Scintillator module, detection module and detector for X-ray imaging detection

Abstract

The utility model discloses a scintillator module for X-ray imaging detection, a detection module and a detector, comprising at least two scintillators with different energy absorption capabilities, the scintillators with different energy absorption capabilities are located on a row and are sequentially arranged on the row at intervals, the energy absorption capabilities of the scintillators located on the same row are the same, and the energy absorption capabilities of the scintillators located on the same row are the same as those of the scintillators located on the same row. And the non-light-emitting surfaces of the scintillators in each row and each row are coupled through a binder, so that the scintillators are coupled into a closely arranged whole. According to the utility model, the manufacturing process of the multi-energy imaging detection module is simplified, the product yield is improved, and the production cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of X-ray imaging detection technology, and more specifically, to a scintillator module, detection module and detector for X-ray imaging detection. Background Technology

[0002] The basic structure of a traditional dual-energy imaging detection module is roughly as follows: photodiode arrays are arranged on both sides of the same circuit board, and two different scintillators are then bonded to the surface of the photodiode arrays. One scintillator is typically used to absorb low-energy X-rays, and the other is typically used to absorb high-energy X-rays. A filter is used to absorb the low-energy stray radiation remaining after the X-rays pass through the low-energy scintillator; it can be embedded inside the circuit board or attached to the PCB surface. After the X-rays are converted into a current charge signal, the lead pads or electrode balls on the photodiode array are connected to the lead pads or electrode pads on the circuit board. The signal is then introduced to a charge processing chip or circuit through the circuit board leads, quantized into a digital signal, and then the system uses an image processing algorithm to reconstruct a colorized image containing the information of the detected target, capable of coarsely classifying the material information.

[0003] In the dual-energy imaging detection module structure described above, each scintillator needs to be mounted individually. During the mounting process, the pixels of the scintillator and photodiode need to be aligned, which makes the process relatively complex. At the same time, since the photodiode array and scintillator need to be mounted on both the front and back of the circuit board, the process becomes even more complicated, resulting in a lower yield and higher cost. Utility Model Content

[0004] The main objective of this invention is to provide a scintillator module, detection module, and detector for X-ray imaging detection, in order to solve the problems in related technologies where dual-energy imaging detection modules require individual mounting of each scintillator, and different scintillators need to be mounted on the front and back sides respectively, resulting in complex processes, low yield, and high costs.

[0005] To achieve the above objectives, this utility model provides a scintillator module for X-ray imaging detection, comprising:

[0006] At least two types of scintillators with different X-ray energy absorption capabilities are arranged in a row and at intervals in the row. The scintillators in the same row have the same energy absorption capability. The non-emitting surfaces of the scintillators in each row and each row are coupled by an adhesive to couple the multiple scintillators into a tightly arranged whole.

[0007] Furthermore, the adhesive is glue.

[0008] Furthermore, it also includes a reflective layer that wraps around the non-emitting surface of the scintillator, and reflects the light scattered to the non-emitting surface back to the emitting surface through the reflective layer.

[0009] Furthermore, the adhesive is an adhesive containing reflective material, which is wrapped around the non-light-emitting surface of the scintillator.

[0010] Furthermore, the scintillator comprises at least two pixels.

[0011] Furthermore, among the various scintillators, those with energy absorption capacity greater than a threshold are distributed at intervals in rows.

[0012] Furthermore, among the various scintillators, the scintillator with lower energy absorption and lower height can be a strip-shaped whole.

[0013] Furthermore, the system includes three or more scintillators with different energy absorption capabilities, which are arranged in a row at intervals according to their different energy absorption capabilities.

[0014] According to another aspect of the present invention, an X-ray imaging detection module is provided, including the above-mentioned scintillator module, as well as a circuit board, a charge processing circuit, and a photodiode array. The charge processing circuit is electrically connected to the circuit board, and the photodiode array is electrically connected to the circuit board. The photodiode array and the scintillator module are connected by an optical coupling adhesive, and the pixels of the photodiode array correspond to the pixels of the scintillator module.

[0015] According to another aspect of the present invention, a detector is provided, comprising the scintillator module described above.

