Stacked crystal type optical coupler packaging structure
By using reflective colloid and encapsulating colloid in the stacked optical coupler packaging structure, the problem of poor energy conversion rate caused by light emanating from the sidewalls is solved, achieving high-efficiency energy conversion and electrical insulation capabilities, and avoiding energy waste and external light interference.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WISETOP TECHNOLOGY CO LTD
- Filing Date
- 2025-04-23
- Publication Date
- 2026-05-19
AI Technical Summary
In the existing stacked-chip optical coupler packaging structure, the light emitted by the light-emitting unit may be emitted from the side wall of the light-transmitting insulating block and absorbed by the black glue, resulting in poor energy conversion efficiency. Furthermore, increasing the driving power supply to enhance the light reception will cause energy waste.
A reflective colloid is used to encapsulate the transparent insulating block, increasing the path of light reflection to the photoelectric unit. A hemispherical design is used to improve the energy conversion rate, while the encapsulating colloid is used to avoid interference from external light.
It improves the energy conversion rate between the light-emitting unit and the photoelectric unit, achieving energy saving, and enhances electrical insulation and anti-interference capabilities, avoiding interference from external light to the photoelectric unit.
Smart Images
Figure CN224265407U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a stacked-chip optical coupler packaging structure. Background Technology
[0002] An optocoupler, also known as a photocoupler, optical isolator, or opto-isolator, is a device that transmits electrical signals using visible light or infrared light as a medium. Optical couplers provide electrical isolation between the input and output circuits.
[0003] A typical cascaded optocoupler package consists of a light-emitting unit, a light-transmitting insulating block, and a photoelectric unit, all encapsulated in a single layer of black adhesive. When the light-emitting unit emits light, the light passes through the light-transmitting insulating block and is then received by the photoelectric unit. This achieves the function of an optocoupler.
[0004] However, in a typical stacked-chip optocoupler package structure, the light emitted by the light-emitting unit may escape from the sidewall of the transparent insulating block and be absorbed by the black adhesive, resulting in some light not being received by the photoelectric unit. This leads to poor energy conversion between the light emitted by the light-emitting unit and the light received by the photoelectric unit. If the driving power supply of the light-emitting unit is increased to enable the photoelectric unit to receive sufficient light, it will result in a waste of electrical energy.
[0005] Therefore, improving the energy conversion efficiency between the light-emitting unit and the photoelectric unit in the stacked-chip optical coupler packaging structure is one of the urgent problems to be solved. Utility Model Content
[0006] This invention provides a stacked optical coupler packaging structure, which can improve the energy conversion rate between the light-emitting unit and the photoelectric unit.
[0007] This utility model provides a stacked-chip optocoupler packaging structure, including: a first lead; a second lead adjacent to the first lead; a photoelectric unit disposed on the first lead; a light-transmitting insulating block disposed on the photoelectric unit; a light-emitting unit disposed on the light-transmitting insulating block; and a reflective colloid covering the light-transmitting insulating block.
[0008] In some embodiments, the reflective colloid is substantially hemispherical.
[0009] In some embodiments, the reflective colloid comprises titanium dioxide.
[0010] In some embodiments, the reflective colloid is substantially white in color.
[0011] In some embodiments, the reflective colloid is reflective within the operating spectral range of the light-emitting unit.
[0012] In some embodiments, the reflectivity is greater than or equal to 50%.
[0013] In some embodiments, the stacked optical coupler packaging structure further includes: an encapsulating colloid covering a portion of the first lead, a portion of the second lead, an optoelectronic unit, a light-transmitting insulating block, a light-emitting unit, and a reflective colloid.
[0014] In some embodiments, the encapsulating colloid is substantially black in color.
[0015] In some embodiments, the encapsulating colloid is opaque relative to the operating spectral range of the light-emitting unit.
[0016] In some embodiments, the opacity is defined as a transmittance of less than or equal to 10%.
