Radio frequency front-end device and ultrahigh frequency radio frequency tag read-write equipment

Abstract

The utility model relates to a radio frequency front-end device and ultrahigh frequency radio frequency tag read-write equipment. The radio frequency front end device comprises a radio frequency module, an antenna module, a first heat conduction interface material and a second heat conduction interface material. Wherein the radio frequency module comprises a radio frequency substrate, a radio frequency element and a metal shielding shell, the radio frequency element is arranged on the radio frequency substrate, the metal shielding shell covers the radio frequency element, and a first heat conduction interface material is arranged between the radio frequency element and the metal shielding shell; the second heat-conducting interface material is arranged on one side, far away from the radio frequency element, of the metal shielding shell; the antenna module is arranged on the side, away from the radio frequency module, of the second heat conduction interface material. By adopting the radio frequency front-end device, a relatively small appearance size can be kept on the basis of satisfying heat dissipation of equipment.

Description

Technical Field

[0001] This utility model relates to the field of tag reading equipment technology, and in particular to radio frequency front-end devices and ultra-high frequency radio frequency tag reading and writing equipment. Background Technology

[0002] Ultra-high frequency (UHF) RFID tag readers are based on radio frequency identification (RFID) technology and can quickly identify and read information about items with UHF tags.

[0003] Ultra-high frequency RFID tag reading and writing devices generate a lot of heat when working. Related technologies use built-in fans or heat dissipation metal fins to dissipate heat, which increases the overall size of the device. Utility Model Content

[0004] Therefore, it is necessary to provide an RF front-end device and an UHF RFID tag reader / writer that can maintain a small size while meeting the requirements for device heat dissipation.

[0005] In a first aspect, a radio frequency (RF) front-end device is provided, comprising: an RF module, an antenna module, a first thermally conductive interface material, and a second thermally conductive interface material; wherein...

[0006] The radio frequency module includes a radio frequency substrate, radio frequency components and a metal shielding shell. The radio frequency components are disposed on the radio frequency substrate, the metal shielding shell covers the radio frequency components, and a first thermal interface material is disposed between the radio frequency components and the metal shielding shell.

[0007] The second thermal interface material is placed on the side of the metal shielding shell away from the radio frequency components;

[0008] The antenna module is located on the side of the second thermal interface material away from the RF module.

[0009] In one embodiment, the radio frequency components include a radio frequency power amplifier and a radio frequency transceiver chip;

[0010] The number of first thermal interface materials is 2, one of which is disposed between the RF power amplifier and the metal shielding shell, and the other is disposed between the RF transceiver chip and the metal shielding shell.

[0011] In one embodiment, the thermal conductivity of the first thermal interface material and the second thermal interface material is greater than a first threshold.

[0012] In one embodiment, the radio frequency front-end device further includes: a third thermal interface material and a device housing;

[0013] The device housing has a receiving cavity, the radio frequency module is disposed in the receiving cavity, and the radio frequency components are disposed on the side of the radio frequency substrate away from the device housing;

[0014] The third thermal interface material is placed on the side of the RF substrate closest to the device housing.

[0015] In one embodiment, the third thermal interface material is provided with clearance holes;

[0016] The location of the clearance hole corresponds to the location of the radio frequency component.

[0017] In one embodiment, the thermal conductivity of the third thermal interface material is less than a first threshold.

[0018] In one embodiment, the antenna module includes an antenna substrate and antenna elements; wherein,

[0019] The antenna element is located on the side of the antenna substrate away from the second thermal interface material;

[0020] The side of the antenna substrate closest to the second thermal interface material is treated with copper leakage.

[0021] In one embodiment, the first area corresponding to the copper leakage region on the antenna substrate is greater than or equal to the second area of ​​the second thermal interface material.

[0022] In one embodiment, the radio frequency front-end device includes a heat-spreading material; wherein,

[0023] The heat-spreading material is placed between the antenna module and the second thermal interface material.

[0024] In a second aspect, an ultra-high frequency radio frequency tag reading and writing device is provided, which includes a lens and a radio frequency front-end device as described in the first aspect.

