Power supply over-current protection testing device
By combining a chip test main control board, an oscilloscope module, and a controlled switch module, voltage and current waveforms are monitored in real time, solving the problems of high cost and low efficiency in traditional power supply overcurrent protection testing and achieving efficient power supply overcurrent protection testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN TECH UNIV
- Filing Date
- 2025-05-27
- Publication Date
- 2026-05-19
AI Technical Summary
Existing technologies require various instruments and equipment for power supply overcurrent protection testing and rely on visual observation, resulting in high testing costs and low efficiency.
A combination of a chip test control board, a chip test board, an oscilloscope module, and a controlled switch module is used to monitor voltage and current waveforms in real time through an oscilloscope, thereby understanding the working process of the overcurrent protection switch inside the chip.
This reduces the amount of equipment needed for testing, lowers testing costs, and improves testing efficiency, eliminating the need for software engineers to master the use of multiple instruments.
Smart Images
Figure CN224263363U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of power supply overcurrent protection detection technology, and in particular to power supply overcurrent protection testing devices. Background Technology
[0002] Currently, chips on the market, such as photoelectric encoders, are composed of many sub-modules with different functions. Each module requires a different amount of current. Some important, large-scale sub-modules require high current due to their complex circuit design. Therefore, designers incorporate overcurrent protection circuits into the power supply section of the chip to prevent overcurrent thermal damage caused by latch-up or other reasons during use. After chips are fabricated at the wafer fab, they are bare dies. Hardware engineers design dedicated chip test boards to conduct comprehensive testing. Overcurrent protection functions typically have pre-reserved test interfaces to verify their functionality. A common method for testing overcurrent protection is to use a combination of a DC digitally controlled power supply and an electronic load. The electronic load is set to constant current mode, and the overcurrent protection current value is adjusted while observing the voltage change of the DC digitally controlled power supply to understand the overcurrent protection process. Figure 1 As shown, a traditional power supply overcurrent protection test system mainly consists of a chip test control board, a chip test board, a DC digitally controlled power supply, and an electronic load. The chip test board has a reserved voltage input interface VDDA_IN and an overcurrent protection voltage test interface VDDA. The chip internally contains an overcurrent protection switch S1. The traditional overcurrent protection test method is as follows:
[0003] Step 1: Press Figure 1 Connect the DC digital control power supply and the electronic load to the test points on the chip test board.
[0004] Step 2: Send a command through the chip test main control board to configure the overcurrent protection threshold of the overcurrent protection switch inside the chip on the chip test board to the maximum value of 160mA.
[0005] Step 3: Set the voltage of the CNC DC power supply to 5V and the current to 165mA.
[0006] Step 4: Set the electronic load to constant current mode and set the current value to 150mA. Then, increase the current setting of the electronic load in 5mA increments while observing the voltage value on the DC CNC power supply display. You will find that as the electronic load current value gradually reaches 160mA or 165mA, the voltage value on the DC CNC power supply display will decrease. At this time, use a multimeter to test the overcurrent protection voltage test interface VDDA. You will find that the VDDA voltage value is 0V, indicating that the overcurrent protection switch S1 inside the chip has triggered the overcurrent protection threshold of 160mA and turned off, thus enabling the overcurrent protection function.
[0007] As can be seen from the above testing process of traditional overcurrent protection, the testing of traditional overcurrent protection mainly relies on instrument testing and visual observation of the final output result. It is impossible to see the detailed working process of the overcurrent protection switch inside the chip. In addition, software engineers need to be proficient in the use of each instrument, which is cumbersome and not conducive to software engineers. Utility Model Content
[0008] This invention aims to address at least the technical problems existing in the prior art, such as the need for multiple instruments and equipment for testing and the requirement for visual monitoring of output results, leading to excessively high testing costs and low testing efficiency. To this end, this invention proposes a power supply overcurrent protection testing device that can reduce testing costs and improve testing efficiency.
[0009] To achieve the above objectives, this utility model proposes a power supply overcurrent protection testing device for performing overcurrent protection testing on chips. It includes: a chip testing main control board, which includes a power port and an output port, used to configure the chip's overcurrent protection threshold; and a chip testing board, communicatively connected to the chip testing main control board, used for fixing and testing the chip, which includes a power input terminal and a voltage testing interface. The voltage testing interface of the chip testing board is connected to the output port of the chip testing main control board, and the power input terminal of the chip testing board is connected to the power port of the chip testing main control board. An overcurrent protection switch for the chip is connected to both the power input terminal and the voltage testing interface. Between the interfaces; an oscilloscope module, used for real-time monitoring and display of the chip's voltage and current, including a current probe and a voltage probe, the current probe and voltage probe of the oscilloscope module are connected to the voltage test interface of the chip test board; a controlled switch module, including a control terminal, an input terminal and an output terminal, the control terminal of the controlled switch module is connected to the output port of the chip test main control board, a first resistor is connected between the input terminal and the control terminal of the controlled switch module, the output terminal of the controlled switch module is connected to the voltage test interface of the chip test board, wherein the output port of the chip test main control board outputs a control signal, and the controlled switch module remains on for a set time according to the control signal.
