A semiconductor production and processing electroplating device

Abstract

The utility model discloses a kind of production and processing electroplating devices of semiconductor, belong to the field of semiconductor production and processing, including placing assembly, the placing assembly includes placing rack, the placing rack is located in the inside of electroplating box, the inner wall of the placing rack is equidistantly fixedly connected with multiple placing plates, multiple placing grooves are equidistantly opened in the top of the placing plate, multiple first through grooves and second through grooves are equidistantly opened in the inside of the placing plate, the first through groove and second through groove are arranged in ninety degrees arrangement setting.This production and processing electroplating device of semiconductor, by setting placing assembly, the electroplating device when using, by placing groove, placing plate is separated into multiple electroplating chambers, multiple semiconductor can be simultaneously electroplated, improve the efficiency of semiconductor plating, and by elastic through plate, semiconductor is positioned, can avoid the surface of semiconductor to be shielded, guarantee the comprehensiveness of semiconductor plating, and then guarantee the quality of semiconductor plating.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing and processing technology, specifically to an electroplating device for semiconductor manufacturing and processing. Background Technology

[0002] Electroplating equipment is one of the key pieces of equipment in the semiconductor manufacturing process. It is used to perform electroplating on the surface of semiconductor chips. Electroplating is a surface treatment technology that involves immersing the semiconductor chip in an electrolyte and depositing a metal layer on the chip surface under the action of an electric current to change the characteristics of the chip or increase its connectivity.

[0003] An investigation revealed that a Chinese utility model patent discloses an electroplating device for semiconductor production and processing (publication number: CN221421263U), which includes an electroplating device housing. Inside the electroplating device housing, there is a washing tank and an electroplating tank. Three fans are fixedly connected inside the electroplating device housing. A dustproof component is fixedly connected to one side of the electroplating device housing. A moving component is provided on one side of the electroplating device housing. A clamping component is fixedly connected to one side of the moving component.

[0004] While the aforementioned patent utilizes a clamping assembly and a washing tank, with a third motor in the clamping assembly driving the semiconductor to rotate and the washing tank cleaning the semiconductor to prevent dust and impurities on the semiconductor surface from affecting the electroplating effect and improve work efficiency, and also includes a dustproof net on one side of the fan to prevent the fan from blowing airborne impurities onto the surface of the electroplated semiconductor, thus improving product quality, the above solution requires the use of a clamping assembly to fix the semiconductor and immerse it in the electroplating solution during electroplating. In this case, because the clamping assembly blocks part of the semiconductor surface, the blocked area cannot be electroplated, resulting in uneven electroplating layer thickness. This may lead to unstable or unreliable performance of electronic devices. Uneven electroplating thickness and connection problems may cause product quality control issues, increase the difficulty of subsequent processes and testing, and also increase the product defect rate.

[0005] Therefore, this utility model provides an electroplating apparatus for semiconductor production and processing to solve the above-mentioned problems. Utility Model Content

[0006] This invention provides an electroplating apparatus for semiconductor production and processing, which aims to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor production and processing electroplating apparatus, comprising an electroplating tank, wherein a placement assembly is provided inside the electroplating tank, the placement assembly is connected to a rotating assembly via multiple connecting rods, and a drying assembly is provided on the top of the electroplating tank;

[0008] The placement assembly includes a placement rack located inside the electroplating tank. Multiple placement plates are fixedly connected to the inner wall of the placement rack at equal intervals. Multiple placement slots are equidistantly formed on the top of each placement plate. Multiple first and second flow channels are equidistantly formed inside each placement plate. The first and second flow channels are arranged at a 90-degree angle and penetrate through the placement slots. Flow plates are provided around the inner walls and bottom of the placement slots, and multiple through holes are formed inside each flow plate.

[0009] As a preferred technical solution of this application, the rotating assembly includes a support plate located inside the electroplating tank. A motor is fixedly connected to the top of the support plate, and a turntable is fixedly connected to the output end of the motor. The top of the turntable is connected to the bottom ends of a plurality of connecting rods.