[0017] As described above, the stacked-chip optocoupler packaging structure of this invention converts the input electrical signal source into an optical signal and then back into an electrical signal while maintaining electrical isolation, thus possessing excellent electrical insulation and anti-interference capabilities. Adding this stacked-chip optocoupler packaging structure to the circuit can prevent downstream circuit components from being damaged by imperfect input electrical signal sources, lightning, electrostatic discharge, electromagnetic interference, and switching pulses. The first lead can support the optocoupler unit through a light-transmitting insulating block, therefore the optocoupler unit does not need to be mounted on other support structures.
[0018] Furthermore, the stacked-chip optical coupler packaging structure of this invention incorporates a reflective colloid, increasing the path for light transmission to the photoelectric unit. This improves the energy conversion rate between the light emitted by the light-emitting unit and the light received by the photoelectric unit, achieving a power-saving effect. The reflective colloid can simply cover the light-transmitting insulating block, and the reflective colloid can be substantially hemispherical to save on the material used in manufacturing the reflective colloid.
[0019] Furthermore, the stacked-chip optical coupler packaging structure of this invention can prevent external light from penetrating the packaging colloid and irradiating the photoelectric unit, thereby avoiding external light interference with the photoelectric unit and preventing the induction of erroneous signals to the photoelectric unit. Attached Figure Description
[0020] Details of one or more embodiments of the subject matter described herein are set forth in the following drawings and description. Other features, aspects, and advantages of the subject matter of this specification will become apparent from the description, drawings, and claims, wherein:
[0021] Figure 1 This is a side cross-sectional view of a stacked optocoupler packaging structure according to an embodiment of the present invention.
[0022] Figure 2This is a partially enlarged view of the stacked-chip optocoupler packaging structure according to an embodiment of the present invention. Detailed Implementation
[0023] The detailed description and technical content of this utility model are explained below with reference to the accompanying drawings. However, the accompanying drawings are provided for reference and illustration only and are not intended to limit this utility model.
[0024] As used herein, terms such as “first” and “second” describe various components, parts, regions, layers, and / or portions, which should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another. Unless the context clearly indicates otherwise, the use of terms such as “first” and “second” herein does not imply order or sequence.
[0025] Figure 1 This is a side cross-sectional view of the stacked-chip optocoupler packaging structure of this utility model. Figure 2 This is a partially enlarged view of the stacked-chip optocoupler package structure according to an embodiment of this utility model. Please refer to... Figure 1 and Figure 2 As shown, the stacked-chip optical coupler packaging structure 1 of this embodiment includes a first lead 21, a second lead 22, an optoelectronic unit 31, a light-transmitting insulating block 32, a light-emitting unit 33, and a reflective colloid 41.
[0026] The material of the first lead 21 can be conductive materials such as silver, copper, gold, or aluminum. The first lead 21 can support other components and enable the cascaded optocoupler package structure 1 to be electrically connected to an external circuit. The first lead 21 can, for example, have more than two pins.
[0027] The second lead 22 is adjacent to the first lead 21. The second lead 22 can be located on the same side or opposite side of the first lead 21. The material of the second lead 22 can be conductive materials such as silver, copper, gold, or aluminum. The second lead 22 enables the stacked optocoupler package structure 1 to be electrically connected to an external circuit. The second lead 22 can, for example, have more than two pins.
[0028] The photoelectric unit 31 is disposed on the first lead 21. The photoelectric unit 31 can directly contact the first lead 21, thus electrically connecting the photoelectric unit 31 to the first lead 21. Alternatively, the photoelectric unit 31 can be electrically connected to the first lead 21 via a wire without directly contacting it. The first lead 21 can support the photoelectric unit 31. The first lead 21 can also output electrical signals from the photoelectric unit 31.
[0029] In some embodiments, the photoelectric unit 31 includes a photonic integrated circuit, a photoresistor, a phototransistor, a photodiode, or a phototriac. A photonic integrated circuit is an integrated circuit that integrates photoelectric components onto a single chip. A photonic integrated circuit can utilize photons to perform signal processing and transmission functions. A photoresistor may include, for example, cadmium sulfide or lead sulfide. A photoresistor can change its resistance value according to light intensity. A phototransistor may include, for example, a bipolar junction transistor (BJT), a field-effect transistor (FET), or a metal-oxide-semiconductor field-effect transistor (MOSFET). A photodiode may include, for example, silicon or germanium. A photodiode can generate photocurrent under light illumination and provide a corresponding current signal according to light intensity. A phototriac, also known as a photothyristor, is a semiconductor component that combines the functionality of a triode AC semiconductor switch with the characteristics of a photosensitive component.