[0025] The aforementioned radio frequency (RF) front-end device and UHF RFID tag reading / writing device include an RF front-end device comprising: an RF module, an antenna module, a first thermal interface material, and a second thermal interface material. The RF module includes an RF substrate, RF components, and a metal shielding shell. The RF components are mounted on the RF substrate, and the metal shielding shell covers the RF components. The first thermal interface material is disposed between the RF components and the metal shielding shell. The second thermal interface material is disposed on the side of the metal shielding shell furthest from the RF components. The antenna module is disposed on the side of the second thermal interface material furthest from the RF module. By using the first thermal interface material to fill the air gap between the RF components and the inner surface of the metal shielding shell, and using the second thermal interface material to fill the air gap between the outer surface of the metal shielding shell and the antenna module, the heat generated by the RF components during operation is rapidly transferred to the ambient air via the path: RF components → first thermal interface material → metal shielding shell → second thermal interface material → antenna module. This avoids the problem of large overall device size caused by additional cooling fans or heat dissipation fins in related technologies. The UHF RFID tag reading / writing device using the aforementioned RF front-end device can maintain a small overall size while meeting heat dissipation requirements. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is an exploded view of the radio frequency front-end device in one embodiment;

[0028] Figure 2 This is a schematic diagram of the exploded structure of the radio frequency module in one embodiment;

[0029] Figure 3 This is a schematic diagram of the planar structure of the third thermal interface material in one embodiment;

[0030] Figure 4 This is a schematic diagram of the planar structure of the copper leakage region in the antenna substrate in one embodiment;

[0031] Figure 5 This is a side view of an ultra-high frequency radio frequency tag reader / writer device in one embodiment;

[0032] Figure 6 for Figure 5 An enlarged view of region A shown in the image;

[0033] Figure 7 for Figure 6 An enlarged view of region B shown in the image;

[0034] Figure 8 This is an exploded view of the radio frequency front-end energy device in one embodiment.

[0035] Explanation of reference numerals in the attached drawings: 100, RF module; 110, RF substrate; 121, RF power amplifier; 122, RF transceiver chip; 130, metal shielding shell; 140, support frame; 150, fastener; 200, antenna module; 210, antenna substrate; 211, exposed copper area; 220, antenna element; 310, amplifier thermal conductive material; 320, chip thermal conductive material; 400, second thermal interface material; 500, third thermal interface material; 511, amplifier clearance hole; 512, chip clearance hole; 600, device housing; 700, conductive cloth; 800, connecting part; 900, heat dissipation material. Detailed Implementation

[0036] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0037] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0042] In one exemplary embodiment, please refer to Figure 1 The provided radio frequency front-end device includes: radio frequency module 100, antenna module 200, first thermal interface material and second thermal interface material 400.

[0043] Please refer to the following: Figure 2 The radio frequency module 100 includes a radio frequency substrate 110, radio frequency components and a metal shielding shell 130, wherein the radio frequency components are disposed on the radio frequency substrate 110, the metal shielding shell 130 covers the radio frequency components, and a first thermal interface material is disposed between the radio frequency components and the metal shielding shell 130.

[0044] In this embodiment, the heat source in the radio frequency front-end device is mainly the radio frequency component in the radio frequency module 100. The first thermal interface material is placed between the radio frequency component and the metal shield 130 to fill the air gap generated between the radio frequency component and the inner side of the metal shield 130, so that the heat generated by the operation of the radio frequency component can be quickly transferred to the metal shield 130 through the first thermal interface material.

[0045] For example, the metal shielding shell 130 is made of stainless steel.

[0046] For example, the shape and size of the first thermal interface material are the same as the surface shape and size of the RF component on the side near the metal shield 130, so as to better fill the air gap between the RF component and the metal shield 130 and improve heat dissipation performance.

[0047] In one possible implementation, please refer to Figure 2 The radio frequency module 100 also includes a support frame 140, which is disposed between the radio frequency substrate 110 and the metal shielding shell 130 to support the metal shielding shell 130.

[0048] In this embodiment, the second thermal interface material 400 is disposed on the side of the metal shielding shell 130 away from the radio frequency (RF) components, and the antenna module 200 is disposed on the side of the second thermal interface material 400 away from the RF module 100. In this embodiment, the second thermal interface material 400 fills the air gap between the metal shielding shell 130 and the antenna module, allowing heat received by the metal shielding shell 130 to be rapidly transferred to the antenna module, which then transfers the heat to the ambient air outside the RF front-end device. For ease of description, in this embodiment, the side of the metal shielding shell 130 away from the RF components is referred to as the outer surface of the metal shielding shell 130, and the side of the metal shielding shell 130 closer to the RF components is referred to as the inner surface of the metal shielding shell 130.