[0010] Preferably, the controlled switch module is a MOSFET, with the gate of the MOSFET connected to the control terminal of the controlled switch module, the source of the MOSFET connected to the input terminal of the controlled switch module, and the drain of the MOSFET connected to the output terminal of the controlled switch module.
[0011] Preferably, the first resistor is connected between the gate and source of the MOSFET.
[0012] Preferably, the power overcurrent protection test device further includes a first capacitor, one end of which is connected to the power port of the chip test main control board and the power input terminal of the chip test board, and the other end of the first capacitor is grounded.
[0013] Preferably, the time is set to 80 μS.
[0014] Preferably, the capacitance of the first capacitor is 220μF.
[0015] Preferably, the resistance value of the first resistor is 10KΩ.
[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood in conjunction with the following description of the embodiments in conjunction with the accompanying drawings, wherein:
[0018] Figure 1 This is a schematic diagram of a traditional power supply overcurrent protection test device;
[0019] Figure 2 This is a schematic diagram of the power supply overcurrent protection testing device provided in this embodiment of the utility model;
[0020] Figure 3 Is using Figure 2 The current and voltage waveforms displayed on the oscilloscope module when the power supply overcurrent protection device is tested. Detailed Implementation
[0021] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0022] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the application or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0024] refer to Figures 2 to 3 This utility model proposes a power supply overcurrent protection test device for performing overcurrent protection tests on chips. It includes: a chip test main control board, a chip test board, an oscilloscope module, a first resistor, and a first capacitor.
[0025] The chip test main control board includes a power port VDD and an output port Load_ctrl, used to configure the chip's overcurrent protection threshold. The chip test board, used for fixed connection and testing of the chip, includes a power input terminal VDDA_IN and a voltage test interface VDDA. The voltage test interface VDDA of the chip test board is connected to the output port Load_ctrl of the chip test main control board, and the power input terminal VDDA_IN of the chip test board is connected to the power port VDD of the chip test main control board. The chip's overcurrent protection switch S1 is connected between the power input terminal VDDA_IN and the voltage test interface VDDA. An oscilloscope module is used for... The system monitors and displays the voltage and current of the chip, including a current probe and a voltage probe. Both the current probe and voltage probe of the oscilloscope module are connected to the voltage test interface VDDA of the chip test board. The controlled switch module includes a control terminal, an input terminal, and an output terminal. The control terminal of the controlled switch module is connected to the output port Load_ctrl of the chip test main control board. A first resistor is connected between the input terminal and the control terminal of the controlled switch module. The output terminal of the controlled switch module is connected to the voltage test interface VDDA of the chip test board. The output port Load_ctrl of the chip test main control board outputs a control signal, and the controlled switch module remains on for a set time according to the control signal.
[0026] The controlled switch module is a MOSFET. The gate of the MOSFET is connected to the control terminal of the controlled switch module, the source of the MOSFET is connected to the input terminal of the controlled switch module, and the drain of the MOSFET is connected to the output terminal of the controlled switch module.
[0027] The first resistor is connected between the gate and source of the MOSFET. In this embodiment, the resistance of the first resistor is 10KΩ.
[0028] One end of the first capacitor is connected to the power port VDD of the chip test main control board and the power input terminal VDDA_IN of the chip test board, and the other end of the first capacitor is grounded. In this embodiment, the capacitance value of the first capacitor is 220μF.
[0029] In this embodiment, the time is set to 80μS.
[0030] The following is combined with Figure 2 and Figure 3 The working principle of this application will be explained below.
[0031] from Figure 2As can be seen, the chip test board has reserved a voltage input interface VDDA_IN and an overcurrent protection voltage test interface VDDA for the test chip. Internally, the chip is protected by an overcurrent protection switch S1. The improved chip overcurrent protection test method is as follows:
[0032] Step 1: First, connect the 5V power supply of the chip test main control board to the power input terminal VDDA_IN of the chip test board, and add a first capacitor C1 with a value of 220uF at the VDDA_IN terminal to prevent the voltage at the power input terminal VDDA_IN of the chip test board from dropping too much when the overcurrent protection occurs, which would affect the power supply stability of the other circuits.
