Circuit board stamping mechanism

Abstract

The utility model discloses a circuit board stamping mechanism which comprises a conveying frame, two sets of conveying shafts are symmetrically arranged on the conveying frame through bearings, a conveying motor is arranged in cooperation with the conveying shafts, two conveying wheels are symmetrically arranged on each conveying shaft, and a conveying belt is arranged between the two conveying wheels on the same side. A circuit board body is arranged on the two conveying belts in a conveying mode, a first hydraulic cylinder is vertically arranged in the conveying frame, a collecting box is arranged at the top end of the first hydraulic cylinder, a lower die is arranged at the top end of the collecting box, and a discharging hole communicated with the collecting box is formed in the lower die. According to the circuit board punching machine, manual intervention in the circuit board punching process can be reduced, and the punching efficiency of the circuit board is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board stamping technology, and more specifically, to a circuit board stamping mechanism. Background Technology

[0002] A printed circuit board (PCB) is a core component of electronic devices, used to connect and support electronic components. It consists of an insulating substrate and conductive copper layers, with intricate circuits formed through etching. Modern PCBs are mostly multi-layered designs with high integration, and are widely used in communications, computers, medical devices, and other fields.

[0003] Circuit boards require punching during manufacturing, but existing circuit board punching techniques have the following problems:

[0004] 1. Manual loading and unloading is inefficient and lacks stability.

[0005] In existing technologies, circuit board stamping typically relies on manual loading and unloading operations, which is not only inefficient but also prone to positioning errors due to human error, affecting stamping accuracy. Manual operation makes it difficult to ensure that the circuit board is placed in the same position every time, potentially leading to punching misalignment or increased scrap rates. Furthermore, frequent manual intervention increases labor intensity and production costs, especially in mass production, where traditional methods struggle to meet the demands of high-paced automated production. Insufficient fixing during the stamping process can also cause circuit board displacement, further reducing processing quality.

[0006] 2. Difficulty in cleaning up stamping waste affects continuous operation.

[0007] Traditional circuit board stamping mechanisms lack efficient waste collection systems. The debris generated during punching needs to be cleaned manually and regularly, which not only interrupts the production process but may also cause equipment blockage or pollute the working environment. Manual waste cleaning has problems such as untimely cleaning and omissions, and the accumulated waste may damage the mold or affect the stamping accuracy. There are few integrated automatic waste conveying and collection designs in existing technologies, which restricts the continuous operation capability of the equipment. Utility Model Content

[0008] (a) Technical problems to be solved

[0009] To address the problems existing in the prior art, this utility model provides a circuit board stamping mechanism to solve the technical problems mentioned in the background art, such as low efficiency, poor stability, and poor waste collection and cleaning methods in the prior art circuit board stamping mechanism due to manual feeding and unloading.

[0010] (II) Technical Solution

[0011] To achieve the above objectives, this utility model provides the following technical solution:

[0012] A circuit board stamping mechanism includes a conveyor frame with two sets of conveyor shafts symmetrically arranged on the conveyor frame via bearings, and a conveyor motor is provided in conjunction with the conveyor shafts. Each conveyor shaft has two conveyor wheels symmetrically arranged, and a conveyor belt is arranged between the two conveyor wheels on the same side. A circuit board body is conveyed on the two conveyor belts. A first hydraulic cylinder is vertically arranged inside the conveyor frame, and a collection box is provided at the top of the first hydraulic cylinder. A lower die is provided at the top of the collection box, and a material dropping hole is provided on the lower die communicating with the collection box. An upper die is vertically and movable above the conveyor belts, and a lifting drive structure is provided in conjunction with the upper die. A stamping clamping structure is provided on the conveyor frame in conjunction with the circuit board body.

[0013] The present invention is further configured such that the lifting drive structure includes a fixed frame, a second hydraulic cylinder is provided on the fixed frame, the upper mold is provided at the output end of the second hydraulic cylinder, and the movement of the upper mold is controlled by the second hydraulic cylinder, so that the upper mold descends and cooperates with the lower mold to realize the punching and punching operation of the circuit board body.

