Triple heat dissipation device

Abstract

The utility model discloses a triple heat dissipation device, and relates to the technical field of vapor chambers. Comprising an upper copper plate and a lower copper plate which are used for rapid heat dissipation, and the thickness of the upper copper plate and the thickness of the lower copper plate are 0.1 mm-0. 3 mm due to the fact that the upper copper plate and the lower copper plate are integrally formed A sealed cavity is formed between the upper copper plate and the lower copper plate and used for low-boiling heat dissipation of water working media, and the height of the sealed cavity ranges from 0.2 mm to 0.6 mm. In the using process, when heat generated by a heat source is rapidly transmitted through the upper copper plate, the temperature of a water working medium in the sealed cavity rises, when the temperature reaches the boiling point, the working medium is rapidly subjected to phase change and absorbs a large amount of latent heat of vaporization, and due to the fact that the density of a gaseous working medium is lower than that of a liquid working medium, the gaseous working medium is diffused upwards under the action of buoyancy and fills the whole sealed cavity; the liquid working medium which flows back to the surface of the upper copper plate absorbs heat again, the boiling heat absorption process is repeated, continuous condensation circulation is formed, the device can adapt to the inclination angle in any direction, and the device is far superior to the traditional gravity dependence limitation that VC is only smaller than or equal to 15 degrees.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation plate technology, specifically a triple heat dissipation device. Background Technology

[0002] As mobile phones become more feature-rich and sophisticated, the number of electronic components within them also increases. This not only increases power consumption but also generates more heat, causing the phone to overheat. This situation affects the normal operation of the phone and significantly reduces the user experience. In the development of mobile phones, manufacturers have adopted many methods to achieve temperature equalization and heat dissipation. As a result, the VC heat dissipation plate for mobile phones was developed. The heat dissipation plate takes away the heat by contacting the heat source and then dissipates it evenly.

[0003] For example, a VC heat spreader and manufacturing equipment, as disclosed in patent publication number CN222849860U, includes an upper cover with a groove, a heat-conducting mesh placed in the groove of the upper cover, and a lower cover connected to one side of the upper cover. The lower cover has several support columns, and a water injection chamber is formed between the groove, the lower cover, and the support columns, and the water injection chamber is filled with water. By directly injecting water into the water injection chamber formed between the groove, the lower cover, and the support columns, the use of copper pipes in the prior art is eliminated. Because the vacuuming process does not use copper pipes, significant costs associated with transporting and using metal pipes are saved, improving product performance and manufacturing speed.

[0004] For example, a VC heat spreader, as disclosed in patent publication number CN213208734U, includes a plate body composed of a first isolation layer, a second isolation layer, a third isolation layer, and a fourth isolation layer. The second isolation layer is attached to the bottom surface of the first isolation layer, and the third isolation layer is attached to the bottom surface of the second isolation layer. The interior of the third isolation layer is vacuum-treated to form a vapor chamber, which is filled with coolant. The fourth isolation layer is attached to the bottom surface of the third isolation layer. The surface of the plate body is chrome-plated to form a chrome-plated layer, and the chrome-plated layer is parallel to the first isolation layer. Compared with the prior art, the advantages of this utility model are: better heat spreader performance than metal or heat pipes, resulting in more uniform surface temperature (reduced hot spots); secondly, using a VC heat spreader allows direct contact between the heat source and the equipment, thereby reducing thermal resistance.

[0005] However, during the use of the aforementioned devices and common devices, traditional heat dissipation plates rely on gravity for heat dissipation. When tilted, these plates often struggle to maintain stable heat dissipation for extended periods. Consequently, when faced with high-power, high-heat mobile phone electronic components, their heat dissipation efficiency gradually decreases, failing to effectively remove heat in a timely manner. This leads to excessively high phone temperatures, affecting normal operation and user experience. Therefore, we propose a more convenient and practical heat dissipation device to meet these needs. Utility Model Content

[0006] The purpose of this invention is to provide a triple heat dissipation device to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a triple heat dissipation device, comprising an upper copper plate and a lower copper plate, for rapid heat dissipation, wherein the upper copper plate and the lower copper plate are integrally stamped and have a thickness of 0.1mm-0.3mm;

[0008] A sealed cavity is formed between the upper copper plate and the lower copper plate for heat dissipation during low-temperature boiling of the water medium. The height of the sealed cavity is 0.2mm-0.6mm, and the internal pressure is maintained at 1-2kPa.

[0009] The inner wall of the lower copper plate is covered with cotton cloth for the condensate to flow back in the direction of zero gravity. The surface of the cotton cloth is provided with directional reflux channels printed with hydrophobic material. The top of the lower copper plate is fixedly connected with multiple equidistant protrusions.

