Communication device

Abstract

The utility model discloses a communication device, which comprises a circuit board, a shielding shell assembly, a connector assembly, a first cold plate and at least one second cold plate, and is characterized in that the shielding shell assembly comprises a protective shell, a basic shielding shell and at least one laminated shielding shell; the protective shell and the basic shielding shell are connected and fixed on the circuit board; the at least one laminated shielding shell is arranged on one side, deviating from the circuit board, of the basic shielding shell; the basic shielding shell and the laminated shielding shell are used for inserting at least one optical module; the first cold plate is arranged between the basic shielding shell and the laminated shielding shell; at least one second cold plate, wherein each second cold plate is arranged on one side, deviating from the first cold plate, of the laminated shielding shell; the connector assembly is fixed to the circuit board and located in the protective shell. And the optical module is used for being connected with the optical module inserted into the basic shielding shell and is also used for being connected with the optical module inserted into the at least one laminated shielding shell. The stability of the whole shielding shell assembly is guaranteed while liquid cooling heat dissipation is achieved.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a communication device. Background Technology

[0002] With the large-scale construction of data centers, the demand for optical modules is constantly upgrading, evolving towards higher speeds, longer distances, and greater integration. Along with performance improvements, the power consumption of optical modules increases significantly, making heat dissipation a key bottleneck in design.

[0003] Traditional optical module cooling solutions primarily rely on air cooling, specifically heat dissipation through heat sinks on the optical cage and air convection. However, with increasing power consumption, larger heat sink fin areas and higher airflow are required, especially in double-layer optical cage scenarios where the lower optical module has limited cooling space, making the conditions even more demanding. Furthermore, fan power consumption and noise increase simultaneously, impacting overall device efficiency and user experience.

[0004] As data centers evolve towards higher-density computing power, computing chips are increasingly adopting liquid cooling. Optical modules, as one of the main heat sources in communication equipment, are also increasingly shifting towards liquid cooling. Replacing the finned heat sinks above the optical cage with cold plates enables a switch from air cooling to liquid cooling, effectively reducing temperature rise and energy consumption. However, in high-density port layouts, the stacked optical cage design leads to limited structural space, posing significant challenges to the size and layout of the cold plates. Therefore, a cold plate cooling solution for stacked optical cages is a crucial issue that needs to be addressed when communication equipment systems transition to liquid cooling. Utility Model Content

[0005] This application discloses a communication device for achieving liquid cooling of a stacked optical module while ensuring the stability of the entire shielding shell assembly.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] A communication device, comprising:

[0008] Circuit board;

[0009] A shielding shell assembly includes a protective shell, a basic shielding shell, and at least one stacked shielding shell; the protective shell is connected to and fixed to the basic shielding shell; the at least one stacked shielding shell is disposed on the side of the basic shielding shell opposite to the circuit board; both the basic shielding shell and the stacked shielding shell are used to insert at least one optical module;

[0010] The first cold plate is disposed between the basic shielding shell and the stacked shielding shell;

[0011] At least one second cold plate, each second cold plate being disposed on the side of one of the stacked shielding shells opposite to the first cold plate;

[0012] A connector assembly, fixed to the circuit board and located inside the protective housing; used for connecting to an optical module inserted into the basic shielding housing, and also used for connecting to an optical module inserted into at least one stacked shielding housing.

[0013] In the aforementioned communication device, the shielding shell assembly includes a protective shell, a basic shielding shell, and at least one stacked shielding shell, with both the protective shell and the basic shielding shell fixed to the circuit board. Taking a shielding shell assembly comprising a stacked shielding shell as an example, a first cold plate, a stacked shielding shell, and a second cold plate are all stacked on the side of the basic shielding shell facing away from the circuit board. Optical modules can be inserted into both the basic shielding shell and the stacked shielding shell, while the connector assembly for electrically connecting the optical module and the circuit board is located inside the protective shell. The protective shell prevents damage to the connector assembly due to impact. The first cold plate is located between the basic shielding shell and the stacked shielding shell, serving to dissipate heat from both the basic shielding shell and the stacked shielding shell, and further to dissipate heat from the optical module inserted within the basic shielding shell. The second cold plate is located on the side of the stacked shielding shell facing away from the first cold plate, serving to dissipate heat from the stacked shielding shell, and further to dissipate heat from the optical module inserted within the stacked shielding shell, thereby achieving liquid cooling of the stacked optical module. The shielding shell assembly is fixed to the circuit board by the protective shell and the basic shielding shell, supporting the first cold plate, the stacked shielding shell and the second cold plate above, ensuring the stability of the entire shielding shell assembly, avoiding connection failure caused by the shielding shell assembly being "top-heavy" or having too small a contact area with the circuit board, and reducing maintenance costs.

