Conductive device and high-conductivity sealing ring structure thereof
By setting an installation hole inside the sealing ring and installing a conductive spring, the problems of electric sparks and oxidation of the conductive sealing ring during mechanical operation are solved, achieving the effects of low cost, high conductivity and resistance to failure.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YANTAI QICHUANG INTELLIGENT SOFTWARE TECHNOLOGY CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-05-19
AI Technical Summary
In the prior art, during mechanical operation, conductive sealing rings suffer from charge accumulation, which creates a potential difference and leads to problems such as electrical sparks, noise, vibration, and premature failure. Furthermore, high-performance conductive fillers are prone to oxidation, resulting in high sealing ring costs and easy failure.
The design incorporates a mounting hole within the sealing ring to house a conductive spring. The conductive spring is shorter than the sealing ring, ensuring that the sealing ring contacts the part first. The conductive spring then conducts electricity with the part when compressed to a certain ratio, preventing oxidation of the conductive filler. The combination of the rubber sealing ring and the conductive spring achieves low cost and high conductivity.
It achieves low-cost conductivity that is not prone to sealing failure, avoids the oxidation problem of conductive fillers, and ensures conductivity and sealing effect.
Smart Images
Figure CN224260886U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of conductive sealing technology, and more specifically, to a sealing ring structure with high conductivity. Furthermore, it also relates to a conductive device comprising the aforementioned sealing ring structure with high conductivity. Background Technology
[0002] In existing technologies, conductive sealing rings are composite devices that combine environmental sealing, electromagnetic shielding, and conductive transmission functions. Their technological background primarily stems from the dual requirements of industrial equipment for sealing protection and electrical performance management. Common conductive sealing rings, during mechanical operation, experience potential differences due to charge accumulation, generating electrical sparks that lead to pitting corrosion on the metal surface, causing noise, vibration, and premature failure. This indicates that existing conductive sealing rings suffer from insufficient conductive material performance. On one hand, conductive sealing rings rely on metal fillers (such as silver powder or silver-plated particles) to achieve conductivity. However, metal fillers exposed to humid, high-temperature, or corrosive environments for extended periods are prone to oxidation, leading to a decrease in conductivity. Furthermore, high-performance conductive fillers (such as pure silver powder) often result in high sealing ring prices, hindering large-scale application. On the other hand, while a higher filler ratio can improve conductivity, it also reduces rubber elasticity, affecting the sealing compression of the sealing ring. This can lead to problems such as high hardness and insufficient compression, ultimately causing sealing failure.
[0003] In summary, how to provide a conductive sealing ring that is low in manufacturing cost, not prone to sealing failure, and can guarantee conductivity is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0004] In view of this, the purpose of this utility model is to provide a sealing ring structure with high conductivity, which has low manufacturing cost, is not prone to sealing failure, and can ensure the conductivity of the parts.
[0005] Another objective of this invention is to provide a conductive device comprising the aforementioned sealing ring structure with high conductivity.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] A sealing ring structure with high electrical conductivity, comprising:
[0008] A sealing ring having at least two mounting holes along its circumference, the mounting holes both penetrating the sealing ring and extending along the axial direction of the sealing ring.
[0009] A conductive spring is disposed in the mounting hole. The height of the conductive spring is smaller than the height of the sealing ring. When the sealing ring is compressed to a predetermined pressure, the axial height of the sealing ring decreases so that both ends of the conductive spring are at the ends of the mounting hole.
[0010] In one embodiment, both ends of the conductive spring are tapered, and the middle dimension of the conductive spring is larger than the end dimension of the conductive spring.
[0011] In one embodiment, the mounting hole and the middle portion of the conductive spring are interference-fitted.
[0012] In one embodiment, the sealing ring is provided with at least two mounting holes at equal intervals in the circumferential direction.
[0013] In one embodiment, the sealing ring is a rubber sealing ring.
[0014] In one embodiment, the conductivity of the conductive spring is 0.7 × 10⁻⁶. 6 S / m-2.5×10 6 S / m.
[0015] A conductive device comprising a sealing ring structure with high conductivity as described in any one of the preceding claims.
[0016] When using the high-conductivity sealing ring structure provided by this invention, the conductive spring is installed inside the mounting hole of the sealing ring. Furthermore, because the height of the conductive spring is smaller than the height of the sealing ring, in actual use, the sealing ring will first contact the part. Only when the sealing ring is compressed to a certain proportion will the conductive spring directly contact the part and conduct electricity. This achieves both sealed assembly and ensures the conductivity of the part. Moreover, since this device only includes the sealing ring and the conductive spring, it eliminates the need for expensive metal fillers. This avoids the problem of metal fillers easily oxidizing when exposed to humid, high-temperature, or corrosive environments for extended periods. It also effectively reduces the manufacturing and maintenance costs of the device and avoids the problem of high hardness and insufficient compression force in the conductive sealing ring due to a high filler ratio.