[0016] In this embodiment of the invention, at least two types of scintillators with different energy absorption capabilities are provided. The scintillators with different energy absorption capabilities are arranged in a row and spaced apart in sequence. The scintillators in the same row have the same energy absorption capability. The non-light-emitting surfaces of the scintillators in each row and each row are coupled by an adhesive, thereby coupling multiple scintillators into a tightly arranged whole. This achieves the goal of arranging scintillators with different energy absorption capabilities in the same row and coupling multiple scintillators into a whole to form a compact scintillator module. In subsequent assembly, the scintillator module can be used for overall scintillator assembly, thereby simplifying the manufacturing process of the dual-energy imaging detection module, improving product yield, and reducing production costs. This solves the problem in related technologies where dual-energy imaging detection modules require individual mounting of each scintillator, and different scintillators need to be mounted on the front and back sides, resulting in complex processes, low yields, and high costs. Attached Figure Description

[0017] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model, making other features, objects, and advantages of the utility model more apparent. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0018] Figure 1 This is a structural schematic diagram of the scintillator module according to an embodiment of the present invention;

[0019] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure;

[0020] Figure 3 This is a schematic diagram of the scintillator module according to another embodiment of the present invention;

[0021] Figure 4 yes Figure 3 A schematic diagram of the cross-sectional structure;

[0022] Figure 5 This is a schematic diagram of the X-ray imaging detection module;

[0023] Among them, 1 is a scintillator, 101 is a high-energy scintillator, 102 is a low-energy scintillator, 103 is a first-energy scintillator, 104 is a second-energy scintillator, 105 is a third-energy scintillator, 106 is a fourth-energy scintillator, 2 is an adhesive, 3 is a reflective layer, 4 is a photodiode array, 5 is a charge processing circuit, 6 is a circuit board, 7 is a scintillator module, and 8 is an imaging detection module. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0025] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this utility model described herein.

[0026] In this invention, the terms "upper," "lower," "inner," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0027] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0028] Furthermore, the terms "set up," "equipped with," "connected," and "fixed" should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] In addition, the term "multiple" should mean two or more.

[0030] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0031] To solve related technical problems, such as Figure 1 and Figure 2 As shown, this embodiment of the present invention provides a scintillator module for X-ray imaging detection, comprising:

[0032] At least two scintillators 1 with different X-ray energy absorption capabilities are arranged in a row and at intervals in the row. The scintillators 1 in the same row have the same energy absorption capability. The non-light-emitting surfaces of the scintillators 1 in each row and each row are coupled by an adhesive 2 to couple the multiple scintillators 1 into a tightly arranged whole. Typically, the distance between two different scintillators is less than 1 mm.

[0033] In this embodiment, the scintillator module 7 includes at least two scintillators 1 with different X-ray energy absorption capabilities. Taking two scintillators as an example, the scintillator with stronger absorption capability for high-energy X-rays is a high-energy scintillator 101, and the scintillator with weaker absorption capability for high-energy X-rays is a low-energy scintillator 102. The two scintillators can form a dual-energy scintillator module 7. The high-energy scintillator 101 and the low-energy scintillator 102 are arranged alternately in rows, that is, in the same row, the high-energy scintillator 101 and the low-energy scintillator 102 are arranged alternately, with the high-energy scintillator 101 located in odd-numbered rows and the low-energy scintillator 102 in even-numbered rows.

[0034] In one embodiment, a row may include multiple high-energy scintillators 101 and multiple low-energy scintillators 102, but the overall arrangement remains sequential and spaced apart. When multiple high-energy scintillators 101 are present in the same row, the energy absorption capacity of the high-energy scintillators 101 in the same row is the same; similarly, the energy absorption capacity of the low-energy scintillators 102 in the same row is the same. In one embodiment, each high-energy scintillator 101 and low-energy scintillator 102 in the same row includes at least two pixels. To facilitate subsequent assembly, in this embodiment, the total number of pixels of the scintillators matches the number of pixels in the light-emitting diode array.