[0014] In some embodiments, the protective shell and the basic shielding shell are an integral structure.

[0015] In some embodiments, the protective housing is provided with a first fixing part for connecting to the circuit board;

[0016] The basic shielding shell is provided with a second fixing part that is connected to the circuit board.

[0017] In some embodiments, at least one of the stacked shielding shells is fixed to at least one of the protective shell, the base shielding shell, the first cold plate, and the second cold plate.

[0018] In some embodiments, the protective housing has a clearance window on the side facing the basic shielding housing, which allows the optical module to be inserted into the protective housing and connected to the connector assembly.

[0019] In some embodiments, the orthogonal projection of the at least one of the second cold plates, which is furthest from the circuit board, onto the circuit board at least partially covers the orthogonal projection of the protective shell onto the circuit board.

[0020] In some embodiments, the connector assembly includes:

[0021] First connector layer; fixed to the circuit board, for connection with the optical module inserted into the shielding shell;

[0022] At least one second connector layer; fixed to the circuit board and located on the side of the first connector layer opposite to the circuit board, for connection with the optical module into which the at least one stacked shielding shell is inserted.

[0023] In some embodiments, there are multiple shielding shell assemblies, and among the multiple shielding shell assemblies, the first cold plate located on the same layer is an integral structure; and / or, the second cold plate located on the same layer is an integral structure.

[0024] In some embodiments, both the base shield and the stacked shield include a plurality of slots arranged side by side.

[0025] In some embodiments, each of the slots in the basic shielding housing has a first window on the side opposite to the circuit board.

[0026] The first cold plate has a first heat dissipation protrusion corresponding to a plurality of the first windows on the side facing the basic shield shell. The first heat dissipation protrusion passes through the first window and is inserted into the slot.

[0027] In some embodiments, each of the slots in the stacked shielding housing has a second window on the side facing away from the circuit board;

[0028] The second cold plate has a second heat dissipation protrusion on the side facing the stacked shielding shell, which corresponds to a plurality of the second windows. The second heat dissipation protrusion passes through the second window and is inserted into the slot. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of a communication device provided in an embodiment of this application;

[0030] Figure 2 This is a schematic diagram of one side structure of a communication device provided in an embodiment of this application;

[0031] Figure 3 An exploded view of a communication device provided in an embodiment of this application;

[0032] Figure 4 An assembly diagram of a basic shielding shell, a protective shell, and a connector assembly in a communication device provided in an embodiment of this application;

[0033] Figure 5 for Figure 4 A schematic diagram of one side;

[0034] Figure 6 for Figure 4 A diagram of the other side;

[0035] Figure 7 This is a schematic diagram of the structure of a stacked shielding shell in a communication device provided in an embodiment of this application;

[0036] Figure 8 for Figure 7 A schematic diagram of one side;

[0037] Figure 9 An assembly diagram of a shielding shell assembly and a first cold plate in a communication device provided in an embodiment of this application;

[0038] Figure 10 for Figure 9 A schematic diagram of one side;

[0039] Figure 11 This is a schematic diagram of the other side of a communication device provided in an embodiment of this application;

[0040] Figure 12 This is an assembly diagram of a basic shielding shell, a protective shell, and a first cold plate in a communication device provided in an embodiment of this application.

[0041] Figure 13 for Figure 12 A schematic diagram of one side;