[0049] In one possible implementation, the first thermal interface material and the second thermal interface material 400 are made of thermally conductive silicone. For example, the first thermal interface material can be adhered to the surface of the radio frequency component by its own adhesiveness, and the second thermal interface material 400 can be adhered to the outer surface of the metal shielding shell 130 by its own adhesiveness.

[0050] In another possible implementation, the first thermal interface material and the second thermal interface material 400 may also be thermally conductive gel or thermally conductive grease, etc.

[0051] In one possible implementation, the first thermal interface material and the second thermal interface material 400 are high-wattage thermally conductive materials. For example, the thermal conductivity of the first thermal interface material and the second thermal interface material 400 is greater than a first threshold. Optionally, the first threshold value ranges from 6 watts to 8 watts. For example, the thermal conductivity of the first thermal interface material and the second thermal interface material 400 is 8 watts.

[0052] In this embodiment, a first thermally conductive interface material with high thermal conductivity is provided at the position corresponding to the radio frequency component, and a second thermally conductive interface material 400 with high thermal conductivity is provided on the outside of the metal shielding shell 130, which can improve the speed of heat transfer and improve heat dissipation efficiency.

[0053] The radio frequency (RF) front-end device provided in the above embodiments includes an RF module 100, an antenna module 200, a first thermal interface material, and a second thermal interface material 400. The RF module 100 includes an RF substrate 110, RF components, and a metal shielding shell 130. The RF components are disposed on the RF substrate 110, and the metal shielding shell 130 covers the RF components. The first thermal interface material is disposed between the RF components and the metal shielding shell 130. The second thermal interface material 400 is disposed on the side of the metal shielding shell 130 away from the RF components. The antenna module 200 is disposed on the side of the second thermal interface material 400 away from the RF module 100. In this way, the first thermal interface material is used to fill the air gap between the radio frequency component and the inner surface of the metal shielding shell 130, and the second thermal interface material 400 is used to fill the air gap between the outer surface of the metal shielding shell 130 and the antenna module. The heat generated by the radio frequency component during operation is quickly transferred to the ambient air according to the transfer path of radio frequency component → first thermal interface material → metal shielding shell 130 → second thermal interface material 400 → antenna module. This avoids the problem of large overall device size caused by setting additional cooling fans or heat dissipation metal fins in related technologies. The ultra-high RFID tag reading and writing device using the radio frequency front-end device provided in this embodiment can maintain a small size while meeting the heat dissipation requirements of the device.

[0054] In an exemplary embodiment, the radio frequency component includes a radio frequency power amplifier 121 and a radio frequency transceiver chip 122; the number of corresponding first thermal interface materials is 2, one of which is disposed between the radio frequency power amplifier 121 and the metal shielding shell 130, and the other is disposed between the radio frequency transceiver chip 122 and the metal shielding shell 130.

[0055] For ease of description, the first thermal interface material disposed between the RF power amplifier 121 and the metal shielding shell 130 is referred to as amplifier thermal interface material 310, and the first thermal interface material disposed between the RF transceiver chip 122 and the metal shielding shell 130 is referred to as chip thermal interface material 320.

[0056] For example, the surface shape and size of the amplifier thermal conductive material 310 facing the RF power amplifier 121 are the same as the surface shape and size of the RF power amplifier 121 facing the metal shield 130, in order to better fill the air gap between the RF power amplifier 121 and the metal shield 130.

[0057] For example, the surface shape and size of the chip thermal conductive material 320 facing the RF transceiver chip 122 are the same as the surface shape and size of the RF transceiver chip 122 facing the metal shielding shell 130, so as to better fill the air gap between the RF transceiver chip 122 and the metal shielding shell 130.

[0058] In one exemplary embodiment, the radio frequency component includes a radio frequency power amplifier 121, and the first thermal interface material includes an amplifier thermal conductive material 310.

[0059] In one exemplary embodiment, the radio frequency component includes a radio frequency transceiver chip 122, and the first thermal interface material includes a chip thermal conductive material 320.

[0060] In one exemplary embodiment, please refer to Figure 1 The RF front-end device also includes a third thermal interface material 500 and a device housing 600. The device housing 600 has a receiving cavity, within which the RF module 100 is disposed, and the RF components are disposed on the side of the RF substrate 110 away from the device housing 600. The third thermal interface material 500 is disposed on the side of the RF substrate 110 closer to the device housing 600.

[0061] In one possible implementation, the device housing 600, as an exterior hardware component, is made of magnesium alloy.