[0014] The present invention is further configured such that the stamping clamping structure includes a side clamping structure and a top pressing structure, and the circuit board body can be stably fixed during stamping and punching by the cooperation of the top pressing structure and the side clamping structure.

[0015] The present invention is further configured such that the side clamping structure includes a first electric push rod, and the output end of the first electric push rod is provided with a clamping block. The clamping block is symmetrically located on the side of the circuit board body. When the first electric push rod is activated, the clamping block is moved by controlling the first electric push rod, so that the side of the circuit board body can be clamped and fixed, thereby realizing the side clamping and fixing of the circuit board body during stamping and punching.

[0016] The present invention is further configured such that the top pressing structure includes a second electric push rod, which is mounted on a fixed frame. A pressing column is provided at the bottom end of the second electric push rod, and a pressing block is provided at the bottom end of the pressing column. The pressing block is located at the top of the circuit board body. When the second electric push rod is activated, the pressing column can be controlled to descend, thereby pressing the pressing block against the top of the circuit board. This can further improve the stability of the circuit board during stamping and punching operations.

[0017] The present invention is further configured such that a discharge pipe is provided on the side of the collection box, and a guide slope is provided inside the collection box in conjunction with the discharge pipe. The stamping waste entering the collection box can be discharged out in time through the discharge pipe under the action of the guide slope. The inclination angle of the guide slope is preferably 45° to 60°. The inclination angle of the guide slope and the diameter of the discharge pipe are matched with the punching size to avoid waste accumulation and machine shutdown.

[0018] The present invention is further configured such that a conveyor positioner is provided on the side of the conveyor frame. The conveyor positioner can be a photoelectric actuator or an ultrasonic positioning sensor, which can realize accurate detection of whether the circuit board body is conveyed in place during the stamping process.

[0019] The present invention is further configured such that a belt conveyor is provided at the discharge end of the discharge pipe, and a collection box is provided at the tail end of the belt conveyor. Impurities from circuit board stamping discharged through the discharge pipe can fall onto the belt conveyor and be transported to the collection box for collection. This facilitates the collection and cleaning of impurities generated during the circuit board stamping process.

[0020] (III) Beneficial Effects

[0021] Compared with the prior art, the present invention provides a circuit board stamping mechanism, which has the following advantages:

[0022] 1. This utility model has two sets of conveyor belts on the conveyor frame, which transport the circuit board to be punched and punched. When the circuit board is transported to the upper and lower mold positions, the transport stops. The conveyor positioner can be used to detect whether the transport is in place, so that the circuit board body is located above the lower mold. The first hydraulic cylinder controls the collection box to drive the lower mold to move upward. The lower mold provides stable support for the circuit board body during punching and punching. In this way, automatic feeding of the circuit board during punching and punching can be achieved.

[0023] 2. Next, activate the first and second electric push rods. The first electric push rod controls the movement of the clamping block to clamp and fix the side of the circuit board body, thus achieving side clamping and fixing of the circuit board body during punching and punching. The second electric push rod controls the clamping column to drive the clamping block to descend, thereby pressing the top of the circuit board with the clamping block. This further improves the stability of the circuit board during punching and punching operations.

[0024] 3. After the circuit board body is clamped and fixed by clamping blocks and pressing blocks, the upper mold is lowered by the second hydraulic cylinder to perform punching and punching operations on the circuit board body. During this process, the waste generated by punching will enter the collection box through the drop hole, and under the action of the guide slope, it will be discharged through the discharge pipe and fall onto the belt conveyor. The belt conveyor will then transport it to the collection box for collection in a timely manner. This can effectively avoid the accumulation of waste generated during the circuit board punching and punching process, improve the cleanliness of the operation. The drop hole is directly connected to the collection box. The punching waste is guided by the guide slope to the discharge pipe and automatically transferred to the collection box by the belt conveyor. The waste is cleaned without manual intervention throughout the process, which greatly improves efficiency. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of a circuit board stamping mechanism according to the present invention. Figure 1 ;