[0042] Icons: 100 - Circuit board; 200 - Shielding shell assembly; 300 - First cold plate; 400 - Second cold plate; 500 - Connector assembly; 210 - Protective shell; 220 - Basic shielding shell; 230 - Stacked shielding shell; 510 - First connector layer; 520 - Second connector layer; 211 - First fixing part; 212 - Clearance window; 221 - Second fixing part; 222 - Slot; 223 - First window; 231 - Slot; 232 - Second window; 233 - Connecting part; 234 - First side plate; 235 - Second side plate. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships, for example, A and / or B can represent: A alone, A and B at the same time, and B alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0044] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0045] like Figures 1 to 4 As shown, this application provides a communication device including a circuit board 100, a shielding shell assembly 200, a connector assembly 500, a first cold plate 300, and at least one second cold plate 400. In one possible implementation, as... Figure 1 As shown, along the X direction, the communication device includes multiple sets of shielding shell assemblies 200, for example, four sets. Each set of shielding shell assemblies 200 includes a protective shell 210, a basic shielding shell 220, and at least one stacked shielding shell 230. The protective shell 210 is connected to and fixed to the basic shielding shell 220, and at least one stacked shielding shell 230 is disposed on the side of the basic shielding shell 220 opposite to the circuit board 100; both the basic shielding shell 220 and the stacked shielding shell 230 are used to insert at least one optical module. A first cold plate 300 is disposed on the circuit board 100 and located between the basic shielding shell 220 and the stacked shielding shell 230. At least one second cold plate 400 is disposed on the side of a stacked shielding shell 230 opposite to the first cold plate 300. In one possible implementation, the communication device includes four sets of connector assemblies 500. Each set of connector assemblies 500 is fixed on the circuit board 100 and disposed inside the protective shell 210 of the corresponding set of shielding shell assemblies 200, for connecting with the optical module inserted into the basic shielding shell 220, and also for connecting with the optical module inserted into at least one stacked shielding shell 230.

[0046] In the aforementioned communication device, the circuit board 100 serves as the foundation, housing all components and providing power and signal transmission. The shielding housing assembly 200 includes a protective housing 210, a basic shielding housing 220, and at least one stacked shielding housing 230. The protective housing 210 is connected to and fixed to the basic shielding housing 220 on the circuit board 100, providing physical protection for the internal components. The basic shielding housing 220 is directly mounted on the circuit board 100 for inserting at least one optical module. At least one stacked shielding housing 230 is located above the basic shielding housing 220, allowing for the insertion of additional optical modules, increasing the device's capacity and functionality. A first cold plate 300 is located between the basic shielding housing 220 and the stacked shielding housing 230, aiding in the conduction and dissipation of heat from the optical modules. A second cold plate 400 is located on the side of each stacked shielding housing 230 facing away from the circuit board 100, further enhancing heat dissipation and ensuring the normal operation of the stacked optical modules. Both the first cold plate 300 and the second cold plate 400 have cold pipes for conveying cooling media. The connector assembly 500 is fixed on the circuit board 100 and located inside the protective housing 210. It is used to connect the optical modules inserted in the basic shielding housing 220 and the stacked shielding housing 230 to ensure the correct transmission of signals.

[0047] Taking a set of shielding shell assemblies 200 including a stacked shielding shell 230 as an example. In one embodiment, such as Figure 1 and Figure 2 As shown, the protective shell 210 and the basic shielding shell 220 are both fixed to the circuit board 100, forming a stable basic structure. The first cold plate 300, the stacked shielding shell 230, and the second cold plate 400 are all stacked on the basic shielding shell 220. Here, "stacked" is used to define the positional relationship between the first cold plate 300, the stacked shielding shell 230, and the second cold plate 400. The protective shell 210 and the basic shielding shell 220 support the upper components (such as the stacked shielding shell 230 and the second cold plate 400) at the bottom, ensuring the stability of the overall structure and reducing the probability of tilting of the upper components and connection failure due to tilting. Optical modules can be inserted into both the basic shielding shell 220 and the stacked shielding shell 230, while the connector assembly 500 for electrically connecting the optical module and the circuit board 100 is disposed inside the protective shell 210. The protective shell 210 can prevent the connector assembly 500 from being damaged by impact. The first cold plate 300 is located between the basic shielding shell 220 and the stacked shielding shell 230, and is used to dissipate heat from the basic shielding shell 220 and the stacked shielding shell 230, and further to dissipate heat from the optical module inserted inside the basic shielding shell 220. The second cold plate 400 is located on the side of the stacked shielding shell 230 opposite to the first cold plate 300, and is used to dissipate heat from the stacked shielding shell 230, and further to dissipate heat from the optical module inserted inside the stacked shielding shell 230, thereby realizing liquid cooling of the stacked optical module.

[0048] The communication device provided in this application embodiment can achieve liquid cooling heat dissipation of the stacked optical module, and can also avoid damage to the connector assembly 500 due to impact during the assembly process. At the same time, it ensures the stability of the shielding shell assembly 200, avoids connection failure caused by tilting of the shielding shell assembly 20, and reduces maintenance costs.

