaning function as described in claim 1, characterized in that, The chip removal structure includes a recycling box, which has a recycling chamber connected to a vacuum generator. Along the second direction, the recycling box has a recycling port on the side near the processing mold, which is connected to the recycling chamber, and the waste chips can enter the recycling chamber from the recycling port.

5. The material handling mechanism with cleaning function as described in claim 4, characterized in that, Along the second direction, the recycling bin has an installation groove on the side near the processing mold. Along the first direction, the installation groove is located on the side of the recycling port near the material taking component, and the scraper portion is located in the installation groove. The second direction intersects with the first direction.

6. The material handling mechanism with cleaning function as described in claim 4, characterized in that, The air blowing structure includes an air blowing box, which is connected to the side of the recycling box away from the material taking component along a first direction; The air blowing box has an air chamber connected to an air supply component. An air blowing port is provided on one side of the air blowing box, which is connected to the air chamber and is oriented towards the processing mold.

7. The material handling mechanism with cleaning function as described in claim 6, characterized in that, Along the first direction, the air blowing box has an inclined surface on the side away from the recycling box. Along the first direction, the inclined surface extends obliquely from the side away from the material taking component toward the processing mold to the side of the inclined surface near the material taking component, and the air blowing port is located on the inclined surface.

8. The material handling mechanism with cleaning function as described in claim 1, characterized in that, The material handling assembly includes a material handling seat and a material suction component. The material handling seat is connected to the connecting seat, and the material suction component is connected to the material handling seat. The material suction component is configured to pick up the material.

9. The material handling mechanism with cleaning function as described in claim 1, characterized in that, The material handling mechanism with cleaning function further includes a first moving device, which is tractively connected to the connecting seat and is used to drive the connecting seat to move at least along a first direction.

10. A processing apparatus, characterized in that, The device includes a feeding device, a processing mold, a discharging device, and a material handling mechanism with a cleaning function as described in any one of claims 1 to 9. The material handling mechanism with a cleaning function is used to transport the material from the feeding device to the processing mold, and the discharging device is used to remove the material that has been processed at the processing mold.