[0017] In summary, the high conductivity sealing ring structure provided by this utility model has low manufacturing cost, is not prone to sealing failure, and can ensure the conductivity of the parts.
[0018] In addition, this utility model also provides a conductive device including the above-mentioned sealing ring structure with high conductivity. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0020] Figure 1 A schematic diagram of the high conductivity sealing ring structure provided by this utility model;
[0021] Figure 2 A front view of a sealing ring structure with high electrical conductivity;
[0022] Figure 3 A cross-sectional view of a sealing ring structure with high electrical conductivity;
[0023] Figure 4 for Figure 3 A partial schematic diagram.
[0024] Figures 1-4 middle:
[0025] 1 is a sealing ring, 11 is a mounting hole, and 2 is a conductive spring. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] The core of this invention is to provide a sealing ring structure with high conductivity, which is low in manufacturing cost, not prone to sealing failure, and can ensure the conductivity of parts. Another core aspect of this invention is to provide a conductive device including the aforementioned high-conductivity sealing ring structure.
[0028] Please refer to Figure 1 and Figure 2 This specific embodiment provides a sealing ring structure with high conductivity, including:
[0029] The sealing ring 1 has at least two mounting holes 11 along its circumference, and the mounting holes 11 penetrate the sealing ring 1 and extend along the axial direction of the sealing ring 1.
[0030] The conductive spring 2 is disposed in the mounting hole 11. The height of the conductive spring 2 is smaller than the height of the sealing ring 1. When the sealing ring 1 is compressed to a predetermined pressure, the axial height of the sealing ring 1 decreases so that the two ends of the conductive spring 2 are at the ends of the mounting hole 11.
[0031] It should be noted that this application provides an installation hole 11 inside the sealing ring 1, into which the conductive spring 2 is installed. The height of the conductive spring 2 is smaller than that of the sealing ring 1. This allows the high-conductivity sealing ring structure to allow the sealing ring 1 to contact the part first during use. Only when the sealing ring 1 is compressed to a certain ratio will the conductive spring 2 directly contact the part and conduct electricity. This structural design, in which the conductive spring 2 and the sealing ring 1 are directly combined (rather than adding conductive filler), can greatly increase conductivity while ensuring the sealing effect.
[0032] In practical applications, the shape, structure, material, and number of sealing ring 1 and conductive spring 2 can be determined according to the actual situation and needs.
[0033] When using the high conductivity sealing ring structure provided by this utility model, the conductive spring 2 is installed in the mounting hole 11 of the sealing ring 1. Since the height of the conductive spring 2 is smaller than the height of the sealing ring 1, in actual use, the sealing ring 1 will contact the part first. Only when the sealing ring 1 is compressed to a certain ratio will the conductive spring 2 directly contact the part and conduct electricity. This achieves both sealed assembly and ensures the conductivity of the part. Furthermore, since this device only includes the sealing ring 1 and the conductive spring 2, there is no need to use expensive metal fillers. This avoids the problem of metal fillers easily oxidizing when exposed to humid, high-temperature, or corrosive environments for a long time, effectively reducing the manufacturing and maintenance costs of the device. It also avoids the problem of high hardness and insufficient compression force in the conductive sealing ring due to a high filler ratio.
[0034] In summary, the high conductivity sealing ring structure provided by this utility model has low manufacturing cost, is not prone to sealing failure, and can ensure the conductivity of the parts.
[0035] In one embodiment, such as Figure 3 and Figure 4 As shown, both ends of the conductive spring 2 are tapered, and the size of the middle part of the conductive spring 2 is larger than the size of the end part of the conductive spring 2.
[0036] It should be noted that both ends of the conductive spring 2 are tapered, and the middle dimension of the conductive spring 2 is larger than the end dimension, meaning the conductive spring 2 has a spindle-shaped structure. The conductive spring 2 is press-fitted with the sealing ring 1, allowing the operator to manually insert the conductive spring 2 into the mounting hole 11, with the middle of the conductive spring 2 fitting snugly within the mounting hole 11 of the sealing ring 1. Furthermore, the conductive spring 2 is larger in the middle and smaller at both ends because during the compression process of the sealing ring 1, the mounting hole 11 of the sealing ring 1 will deform due to the compression. The smaller tapered dimensions at both ends of the conductive spring 2 allow the tapered structure to easily extend beyond the mounting hole 11 after the sealing ring 1 is compressed, making contact with the part. This prevents the conductive spring 2 from being blocked by the compressed sealing ring 1, thus affecting its conductivity. In actual use, the sealing ring 1 contacts the part first, and only when the sealing ring 1 is compressed to a certain proportion does the tapered structure of the conductive spring 2 directly contact the part to conduct electricity.