[0026] Figure 2 This is a schematic diagram of the overall structure of a circuit board stamping mechanism according to the present invention. Figure 2 ;

[0027] Figure 3 This is a schematic cross-sectional view of the overall structure of the present invention. Figure 1 ;

[0028] Figure 4 This is a schematic diagram of the mating structure between the circuit board body and the clamping block in this utility model;

[0029] Figure 5 This is a schematic cross-sectional view of the overall structure of the present invention. Figure 2 .

[0030] In the diagram: 1. Conveyor frame; 2. Conveyor shaft; 3. Conveyor motor; 4. Conveyor wheel; 5. Conveyor belt; 6. Circuit board body; 7. First hydraulic cylinder; 8. Collection box; 9. Lower mold; 10. Drop hole; 11. Upper mold; 12. Fixing frame; 13. Second hydraulic cylinder; 14. First electric push rod; 15. Clamping block; 16. Second electric push rod; 17. Pressing column; 18. Pressing block; 19. Discharge pipe; 20. Guide slope; 21. Conveyor positioner; 22. Belt conveyor; 23. Collection box. Detailed Implementation

[0031] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0033] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0034] Please see Figures 1-5A circuit board stamping mechanism includes a conveyor frame 1. Two sets of conveyor shafts 2 are symmetrically arranged on the conveyor frame 1 via bearings, and a conveyor motor 3 is arranged in cooperation with the conveyor shafts 2. Two conveyor wheels 4 are symmetrically arranged on each conveyor shaft 2, and a conveyor belt 5 is arranged between the two conveyor wheels 4 on the same side. Here, the cooperation between the conveyor wheels 4 and the conveyor belt 5 can be the cooperation of a toothed conveyor belt and a conveyor gear, or the tooth meshing of a synchronous pulley and a synchronous belt can be used to improve the conveying stability.

[0035] This utility model features a circuit board body 6 conveyed on two conveyor belts 5. A first hydraulic cylinder 7 is vertically installed inside the conveyor frame 1. A collection box 8 is installed at the top of the first hydraulic cylinder 7. A lower mold 9 is installed at the top of the collection box 8. A material drop hole 10 is provided on the lower mold 9, which is connected to the collection box 8. An upper mold 11 is vertically mounted above the conveyor belts 5 and is equipped with a lifting drive structure. A stamping clamping structure is provided on the conveyor frame 1 in conjunction with the circuit board body 6. Due to the need for stamping and punching, the upper mold 11 has punches and other structures. This is existing known technology and will not be described in detail in this utility model.

[0036] Please see Figures 1-5 As one embodiment of the lifting drive structure: the lifting drive structure includes a fixed frame 12, on which a second hydraulic cylinder 13 is provided. The upper mold 11 is located at the output end of the second hydraulic cylinder 13. The movement of the upper mold 11 is controlled by the second hydraulic cylinder 13, so that the upper mold 11 descends and cooperates with the lower mold 9 to realize the punching and punching operation of the circuit board body 6.

[0037] Please see Figures 1-5 As one implementation of the stamping clamping structure: the stamping clamping structure includes a side clamping structure and a top pressing structure. The circuit board body 6 can be stably fixed during stamping and punching by the cooperation of the top pressing structure and the side clamping structure.

[0038] Please see Figures 1-5 As one implementation of the side clamping structure: the side clamping structure includes a first electric push rod 14, and a clamping block 15 is provided at the output end of the first electric push rod 14. The clamping block 15 is symmetrically located on the side of the circuit board body 6. When the first electric push rod 14 is activated, the clamping block 15 is moved by controlling the first electric push rod 14, which can clamp and fix the side of the circuit board body 6, thereby realizing the side clamping and fixing of the circuit board body 6 during punching and punching.