[0049] In some embodiments, such as Figure 5 As shown, the protective shell 210 and the basic shielding shell 220 are an integral structure. This integral design eliminates the connection gap between the protective shell 210 and the basic shielding shell 220, improving the overall structural rigidity and reducing the risk of loosening or tilting due to vibration or external forces. Furthermore, the integral design reduces assembly complexity and production costs by decreasing the number of components, while also reducing potential failure points caused by connecting multiple parts. Since the protective shell 210 and the basic shielding shell 220 are directly connected, heat generated by the connector can be conducted from the protective shell 210 to the basic shielding shell 220 and then to the first cold plate 300, improving overall heat dissipation efficiency.

[0050] In one embodiment, such as Figure 4 and Figure 5 As shown, and in combination Figure 2 Along the thickness direction of the circuit board 100, the protective shell 210 protrudes from the base shielding shell 220. The first cold plate 300 is stacked on top of the base shielding shell 220, and the first cold plate 300 is thermally connected to the protective shell 210. The upper part of the base shielding shell 220 can be understood as the side of the base shielding shell 220 away from the circuit board 100.

[0051] It should be noted that there are several options for the specific implementation of the thermal connection between the first cold plate 300 and the protective shell 210. For example, the side of the first cold plate 300 may be in direct contact with the protective shell 210. Alternatively, the side of the first cold plate 300 may be connected to the protective shell 210 via a thermally conductive component. The thermally conductive component may be a metal sheet or thermally conductive adhesive, etc.

[0052] In some embodiments, such as Figure 4 and Figure 5 As shown, the protective shell 210 is provided with a first fixing part 211 for connecting with the circuit board 100, and the basic shielding shell 220 is provided with a second fixing part 221 for connecting with the circuit board 100.

[0053] The first fixing part 211 and the second fixing part 221 are directly connected to the circuit board 100, ensuring that the protective shell 210 and the basic shielding shell 220 are firmly fixed on the circuit board 100.

[0054] In one embodiment, both the first fixing part 211 and the second fixing part 221 are press-fit pins.

[0055] Because the protective shell 210 and the basic shielding shell 220 are integrated, the crimp pin design enhances the overall structural rigidity, preventing loosening or tilting due to external forces or vibrations. This connection method reduces the need for soldering or other complex processes, lowering production costs and failure rates. The crimp pins provide an additional path for heat conduction, allowing heat within the basic shielding shell 220 to be transferred more quickly to the circuit board 100 and the cold plate system, improving overall heat dissipation efficiency. The crimp pin design simplifies the assembly process, reduces reliance on complex tools, and improves production efficiency.

[0056] In some embodiments, such as Figure 4 and Figure 6 As shown, the protective shell 210 has a clearance window 212 on the side facing the base shield shell 220, which allows the optical module to be inserted into the protective shell 210 and connected to the connector assembly 500.

[0057] In one embodiment, such as Figure 4 and Figure 6 As shown, the protective housing 210 has multiple clearance windows 212 on the side facing the base shielding housing 220, each clearance window 212 corresponding to one optical module. The connector assembly 500 is located inside the protective housing 210. It can be understood that the insertion and removal direction of the optical module is the same as the arrangement direction of the protective housing 210 and the base shielding housing 220. Some clearance windows 212 communicate with the base shielding housing 220, and some clearance windows 212 communicate with the stacked shielding housing 230.

[0058] In some embodiments, at least one stacked shielding shell 230 is fixed to at least one of the protective shell 210, the base shielding shell 220, the first cold plate 300, and the second cold plate 400.

