Multifunctional BGA chip defect measuring device

Abstract

The utility model relates to the technical field of chip measurement, in particular to a multifunctional measuring device for BGA chip defects. The multifunctional BGA chip defect measuring device comprises a ruler plate and a plurality of plug gauge sheets with different thicknesses, the ruler plate can measure the length and the width of the BGA chip defect; the plug gauge sheet is movably connected to the ruler plate and has a storage position and a working position, the plug gauge sheet is stored in the ruler plate at the storage position, and the plug gauge sheet extends out of the ruler plate to measure the gap thickness of the BGA chip defect at the working position. According to the device, the ruler and the plug gauge are integrated, so that an operator does not need to replace a tool when measuring the defect of a single BGA chip, the measurement time of the defect of the BGA chip can be effectively shortened, and the working efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of chip measurement technology, and more specifically, to a multifunctional measurement device for defects in BGA chips. Background Technology

[0002] In the semiconductor chip manufacturing process, especially in the production of BGA chips, various types of defects may occur due to the influence of a variety of complex factors. To ensure product quality and determine whether to release or scrap the product, appropriate tools must be used to accurately measure and assess these defects. Currently, rulers and plug gauges are commonly used in the industry to accomplish this task. Rulers are primarily used to measure the length and width of defects, while plug gauges are responsible for measuring the gap thickness of defects.

[0003] In practical applications, when measuring defects in a single product, operators need to frequently switch between rulers and plug gauges. This operation is not only time-consuming and labor-intensive, but also places high demands on the operator's technical proficiency. For rapid and efficient defect identification on the production line, this complex operation process greatly affects overall production efficiency and may lead to lax quality control due to human error. Utility Model Content

[0004] This application provides at least one multifunctional measuring device for BGA chip defects. This device integrates a ruler and a plug gauge, so that operators do not need to change tools when measuring defects in a single BGA chip, thereby effectively shortening the measurement time for BGA chip defects and improving work efficiency.

[0005] This application provides a multifunctional measuring device for BGA chip defects, the device including a ruler and multiple plug gauges of varying thicknesses;

[0006] The ruler can measure the length and width of defects in BGA chips;

[0007] The plug gauge is movably connected to the ruler plate and has a retracted position and a working position. In the retracted position, the plug gauge is retracted into the ruler plate. In the working position, the plug gauge protrudes outside the ruler plate to measure the gap thickness of BGA chip defects.

[0008] In one alternative embodiment, the ruler is provided with a plurality of scale lines of different widths and corresponding readings for each scale line.

[0009] In one alternative embodiment, the scale lines are arranged sequentially, and the width of the scale lines gradually increases or decreases along the arrangement direction.

[0010] In one alternative implementation, the ruler is a transparent plate.

[0011] In one alternative embodiment, the plug gauge fits against the surface of the ruler when in the stowed position.

[0012] In one alternative implementation, the plug gauge is provided with a thickness parameter.

[0013] In one alternative embodiment, the plug gauge is rotatably disposed on the ruler plate, and the plug gauge rotates relative to the ruler plate to switch positions.

[0014] In one optional embodiment, the plug gauges are distributed at circumferential intervals along the ruler plate, and the rotation direction of each plug gauge is consistent when it is stored.

[0015] In one alternative embodiment, the device further includes a rotating shaft and two limiting members;

[0016] The pivot extends through the thickness of the ruler plate, and the plug gauge is fitted onto the pivot.

[0017] The limiting components are respectively disposed at both ends of the rotating shaft.

[0018] In one alternative embodiment, the limiting member is a sleeve, and the diameter of the middle part of the rotating shaft is smaller than the diameters of the two ends.

[0019] The above-mentioned technical solution of this application has the following beneficial technical effects:

[0020] The multifunctional measuring device for BGA chip defects in this application integrates a ruler and a plug gauge, allowing operators to measure defects in a single BGA chip without changing tools midway, thereby effectively shortening the measurement time and improving work efficiency.

[0021] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0023] Figure 1This paper shows a schematic diagram of the structure of a multifunctional measurement device for BGA chip defects provided in an embodiment of this application;

[0024] Figure 2 It shows Figure 1 Assembly diagram of the center ruler plate and plug gauge piece;

[0025] In the picture:

[0026] 10. Ruler plate; 11. Scale lines; 12. Reading; 20. Plug gauge; 21. Thickness parameter; 30. Rotating shaft; 40. Limiting component. Detailed Implementation

[0027] Various exemplary embodiments of this application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application.

