Electrolytic gold and immersion gold HDI plate

Abstract

The utility model relates to the technical field of HDI plates, in particular to a gold plating and gold immersion HDI plate, which comprises a circuit board, the top of the circuit board is connected with a component through a bonding pad, a golden finger is arranged on one side of the top of the circuit board, the outside of the circuit board is connected with a protective frame, the top of the protective frame is provided with a top cover, and the top of the top cover is provided with an air inlet. A fan is installed in the air inlet and located above the component, a plurality of through grooves are formed in the edge of the top of the circuit board, an air guide groove is formed in the side face of the bottom of the protection frame, the top of the air guide groove communicates with the bottoms of the through grooves, and a pair of fixing blocks is installed at the top of the top cover. The surface of the circuit board can be blown through the fan, components on the surface of the circuit board can be cooled, then air blown in by the fan can be blown to the bottom of the circuit board along the through grooves and the air guide grooves, the bottom of the circuit board is cooled sufficiently, and the cooling effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of HDI board technology, and in particular to an HDI board with electroplating and immersion gold plating. Background Technology

[0002] HDI boards are an advanced type of PCB that achieves ultra-high wiring density through microvia technology, fine circuitry, and multi-layer stacking structures.

[0003] Existing HDI boards are typically mounted directly into the device housing using bolts, and cooled by a fan installed inside the housing. However, the fan only cools one side of the HDI board, while the other side, in contact with the housing, experiences slow and ineffective heat dissipation. Furthermore, because the housing's interior is connected to the external environment via heat dissipation channels, dust and other impurities from the outside environment can penetrate these channels and adhere to the HDI board surface, affecting its performance and resulting in poor dust protection. To address these issues, we propose an HDI board that combines electroplating and immersion gold plating. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing an HDI board with electroplating and immersion gold plating.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: designing an HDI board with electroplating and immersion gold plating, including a circuit board, with components connected to the top of the circuit board via solder pads, and gold fingers provided on one side of the top of the circuit board.

[0006] The circuit board has a protective frame on its external connection. The top of the protective frame has a top cover, and the top of the top cover has an air inlet. A fan is installed inside the air inlet and is located above the components.

[0007] Several through slots are provided on the top edge of the circuit board, and air guide slots are provided on the bottom side of the protective frame, with the top of the air guide slots connected to the bottom of the through slots.

[0008] A pair of fixing blocks are installed on the top of the top cover. A rotating shaft is rotatably connected between the two fixing blocks. A connecting block is installed on the side of the rotating shaft. One end of the connecting block is connected to a rim. A first dustproof net is installed inside the rim and covers the top of the air inlet.

[0009] The bottom of the protective frame has a receiving groove, and a second dustproof net is installed inside the receiving groove.

[0010] Preferably, the surface of the gold finger is provided with an electroplated gold layer, and the surface of the solder pad is provided with an immersion gold layer.

[0011] Preferably, when the top cover is fixed to the top of the protective frame, there is a gap between the fan and the components.

[0012] Preferably, the air guide duct is arc-shaped.

[0013] Preferably, torsion springs are installed at both ends of the rotating shaft, with one end of each torsion spring fixed to the side of the rotating shaft and the other end of each torsion spring fixed to the side of the corresponding fixing block.

[0014] Preferably, when the first dustproof net covers the top of the air inlet, the edging is fitted onto the side of the air inlet and sealed to the side of the air inlet.

[0015] Preferably, the bottom edge of the protective frame is equipped with several fixing feet, and there is a gap between the bottom of the fixing feet and the bottom of the protective frame.

[0016] Preferably, the protective frame has an interface on the side near the gold fingers.

[0017] The design scheme proposed in this utility model has the following beneficial effects in application:

[0018] 1. The fan blows air onto the surface of the circuit board, cooling the components on the board. The air blown in by the fan will then be blown along the through slots and air guides to the bottom of the circuit board, cooling the bottom of the board. This thorough cooling improves the heat dissipation effect.

[0019] 2. The first dustproof net can block the air inlet, and the second dustproof net can block the bottom of the protective frame, thereby preventing dust and other impurities from the external environment from adhering to the surface of the components and improving the dustproof effect. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 ;

[0021] Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 ;

[0022] Figure 3 This is a schematic diagram of the connecting block and the first dustproof net structure of this utility model;

[0023] Figure 4 This is a partial structural sectional view of the present invention.