[0010] The cotton fabric is made of at least one of ceramic fiber cloth, cotton fiber and polyester fiber, and the directional reflux channel is a channel formed by hydrophobic material or a capillary guide path formed by surface microstructure.

[0011] Furthermore, the top of the upper copper plate is provided with reinforcing ribs, which are wavy in shape.

[0012] Furthermore, the sealed cavity is filled with a water-based working medium, which has a boiling point of 10℃-20℃ under a pressure of 1.5kPa.

[0013] Furthermore, the surface of the cotton fabric is etched with 500-800 etchants / mm. 2 The micro-concave structure is used to enhance wettability and condensate distribution.

[0014] Furthermore, particles with a diameter of 20-40 μm and a concentration of 0.05 mg / cm³ are added into the sealed cavity. 3 -0.2mg / cm 3 The ZrVFe getter is used to maintain the vacuum level of the cavity.

[0015] Furthermore, the pressure of the sealed cavity is set to 1 kPa ± 2 kPa.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] This triple heat dissipation device, through the arrangement of cotton cloth and directional return channels, allows heat generated by the heat source to be rapidly transferred through the upper copper plate during use, raising the temperature of the water medium inside the sealed cavity. Because the cavity pressure is maintained at 1-2 kPa, the boiling point of the water medium drops to around 12°C. When the temperature reaches the boiling point, the medium rapidly undergoes a phase change, absorbing a large amount of latent heat of vaporization. The gaseous medium, due to its lower density than the liquid state, diffuses upwards under buoyancy, filling the entire sealed cavity. Upon contact with the cooler inner wall of the lower copper plate, the gaseous medium releases its latent heat of vaporization and re-condenses into a liquid state. The liquid medium flows along the directional return channels on the surface of the cotton cloth and eventually returns to the surface of the upper copper plate through capillary action of the protrusions or with the assistance of gravity. The liquid medium returning to the upper copper plate absorbs heat again, repeating the boiling and heat absorption process, forming a continuous cycle. This device can adapt to any tilt angle, far superior to the gravity-dependent limitation of traditional VC systems (≤15°), making it highly practical and suitable for widespread application.

[0018] Meanwhile, the copper plate is formed into micro-bumps and reinforcing ribs in one go by die stamping, which has the functions of heat dissipation and heat conduction enhancement and structural anti-collapse, while reducing processing costs. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the overall structure of this utility model in an exploded view.

[0021] Figure 3 This is a schematic diagram of the upper copper plate structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the cotton fabric structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the lower copper plate structure of this utility model.

[0024] In the diagram: 1. Upper copper plate; 2. Reinforcing rib; 3. Cotton cloth; 4. Directional return channel; 5. Lower copper plate; 6. Protrusion. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] When using portable terminal devices such as mobile phones, laptops, and tablets, heat dissipation equipment is required. When using this heat dissipation equipment, ensure that it is in close contact with the portable terminal device to ensure effective heat transfer. When installing the heat dissipation equipment, take care to avoid damaging the surface or internal components of the portable terminal device. Regularly check the cleanliness of the heat dissipation equipment to prevent dust or debris from blocking the heat dissipation channels and affecting the heat dissipation effect. Avoid using the heat dissipation equipment in extreme environments, such as excessively high or low temperatures, so as not to affect its heat dissipation performance and service life.

[0027] like Figures 1-5 As shown, this utility model provides a technical solution: a triple heat dissipation device, including an upper copper plate 1 and a lower copper plate 5, for rapid heat dissipation. The upper copper plate 1 and the lower copper plate 5 are integrally stamped and have a thickness of 0.1mm-0.3mm. A sealed cavity is formed between the upper copper plate 1 and the lower copper plate 5 for low-temperature boiling heat dissipation of a water-based working medium. The height of the sealed cavity is 0.2mm-0.6mm, and a low pressure of 1-2kPa is maintained inside. The sealed cavity is filled with a water-based working medium with a boiling point of 10℃-20℃ at a pressure of 1.5kPa. A particle size of 20-40μm and a concentration of 0.05mg / cm³ are added to the sealed cavity. 3 -0.2mg / cm 3 The ZrVFe getter is used to maintain the vacuum level of the cavity. The cavity pressure is set to 1kPa±2kPa. The top of the upper copper plate 1 is provided with a reinforcing rib 2, which is wavy.

