High-uniformity pixel type packaging module structure
By employing equidistantly arranged light-emitting components and staggered light-blocking walls in the pixel-based packaging module structure, the contradiction between halo effect and cost control in existing technologies has been resolved, achieving high uniformity and low-cost light emission effects, and improving the user experience of automotive lights and display products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- APT ELECTRONICS
- Filing Date
- 2024-12-31
- Publication Date
- 2026-05-19
AI Technical Summary
Existing pixelated headlight solutions present a contradiction between achieving a halo effect and cost control. When the pitch is 10mm, the space requirement is large and the cost is high. When the pitch is 1.25~2.0mm, the cost rises sharply. When the pitch is 2.5~6mm, the graininess is strong and the realistic effect is not ideal, making it difficult to meet the demand for high-quality visual effects.
A highly uniform pixel-type packaging module structure is designed, including a substrate, light-emitting components, electrical components, encapsulating adhesive layer, and light-blocking walls. By using equally spaced light-emitting components and equally spaced staggered light-blocking walls, light crosstalk is prevented, achieving uniform light emission and efficient transmission.
It improves the uniformity of light emission and the clarity of display effects, reduces system costs, saves space, simplifies the dependence on optical structural components, and improves production efficiency and product competitiveness.
Smart Images
Figure CN224265420U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of light-emitting semiconductor technology, specifically a highly uniform pixel-type packaging module structure. Background Technology
[0002] In the field of automotive lighting and display technology, pixelation design has become an important means to improve visual effects and user experience. However, existing pixelated automotive lighting solutions often present a contradiction between achieving a halo effect and cost control. Specifically, when the pixel pitch is greater than 10mm, although a good halo effect can be achieved through optical structural components, this solution requires more space and has a higher system cost, which is not conducive to the popularization and application of the product.
[0003] On the other hand, when the pixel pitch is reduced to 1.25~2.0mm, although it can present an excellent interactive screen display effect, the overall cost increases sharply due to the large number of LED particles. This is obviously not an ideal choice for car lights and display products that pursue cost-effectiveness.
[0004] Furthermore, for pixel pitch of 2.5~6mm, although the cost of a single LED is relatively low, when used directly in a display, the effect is not ideal due to the strong graininess, making it difficult to meet users' demand for high-quality visual effects. Utility Model Content
[0005] In order to overcome the problems existing in the prior art, the purpose of this utility model is to provide a pixel-type packaging module structure with high uniformity.
[0006] The technical solution adopted by this utility model to solve its technical problem is: a highly uniform pixel-type packaging module structure, comprising:
[0007] Substrate, light-emitting components, electrical components, encapsulating adhesive layer, light-blocking wall;
[0008] The light-emitting components are provided in multiple ways, and the multiple light-emitting components are equidistantly arranged on one side of the substrate, while the electrical components are arranged on the other side of the substrate.
[0009] The encapsulating adhesive layer is disposed on the side of the substrate on which the light-emitting components are disposed, and the encapsulating adhesive layer covers the plurality of light-emitting components;
[0010] The light-blocking wall is disposed above the encapsulating adhesive layer, and there are multiple sets of the light-blocking wall. The multiple sets of the light-blocking wall are arranged at equal intervals and are staggered from the multiple light-emitting components.