[0010] As a preferred technical solution of this application, the top of the support plate is provided with a guide groove, the bottom of the turntable is fixedly connected with a plurality of stabilizing rods, the bottom end of the stabilizing rods is fixedly connected with a guide wheel, the guide wheel is rotatably connected to the guide groove, and the shape of the guide wheel is adapted to the shape of the guide groove.

[0011] As a preferred technical solution of this application, the drying assembly includes a top plate, the top plate having multiple mounting slots inside, the top plate being detachably installed with multiple fans through the multiple mounting slots, and support rods being fixedly connected to the four bottom corners of the top plate, the bottom ends of the support rods being fixedly connected to the top of the electroplating box.

[0012] As a preferred technical solution of this application, a heating box is fixedly connected to the bottom of the top plate, a through groove is opened on the top of the heating box, a heater is fixedly connected to one side of the heating box, an air outlet plate is fixedly connected to the inner wall of the heating box, and multiple air outlet holes are equidistantly opened inside the air outlet plate.

[0013] As a preferred technical solution of this application, the electroplating box is fixedly connected to the four corners of the bottom of the electroplating box, the top of the placement plate is detachably installed with a sealing pressure plate, and the bottom of the electroplating box is fixedly connected with an electric telescopic rod, the output end of which passes through the electroplating box and connects to the bottom of the support plate.

[0014] The beneficial effects of this utility model are as follows:

[0015] 1. The semiconductor electroplating apparatus, by setting up a placement component, divides the placement plate into multiple electroplating chambers through placement tanks during use, thereby enabling simultaneous electroplating of multiple semiconductors, improving the efficiency of semiconductor electroplating. Furthermore, separating the semiconductors through multiple interconnected electroplating chambers can prevent collision damage during the electroplating process. Additionally, the flexible flow plate limits the semiconductors, preventing surface obstruction and ensuring the comprehensiveness and quality of semiconductor electroplating.

[0016] 2. The semiconductor production and processing electroplating apparatus, by setting a rotating component, enables the plating plate to rotate slowly during use, so that the electroplating solution flowing inside the plating plate can evenly contact the semiconductor, thereby comprehensively electroplating the semiconductor and avoiding incomplete semiconductor electroplating that would affect the production quality of subsequent products. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a semiconductor manufacturing electroplating apparatus.

[0018] Figure 2 A frontal cross-sectional view of the electroplating tank in an electroplating apparatus for semiconductor manufacturing.

[0019] Figure 3 This is a schematic diagram of the distribution of rotating components in an electroplating apparatus for semiconductor manufacturing.

[0020] Figure 4 This is a schematic diagram of the overall structure of a semiconductor manufacturing electroplating apparatus containing components.

[0021] Figure 5 This is a three-dimensional structural diagram of a plate placed in an electroplating apparatus for semiconductor manufacturing.

[0022] Figure 6 This is a schematic diagram of the overall structure of the drying component in an electroplating apparatus for semiconductor manufacturing.

[0023] In the picture:

[0024] 1. Electroplating box; 2. Placement assembly; 201. Placement rack; 202. Placement plate; 203. Placement trough; 204. First flow trough; 205. Second flow trough; 206. Flow plate; 3. Rotating assembly; 301. Support plate; 302. Motor; 303. Turntable; 304. Guide trough; 305. Stabilizing rod; 306. Guide wheel; 4. Drying assembly; 401. Top plate; 402. Fan; 403. Support rod; 404. Heating box; 405. Heater; 406. Air outlet plate; 5. Support foot; 6. Sealing pressure plate; 7. Electric telescopic rod; 8. Connecting rod. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] like Figure 1-6 As shown, this utility model provides a semiconductor production and processing electroplating device, including an electroplating tank 1, an internal placement component 2, a placement component 2 connected to a rotating component 3 via multiple connecting rods 8, and a drying component 4 on the top of the electroplating tank 1.