[0039] Please see Figures 1-5As one implementation of the top clamping structure: the top clamping structure includes a second electric push rod 16, which is mounted on the fixed frame 12. A clamping column 17 is provided at the bottom end of the second electric push rod 16, and a clamping block 18 is provided at the bottom end of the clamping column 17. The clamping block 18 is located at the top of the circuit board body 6. When the second electric push rod 16 is activated, the clamping column 17 can be controlled to drive the clamping block 18 to descend, thereby clamping the top of the circuit board with the clamping block 18. This can further improve the stability of the circuit board during the punching and punching operation.

[0040] Please see Figures 1-5 As one implementation of the collection box 8: a discharge pipe 19 is provided on the side of the collection box 8, and a guide slope 20 is provided inside the collection box 8 in conjunction with the discharge pipe 19. The stamping waste entering the collection box 8 can be discharged out in time through the discharge pipe 19 under the action of the guide slope 20. The inclination angle of the guide slope 20 is preferably 45° to 60°. The inclination angle of the guide slope 20 and the diameter of the discharge pipe 19 are matched with the punching size to avoid waste accumulation and machine shutdown.

[0041] Please see Figures 1-5 As one implementation of the conveyor frame 1: a conveyor positioner 21 is provided on the side of the conveyor frame 1. The conveyor positioner 21 can be a photoelectric actuator or an ultrasonic positioning sensor, which can realize the accurate detection of whether the circuit board body 6 is in place during the stamping process.

[0042] Please see Figures 1-5 As one implementation of the discharge pipe 19: a belt conveyor 22 is provided at the discharge end of the discharge pipe 19, and a collection box 23 is provided at the tail end of the belt conveyor 22. The circuit board stamping impurities discharged through the discharge pipe 19 can fall onto the belt conveyor 22 and be transported to the collection box 23 for collection. This facilitates the collection and cleaning of impurities generated during the circuit board stamping process.

[0043] In summary:

[0044] This utility model uses two sets of conveyor belts 5 on the conveyor frame 1 to convey the circuit board to be punched. When the circuit board is conveyed to the position of the upper mold 11 and the lower mold 9, the conveying stops. The conveyor positioner 21 can be used to detect whether the conveying is in place, so that the circuit board body 6 is located above the lower mold 9. The first hydraulic cylinder 7 controls the collection box 8 to drive the lower mold 9 to move upward. The lower mold 9 provides stable support for the circuit board body 6 during punching. In this way, the circuit board can be automatically fed during punching and the height of the circuit board body 6 is matched with the position of the clamping block 15.

[0045] Then, the first electric push rod 14 and the second electric push rod 16 are activated. The first electric push rod 14 controls the movement of the clamping block 15, which can clamp and fix the side of the circuit board body 6. This can achieve side clamping and fixing of the circuit board body 6 during punching and punching. The second electric push rod 16 can control the clamping column 17 to drive the clamping block 18 to descend, so that the clamping block 18 presses the top of the circuit board. This can further improve the stability of the circuit board during punching and punching operations. The first electric push rod 14 and the second electric push rod 16 can be miniature electric push rods, which are mature products on the market. Just select the appropriate model. This utility model will not elaborate further.

[0046] After the circuit board body 6 is clamped and fixed by the clamping block 15 and the pressing block 18, the upper mold 11 is lowered by the second hydraulic cylinder 13 to perform punching and punching operations on the circuit board body 6. During this process, the waste generated by punching will enter the collection box 8 through the drop hole 10, and under the action of the guide slope 20, it will be discharged through the discharge pipe 19 and fall onto the belt conveyor 22. The belt conveyor 22 will then promptly transport it to the collection box 23 for collection. This can effectively avoid the accumulation of waste generated during the circuit board punching and punching process and improve the cleanliness of the operation. The drop hole 10 is directly connected to the collection box 8. The punching waste is guided by the guide slope 20 to the discharge pipe 19 and automatically transferred to the collection box 23 by the belt conveyor 22, realizing the waste cleaning without manual intervention throughout the process and greatly improving efficiency.