[0011] Main Working Principle: The substrate serves as the basic support structure for the entire packaging module, providing a mounting platform for components such as light-emitting components and electrical components. The substrate is typically made of insulating material to ensure electrical isolation between the electrical components and the light-emitting components, while also possessing good mechanical strength and thermal stability to withstand various stresses during the packaging process and temperature changes during long-term use. Multiple light-emitting components are equidistantly arranged on one side of the substrate, forming a uniform light-emitting array. The light-emitting components are the core components of the module; these can be light-emitting chips or pre-packaged LEDs, responsible for converting electrical energy into light energy. Each light-emitting component is connected to the electrical components through specific circuits to receive control signals and electrical energy. The luminous performance of the light-emitting components directly affects the overall luminous effect and brightness uniformity of the module. Electrical components are located on the other side of the substrate, providing electrical energy and control signals to the light-emitting components. These components may include drive circuits, power management modules, signal processors, etc., which work together to ensure that the light-emitting components emit light according to a predetermined pattern and time sequence, thereby achieving the desired display effect. An encapsulating adhesive layer is applied to the side of the substrate where the light-emitting components are located, covering the multiple light-emitting components. The primary function of the encapsulating adhesive layer is to protect the light-emitting components from damage caused by the external environment, such as moisture, dust, and mechanical impact. Simultaneously, the encapsulating adhesive layer also possesses a certain degree of light transmittance to ensure that the light emitted by the light-emitting components can be smoothly transmitted to the outside of the module, and it also has a diffusion effect. The encapsulating adhesive contains diffusing particles, which can help to even out the light and reduce graininess. Light-blocking walls are positioned above the encapsulating adhesive layer, with multiple sets of light-blocking walls arranged equidistantly and staggered from the multiple light-emitting components. The main function of the light-blocking walls is to prevent light crosstalk between the light-emitting components, that is, to prevent the light emitted by one light-emitting component from interfering with the light emission effect of adjacent light-emitting components. By precisely designing and manufacturing the height, width, and position of the light-blocking walls, it can be ensured that the light from each light-emitting component can be independently transmitted to the outside of the module, thereby achieving a highly uniform light emission effect.
[0012] In summary, the highly uniform pixel-type packaging module structure of this invention achieves uniform light emission and efficient light transmission through the rational design of the layout and structure of components such as the substrate, light-emitting component, electrical component, encapsulating adhesive layer, and light-blocking wall. Simultaneously, this structure also possesses excellent protective performance and stability, making it suitable for various applications requiring highly uniform light emission effects.
[0013] Preferably, the light-blocking wall is filled with a black filler.
[0014] Alternatively, the light-blocking wall is filled with black filler and white filler, with the white filler filling the inner side of the light-blocking wall and the black filler being placed on the outer side of the light-blocking wall, and the white filler occupying 50%-90% of the space of the light-blocking wall.
[0015] Preferably, the white filler has a reflectivity of 80% or higher.
[0016] Preferably, the spacing between the plurality of light-emitting components is 2.5mm-6mm.
[0017] Preferably, the thickness of the encapsulating adhesive layer is 0.5mm-10mm.
[0018] Preferably, the width of the light-blocking wall is 0.4-2.0 mm, and the distance between the light-blocking wall and the substrate is less than 0.5 mm.
[0019] A method for fabricating a highly uniform pixel-based packaging module structure, comprising the following steps:
[0020] S1. Electrical components and light-emitting components are soldered onto the substrate using SMT (Surface Mount Technology).
[0021] S2. Set up a dam around the substrate;
[0022] S3. Pour the encapsulating adhesive layer into the middle of the dam, covering the light-emitting components until the encapsulating adhesive layer solidifies.
[0023] S4. Multiple slots are cut above the encapsulating adhesive layer using a half-cut process;
[0024] S5. Fill the groove with black filler, or black filler and white filler, to form a light-blocking wall.
[0025] S6. Cut off the dam to obtain a highly uniform pixel-type encapsulation module structure.
[0026] Preferably, in S3, when only black filler is filled into the slot, the black filler needs to completely fill the slot until it is flush with the top of the encapsulating adhesive layer.
[0027] As a preferred embodiment, in S3, when both black and white fillers need to be filled into the groove at the same time, the white filler should be poured into the groove first until it fills 50%-90% of the groove space, and then the black filler should be poured on top of the white filler until it is flush with the top of the encapsulating adhesive layer.
[0028] Compared with the prior art, the beneficial effects of this utility model are:
[0029] This invention effectively prevents light crosstalk between light-emitting components by using equidistantly arranged light-emitting components and multiple sets of equidistantly arranged, staggered light-blocking walls. This ensures that the light from each component can be transmitted independently and uniformly to the outside of the module. For pixel lamps with a pixel pitch of 2.5~6mm, this not only improves the uniformity of light emission across the entire module but also enhances the clarity and detail of the display. Compared to traditional solutions that require complex optical structures to achieve a halo effect, this invention achieves a similar effect with a simple light-blocking wall design, thereby reducing reliance on optical structures and associated costs. Furthermore, the equidistant arrangement of the light-emitting components eliminates the need for additional space to accommodate complex optical structures, further saving space costs.