[0030] A light-transmitting insulating block 32 is disposed on the photoelectric unit 31. In some embodiments, the light-transmitting insulating block 32 can be sandwiched between the photoelectric unit 31 and the light-emitting unit 33, serving as a medium for light L conduction and electrically isolating the photoelectric unit 31 and the light-emitting unit 33. In other words, the current and voltage at the input end will not directly act on the output end, and the current and voltage at the output end will not directly act on the input end. The material of the light-transmitting insulating block 32 can be, for example, a light-transmitting and insulating material such as acrylic sheet, glass, polycarbonate, resin, or plastic, but it is not limiting.
[0031] The light-emitting unit 33 is disposed on the light-transmitting insulating block 32 and electrically connected to the second lead 22. The light-transmitting insulating block 32 can transmit the light L emitted by the light-emitting unit 33. When the second lead 22 is connected to an appropriate input electrical signal source, the input electrical signal source causes the light L emitted by the light-emitting unit 33 to change. The light-emitting unit 33 can be a light-emitting diode, a light bulb, or a fluorescent tube.
[0032] In some embodiments, the light-emitting unit 33 is a light-emitting diode, such as a red light-emitting diode, a yellow light-emitting diode, a green light-emitting diode, a blue light-emitting diode, a violet light-emitting diode, an infrared light-emitting diode, or an ultraviolet light-emitting diode, but this is not limiting. The light-emitting diode can be an inorganic light-emitting diode or an organic light-emitting diode (OLED), but this is not limiting.
[0033] Reflective colloid 41 covers the light-transmitting insulating block 32. The reflective colloid 41 can, for example, cover the photoelectric unit 31, the light-transmitting insulating block 32, and the light-emitting unit 33 through plastic encapsulation (or molding). In some embodiments, the reflective colloid 41 can also cover a portion of the first lead 21 and the second lead 22. The reflective colloid 41 can reflect light L escaping from the sidewall of the light-transmitting insulating block 32 and reflect the light L back to the photoelectric unit 31.
[0034] In some embodiments, the reflective colloid 41 is substantially hemispherical. The reflective colloid 41 may be a partial sphere, which can be larger or smaller than a hemisphere. The reflective colloid 41 may have one free-form surface and the other a flat surface. For example, the reflective colloid 41 can be made by dispensing adhesive, thus forming a free-form surface according to the viscosity characteristics and surface tension of the adhesive. The reflective colloid 41 contacts the photoelectric unit 31 at the hemispherical flat surface, and only covers the light-transmitting insulating block 32 and part of the light-emitting unit 33. In other embodiments, the reflective colloid 41 contacts the first guide pin 21 at the hemispherical flat surface, and covers the light-transmitting insulating block 32, the light-emitting unit 33, and the photoelectric unit 31.
[0035] In some embodiments, the reflective colloid 41 comprises titanium dioxide. When titanium dioxide is dispersed in the reflective colloid 41, the whiteness of the reflective colloid 41 can be increased to enhance the diffuse reflection effect.
[0036] In some embodiments, the reflective colloid 41 is substantially white. The reflective colloid 41 may be, for example, a white glue. The reflective colloid 41 may be, for example, a colloid with added titanium dioxide, calcium carbonate, talc, or zinc oxide, or a colloid with added white pigment, to give the reflective colloid 41 a white appearance to facilitate the reflection of light L.
[0037] In some embodiments, the reflective colloid 41 is reflective within the operating spectral range of the light-emitting unit 33. The photoelectric unit 31 can receive light L at a certain frequency. For example, the photoelectric unit 31 can receive both infrared and visible light. If the reflective colloid 41 is reflective in both the infrared and visible light bands, it can increase the energy conversion rate between the light emitted by the light-emitting unit 33 and the light received by the photoelectric unit 31. In other embodiments, if the light emitted by the light-emitting unit 33 is in the visible light band, and the light L that the photoelectric unit 31 can receive is also in the visible light band, then the reflective colloid 41 can be reflective in the visible light band to increase the energy conversion rate between the light emitted by the light-emitting unit 33 and the light received by the photoelectric unit 31.