[0028] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0029] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0030] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] refer to Figure 1 This application provides a multifunctional measuring device for BGA chip defects. The device includes a ruler plate 10 and multiple plug gauges 20 of varying thicknesses. The ruler plate 10 can measure the length and width of the BGA chip defects. The plug gauges 20 are movably connected to the ruler plate 10 and have a retracted position and a working position. In the retracted position, the plug gauges 20 are retracted into the ruler plate 10. In the working position, the plug gauges 20 protrude beyond the ruler plate 10 to measure the gap thickness of the BGA chip defects. In practical use, the operator can use the ruler plate 10 to measure the length and width of the BGA chip defects. Simultaneously, the operator can move the plug gauges 20 on the ruler plate 10 to the working position to measure the gap thickness of the BGA chip defects.

[0033] The multifunctional measuring device for BGA chip defects in this application integrates a ruler and a plug gauge, allowing operators to measure defects in a single BGA chip without changing tools midway, thereby effectively shortening the measurement time and improving work efficiency.

[0034] Optionally, in this embodiment, the ruler 10 is provided with a plurality of scale lines 11 of different widths and corresponding readings 12 for each scale line 11. For example... Figure 1 As shown in the illustration, this embodiment displays five scale lines 11, with width readings 12 of 1mm, 0.75mm, 0.5mm, 0.3mm, and 0.1mm, respectively. In use, the operator can first determine the scale line 11 corresponding to the length / width of the BGA chip defect by comparison, and then determine the length / width of the BGA chip defect based on the readings 12 of the scale line 11. Of course, the width and number of scale lines 11 can be selected according to actual conditions, and are not limited to the methods discussed above.

[0035] Optionally, in this embodiment, the scale lines 11 are arranged sequentially, and the width of the scale lines 11 gradually increases or decreases along the arrangement direction. For example... Figure 1As shown in the figure, this embodiment illustrates that the scale lines 11 are arranged sequentially from left to right, and the width of each scale line 11 decreases sequentially from left to right. Of course, the arrangement of the scale lines 11 can be selected according to the actual situation, and is not limited to the arrangement discussed above.

[0036] Optionally, in this embodiment, the ruler 10 is a transparent plate. In practical use, the operator can see the defect location and surrounding details on the chip surface below through the transparent plate, which helps to quickly and accurately align the scale lines 11 of the transparent plate to the edge of the defect or specific features, thereby improving the reliability and efficiency of the measurement results. Of course, in other embodiments, the ruler 10 can also be a non-transparent plate.

[0037] Optionally, in this embodiment, the plug gauge 20 is provided with a thickness parameter 21. For example... Figure 1 As shown in the illustration, this embodiment displays four plug gauge pieces 20, with thickness parameters 21 of 0.01mm, 0.05mm, 0.075mm, and 0.1mm for each piece. This arrangement facilitates the operator's selection of the appropriate plug gauge piece 20 based on the thickness parameter 21, thus improving operational convenience. Of course, the thickness of the plug gauge piece 20 can be selected according to actual conditions and is not limited to the method discussed above.

[0038] Optionally, in this embodiment, the thickness of one of the plug gauges 20 is equal to the maximum gap thickness required for the BGA chip defect. For example, the maximum gap thickness required for the BGA chip defect is 0.075 mm. When the gap thickness of the BGA chip defect is not greater than 0.075 mm, the BGA chip can be considered a normal product. When the gap thickness of the BGA chip defect is greater than 0.075 mm, the BGA chip can be considered a defective product and requires rework. Of course, the maximum gap thickness required for the BGA chip defect can be selected according to the actual situation and is not limited to the method discussed above.

[0039] Optionally, in this embodiment, the plug gauge 20 is attached to the surface of the ruler plate 10 when in the stowed position. For example... Figure 1 As shown, the plug gauge 20 is attached to the upper surface of the ruler plate 10 when in the stowed position. Of course, in other embodiments, the plug gauge 20 can also be attached to the side or lower surface of the ruler plate 10 when in the stowed position.

[0040] Optionally, in this embodiment, the plug gauge 20 is rotatably disposed on the ruler plate 10, and the plug gauge 20 rotates relative to the ruler plate 10 to switch positions. That is, the plug gauge 20 can switch between a storage position and a working position by rotating relative to the ruler plate 10. Figure 1As shown in this embodiment, the plug gauge 20 is rotatably disposed on the surface of the ruler plate 10. When the plug gauge 20 is in the retracted position, it is in contact with the surface of the ruler plate 10. When the plug gauge 20 is in the working position, one end of it protrudes beyond the ruler plate 10. Of course, in other embodiments, the plug gauge 20 can also move relative to the ruler plate 10 to change its position.