[0030] In summary, the highly uniform pixel-type packaging module structure of this utility model has significant beneficial effects in improving light emission uniformity, reducing system costs, increasing production efficiency, enhancing product competitiveness, and expanding application areas. Attached Figure Description
[0031] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0032] Figure 1 This is a schematic diagram of the highly uniform pixel-based packaging module structure. Figure 1 ;
[0033] Figure 2 This is a schematic diagram of the highly uniform pixel-based packaging module structure. Figure 2 ;
[0034] Figure 3 This is a flowchart illustrating the fabrication process of this highly uniform pixel-based packaging module structure.
[0035] 1. Substrate; 2. Light-emitting component; 3. Electrical component; 4. Encapsulating adhesive layer; 5. Light-blocking wall; 50. Black filler; 51. White filler; 7. Dam. Detailed Implementation
[0036] To better understand the above-mentioned objectives, features, and advantages of this utility model, it will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this utility model; the described embodiments are merely some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
[0038] Example 1
[0039] This embodiment discloses a highly uniform pixel-based packaging module structure, such as... Figures 1-2 As shown, the module includes a substrate 1, light-emitting components 2, electrical components 3, an encapsulating adhesive layer 4, and a light-blocking wall 5. The substrate 1 serves as the basic support structure for the entire encapsulation module, providing a mounting platform for components such as the light-emitting components 2 and electrical components 3. The substrate 1 is typically made of insulating material to ensure electrical isolation between the electrical components 3 and the light-emitting components 2, while also possessing good mechanical strength and thermal stability to withstand various stresses during the encapsulation process and temperature changes during long-term use. Multiple light-emitting components 2 are equidistantly arranged on one side of the substrate 1, forming a uniform light-emitting array. The light-emitting components 2 are the core components of the module, responsible for converting electrical energy into light energy. Each light-emitting component 2 is connected to the electrical components 3 through a specific circuit to receive control signals and electrical energy. The light-emitting performance of the light-emitting components 2 directly affects the overall luminous effect and brightness uniformity of the module. The electrical components 3 are located on the other side of the substrate 1, providing electrical energy and control signals to the light-emitting components 2. These components may include drive circuits, power management modules, signal processors, etc., which work together to ensure that the light-emitting components 2 emit light according to a predetermined pattern and time sequence, thereby achieving the desired display effect. An encapsulating layer 4 is disposed on one side of the substrate 1 where the light-emitting components 2 are located, and covers the multiple light-emitting components 2. The main function of the encapsulating layer 4 is to protect the light-emitting components 2 from damage caused by the external environment, such as moisture, dust, and mechanical impact. At the same time, the encapsulating layer 4 also has a certain degree of light transmittance to ensure that the light emitted by the light-emitting components 2 can be smoothly transmitted to the outside of the module. Some encapsulating layers 4 contain diffusing particles, which scatter the light emitted by the light-emitting components 2, expanding the surface area and achieving a uniform surface light emission effect.
[0040] Light-blocking walls 5 are positioned above the encapsulating adhesive layer 4, with multiple sets of light-blocking walls 5 arranged equidistantly and staggered from the multiple light-emitting components 2. The main function of the light-blocking walls 5 is to prevent light crosstalk between the light-emitting components 2, that is, to prevent the light emitted by one light-emitting component 2 from interfering with the light-emitting effect of adjacent light-emitting components 2. By precisely designing and manufacturing the height, width, and position of the light-blocking walls 5, it can be ensured that the light from each light-emitting component 2 can be independently transmitted to the outside of the module, thereby achieving a highly uniform light-emitting effect.
[0041] In summary, the highly uniform pixel-type packaging module structure of this invention achieves uniform light emission and efficient transmission of the light-emitting component 2 through the rational design of the layout and structure of components such as the substrate 1, the light-emitting component 2, the electrical component 3, the encapsulating adhesive layer 4, and the light-blocking wall 5. Simultaneously, this structure also possesses good protective performance and stability, making it suitable for various applications requiring highly uniform light emission effects.
[0042] In some alternative embodiments, the light-blocking wall 5 is filled with black filler 50, or simultaneously filled with black filler 50 and white filler 51.