[0035] To facilitate understanding of the directions referred to by rows and columns in this embodiment, in such cases... Figure 1 In the coordinate system shown, the z-axis represents the direction of movement of the conveyor belt or object, and the x-axis represents the direction in which multiple imaging detection modules are cascaded. These modules are cascaded along the x-axis to form a length sufficient to cover the inspected object / person. In this embodiment, the scintillator module 7 may include multiple rows of scintillators. Pixels on the x-axis are in the same row and have the same X-ray energy absorption capacity. On the z-axis, pixels with different X-ray absorption capacities are arranged alternately. The number of pixels on the z-axis is also called the number of rows, and the number of pixels on the x-axis is also called the number of channels.

[0036] The scintillators arranged in the above manner are coupled together by adhesive 2 to form scintillator module 7. Specifically, the side of the scintillator 1 corresponding to the light-emitting diode is the light-emitting surface, and the other sides are non-light-emitting surfaces. Adhesive 2 needs to avoid the light-emitting surfaces, so adhesive 2 couples the non-light-emitting surfaces of each row and column of scintillators 1 together to form a whole.

[0037] In this embodiment, the odd-numbered rows of the scintillator module 7 can simultaneously acquire information from both low-energy and high-energy rays containing information about the detected target. Even-numbered rows can only capture information from low-energy rays and a small amount of high-energy rays. For example... Figure 5As shown, after the imaging detection module 8 is assembled, when the imaging detection module 8 scans the target being inspected, it uses the image algorithm of the host computer and interpolation to fuse the image information data of the odd-numbered rows and even-numbered rows, and finally obtains the image reconstruction result containing the material information of the target being inspected, so that the detector has the ability to identify materials.

[0038] The scintillator module 7 in this invention features a simplified assembly process, eliminating the need for sequential mounting of each row of scintillators; instead, it is assembled as a single unit. During the manufacturing of the scintillator module 7, high-precision assembly is achieved using pre-designed tooling fixtures. Compared to dual-energy detectors in related technologies, it eliminates the need to place double the number of photodiode array chips, scintillators, and processing circuits / chips on both sides, reducing material usage, scintillator cost, and assembly cost, thus enabling dual-energy or multi-energy imaging.

[0039] It should be noted that the above embodiment uses two scintillators 1 as an example for illustration. Of course, more than two scintillators 1 can also be set. The overall arrangement logic is the same as the above embodiment, so it will not be repeated here.

[0040] In one embodiment, the adhesive 2 is a glue, specifically an epoxy glue.

[0041] Since the scintillator 1 with a large energy absorption capacity generally has a certain height, in order to avoid optical crosstalk, the scintillator module 7 in this embodiment also includes a reflective layer 3. The reflective layer 3 wraps around the non-light-emitting surface of the scintillator 1 with an energy absorption capacity greater than a threshold, and reflects the light scattered to the non-light-emitting surface back to the light-emitting surface through the reflective layer 3.

[0042] Specifically, in this embodiment, the reflective layer 3 is made of a material containing reflective components. The reflective layer 3 wraps around the non-emitting surface of this type of scintillator, reflecting some of the light scattered to the non-emitting surface back to the emitting surface of the scintillator, thereby increasing the conversion efficiency. After the reflective layer 3 is applied, each scintillator is coupled using an adhesive 2 to form the final scintillator module 7. For example... Figure 1 and Figure 2 As shown, the reflective layer 3 is wrapped around the non-light-emitting surface of the high-energy scintillator 101.

[0043] In another embodiment, the scintillator 1 with an energy absorption capacity greater than the threshold may not be wrapped with a reflective layer 3. Instead, an adhesive 2 containing reflective material may be used. The adhesive 2 performs both bonding and reflective functions and is coupled to the non-light-emitting surfaces of each scintillator to form the final scintillator module 7.

[0044] To facilitate the reduction of optical crosstalk and increase conversion efficiency through reflection, in this embodiment, scintillators 1 with energy absorption capacity greater than a threshold are arranged at intervals in rows. Therefore, for each scintillator 1 with energy absorption capacity greater than the threshold, a reflective layer 3 can be easily formed on its non-light-emitting surface.

[0045] In one embodiment, the scintillator 1, with an energy absorption capacity less than a threshold, is thinner, resulting in less optical crosstalk. Therefore, as... Figure 1 As shown, among the various scintillators 1, the scintillator 1 with lower energy absorption and lower height can be a strip-shaped whole, which can further increase the processing efficiency and positional accuracy of the scintillator module 7, while reducing production costs.