[0059] In one embodiment, the stacked shielding shell 230 is fixed to the protective shell 210. For example, as... Figures 7-10 As shown, the laminated shielding shell 230 includes a connecting portion 233, which is fixed to the protective shell 210. When the laminated shielding shell 230 is placed above the base shielding shell 220, the connecting portion 233 can be erected above the protective shell 210 and connected and fixed to the protective shell 210 by detachable connectors such as threaded connectors or clips. Figure 7The stacked shielding shell 230 may include a connecting portion 233 and two side plates, namely a first side plate 234 and a second side plate 235. The first side plate 234 and the second side plate 235 are located on opposite sides of the connecting portion 233 and cooperate with the connecting portion 233 to form a gate-shaped structure. The first side plate 234 and the second side plate 235 may or may not be connected to the connecting portion 233. The connecting portion 233 is fixed to the protective shell 210, and / or the two side plates are fixed to the protective shell 210. When the stacked shielding shell 230 is placed above the base shielding shell 220, the connecting portion 233 rests on top of the protective shell 210, and the first side plate 234 and the second side plate 235 are located on the outer sides of the protective shell 210, respectively. The connecting portion 233 and / or the two side plates of the stacked shielding shell 230 are connected and fixed to the protective shell 210 by detachable connectors such as threaded connectors or buckles. By fixing the stacked shielding shell 230 to the protective shell 210, the structural strength of the protective shell 210 is used to support the stacked shielding shell 230 and its internal optical module. This method simplifies the assembly process while ensuring the stability and reliability of the stacked shielding shell 230.

[0060] In another embodiment, the laminated shielding shell 230 is fixed to the base shielding shell 220. For example, the laminated shielding shell 230 is fixed to the base shielding shell 220 by a connector that penetrates the first cold plate 300.

[0061] In another embodiment, the stacked shielding shell 230 is connected to the first cold plate 300 and / or the second cold plate 400. For example, the stacked shielding shell 230 can be connected to the first cold plate 300 and / or the second cold plate 400 via threaded connectors or clips. Alternatively, the first cold plate 300 and / or the second cold plate 400 can also be fixedly connected to the circuit board 100 via threaded connectors, thus enabling the stacked shielding shell 230 to be connected to the circuit board 100 via the first cold plate 300 and / or the second cold plate 400. In one possible implementation, the first cold plate 300 and / or the second cold plate 400 are threadedly connected to the circuit board 100 via a single threaded connector. When the first cold plate 300 and the second cold plate 400 are connected and fixed to the circuit board 100 using the same threaded connector, the threaded connector sequentially passes through the circuit board 100, the first cold plate 300, and is threadedly connected to the second cold plate 400. In another possible implementation, the first cold plate 300 is threadedly connected to the circuit board 100 via a single threaded connector, and the second cold plate 400 is threadedly connected to the circuit board 100 via two threaded connectors. Specifically, the first cold plate 300's lower surface is threadedly connected to the circuit board 100 via the first threaded connector; the second cold plate 400's lower surface is connected and fixed to the upper surface of the first cold plate 300 via the second threaded connector, thus indirectly achieving the connection to the circuit board 100. In this second implementation, when connecting the first cold plate 300 and / or the second cold plate 400 to the circuit board 100, the threaded connectors do not need to penetrate through the first cold plate 300 and the second cold plate 400, thus not affecting the flow channel layout in the first cold plate 300 and the second cold plate 400. It is worth noting that the threaded connectors are located in areas of the first cold plate 300 and / or the second cold plate 400 that do not cover the shielding shell assembly 200, for example, in conjunction with... Figure 1 Along the X direction, the communication device includes four sets of shielding shell assemblies 200, with gaps between adjacent sets of shielding shell assemblies 200. Threaded connectors are located at the gaps between adjacent shielding shell assemblies 200. In one possible implementation, the connection between the stacked shielding shell 230 and the first cold plate 300 and / or the second cold plate 400 can be achieved by pressing the stacked shielding shell 230 onto the first cold plate 300 and / or the second cold plate 400. For example, the first cold plate 300 and / or the second cold plate 400 may have multiple pressing grooves, and the stacked shielding shell 230 may have multiple pressing parts corresponding to these pressing grooves. When the first cold plate 300 needs to be replaced, the removed stacked shielding shell 230 can still be used. By fixing the stacked shielding shell 230 onto the first cold plate 300 or the second cold plate 400, not only is the mechanical stability of the stacked shielding shell 230 enhanced, but the heat dissipation path is also optimized. The first cold plate 300 and the second cold plate 400 serve as the main heat dissipation components, directly contacting the stacked shielding shell 230, which can more efficiently conduct and dissipate heat from the optical module.

[0062] In another embodiment, the rear end of the stacked shielding shell 230 is fixed to the protective shell 210 via the connecting portion 233 and / or two side plates. Simultaneously, the stacked shielding shell 230 is also press-fitted to the first cold plate 300 and / or the second cold plate 400 to improve the stability of the stacked shielding shell 230. The rear end of the stacked shielding shell 230 is the end furthest from the insertion side used to insert the optical module.