[0028] It is important to note that in current use, the height of the sealed cavity is 0.5mm, and the boiling point of the water working fluid is reduced to 12℃ using an ultra-low pressure environment of 1.5kPa, achieving a phase change temperature far below 100℃ under normal pressure. This is suitable for low-temperature heat sources. Through plasma etching and fluorocarbon resin pattern printing, high capillary force and directional reflux channels 4 are constructed on the cotton cloth 3 to ensure efficient reflux of the condensate in the zero-gravity direction. The 0.2mm copper plate is stamped in one piece with micro-bumps 6 and reinforcing ribs 2, which have the functions of heat dissipation and heat conduction enhancement as well as structural anti-collapse, while reducing processing costs.

[0029] like Figure 3 As shown, the inner wall of the lower copper plate 5 is covered with cotton cloth 3 for the condensate to flow back in the direction of zero gravity. The surface of the cotton cloth 3 is provided with directional reflux channels 4 printed with hydrophobic material. Multiple equidistant protrusions 6 are fixedly connected to the top of the lower copper plate 5.

[0030] like Figure 4 As shown, the cotton cloth 3 is made of at least one of ceramic fiber cloth, cotton fiber, and polyester fiber. The directional reflux channel 4 is a channel formed by hydrophobic material or a capillary guide path formed by surface microstructure. 500-800 channels / mm are etched on the surface of the cotton cloth 3. 2The micro-concave structure is used to enhance wettability and condensate distribution.

[0031] It is important to note that during use, when the heat generated by the heat source is rapidly transferred through the upper copper plate 1, the temperature of the water medium inside the sealed cavity rises. Because the cavity pressure is maintained at 1-2 kPa, the boiling point of the water medium drops to approximately 12°C. When the temperature reaches the boiling point, the medium rapidly undergoes a phase change, absorbing a large amount of latent heat of vaporization. Because the gaseous medium has a lower density than the liquid state, it diffuses upwards under buoyancy, filling the entire sealed cavity. Upon contact with the cooler inner wall of the lower copper plate 5, the gaseous medium releases its latent heat of vaporization and re-condenses into a liquid state. The working fluid flows along the directional return channel 4 on the surface of the cotton cloth 3, and finally returns to the surface of the upper copper plate 1 through the capillary action of the protrusions 6 or the assistance of gravity. The liquid working fluid returning to the upper copper plate 1 absorbs heat again, repeating the boiling and heat absorption process to form a continuous cycle. This device can adapt to any tilt angle, which is far superior to the gravity dependence limitation of traditional VC of only ≤15°. At the same time, the copper plate is formed into micro protrusions 6 and reinforcing ribs 2 in one piece by die stamping, which has the functions of heat dissipation and heat conduction enhancement and structural anti-collapse, while reducing processing costs.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended embodiments and their equivalents.

Claims

1. A triple heat dissipation device, characterized in that: include The upper copper plate (1) and the lower copper plate (5) are used for rapid heat dissipation. The upper copper plate (1) and the lower copper plate (5) are integrally stamped and have a thickness of 0.1mm-0.3mm. A sealed cavity is formed between the upper copper plate (1) and the lower copper plate (5) for heat dissipation during low-temperature boiling of the water medium. The height of the sealed cavity is 0.2mm-0.6mm, and the internal pressure is maintained at 1-2kPa. The inner wall of the lower copper plate (5) is covered with cotton cloth (3) for the condensate to flow back in the direction of zero gravity. The surface of the cotton cloth (3) is provided with a directional reflux channel (4) printed with hydrophobic material. The top of the lower copper plate (5) is fixedly connected with multiple equidistant protrusions (6). The cotton cloth (3) is made of at least one of ceramic fiber cloth, cotton fiber and polyester fiber, and the directional reflux channel (4) is a channel formed by hydrophobic material or a capillary guide path formed by surface microstructure.

2. The triple heat dissipation device according to claim 1, characterized in that: The top of the upper copper plate (1) is provided with a reinforcing rib (2), which is wavy.

3. The triple heat dissipation device according to claim 1, characterized in that: The sealed cavity is filled with a water-based working medium, which has a boiling point of 10℃-20℃ under a pressure of 1.5kPa.

4. The triple heat dissipation device according to claim 1, characterized in that: The surface of the cotton fabric (3) is etched with 500-800 per mm. 2 The micro-concave structure is used to enhance wettability and condensate distribution.

5. The triple heat dissipation device according to claim 1, characterized in that: The sealed cavity contains particles with a diameter of 20-40 μm and a concentration of 0.05 mg / cm³. 3 -0.2mg / cm 3 The ZrVFe getter is used to maintain the vacuum level of the cavity.

6. The triple heat dissipation device according to claim 1, characterized in that: The pressure of the sealed cavity is set to 1 kPa ± 2 kPa.

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