[0043] like Figure 1 As shown, when filled with black filler 50, the black filler 50 can be black silicone. The black filler 50 has high light absorption and can absorb excess light inside and outside the light-blocking wall 5 to prevent light crosstalk.
[0044] like Figure 2 As shown, when filled with black filler 50 and white filler 51, the white filler 51 can be white silicone. The white filler 51 is filled inside the light-blocking wall 5, and the black filler 50 is placed on the outside of the light-blocking wall 5. The white filler 51 occupies 50%-90% of the space of the light-blocking wall. The white filler 51 has high reflectivity and can reflect the light emitted by the light-emitting component 2, improving the utilization rate of light and the uniformity of the light emission effect. When the white filler 51 occupies a certain space in the light-blocking wall 5, it can ensure the reflection effect while avoiding light interference caused by excessive reflection.
[0045] By filling with black and white fillers 51, the uniformity of light emission and light utilization are further improved. At the same time, this design also increases the functionality and flexibility of the light-blocking wall 5, allowing the proportion and position of the fillers to be adjusted according to specific needs.
[0046] In some optional embodiments, the white filler 51 has a reflectivity of over 80%, ensuring a high reflectivity effect. The high-reflectivity white filler 51 can more effectively reflect the light emitted by the light-emitting component 2, reducing light loss and improving luminous efficiency and uniformity. The high-reflectivity white filler 51 significantly improves luminous efficiency and light utilization, enabling the module to emit brighter and more uniform light with the same power consumption.
[0047] In some optional embodiments, the spacing between the multiple light-emitting components 2 is 2.5mm-6mm. This range ensures the clarity of the light emission effect while avoiding excessive graininess that would result in poor visual quality. Within this spacing range, the light-emitting components 2 can emit clear and uniform light, while avoiding light interference between adjacent light-emitting components 2. A reasonable spacing between the light-emitting components 2 allows the module to maintain high light emission uniformity while reducing system cost and manufacturing difficulty.
[0048] In some optional embodiments, the thickness of the encapsulating adhesive layer 4 in this embodiment is 0.5mm-10mm, and this range can be adjusted according to specific needs. The encapsulating adhesive layer 4 serves to protect and fix the light-emitting component 2 while allowing light to pass through. Within this thickness range, the encapsulating adhesive layer 4 can provide good protection without affecting light transmission. A reasonable thickness of the encapsulating adhesive layer 4 allows the module to maintain high luminous efficiency while having good durability and stability.
[0049] In some optional embodiments, the width of the light-blocking wall 5 in this embodiment is 0.4-2.0 mm, and the distance between the light-blocking wall 5 and the substrate 1 is less than 0.5 mm. This range ensures the light-blocking effect while avoiding an excessively large module size due to an overly wide light-blocking wall 5. Within this size range, the light-blocking wall 5 can effectively block light interference between adjacent light-emitting components 2 while maintaining the compactness of the module structure. The reasonable size of the light-blocking wall 5 allows the module to maintain high light emission uniformity while having a small size and light weight, making it easy to carry and install.
[0050] Example 2
[0051] This embodiment provides a method for fabricating a highly uniform pixel-based packaging module structure, which is applicable to fabricating the highly uniform pixel-based packaging module structure in Embodiment 1. For example... Figure 3 As shown, the specific production steps are as follows:
[0052] S1. First, using surface mount technology (SMT), the electrical components 3 (such as the drive circuit, power management module, etc.) and the light-emitting components 2 are precisely soldered onto the substrate 1. This step ensures a stable and reliable electrical connection between the electrical components 3 and the light-emitting components 2, while maintaining the compactness of the module structure.
[0053] S2. Next, a perimeter barrier 7 is formed around the substrate 1. The purpose of the perimeter barrier 7 is to prevent the encapsulating adhesive layer 4 from overflowing in subsequent steps, ensuring the smooth progress of the encapsulation process. The material and size of the perimeter barrier 7 should be selected and designed according to specific requirements.
[0054] S3. Next, pour an appropriate amount of encapsulating adhesive layer 4 into the center of the dam 7. The encapsulating adhesive layer 4 should cover the light-emitting component 2 and fill it to the appropriate height. Before the encapsulating adhesive layer 4 solidifies, ensure that its surface is smooth and free of air bubbles. This step provides the necessary protection and fixation for the light-emitting component 2 while allowing light to pass through.