[0037] Furthermore, if other components are used to install the conductive spring 2 inside the sealing ring 1, the manufacturing of these components may be cumbersome, the installation operation time-consuming and labor-intensive, and other components may even prevent the conductive spring 2 from extending out of the sealing ring 1 and contacting the part, thus affecting the conductivity of the conductive spring 2. Of course, in practical applications, a suitable fixing method can be selected to fix the conductive spring 2 inside the mounting hole 11 of the sealing ring 1, ensuring that the conductive spring 2 only contacts the part and conducts electricity after the sealing ring 1 is compressed to a certain extent.
[0038] In one embodiment, such as Figure 3 and Figure 4 As shown, the mounting hole 11 and the middle part of the conductive spring 2 are interference fit to prevent the conductive spring 2 from easily disengaging from the mounting hole 11 during use.
[0039] In one embodiment, the sealing ring 1 is provided with at least two mounting holes 11 at equal intervals in the circumferential direction. The size, number, and position of the mounting holes 11 can be determined according to the actual situation and actual needs during actual application.
[0040] In one embodiment, the sealing ring 1 is a rubber sealing ring.
[0041] It should be noted that conventional conductive sealing rings are made by adding conductive fillers to the original material. This increases the price and reduces the sealing performance of the sealing ring. This application uses ordinary rubber (insulating) to make the sealing ring 1. The sealing ring 1 provides a sealing function, and the conductive spring 2 conducts electricity. Four, six, or eight mounting holes 11 can be provided around the sealing ring 1 to accommodate multiple conductive springs 2, which also helps improve the conductivity of the device.
[0042] In one embodiment, the conductivity of the conductive spring 2 is 0.7 × 10⁻⁶. 6S / m-2.5×10 6 S / m. The design of the conductive spring 2 needs to consider both the functional requirements of the specific device and the conductive connection. During the design process, appropriate materials must be selected, and the shape, size, and conductive contact method of the spring must be considered to ensure its stability and conductivity. Through optimized design, the conductive spring 2 can achieve better results in both its specific function and conductive function. In practical applications, the conductivity of the conductive spring 2 can be selected according to the actual situation and needs.
[0043] In addition to the high conductivity sealing ring structure described above, this utility model also provides a conductive device that includes the high conductivity sealing ring structure disclosed in the above embodiments. For the structure of other parts of this conductive device, please refer to the prior art, which will not be repeated here.
[0044] In addition, it should be noted that the orientation or positional relationship indicated by "top" and "bottom" in this application is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the purpose of simplifying the description and making it easier to understand, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0045] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. Any combination of all embodiments provided by this utility model is within the protection scope of this utility model and will not be elaborated upon here.
[0046] The conductive device and its highly conductive sealing ring structure provided by this utility model have been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core idea of this utility model. It should be noted that those skilled in the art can make several improvements and modifications to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.
Claims
1. A sealing ring structure with high electrical conductivity, characterized in that, include: A sealing ring (1) is provided with at least two mounting holes (11) along the circumferential direction. The mounting holes (11) all penetrate the sealing ring (1) and extend along the axial direction of the sealing ring (1). A conductive spring (2) is disposed in the mounting hole (11). The height of the conductive spring (2) is smaller than the height of the sealing ring (1). When the sealing ring (1) is compressed to a predetermined pressure, the axial height of the sealing ring (1) decreases so that both ends of the conductive spring (2) are at the ends of the mounting hole (11).
2. The high conductivity sealing ring structure according to claim 1, characterized in that, Both ends of the conductive spring (2) are tapered, and the middle dimension of the conductive spring (2) is larger than the end dimension of the conductive spring (2).
3. The high conductivity sealing ring structure according to claim 2, characterized in that, The mounting hole (11) and the middle part of the conductive spring (2) are interference fit.
4. The high conductivity sealing ring structure according to claim 1, characterized in that, The sealing ring (1) is provided with at least two mounting holes (11) at equal intervals in the circumferential direction.
5. The sealing ring structure with high conductivity according to any one of claims 1 to 4, characterized in that, The sealing ring (1) is a rubber sealing ring.
6. The sealing ring structure with high conductivity according to any one of claims 1 to 4, characterized in that, The conductivity of the conductive spring (2) is 0.7 × 10⁻⁶. 6 S / m-2.5×10 6 S / m.
7. A conductive device, characterized in that, The sealing ring structure with high conductivity as described in any one of claims 1 to 6 is included.