[0063] In another embodiment, the stacked shielding shell 230 is clamped and fixed by a first cold plate 300 and a second cold plate 400, and the first cold plate 300 and the second cold plate 400 can be fixedly connected to the circuit board 100 by threaded connectors. In one possible implementation, such as Figure 9 and Figure 10 As shown, and in combination Figure 1 and Figure 2 When the laminated shielding shell 230 is placed above the first cold plate 300, the connecting part 233 rests on top of the protective shell 210, and the second cold plate 400 is placed above the laminated shielding shell 230. A threaded connector passes through the circuit board 100 and the first cold plate 300 in sequence and is threadedly connected to the second cold plate 400. At this time, the second cold plate 400 contacts the protective shell 210 through the connecting part 233, and simultaneously, the second cold plate 400 and the first cold plate 300 clamp and fix the laminated shielding shell 230 between them. When it is necessary to replace the first cold plate 300 and / or the second cold plate 400, the removed laminated shielding shell 230 can be reused.

[0064] All of the above methods effectively ensure the stability and heat dissipation performance of the stacked shielding shell 230, and users can choose the appropriate fixing method according to specific application requirements. For example, if higher heat dissipation efficiency is required, the stacked shielding shell 230 can be fixed to the cold plate; while if a simple assembly process is desired, it can be fixed to the protective shell 210.

[0065] In some embodiments, such as Figure 11 As shown, and in combination Figure 1 and Figure 2 At least one of the second cold plates 400, which is farther from the circuit board 100, has its orthogonal projection on the circuit board 100 at least partially covering the orthogonal projection of the protective shell 210 on the circuit board 100.

[0066] In one embodiment, such as Figure 11As shown, the orthographic projection of the second cold plate 400 onto the circuit board 100 covers the orthographic projection of the protective shell 210 onto the circuit board 100. This overlap of the second cold plate 400's orthographic projection with the protective shell 210 allows heat generated by the connector assembly 500 to be directly transferred to the second cold plate 400 through the protective shell 210. This ensures that heat in the area covered by the protective shell 210 is effectively conducted and dissipated, preventing localized overheating. Furthermore, by placing the second cold plate 400 on the protective shell 210, the protective shell 210 provides support for the second cold plate 400, enhancing the overall mechanical stability of the structure.

[0067] In one embodiment, the connecting portion 233 of the stacked shielding shell 230 is located between the protective shell 210 and the second cold plate 400, and the second cold plate 400 is in thermal contact with the protective shell 210 through the connecting portion 233 of the stacked shielding shell 230.

[0068] In some embodiments, the connector assembly 500 includes:

[0069] First connector layer 510; fixed to circuit board 100, for connection with optical module into which shielding shell is inserted; and

[0070] At least one second connector layer 520; fixed to the circuit board 100 and located on the side of the first connector layer 510 opposite to the circuit board 100, for connection with an optical module into which at least one stacked shielding shell 230 is inserted.

[0071] Taking connector assembly 500, which includes a first connector layer 510 and a second connector layer 520, as an example, Figure 4 and Figure 6 As shown, the first connector layer 510 is fixed to the circuit board 100 and directly connects to the optical module inserted inside the basic shielding shell 220, ensuring that the optical module inside the basic shielding shell 220 can stably transmit signals and power to the circuit board 100. The second connector layer 520 is also fixed to the circuit board 100, but is located on the side of the first connector layer 510 facing away from the circuit board 100. It is used to connect to the optical module inserted inside the stacked shielding shell 230, ensuring the signal and power transmission of the stacked optical module.

[0072] By using a layered connector design, more optical modules can be connected within a limited space, adapting to the needs of high-density applications. Each connector layer connects to an optical module within a specific shielding shell, reducing the risk of failure caused by complex connections.

[0073] In some embodiments, there are multiple shielding shell assemblies 200, and among the multiple shielding shell assemblies 200, the first cold plate 300 located on the same layer is an integral structure; and / or, the second cold plate 400 located on the same layer is an integral structure.