[0055] S4. After the encapsulating adhesive layer 4 has completely solidified, multiple slots are cut into the top of the encapsulating adhesive layer 4 using a half-cutting process. The location and number of slots should be determined according to the layout of the light-emitting component 2 and the design requirements of the light-blocking wall 5. This step prepares for the subsequent formation of the light-blocking wall 5.
[0056] S5. Fill the groove with black filler 50, or simultaneously with black filler 50 and white filler 51. When using both fillers, first fill the inside of the light-blocking wall 5 with white filler 51, then place the black filler 50 on the outside of the light-blocking wall 5. The proportion and position of the fillers should be adjusted according to specific needs to ensure the functionality and aesthetics of the light-blocking wall 5.
[0057] S6. Finally, the dam 7 is removed to obtain a complete, highly uniform pixel-based encapsulation module structure. After removing the dam 7, the module should be cleaned and inspected as necessary to ensure that its quality and performance meet design requirements.
[0058] This method achieves the fabrication of a highly uniform pixel-based encapsulation module structure through precise SMT soldering, dam setting (7), encapsulating adhesive layer pouring (4), half-cutting and slotting, filler filling, and dam removal (7). During the fabrication process, each step collaborates to ensure the compactness, stability, and uniform light emission of the module structure.
[0059] This method employs precise SMT and half-cut processes to ensure the accurate position and size of the electrical component 3, the light-emitting component 2, and the light-blocking wall 5, thereby improving the precision and consistency of module manufacturing. Through a rational layout of the light-emitting component 2 and the design of the light-blocking wall 5, along with precise filler filling, this method achieves a pixel-based encapsulation module structure with high luminous uniformity. This contributes to improved display effects and user experience. This method simplifies the manufacturing process, reduces reliance on complex optical components, and thus lowers system costs. Simultaneously, the efficient manufacturing process also helps improve production efficiency and reduce costs. This method allows for adjustments to parameters such as the layout of the light-emitting component 2, the design of the light-blocking wall 5, and the proportion and position of the filler, according to specific needs, thereby producing pixel-based encapsulation module structures that meet the requirements of different application scenarios.
[0060] In some alternative embodiments, in S3, when the slot is filled only with black filler 50, the black filler 50 needs to completely fill the slot until it is flush with the top of the encapsulating adhesive layer 4.
[0061] In some optional embodiments, in S3, when the slot needs to be filled with both black filler 50 and white filler 51 at the same time, the white filler 51 needs to be poured into the slot first until the white filler 51 fills 50%-90% of the slot space, and then the black filler 50 is poured on top of the white filler 51 until it is flush with the top of the encapsulating adhesive layer 4.
[0062] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.
Claims
1. A high-uniformity pixel package module structure, characterized in that, include: Substrate, light-emitting components, electrical components, encapsulating adhesive layer, light-blocking wall; The light-emitting components are provided in multiple ways, and the multiple light-emitting components are equidistantly arranged on one side of the substrate, while the electrical components are arranged on the other side of the substrate. The encapsulating adhesive layer is disposed on the side of the substrate on which the light-emitting components are disposed, and the encapsulating adhesive layer covers the plurality of light-emitting components; The light-blocking wall is disposed above the encapsulating adhesive layer, and multiple sets of the light-blocking wall are disposed, with the multiple sets of the light-blocking wall arranged at equal intervals and staggered from the multiple light-emitting components; The light-blocking wall is filled with black filler and white filler. The white filler is filled on the inner side of the light-blocking wall, and the black filler is placed on the outer side of the light-blocking wall. The white filler occupies 50%-90% of the space of the light-blocking wall. The thickness of the encapsulating adhesive layer is 0.5mm-10mm.
2. The high-uniformity pixel-type packaging module structure according to claim 1, characterized in that, The white filler has a reflectivity of over 80%.
3. The high-uniformity pixel-type packaging module structure according to claim 1, characterized in that, The spacing between the plurality of light-emitting components is 2.5mm-6mm.
4. The high-uniformity pixel-type packaging module structure according to claim 1, characterized in that, The width of the light-blocking wall is 0.4-2.0 mm, and the distance between the light-blocking wall and the substrate is less than 0.5 mm.