[0027] The placement assembly 2 includes a placement rack 201 located inside the electroplating tank 1. Multiple placement plates 202 are fixedly connected to the inner wall of the placement rack 201 at equal intervals. Multiple placement slots 203 are equidistantly opened on the top of the placement plates 202. Multiple first flow slots 204 and second flow slots 205 are equidistantly opened inside the placement plates 202. The first flow slots 204 and second flow slots 205 are arranged at a 90-degree angle and are connected to the placement slots 203 through each other. Flow plates 206 are provided around the inner wall and bottom of the placement slots 203. Multiple through holes are opened inside the flow plates 206.

[0028] The rotating assembly 3 includes a support plate 301 located inside the electroplating tank 1. A motor 302 is fixedly connected to the top of the support plate 301, and a turntable 303 is fixedly connected to the output end of the motor 302. The top of the turntable 303 is connected to the bottom ends of multiple connecting rods 8. A guide groove 304 is provided on the top of the support plate 301, and multiple stabilizing rods 305 are fixedly connected to the bottom of the turntable 303. A guide wheel 306 is fixedly connected to the bottom end of the stabilizing rod 305, and the guide wheel 306 is rotatably connected to the guide groove 304. The shape of the guide wheel 306 is the same as the shape of the guide groove 304. In accordance with this, by setting the rotating component 3, the electroplating device drives the placement plate 202 to rotate slowly during use. This allows the electroplating solution flowing inside the placement plate 202 to come into uniform contact with the semiconductor, thereby comprehensively electroplating the semiconductor and avoiding incomplete electroplating that could affect the production quality of subsequent products. Furthermore, the cooperation between the guide groove 304 and the guide wheel 306 provides auxiliary support during the rotation of the turntable 303, ensuring the stability of the turntable 303's rotation and, consequently, the stability of the placement component 2's rotation.

[0029] The drying assembly includes a top plate 401, which has multiple mounting slots. The top plate 401 is detachably installed with multiple fans 402 through these slots. Support rods 403 are fixedly connected to the four corners of the bottom of the top plate. The bottom ends of the support rods 403 are fixedly connected to the top of the electroplating box 1. A heating box 404 is fixedly connected to the bottom of the top plate 401. A through slot is provided on the top of the heating box 404. A heater 405 is fixedly connected to one side of the heating box 404. An air outlet plate 406 is fixedly connected to the inner wall of the heating box 404. Multiple air outlet holes are equidistantly provided inside the air outlet plate 406. By setting up the drying mechanism, the electroplating device can dry the electroplating solution on the semiconductor surface during use, thereby accelerating the solidification rate of the electroplating solution. The heating box 404 heats the airflow, and the airflow is dispersed through the mesh of the air outlet plate 406, allowing the airflow to dry the semiconductor from multiple angles and directions, ensuring the drying effect of the semiconductor and avoiding the occurrence of drying dead zones.

[0030] Support feet 5 are fixedly connected to the four corners of the bottom of the electroplating box 1. A sealing pressure plate 6 is detachably installed on the top of the placement plate 202. An electric telescopic rod 7 is fixedly connected to the bottom of the electroplating box 1. The output end of the electric telescopic rod 7 passes through the electroplating box 1 and connects to the bottom of the support plate 301. By setting the sealing pressure plate 6, the placement groove 203 can be sealed, thereby preventing the semiconductor from detaching from the placement groove 203 during rotation. The electric telescopic rod 7 can automatically raise and lower the rotating component 3 and the placement component 2, thereby facilitating the removal of the electroplated semiconductor from the electroplating box 1 and reducing the amount of manual material handling.