[0062] In this embodiment, the air gap between the device housing 600 and the radio frequency substrate 110 is filled by the third thermal interface material 500, so that part of the heat generated by the radio frequency component is transferred to the ambient air through the radio frequency substrate 110 → the third thermal interface material 500 → the device housing 600.

[0063] In one possible implementation, the third thermal interface material 500 is thermally conductive silicone; for example, the third thermal interface material 500 can be self-adhesively attached to the surface of the RF substrate 110 near the device housing 600.

[0064] In another possible implementation, the third thermal interface material 500 may also be a thermally conductive gel or a thermally conductive silicone grease.

[0065] In one exemplary embodiment, please refer to Figure 1 and Figure 3 The third thermal interface material 500 in the RF front-end device is provided with clearance holes, wherein the location of the clearance holes corresponds to the location of the RF components.

[0066] For example, the radio frequency components include a radio frequency amplifier and a radio frequency transceiver chip 122; correspondingly, the clearance holes include an amplifier clearance hole 511 and a chip clearance hole 512. The shape and size of the amplifier clearance hole 511 are the same as the surface shape and size of the radio frequency power amplifier 121 facing the metal shielding shell 130, and the shape and size of the chip clearance hole 512 are the same as the surface shape and size of the radio frequency transceiver chip 122 facing the metal shielding shell 130.

[0067] In this embodiment, a clearance hole is provided in the third thermal interface material 500 at the position corresponding to the radio frequency component to limit the amount of heat transferred to the device housing 600. This avoids excessive heat dissipation through the device housing 600, which could lead to severe overheating of the device housing 600 adjacent to the handheld part of the device. The radio frequency front-end device provided in this embodiment can reduce the amount of heat transferred to the device housing 600 while ensuring heat dissipation, thus preventing the device housing 600 from overheating and improving the user experience.

[0068] In one possible implementation, please refer to Figure 1 The radio frequency module 100 is fixed to the device housing 600 by a fastener 150, wherein the device housing 600 is provided with a fixing hole corresponding to the fastener 150. For example, the fastener 150 is a screw, and the corresponding fixing hole is a screw hole.

[0069] In one exemplary embodiment, the thermal conductivity of the third thermal interface material 500 is less than a first threshold. The third thermal interface material 500 is a low-wattage thermally conductive material relative to the first and second thermal interface materials 400. For example, the thermal conductivity of the third thermal interface material 500 is 5 watts.

[0070] In the above embodiments, by using a third thermal interface material 500 with low thermal conductivity to fill the air gap between the antenna substrate 210 and the device housing 600, the heat dissipation through the device housing 600 is limited, so that most of the heat is transferred to the ambient air through the first thermal interface material and the second thermal interface material 400 and the antenna module, thus avoiding the problem of the RF front-end device housing getting hot and improving the user's product experience.

[0071] In an exemplary embodiment, the antenna module 200 includes an antenna substrate 210 and an antenna element 220, wherein the antenna element 220 is disposed on the side of the antenna substrate 210 away from the second thermal interface material 400, and the side of the antenna substrate 210 close to the second thermal interface material 400 is subjected to copper leakage treatment.

[0072] Please refer to the following: Figure 4 The copper leakage area 211 of the antenna substrate 210 avoids the grounding coaxial line connection area between antenna elements.

[0073] In one possible implementation, antenna element 220200 is a multi-arm helical antenna. For example, Figure 1 As shown, antenna element 220 is a four-arm helical antenna.

[0074] In one possible implementation, please refer to Figure 4 The first area corresponding to the copper leakage region 211 on the antenna substrate 210 is greater than or equal to the second area corresponding to the second thermal interface material 400.

[0075] In this embodiment, copper leakage treatment is performed on the side of the antenna substrate 210 close to the second thermal interface material 400, which can better transfer the heat transferred by the second thermal interface material 400 to the surface of the antenna element 220 and improve the heat dissipation speed.

[0076] In one aspect, in related technologies, the back side of the antenna substrate 210, that is, the side close to the second thermal interface material 400, is covered with green oil. However, this results in the equivalent ground of the antenna element 220 being only connected to the coaxial line, leading to poor stability. In this embodiment, the back side of the antenna substrate 210 is treated with copper leakage, so that the copper leakage area 211 of the antenna substrate 210 has more foundation with the ground of the whole device. This allows the heat generated by the radio frequency components to be transferred to the antenna module direction, while improving the antenna performance by increasing the equivalent ground of the antenna, thereby increasing the group reading performance of the UHF RFID tag reader / writer.