[0074] In one embodiment, such as Figures 11-13 As shown, the shielding shell assembly 200 consists of multiple sets, for example... Figure 11 Four sets of shielding shell assemblies 200 are shown. Multiple sets of shielding shell assemblies 200 are fixed to the same surface of the circuit board 100 by an integral protective shell 210 and a base shielding shell 220. In one possible implementation, among the multiple sets of shielding shell assemblies 200, the base shielding shell 220 is located in the first layer, a first cold plate 300 above the base shielding shell 220 (i.e., on the side facing away from the circuit board 100) is located in the second layer, a first stacked shielding shell 230 above the first cold plate 300 is located in the third layer, and a first second cold plate 400 above the stacked shielding shell 230 is located in the fourth layer. In one possible implementation, the first cold plate 300 located in the second layer is connected as a whole; it can also be understood that multiple base shielding shells 220 located in the first layer share the same first cold plate 300. For example, as... Figure 12 As shown, the four shielding shell assemblies 200 share the same first cold plate 300. In one possible implementation, the first cold plate 300 located in the fourth layer is connected as a whole; this can also be understood as the multiple stacked shielding shells 230 located in the third layer sharing the same second cold plate 400. Figure 11 As shown, multiple stacked shielding shells 230 located in the third layer share the same second cold plate 400. Alternatively, as... Figure 1 As shown, the four shielding shell assemblies 200 share the same second cold plate 400.

[0075] In some embodiments of this application, such as Figures 11-13 As shown, by designing the first cold plate 300 or the second cold plate 400 on the same layer as a single integrated structure, the performance and structural stability of the heat dissipation system are further optimized. Simultaneously, multiple shielding shell assemblies 200 sharing the same first cold plate 300 and / or the same second cold plate 400 can reduce the number of external cold pipes on the cold plate, thereby saving space to some extent. Furthermore, the integrated cold plate design provides a larger heat conduction area and a more uniform heat distribution, ensuring that the heat generated by the optical module can be transferred to the cooling system more quickly and evenly. This embodiment of the application, through optimizing the cold plate design, can achieve a higher integration density of optical modules within a limited space, meeting the needs of high-density application scenarios.

[0076] There are several options for fixing the first cold plate 300 and the second cold plate 400. For example, the first cold plate 300 and the second cold plate 400 can be fixed to the circuit board 100 using different structural components. Alternatively, the first cold plate 300 and the second cold plate 400 can be fixed to the circuit board 100 using the same structural component. Simultaneously, the first cold plate 300 and the second cold plate 400 can also be used to fix the laminated shielding shell 230, so that the laminated shielding shell 230 does not need to be fixed to the circuit board 100, and thus the disassembled laminated shielding shell 230 can still be reused when the first cold plate 300 needs to be replaced.

[0077] In some embodiments, both the base shielding shell 220 and the stacked shielding shell 230 include multiple side-by-side slots. By providing multiple side-by-side slots in the base shielding shell 220 and the stacked shielding shell 230, the modularity and scalability of the device are enhanced. Each slot can accommodate one optical module, and the design of multiple side-by-side slots allows a single shielding shell to support the simultaneous operation of multiple optical modules. This design is particularly suitable for high-density applications, enabling higher optical module integration within a limited space. Users can select to insert different numbers and types of optical modules according to actual needs, adapting to different application environments and functional requirements. When it is necessary to add or replace optical modules, only the corresponding slot needs to be operated without affecting the operation of other parts.

[0078] The basic shielding shell 220 and the stacked shielding shell 230 in this application embodiment can be various port types such as 2x1, 2x2, 2x4, 2x6, and various specifications of optical cages such as quad small form factor pluggable (QSFP) and eight small form factor pluggable (OSFP).

[0079] In some embodiments, such as Figure 4 As shown, in the base shielding shell 220, each slot 222 has a first window 223 on the side away from the circuit board 100; the first cold plate 300 is provided with a first heat dissipation protrusion corresponding to the multiple first windows 223 on the side facing the base shielding shell 220, and the first heat dissipation protrusion passes through the first window 223 and is inserted into the slot 222.

[0080] Each slot 222 has a first window 223 on the side facing away from the circuit board 100, providing a channel for the first heat dissipation protrusion of the first cold plate 300 to enter the slot 222. This design ensures direct contact between the optical module and the cold plate, improving heat conduction efficiency. The first cold plate 300 has first heat dissipation protrusions corresponding to the multiple first windows 223 on the side facing the base shielding shell 220. The first heat dissipation protrusions penetrate the first windows 223 and insert into the slots 222, directly contacting the optical module and rapidly transferring the heat generated by the optical module to the cold plate. This embodiment further improves heat dissipation performance by increasing the contact area and reducing thermal resistance.