[0031] Working principle:

[0032] In use, the semiconductor is placed into the placement slot 203 of the placement plate 202, and then the top of the placement plate 202 is sealed by the sealing plate 6. Then, the electric telescopic rod 7 is activated, which drives the rotating component 3 to move downward. The downward movement of the rotating component 3 drives the connecting rod 8 to move downward, thereby moving the placement component 2 downward, thus moving the placement plate 202 into the electroplating tank 1. Then, the electroplating solution flows into the placement plate 202 through the first flow channel 204 and the second flow channel 205, and the placement plate 202 is divided into multiple electroplating chambers by the flow plate 206 and the placement slot 203. Then, the electric motor is activated, and the electric motor drives the turntable 303 to rotate. The turntable 303 is connected to the connecting rod 8. The rotating placement component 2 rotates, causing the placement plate 202 to rotate slowly. This allows the electroplating solution flowing inside the placement plate 202 to fully contact the semiconductor in the placement tank 203 under the action of rotation, thus performing electroplating on the semiconductor. After the treatment is completed, the electric telescopic rod 7 is activated, which drives the rotating component 3 and the placement component 2 to move upward, thereby removing the placement plate 202 from the electroplating tank 1. Then, the fan 402 and the heater 405 are activated, so that the airflow generated by the fan 402 is heated through the heating box 404 and flows into the placement plate 202 and the semiconductor through the air outlet of the air outlet plate 406, thus quickly drying the electroplating solution on the semiconductor surface.

[0033] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A semiconductor manufacturing electroplating apparatus, comprising an electroplating tank (1), characterized in that: The electroplating box (1) is equipped with a placement component (2), which is connected to the rotating component (3) via multiple connecting rods (8). The top of the electroplating box (1) is equipped with a drying component (4). The placement assembly (2) includes a placement rack (201), which is located inside the electroplating tank (1). Multiple placement plates (202) are fixedly connected to the inner wall of the placement rack (201) at equal intervals. Multiple placement slots (203) are provided at equal intervals on the top of the placement plate (202). Multiple first flow slots (204) and second flow slots (205) are provided at equal intervals inside the placement plate (202). The first flow slots (204) and second flow slots (205) are arranged at a 90-degree angle. The first flow slots (204) and second flow slots (205) are connected to the placement slots (203) through each other. Flow plates (206) are provided around the inner wall and bottom of the placement slots (203). Multiple through holes are provided inside the flow plates (206).

2. The semiconductor production and processing electroplating apparatus according to claim 1, characterized in that: The rotating assembly (3) includes a support plate (301) located inside the electroplating box (1). A motor (302) is fixedly connected to the top of the support plate (301). A turntable (303) is fixedly connected to the output end of the motor (302). The top of the turntable (303) is connected to the bottom end of a plurality of connecting rods (8).

3. The semiconductor production and processing electroplating apparatus according to claim 2, characterized in that: The top of the support plate (301) is provided with a guide groove (304), and the bottom of the turntable (303) is fixedly connected with a plurality of stabilizing rods (305). The bottom end of the stabilizing rod (305) is fixedly connected with a guide wheel (306). The guide wheel (306) is rotatably connected to the guide groove (304), and the shape of the guide wheel (306) is adapted to the shape of the guide groove (304).

4. The semiconductor production and processing electroplating apparatus according to claim 1, characterized in that: The drying assembly includes a top plate (401), which has multiple mounting slots inside. The top plate (401) is detachably installed with multiple fans (402) through the multiple mounting slots. Support rods (403) are fixedly connected to the four bottom corners of the top plate. The bottom end of the support rods (403) is fixedly connected to the top of the electroplating box (1).

5. The semiconductor production and processing electroplating apparatus according to claim 4, characterized in that: A heating box (404) is fixedly connected to the bottom of the top plate (401). A through groove is opened on the top of the heating box (404). A heater (405) is fixedly connected to one side of the heating box (404). An air outlet plate (406) is fixedly connected to the inner wall of the heating box (404). Multiple air outlet holes are equidistantly opened inside the air outlet plate (406).

6. The semiconductor production and processing electroplating apparatus according to claim 2, characterized in that: The electroplating box (1) is fixedly connected to four corners of the bottom with support feet (5), the top of the placement plate (202) is detachably installed with a sealing pressure plate (6), the bottom of the electroplating box (1) is fixedly connected with an electric telescopic rod (7), and the output end of the electric telescopic rod (7) passes through the electroplating box (1) and is connected to the bottom of the support plate (301).

Images