[0038] In some embodiments, reflectivity is defined as a reflectance greater than or equal to 50%. Reflectance is a measure of the ratio of incident light energy reflected from an object's surface to incident light energy, expressed as the ratio of reflected light energy to incident light energy. Reflectance is related to the frequency of the incident light and the material of the object, and is typically between 0% and 100%. If the light L emitted by the light-emitting unit 33 is in the visible light band, and the light L that the photoelectric unit 31 can receive is also in the visible light band, then the reflectance of the reflective colloid 41 in the visible light band can be greater than or equal to 50%. The reflectance of the reflective colloid 41 can be, for example, 50%, 60%, 70%, 80%, 90%, or 100%, but this is not limiting.
[0039] In some embodiments, the reflective colloid 41 can protect the photoelectric unit 31, the light-transmitting insulating block 32, and the light-emitting unit 33 from damage by mechanical force, corrosive substances, oxygen, water vapor, or electricity.
[0040] In some embodiments, the stacked optocoupler package structure 1 further includes an encapsulating colloid 42 covering a portion of the first lead 21, a portion of the second lead 22, the optoelectronic unit 31, the light-transmitting insulating block 32, the light-emitting unit 33, and the reflective colloid 42. The encapsulating colloid 42 can be, for example, epoxy resin or hot melt adhesive. The encapsulating colloid 42 can protect the internal electronic components from damage by mechanical forces, corrosive substances, oxygen, moisture, or electricity. A portion of the first lead 21 and the second lead 22 are covered by the encapsulating colloid 42, and the other portion of the first lead 21 and the second lead 22 can serve as pins for connection to external circuitry.
[0041] In some embodiments, the encapsulating colloid 42 is substantially black. The encapsulating colloid 42 may be, for example, a black adhesive. The encapsulating colloid 42 may be a colloid containing carbon or iron oxide, or a colloid containing black pigment, giving the encapsulating colloid 42 a black appearance. This facilitates the shielding of external light L from the cascaded optocoupler encapsulation structure 1.
[0042] In some embodiments, the encapsulating colloid 42 is opaque relative to the operating spectral range of the light-emitting unit 33. The light-emitting unit 33 can receive light of a certain frequency L. For example, the photoelectric unit 31 can receive infrared and visible light. The encapsulating colloid 42 is opaque in the infrared and visible light bands to prevent infrared and visible light from outside the cascaded optocoupler encapsulation structure 1 from penetrating the encapsulating colloid 42 and irradiating the photoelectric unit 31.
[0043] In some embodiments, opacity is defined as a transmittance of less than or equal to 10%. Transmittance is a measure of the ratio of transmitted light energy to incident light energy when light passes through a material, expressed as the ratio of reflected light energy to incident light energy. Transmittance is related to the frequency of the incident light and the material of the object, and is typically between 0% and 100%. If the light emitted by the light-emitting unit 33 is in the visible light band, and the light L that the photoelectric unit 31 can receive is also in the visible light band, then the transmittance of the encapsulating colloid 42 in the visible light band can be less than or equal to 10%. The transmittance of the encapsulating colloid 42 can be, for example, 0%, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, or 10%, but this is not limiting.
[0044] Therefore, when the second pin 22 of the stacked optocoupler package structure 1 is connected to an input electrical signal source, the light-emitting unit 33 can emit light L. Light L can pass directly through the light-transmitting insulating block 32, or it can be reflected by the reflective colloid 41 and then pass through the light-transmitting insulating block 32. The photoelectric unit 31 can receive the light L and generate an electrical signal. In other words, the input electrical signal source causes the light L emitted by the light-emitting unit 33 to change. The change in light L causes the photoelectric unit 31 to generate electrical signals such as voltage or current signals, which are then output from the first pin 21, thereby achieving the function of the optocoupler.