[0024] In the diagram: 1. Circuit board; 2. Protective frame; 3. Solder pad; 4. Fixing foot; 5. Through slot; 6. Gold finger; 7. Fixing block; 8. First dustproof net; 9. Connecting block; 10. Fan; 11. Top cover; 12. Air inlet; 13. Surrounding edge; 14. Shaft; 15. Torsion spring; 16. Air guide channel; 17. Second dustproof net; 18. Receiving slot; 19. Interface. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0026] Reference Figures 1-4 An HDI board with electroplating and immersion gold plating includes a circuit board 1, characterized in that: components are connected to the top of the circuit board 1 via pads 3, and the surface of the pads 3 is provided with an immersion gold layer, which can reduce the offset of solder balls between the components and the pads 3 and improve the soldering effect.

[0027] like Figure 1 As shown, the circuit board 1 is externally connected to a protective frame 2. A gold finger 6 is provided on one side of the top of the circuit board 1. An interface 19 is provided on the side of the protective frame 2 near the gold finger 6. In actual use, the external device can be plugged into the gold finger 6 through the interface 19 to connect the circuit board 1 to the external device.

[0028] The surface of the gold finger 6 is covered with an electroplated gold layer, which increases the wear resistance of the gold finger 6 and improves its performance.

[0029] like Figure 1 As shown, several fixing feet 4 are installed on the bottom edge of the protective frame 2. There is a gap between the bottom of the fixing feet 4 and the bottom of the protective frame 2. The fixing feet 4 can be used to install the protective frame 2 in a preset position, thereby fixing the circuit board 1 and making the installation stable.

[0030] like Figure 1 and Figure 2 As shown, the top of the protective frame 2 is provided with a top cover 11, and the top of the top cover 11 is provided with an air inlet 12. A fan 10 is installed inside the air inlet 12. The fan 10 is connected to the circuit board 1 through a wire. The fan 10 is located above the components. In actual use, the fan 10 can blow external air to the top of the circuit board 1 to dissipate heat from the components on the top of the circuit board 1.

[0031] It should be noted that, as Figure 4 As shown, when the top cover 11 is fixed to the top of the protective frame 2, there is a gap between the fan 10 and the components. This creates a space between the top cover 11 and the protective frame 2, protecting the circuit board 1, while preventing the fan 10 from colliding with the components on the circuit board 1.

[0032] like Figure 1 and Figure 4As shown, the top edge of the circuit board 1 is provided with several through slots 5, and the bottom side of the protective frame 2 is provided with an air guide slot 16. The top of the air guide slot 16 is connected to the bottom of the through slot 5. In actual use, after the air blown in by the fan 10 cools the components, the air will flow from the through slot 5 and the air guide slot 16 to the bottom of the circuit board 1 to dissipate heat and cool the bottom of the circuit board 1. The cooling is sufficient and the heat dissipation effect is improved.

[0033] It should be noted that, as Figure 4 As shown, the air guide 16 is arc-shaped, which can guide the air flowing into the through groove 5, so that the air will blow along the air guide 16 to the bottom of the circuit board 1, and fully dissipate heat from the bottom of the circuit board 1.

[0034] like Figure 1 Hehe Figure 2 As shown, a pair of fixing blocks 7 are installed on the top of the top cover 11. A rotating shaft 14 is rotatably connected between the two fixing blocks 7. A connecting block 9 is installed on the side of the rotating shaft 14. One end of the connecting block 9 is connected to a rim 13. A first dustproof net 8 is installed inside the rim 13. The first dustproof net 8 covers the top of the air inlet 12. In actual use, by covering the air inlet 12 with the first dustproof net 8, the air drawn in by the fan 10 can be filtered to remove dust and other impurities in the air, thus preventing dust from adhering to the surface of the circuit board 1 and affecting heat dissipation.

[0035] like Figure 3 As shown, torsion springs 15 are installed at both ends of the rotating shaft 14. One end of each torsion spring 15 is fixed to the side of the rotating shaft 14, and the other end of each torsion spring 15 is fixed to the side of the corresponding fixing block 7. Through the torsion of the torsion springs 15, the first dustproof net 8 can be tightly covered on the top of the air inlet 12 and will not come off by itself.