[0077] On another front, the UHF RFID tag reader / writer also includes conductive cloth 700; for example, please refer to... Figure 5 This is a first-view plan view of an UHF RFID tag reader, where region A includes the RFID front-end device. Please refer to [reference needed]. Figure 6 ,for Figure 5 Please refer to the enlarged view of region A in the middle. Figure 7 ,for Figure 6An enlarged view of region B; in this view, a portion of the conductive cloth 700 is disposed between the metal shielding shell 130 and the antenna module, and another portion of the conductive cloth 700 is disposed between the antenna module and the connecting part 800, wherein the connecting part 800 is used to connect the radio frequency front-end device and the UHF RFID tag reading and writing device body; in the related technology where the back side of the antenna substrate 210 is covered with green oil, the copper layer of the antenna substrate 210 does not contact the conductive cloth 700, and a very small electric field is formed between the copper layer and the conductive cloth 700, with the direction of the electric field pointing from the direction of the antenna substrate 210 to the direction of the conductive cloth 700, such as... Figure 6 As shown by the green arrow in the diagram. For the antenna module as a whole, this electric field has a continuous effect on the antenna performance; in this embodiment, the back of the antenna substrate 210 is treated with copper exposure, and there is no green solder mask on the back of the antenna substrate 210. At this time, the conductive cloth 700 is in close contact with the copper layer of the antenna substrate 210, producing a common ground effect, so that this electric field does not exist, thereby improving the transmit and receive performance of the antenna module.

[0078] In summary, in the radio frequency front-end device provided in this embodiment, the side of the antenna substrate 210 near the second thermal interface material 400 is treated with copper leakage, which can not only improve the heat dissipation speed of the radio frequency front-end device, but also improve the transmission performance of the antenna module in the radio frequency front-end device and increase the group reading performance of the UHF RFID tag reader / writer.

[0079] In one exemplary embodiment, please refer to Figure 8 The radio frequency front-end device includes a heat-spreading material 900, which is disposed between the antenna module and the second thermal interface material 400.

[0080] In one possible implementation, the heat spreader 900 is a copper foil; for example, the copper foil is adhered to the side of the antenna substrate 210 near the second thermal interface material 400.

[0081] In this embodiment, the heat transferred from the second thermal interface material 400 is evenly distributed to the antenna module by the heat homogenizing material 900700, which avoids local overheating caused by the heat being concentrated in one area when it is transferred to the antenna module, thereby improving the heat dissipation performance.

[0082] In one exemplary embodiment, please refer to Figure 1 , Figure 2 and Figure 3The provided radio frequency (RF) front-end device includes: an RF module 100, an antenna module 200, a first thermal interface material 300, a second thermal interface material 400, a third thermal interface material 500, and a device housing 600; wherein, the RF module 100 includes an RF substrate 110, an RF power amplifier 121, an RF transceiver chip 122, and a metal shielding shell 130, wherein the RF power amplifier 121 and the RF transceiver chip 122 are disposed on the RF substrate 110, the metal shielding shell 130 covers the RF components, one of the first thermal interface materials 300 is disposed between the RF power amplifier 121 and the metal shielding shell 130, and the other of the first thermal interface materials 300 is disposed between the RF transceiver chip 122 and the metal shielding shell 130; the second thermal interface material 400 is disposed on the side of the metal shielding shell 130 away from the RF components; the antenna module 200 is disposed on the side of the second thermal interface material 400 away from the RF module 100.

[0083] The device housing 600 has a receiving cavity, the radio frequency module 100 is disposed in the receiving cavity, and the radio frequency components are disposed on the side of the radio frequency substrate 110 away from the device housing 600; the third thermal interface material 500 is disposed on the side of the radio frequency substrate 110 close to the device housing 600; and the third thermal interface material 500 is provided with an amplifier clearance hole 511 and a chip clearance hole 512, wherein the position of the amplifier clearance hole 511 corresponds to the position of the radio frequency power amplifier 121511 on the radio frequency substrate 110, and the position of the chip clearance hole 512 corresponds to the position of the radio frequency transceiver chip 122 on the radio frequency substrate 110.

[0084] Wherein, the thermal conductivity of the first thermally conductive interface material and the second thermally conductive interface material 400 is greater than the first threshold; the thermal conductivity of the third thermally conductive interface material 500 is less than the first threshold; the thermal conductivity of the third thermally conductive interface material 500 is less than the first threshold.