[0045] In summary, the tandem optocoupler packaging structure of this invention converts the input electrical signal source into an optical signal and then back into an electrical signal while maintaining electrical isolation, thus possessing excellent electrical insulation and anti-interference capabilities. Incorporating this tandem optocoupler packaging structure into the circuit can prevent downstream circuit components from being damaged by imperfect input electrical signal sources, lightning, electrostatic discharge, electromagnetic interference, and switching pulses. The first lead can support the optocoupler unit through a light-transmitting insulating block, therefore the optocoupler unit does not need to be mounted on other support structures.
[0046] Furthermore, the stacked-chip optical coupler packaging structure of this invention incorporates a reflective colloid, increasing the path for light transmission to the photoelectric unit. This improves the energy conversion rate between the light emitted by the light-emitting unit and the light received by the photoelectric unit, achieving a power-saving effect. The reflective colloid can simply cover the light-transmitting insulating block, and the reflective colloid can be substantially hemispherical to save on the material used in manufacturing the reflective colloid.
[0047] Furthermore, the stacked-chip optical coupler packaging structure of this invention can prevent external light from penetrating the packaging colloid and irradiating the photoelectric unit, thereby avoiding external light interference with the photoelectric unit and preventing the induction of erroneous signals to the photoelectric unit.
[0048] Unless otherwise defined, terms such as "substantially" and "approximately" are used to describe and narrate small changes. When used in connection with an event or situation, these terms may include the exact moment the event or situation occurred, or an approximate point in time. For example, when used in connection with a numerical value, these terms may include a range of variation less than or equal to ±10% of that value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.
[0049] The foregoing outlines components of several embodiments to enable those skilled in the art to better understand the concepts of the embodiments of this invention. Those skilled in the art should understand that other processes and structures can be designed or modified based on the embodiments of this invention to achieve the same purpose and / or benefits as the embodiments described herein. Those skilled in the art should also understand that these equivalent structures do not depart from the spirit and scope of this invention, and various changes, substitutions, and other options can be made therein without departing from the spirit and scope of this invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.
[0050] [Symbol Explanation]
[0051] 1: Stacked-chip optocoupler packaging structure
[0052] 21: First Leading Foot
[0053] 22: Second Leading Pin
[0054] 31: Photoelectric unit
[0055] 32: Translucent Insulating Block
[0056] 33: Light-emitting unit
[0057] 41: Reflective colloid
[0058] 42: Encapsulating colloid
[0059] L: Light ray.
Claims
1. A stacked-chip optocoupler packaging structure, characterized in that, include: First leading foot; A second guide pin is disposed adjacent to the first guide pin; A photoelectric unit is disposed on the first guide pin; A light-transmitting insulating block is disposed on the photoelectric unit; A light-emitting unit is disposed on the light-transmitting insulating block; and A reflective colloid is used to coat the light-transmitting insulating block.
2. The stacked-chip optocoupler packaging structure according to claim 1, characterized in that, The reflective colloid is essentially hemispherical.
3. The stacked-chip optocoupler packaging structure according to claim 1, characterized in that, The reflective colloid includes titanium dioxide.
4. The stacked-chip optocoupler packaging structure according to claim 1, characterized in that, The reflective colloid is actually white in color.
5. The stacked-chip optocoupler packaging structure according to claim 1, characterized in that, The reflective colloid has reflectivity within an operating spectral range of the light-emitting unit.
6. The stacked-chip optocoupler packaging structure according to claim 5, characterized in that, The reflectivity is defined as a reflectance greater than or equal to 50%.
7. The stacked-chip optocoupler packaging structure according to claim 1, characterized in that, Also includes: An encapsulating colloid covers a portion of the first lead, a portion of the second lead, the photoelectric unit, the light-transmitting insulating block, the light-emitting unit, and the reflective colloid.
8. The stacked-chip optocoupler packaging structure according to claim 7, characterized in that, The encapsulating colloid is actually black in color.
9. The stacked-chip optocoupler packaging structure according to claim 7, characterized in that, The encapsulating colloid is opaque within a certain operating spectral range of the light-emitting unit.
10. The stacked-chip optocoupler packaging structure according to claim 9, characterized in that, The opacity is defined as a transmittance of less than or equal to 10%.