[0047] In all the solutions mentioned above, the connection between two components can be selected according to the actual situation, such as welding, bolt and nut connection, bolt or screw connection, or other known connection methods, which will not be elaborated here. For all the fixed connections mentioned above, welding is preferred. Although the embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents.

[0048] In all the solutions mentioned above, those involving the operation of electrical components, unless otherwise specified, are controlled by a controller. Since the devices matched with the controllers are common devices, their control principles and circuit connections are existing, well-known, and mature technologies, and their specific circuit structures will not be described in detail here.

[0049] Of all the solutions mentioned above, those involving motors can be combined with reducers if necessary. The connection structure and working principle between the motor and the reducer are existing known technologies, and this utility model will not elaborate on them.

[0050] If any of the technical solutions mentioned above involve a synchronous belt drive structure, and there is no specific structure, they are all existing technologies involving the combination of synchronous belt and synchronous pulley. The connection between the synchronous belt and the shaft structure is a known technology and will not be elaborated upon in this utility model.

[0051] Of all the solutions mentioned above, those involving the connection between solar panels and batteries can be equipped with essential accessories such as inverters, battery charging controllers, cables, fuses, and brackets. Their control principles and circuit connections are all existing, well-known, and mature technologies, and their specific circuit structures will not be elaborated here.

Claims

1. A circuit board stamping mechanism, comprising a conveyor frame (1), characterized in that: The conveyor frame (1) is symmetrically provided with two sets of conveyor shafts (2) via bearings, and a conveyor motor (3) is provided in conjunction with the conveyor shafts (2). Each conveyor shaft (2) is symmetrically provided with two conveyor wheels (4). A conveyor belt (5) is provided between the two conveyor wheels (4) on the same side. The circuit board body (6) is conveyed on the two conveyor belts (5). A first hydraulic cylinder (7) is vertically provided inside the conveyor frame (1). A collection box (8) is provided at the top of the first hydraulic cylinder (7). A lower mold (9) is provided at the top of the collection box (8). A material drop hole (10) is provided on the lower mold (9) in connection with the collection box (8). An upper mold (11) is provided above the conveyor belt (5) and can be raised and lowered. A lifting drive structure is provided in conjunction with the upper mold (11). A stamping clamping structure is provided on the conveyor frame (1) in conjunction with the circuit board body (6).

2. The circuit board stamping mechanism according to claim 1, characterized in that: The lifting drive structure includes a fixed frame (12), on which a second hydraulic cylinder (13) is provided, and the upper mold (11) is located at the output end of the second hydraulic cylinder (13).

3. The circuit board stamping mechanism according to claim 2, characterized in that: The stamping clamping structure includes a side clamping structure and a top clamping structure.

4. The circuit board stamping mechanism according to claim 3, characterized in that: The side clamping structure includes a first electric push rod (14), and the output end of the first electric push rod (14) is provided with a clamping block (15), which is symmetrically located on the side of the circuit board body (6).

5. A circuit board stamping mechanism according to claim 4, characterized in that: The top clamping structure includes a second electric push rod (16), which is mounted on a fixed frame (12). A clamping column (17) is provided at the bottom end of the second electric push rod (16), and a clamping block (18) is provided at the bottom end of the clamping column (17). The clamping block (18) is located at the top of the circuit board body (6).

6. A circuit board stamping mechanism according to any one of claims 1-5, characterized in that: The collection box (8) is provided with a discharge pipe (19) on its side, and the collection box (8) is provided with a guide slope (20) inside in conjunction with the discharge pipe (19).

7. A circuit board stamping mechanism according to claim 1, characterized in that: A conveyor positioner (21) is provided on the side of the conveyor frame (1).

8. A circuit board stamping mechanism according to claim 6, characterized in that: The discharge end of the discharge pipe (19) is provided with a belt conveyor (22), and the tail end of the belt conveyor (22) is provided with a collection box (23).

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