[0033] Step 2: Connect the voltage test interfaces VDDA and GND of the chip test board to the drain and source of the MOS transistor in the controlled switch module, respectively.
[0034] Step 3: Connect the output ports Load_Ctrl and GND of the chip test main control board to the gate and source of the MOS transistor, respectively.
[0035] Step 4: Use the voltage test interface VDDA on the chip test board as the test point. Connect the current probe (CurrentProbe) and voltage probe (VoltageProbe) of the oscilloscope to the voltage test interface VDDA respectively, and set the oscilloscope to trigger mode.
[0036] Step 5: Send a command through the chip test main control board to configure the overcurrent protection threshold of the overcurrent protection switch inside the chip on the chip test board to the maximum value of 160mA.
[0037] Step 6: The main control board generates a control signal through chip testing. This control signal is a high-level signal that lasts for 80μS, controlling the MOSFET to conduct for 80μS.
[0038] Step 7: Observe the waveforms acquired by the current probe and voltage probe using an oscilloscope, such as... Figure 3 As shown, the yellow line waveform (the upper waveform) is the waveform acquired by the current probe, and the green line waveform (the lower waveform) is the waveform acquired by the voltage probe.
[0039] As observed from the oscilloscope waveform, when the internal overcurrent protection switch S1 detects an instantaneous current (yellow line waveform on the oscilloscope) exceeding the overcurrent protection threshold of 160mA, the overcurrent protection switch S1 begins to shut down. After the controlled MOSFET load has operated for 80µs, the overcurrent protection switch S1 remains off for 100µs (green waveform on the oscilloscope), and then it turns on again to restore the VDDA voltage to 5V. This fully complies with the chip design requirements.
[0040] As can be seen from the improved overcurrent protection test process described above, this test method reduces the number of instruments used, requiring only an oscilloscope, current probe, voltage probe, and MOSFET load. During the test, the detailed working process of the overcurrent protection switch S1 inside the chip and the requirements of chip designers can be understood in detail, reducing the trouble for software engineers to master the use of multiple instruments and improving the work efficiency of software engineering.
[0041] In summary, the power overcurrent protection testing device provided by this patent can reduce the instruments and equipment required for testing, thereby reducing testing costs and improving testing efficiency in practical applications.
[0042] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0043] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.
Claims
1. A power supply overcurrent protection testing device, used for performing overcurrent protection testing on chips, characterized in that, It includes: The chip test main control board includes a power port and an output port, which are used to configure the overcurrent protection threshold of the chip. A chip test board, which is communicatively connected to the chip test main control board, is used to fix and test the chip. It includes a power input terminal and a voltage test interface. The voltage test interface of the chip test board is connected to the output port of the chip test main control board, and the power input terminal of the chip test board is connected to the power port of the chip test main control board. The overcurrent protection switch of the chip is connected between the power input terminal and the voltage test interface. An oscilloscope module for real-time monitoring and display of the voltage and current of the chip, comprising a current probe and a voltage probe, wherein the current probe and voltage probe of the oscilloscope module are connected to the voltage test interface of the chip test board; A controlled switch module includes a control terminal, an input terminal, and an output terminal. The control terminal of the controlled switch module is connected to the output port of the chip test main control board. A first resistor is connected between the input terminal and the control terminal of the controlled switch module. The output terminal of the controlled switch module is connected to the voltage test interface of the chip test board. The output port of the chip test main control board outputs a control signal, and the controlled switch module remains on for a set time according to the control signal.
2. The power supply overcurrent protection test apparatus of claim 1, wherein, The controlled switch module is a MOSFET. The gate of the MOSFET is connected to the control terminal of the controlled switch module, the source of the MOSFET is connected to the input terminal of the controlled switch module, and the drain of the MOSFET is connected to the output terminal of the controlled switch module.
3. The power supply overcurrent protection test apparatus of claim 2, wherein, The first resistor is connected between the gate and source of the MOS transistor.
4. The power supply overcurrent protection test apparatus of claim 1, wherein, The power overcurrent protection test device also includes a first capacitor, one end of which is connected to the power port of the chip test main control board and the power input terminal of the chip test board, and the other end of the first capacitor is grounded.
5. The power supply overcurrent protection test apparatus of claim 1, wherein, The set time is 80μS.
6. The power supply overcurrent protection test apparatus of claim 4, wherein, The capacitance of the first capacitor is 220μF.
7. The power supply overcurrent protection test apparatus of claim 1, wherein, The resistance of the first resistor is 10KΩ.