[0036] like Figure 4 As shown, the bottom of the protective frame 2 is provided with a receiving groove 18, and a second dustproof net 17 is installed inside the receiving groove 18. The second dustproof net 17 can cover the bottom of the protective frame 2, preventing dust in the outside air from adhering to the bottom of the circuit board 1, and also preventing dust in the air from seeping into the top of the circuit board 1 through the air guide groove 16 and the through groove 5, thereby improving the dustproof effect.

[0037] Specifically, in use, the operator places the top cover 11 on the protective frame 2. The first dustproof net 8, under the torque of the torsion spring 15, tightly covers the top of the air inlet 12. Then, the operator fixes the second dustproof net 17 in the receiving groove 18 at the bottom of the protective frame 2, covering the bottom of the protective frame 2. This blocks dust from the external environment, preventing dust from adhering to the surface of the circuit board 1 and improving the performance. After that, the fixing feet 4 at the bottom of the protective frame 2 are fixed in the preset position, and the circuit board 1 is installed. When the components on the circuit board 1 are working, the circuit board 1 controls the fan 10 to work. The fan 10 blows external air through the first dustproof net 8 and onto the surface of the circuit board 1 to dissipate heat from the components. Then, the air flows along the circuit board 1 to the through groove 5 and blows towards the bottom of the circuit board 1 through the through groove 5 and the air guide groove 16 to dissipate heat from the bottom of the circuit board 1. The heat dissipation is sufficient and the heat dissipation effect is improved.

[0038] Furthermore, when the first dustproof net 8 covers the top of the air inlet 12, the edging 13 is fitted onto the side of the air inlet 12 and sealed to the side of the air inlet 12. This prevents external dust from seeping into the top of the circuit board 1 through the gap between the air inlet 12 and the edging 13, thus improving the dustproof effect.

[0039] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An HDI board with electroplating and immersion gold plating, comprising a circuit board (1), characterized in that: The top of the circuit board (1) is connected to components via pads (3), and gold fingers (6) are provided on one side of the top of the circuit board (1). The circuit board (1) is connected to a protective frame (2). The top of the protective frame (2) is provided with a top cover (11). The top of the top cover (11) is provided with an air inlet (12). A fan (10) is installed inside the air inlet (12). The fan (10) is located above the components. The top edge of the circuit board (1) is provided with several through slots (5), and the bottom side of the protective frame (2) is provided with an air guide slot (16), and the top of the air guide slot (16) is connected to the bottom of the through slot (5). A pair of fixing blocks (7) are installed on the top of the top cover (11). A rotating shaft (14) is rotatably connected between the two fixing blocks (7). A connecting block (9) is installed on the side of the rotating shaft (14). A rim (13) is connected to one end of the connecting block (9). A first dustproof net (8) is installed inside the rim (13). The first dustproof net (8) covers the top of the air inlet (12). The bottom of the protective frame (2) is provided with a receiving groove (18), and a second dustproof net (17) is installed inside the receiving groove (18).

2. The HDI board with electroplating and immersion gold plating according to claim 1, characterized in that: The surface of the gold finger (6) is provided with an electroplated gold layer, and the surface of the pad (3) is provided with an immersion gold layer.

3. The HDI board with electroplating and immersion gold according to claim 1, characterized in that: When the top cover (11) is fixed to the top of the protective frame (2), there is a gap between the fan (10) and the components.

4. An HDI board with electroplating and immersion gold plating according to claim 1, characterized in that: The air guide slot (16) is arc-shaped.

5. An HDI board with electroplating and immersion gold plating according to claim 1, characterized in that: Both ends of the rotating shaft (14) are equipped with torsion springs (15). One end of each torsion spring (15) is fixed on the side of the rotating shaft (14), and the other end of each torsion spring (15) is fixed on the side of the corresponding fixing block (7).

6. An HDI board with electroplating and immersion gold plating according to claim 1, characterized in that: When the first dustproof net (8) covers the top of the air inlet (12), the edging (13) is fitted onto the side of the air inlet (12) and sealed to the side of the air inlet (12).

7. An HDI board with electroplating and immersion gold plating according to claim 1, characterized in that: Several fixing feet (4) are installed on the bottom edge of the protective frame (2), and there is a gap between the bottom of the fixing feet (4) and the bottom of the protective frame (2).

8. An HDI board with electroplating and immersion gold plating according to claim 1, characterized in that: An interface (19) is provided on the side of the protective frame (2) near the gold finger (6).

Images