[0081] In some embodiments, such as Figure 7 As shown, in the stacked shielding shell 230, each slot 231 has a second window 232 on the side away from the circuit board 100; the second cold plate 400 is provided with a second heat dissipation protrusion corresponding to the multiple second windows 232 on the side facing the stacked shielding shell 230, and the second heat dissipation protrusion passes through the second window 232 and is inserted into the slot 231.

[0082] Each slot 231 has a second window 232 on the side facing away from the circuit board 100, providing a channel for the second heat dissipation protrusion of the second cold plate 400 to enter the slot 231. This design ensures direct contact between the optical module and the cold plate, improving heat conduction efficiency. The second cold plate 400 has second heat dissipation protrusions corresponding to the multiple second windows 232 on the side facing the base shielding shell 220. The second heat dissipation protrusions penetrate the second windows 232 and insert into the slots 231, directly contacting the optical module and rapidly transferring the heat generated by the optical module to the cold plate. This embodiment further improves heat dissipation performance by increasing the contact area and reducing thermal resistance.

[0083] This application embodiment optimizes the contact method between the cold plate and the shielding shell, thereby achieving a higher degree of optical module integration within a limited space and meeting the needs of high-density application scenarios.

[0084] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations.

Claims

1. A communication device, characterized by include: Circuit board; A shielding shell assembly includes a protective shell, a basic shielding shell, and at least one stacked shielding shell; The protective shell is connected to the basic shielding shell and both are fixed to the circuit board; The at least one stacked shielding shell is disposed on the side of the base shielding shell opposite to the circuit board; both the base shielding shell and the stacked shielding shell are used to insert at least one optical module; The first cold plate is disposed between the basic shielding shell and the stacked shielding shell; At least one second cold plate, each second cold plate being disposed on the side of one of the stacked shielding shells opposite to the first cold plate; as well as A connector assembly, fixed to the circuit board and located inside the protective housing; used for connecting to an optical module inserted into the basic shielding housing, and also used for connecting to an optical module inserted into at least one stacked shielding housing.

2. The communication apparatus according to claim 1, wherein The protective shell and the basic shielding shell are an integral structure.

3. The communication apparatus according to claim 1, wherein The protective shell is provided with a first fixing part for connecting to the circuit board; and The basic shielding shell is provided with a second fixing part that is connected to the circuit board.

4. The communication apparatus according to claim 1, wherein At least one of the stacked shielding shells is fixed to at least one of the protective shell, the base shielding shell, the first cold plate, and the second cold plate.

5. The communication apparatus according to claim 4, wherein The laminated shielding shell is pressed onto the first cold plate and / or the second cold plate.

6. The communication apparatus according to claim 4, wherein The first cold plate and / or the second cold plate are fixed to the circuit board by threaded connectors; The laminated shielding shell is clamped and fixed between the first cold plate and the second cold plate; and / or, The stacked shielding shell is clamped and fixed between two adjacent second cold plates.

7. The communication apparatus according to claim 1, wherein The protective shell has a clearance window on the side facing the basic shielding shell, which allows the optical module to be inserted into the protective shell and connected to the connector assembly.

8. The communication apparatus according to claim 1, wherein The connector assembly includes: A first connector layer, fixed to the circuit board, is used to connect with the optical module inserted into the basic shielding shell; At least one second connector layer, which is fixed to the circuit board and located on the side of the first connector layer opposite to the circuit board, is used to connect to the optical module into which the at least one stacked shielding shell is inserted.

9. The communication apparatus according to any one of claims 1-8, wherein, The shielding shell assembly is in multiple sets, and in the multiple sets of shielding shell assemblies, the first cold plate located on the same layer is an integral structure; and / or, the second cold plate located on the same layer is an integral structure.

10. The communication apparatus according to any one of claims 1-8, wherein, The basic shielding shell includes multiple slots arranged side by side, each slot having a first window on the side facing away from the circuit board; the first cold plate has a first heat dissipation protrusion corresponding to the multiple first windows on the side facing the basic shielding shell, the first heat dissipation protrusion passing through the first window and inserted into the slot; and / or The stacked shielding shell includes multiple slots arranged side by side, each slot having a second window on the side facing away from the circuit board; the second cold plate has a second heat dissipation protrusion corresponding to the multiple second windows on the side facing the stacked shielding shell, the second heat dissipation protrusion passing through the second window and inserted into the slot.

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