[0046] In one embodiment, the scintillator 1 includes three or more types of scintillators 1 with different energy absorption capabilities, and the scintillators 1 are arranged in rows at intervals according to their different energy absorption capabilities. For example, the scintillator 1 includes four types of energy absorption capabilities, arranged in rows as follows: a scintillator with 90% energy absorption capability, a scintillator with 20% energy absorption capability, a scintillator with 60% energy absorption capability, and a scintillator with 40% energy absorption capability.

[0047] In another implementation, such as Figure 3 and Figure 4 As shown, the scintillator module 7 includes four scintillators 1 with different energy absorption capabilities, which are classified as first energy scintillator 103, second energy scintillator 104, third energy scintillator 105, and fourth energy scintillator 106, in descending order of energy absorption capability. The four energy scintillators are arranged in a row at intervals according to a gradual change in energy absorption capability, and then coupled together by adhesive 2 to form the scintillator module 7. The more types of scintillators with different energy absorption capabilities contained in the scintillator module 7, the more energy spectrum information can be obtained through the host computer image algorithm, ultimately improving the ability to identify the energy spectrum of the detected target and obtaining more material information.

[0048] According to another aspect of this utility model, such as Figure 5As shown, an X-ray imaging detection module 8 is provided. The imaging detection module 8 includes the aforementioned scintillator module 7, a circuit board 6, a charge processing circuit 5, and a photodiode array 4. The charge processing circuit 5 is electrically connected to the circuit board 6, and the photodiode array 4 is also electrically connected to the circuit board 6. The photodiode array 4 is connected to the scintillator module 7 via optical coupling adhesive, and the pixels of the photodiode array 4 correspond to the pixels of the scintillator module 7. The photodiode array 4 converts the light signal generated by the scintillator 1 into a charge signal, which is then converted into a digital signal by the charge processing circuit 5. Finally, the signal is transmitted to the host computer through the data control system for image reconstruction of the inspected target.

[0049] According to another aspect of the present invention, a detector is provided, comprising the scintillator module 7 described above.

[0050] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A scintillator module for X-ray imaging detection, characterized in that, include: At least two types of scintillators with different X-ray energy absorption capabilities are arranged in a row and at intervals in the row. The scintillators in the same row have the same energy absorption capability. The non-light-emitting surfaces of the scintillators in each row and each row are coupled by an adhesive to couple multiple scintillators into a tightly arranged integral scintillator module so that the scintillator module can be assembled as a whole. Among the various scintillators, those with energy absorption capacity greater than a threshold are distributed at intervals in the row; Among the various scintillators, the scintillator with an energy absorption capacity less than a threshold is a strip-shaped whole.

2. The scintillator module for X-ray imaging detection according to claim 1, characterized in that, The adhesive is glue.

3. The scintillator module for X-ray imaging detection according to claim 1, characterized in that, It also includes a reflective layer, which wraps around the non-emitting surface of the scintillator, where the energy absorption capacity is greater than a threshold, and reflects the light scattered to the non-emitting surface back to the emitting surface through the reflective layer.

4. The scintillator module for X-ray imaging detection according to claim 1, characterized in that, The adhesive is an adhesive containing reflective material, and the adhesive is wrapped around the non-light-emitting surface of the scintillator.

5. The scintillator module for X-ray imaging detection according to claim 1, characterized in that, The scintillator comprises at least two pixels.

6. The scintillator module for X-ray imaging detection according to claim 1, characterized in that, The scintillator comprises three or more types of scintillators with different energy absorption capabilities, which are arranged in a row at intervals according to their different energy absorption capabilities.

7. An X-ray imaging detection module, characterized in that, The device includes a scintillator module as described in any one of claims 1 to 6, a circuit board, a charge processing circuit, and a photodiode array, wherein the charge processing circuit is electrically connected to the circuit board, the photodiode array is electrically connected to the circuit board, the photodiode array is connected to the scintillator module via optical coupling adhesive, and the pixels of the photodiode array correspond to the pixels of the scintillator module.

8. A detector, characterized in that, Includes the scintillator module as described in any one of claims 1 to 6.

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