[0085] The antenna module includes an antenna substrate 210 and an antenna element 220, wherein the antenna element 220 is disposed on the side of the antenna substrate 210 away from the second thermal interface material 400.

[0086] Optionally, the antenna substrate 210 is subjected to copper leakage treatment on the side close to the second thermal interface material 400, wherein the first area corresponding to the copper leakage area 211 on the antenna substrate 210 is greater than or equal to the second area of ​​the second thermal interface material 400.

[0087] Optionally, the radio frequency front-end device includes a heat-spreading material 900, wherein the heat-spreading material 900 is disposed between the antenna module 200 and the second thermal interface material 400.

[0088] The RF front-end device provided in the above embodiment has an opening in the third thermal interface material 500 between the device housing 600 and the RF substrate 110 to avoid the RF power amplifier 121 and the RF transceiver chip 122. The third thermal interface material 500 is selected as a low-wattage thermal interface material to limit the transfer of heat to the surface of the device housing. The upper surfaces of the RF power amplifier 121 and the RF transceiver chip 122 are made of a high-wattage first thermal interface material, which transfers most of the heat generated by the RF power amplifier 121 and the RF transceiver chip 122 to the metal shielding shell 130. Then, the heat is transferred to the ambient air through the antenna module via the high-wattage second thermal interface material 400. This can improve the heat dissipation performance of the RF front-end device while avoiding overheating of the device housing 600.

[0089] This application also provides an ultra-high frequency radio frequency tag reading and writing device; please refer to... Figure 1 and Figure 5 The ultra-high frequency radio frequency tag reading and writing device includes the radio frequency front-end device provided in the aforementioned embodiments.

[0090] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A radio frequency front-end device, characterized in that, The radio frequency front-end device includes: a radio frequency module, an antenna module, a first thermally conductive interface material, and a second thermally conductive interface material; wherein... The radio frequency module includes a radio frequency substrate, radio frequency components, and a metal shielding shell. The radio frequency components are disposed on the radio frequency substrate, and the metal shielding shell covers the radio frequency components. The first thermally conductive interface material is disposed between the radio frequency components and the metal shielding shell. The second thermally conductive interface material is disposed on the side of the metal shielding shell away from the radio frequency component; The antenna module is located on the side of the second thermal interface material away from the radio frequency module.

2. The radio frequency front-end device according to claim 1, characterized in that, The radio frequency components include a radio frequency power amplifier and a radio frequency transceiver chip; The number of the first thermal interface materials is 2, one of which is disposed between the RF power amplifier and the metal shielding shell, and the other of which is disposed between the RF transceiver chip and the metal shielding shell.

3. The radio frequency front-end device according to claim 1, characterized in that, The thermal conductivity of the first thermal interface material and the second thermal interface material is greater than the first threshold.

4. The radio frequency front-end device according to claim 1, characterized in that, The radio frequency front-end device also includes: a third thermal interface material and a device housing; The device housing has a receiving cavity, the radio frequency module is disposed in the receiving cavity, and the radio frequency element is disposed on the side of the radio frequency substrate away from the device housing; The third thermal interface material is disposed on the side of the radio frequency substrate near the device housing.

5. The radio frequency front-end device according to claim 4, characterized in that, The third thermally conductive interface material is provided with clearance holes; The location of the clearance hole corresponds to the location of the radio frequency component.

6. The radio frequency front-end device according to claim 4, characterized in that, The thermal conductivity of the third thermal interface material is less than the first threshold.

7. The radio frequency front-end device according to claim 1, characterized in that, The antenna module includes an antenna substrate and antenna elements; wherein... The antenna element is disposed on the side of the antenna substrate away from the second thermally conductive interface material; The side of the antenna substrate closest to the second thermal interface material is treated with copper leakage.

8. The radio frequency front-end device according to claim 7, characterized in that, The first area corresponding to the copper leakage region on the antenna substrate is greater than or equal to the second area of ​​the second thermal interface material.

9. The radio frequency front-end device according to claim 1, characterized in that, The radio frequency front-end device includes a heat-spreading material; wherein... The heat-spreading material is disposed between the antenna module and the second thermal interface material.

10. An ultra-high frequency radio frequency tag reading and writing device, characterized in that, The ultra-high frequency radio frequency tag reading and writing device includes the radio frequency front-end device as described in any one of claims 1-9.

Images