[0041] Optionally, in this embodiment, the plug gauge pieces 20 are spaced apart circumferentially along the ruler plate 10, and the rotation direction of each plug gauge piece 20 is consistent when it is stored. For example... Figure 1 As shown in the illustration, this embodiment displays four plug gauge pieces 20, each positioned at one of the four corners of the ruler plate 10. When each plug gauge piece 20 rotates clockwise relative to the ruler plate 10, it retracts into the surface of the ruler plate 10. When each plug gauge piece 20 rotates counterclockwise relative to the ruler plate 10, one end protrudes beyond the ruler plate 10, and this protruding end can measure the gap thickness of BGA chip defects. This arrangement avoids interference between adjacent plug gauge pieces 20, making operation more convenient. Of course, the installation position of the plug gauge pieces 20 can be selected according to actual conditions and is not limited to the method discussed above.

[0042] Optionally, in this embodiment, as Figure 2 As shown, the device also includes a rotating shaft 30 and two limiting members 40. The rotating shaft 30 extends through the thickness of the ruler plate 10, and the plug gauge 20 is sleeved on the rotating shaft 30. The two limiting members 40 are respectively disposed at both ends of the rotating shaft 30. Specifically, the plug gauge 20 is rotatably mounted on the ruler plate 10 via the rotating shaft 30, allowing the plug gauge 20 to rotate relative to the ruler plate 10. The two limiting members 40 are fixed to the rotating shaft 30 and are used to clamp the plug gauge 20 and the ruler plate 10 to prevent the plug gauge 20 from rotating freely on the ruler plate 10, thereby affecting the user experience. Of course, the installation method of the plug gauge 20 can be selected according to the actual situation and is not limited to the method discussed above.

[0043] Optionally, in this embodiment, the limiting member 40 can be a socket. For example... Figure 2 As shown in the figure, this embodiment illustrates that the limiting member 40 can be a ring-shaped structure, which is sleeved on the outside of the rotating shaft 30 and fixedly connected to the rotating shaft 30. Of course, the limiting member 40 can also adopt other structures, such as a pin that penetrates the radial direction of the rotating shaft 30 or a nut that is threaded into the rotating shaft 30.

[0044] Optionally, in this embodiment, the diameter of the middle portion of the rotating shaft 30 is smaller than the diameters of both ends. Specifically, the diameters of both ends of the rotating shaft 30 can be larger than the aperture of the limiting member 40, thus restricting the limiting member 40 onto the rotating shaft 30 to prevent it from falling off, thereby ensuring the connection stability between the plug gauge 20 and the ruler plate 10. In specific implementations, the side surface of the rotating shaft 30 can be a stepped surface or a curved surface (i.e., the diameter of the rotating shaft 30 gradually increases from the middle to both ends). This application does not specifically limit this aspect.

[0045] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.

[0046] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A multifunctional measurement device for defects in BGA chips, characterized in that, The device includes a ruler and multiple plug gauges of varying thicknesses; The ruler can measure the length and width of defects in BGA chips; The plug gauge is movably connected to the ruler plate and has a retracted position and a working position. In the retracted position, the plug gauge is retracted into the ruler plate. In the working position, the plug gauge protrudes outside the ruler plate to measure the gap thickness of BGA chip defects.

2. The multifunctional measurement device for BGA chip defects according to claim 1, characterized in that, The ruler is provided with multiple scale lines of different widths and corresponding readings for each scale line.

3. The multifunctional measurement device for BGA chip defects according to claim 2, characterized in that, The scale lines are arranged sequentially, and the width of the scale lines gradually increases or decreases along the direction of arrangement.

4. The multifunctional measurement device for BGA chip defects according to claim 1, characterized in that, The ruler is a transparent plate.

5. The multifunctional measurement device for BGA chip defects according to claim 1, characterized in that, The plug gauge fits against the surface of the ruler when in the storage position.

6. The multifunctional measurement device for BGA chip defects according to claim 1, characterized in that, The plug gauge is configured with a thickness parameter.

7. The multifunctional measurement device for BGA chip defects according to claim 1, characterized in that, The plug gauge is rotatably mounted on the ruler plate, and the plug gauge can rotate relative to the ruler plate to switch positions.

8. The multifunctional measurement device for BGA chip defects according to claim 7, characterized in that, The plug gauges are distributed at intervals along the circumference of the ruler plate, and the rotation direction of each plug gauge is consistent when it is stored.

9. The multifunctional measurement device for BGA chip defects according to claim 7, characterized in that, The device also includes a rotating shaft and two limiting components; The pivot extends through the thickness of the ruler plate, and the plug gauge is fitted onto the pivot. The limiting components are respectively disposed at both ends of the rotating shaft.

10. The multifunctional measurement device for BGA chip defects according to claim 9, characterized in that, The limiting component is a sleeve, and the diameter of the middle part of the rotating shaft is smaller than the diameters of the two ends.

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