Silicon wafer drying device

Abstract

The utility model provides a silicon wafer drying device, and relates to the technical field of silicon wafer drying. The silicon wafer drying device can comprise at least one drying groove body, at least one heating assembly and an air inlet assembly, the silicon wafer drying device utilizes the air inlet assembly to filter and convey gas, the heating assembly heats the filtered gas, the heated gas enters the drying groove body, and the drying groove body is used for drying the silicon wafer. And drying the silicon wafer in the drying tank body. The heating assembly is arranged outside the drying groove body, the temperature in the drying groove body can be effectively controlled, the heating assembly is arranged outside the drying groove body, the heating assembly does not need to be arranged in the drying groove body, air in the drying groove body is smooth and efficient in circulation, hot air is even, and the drying effect can be improved. The air inlet assembly of the silicon wafer drying device is arranged above the heating assembly, so that the space above the heating assembly can be fully utilized, and the occupied area of the whole machine is further saved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer drying technology, and in particular to a silicon wafer drying device. Background Technology

[0002] A silicon wafer drying device is used to remove moisture or other solvents from the surface of silicon wafers. It typically heats the wafers using methods such as heat conduction, convection, or radiation, causing the moisture to evaporate and be discharged. Currently, the mainstream methods for drying silicon wafers in texturing and cleaning equipment include an internal heating and circulation drying method. This method involves heating elements and a circulating fan inside the tank to circulate hot air for drying. However, this method requires high temperature resistance from the tank itself due to the heating elements being inside, and the built-in heat source makes installation and maintenance inconvenient. Furthermore, the temperature drops significantly each time a new basket is placed in and the tank lid is opened, leading to poor cleanliness after long-term operation.

[0003] Currently, there is another mainstream external PTC heater and air blower, which delivers externally heated air to the drying tank through pipes. The hot air is then blown onto the flower baskets through the grid or perforated plate inside the tank to achieve the drying effect. In this solution, the filtration device and heating device are both located outside the drying tank, and the filtration device, heating device and drying tank are arranged in sequence in the horizontal direction, resulting in a large area occupied by the entire device. Utility Model Content

[0004] The purpose of this invention is to provide a silicon wafer drying device that solves the technical problem of large footprint of existing silicon wafer drying devices.

[0005] According to the first aspect of the present invention, the present invention provides a silicon wafer drying apparatus, comprising:

[0006] At least one drying tank for holding silicon wafers and drying the silicon wafers using hot gas;

[0007] At least one heating element, each of the heating elements being disposed on the side of a corresponding drying tank; the heating element is in communication with the drying tank to allow gas to be introduced into the drying tank after the heating element heats the gas; and

[0008] An air inlet assembly is positioned above the heating assembly to filter the gas before introducing it into the corresponding heating assembly for heating.

[0009] Optionally, the air intake assembly includes:

[0010] The first filter element filters the gas;

[0011] At least one air inlet pipe, one end of each air inlet pipe being connected to the first filter element, and the other end of each air inlet pipe being connected to the corresponding heating component, so that the gas filtered by the first filter element flows into the corresponding heating component through the air inlet pipe.

[0012] Optionally, the heating assembly includes:

[0013] A heating element includes a heating medium and a gas flow pipe located between the heating medium. One end of the gas flow pipe is connected to the air inlet pipe, and the other end is connected to the drying tank so that the gas after heat exchange in the gas flow pipe flows into the drying tank.

[0014] A high-pressure induced draft fan includes an air inlet and an air outlet. The air inlet is connected to the air intake pipe, and the air outlet is connected to the gas flow pipe, so as to introduce the gas from the air intake pipe into the gas flow pipe and increase the gas flow velocity in the gas flow pipe.

[0015] Optionally, the gas flow conduit includes:

[0016] The first pipe has one end connected to the air inlet pipe and the air outlet of the high-pressure induced draft fan.

[0017] The gas distributor includes an air inlet and multiple air outlets. The air inlet is connected to the first pipe so that gas flowing in from the first pipe flows into the gas distributor through the air inlet and then flows out through the multiple air outlets.

[0018] A plurality of second pipes, one end of each second pipe being connected to a corresponding air outlet, the plurality of second pipes being located at the heating medium so that the gas passing through the second pipes exchanges heat with the heating medium, and the other end of the plurality of second pipes extending into the drying tank.

[0019] Optionally, the heating assembly further includes at least one second filter element, each second filter element being located between the second pipe of the corresponding heating assembly and the drying tank, such that the gas flowing through the second pipe passes through the second filter element before entering the drying tank.

[0020] Optionally, at least one air distribution pipe is provided in the drying tank body, located at the bottom of the drying tank body, and one end of each air distribution pipe is connected to the second filter element so that the gas filtered by the second filter element enters the air distribution pipe.

[0021] Each of the air distribution pipes has multiple air outlets on its pipe wall, and the gas passing through the air distribution pipes flows into the drying tank through the air outlets.

[0022] Optionally, there are two air distribution pipes, which are arranged on both sides of the bottom of the drying tank.

[0023] Optionally, a circulating fan is provided at the bottom of each of the drying tanks, and the circulating fan blows the gas blown out by the air distribution pipe to circulate within the drying tank.

[0024] Optionally, at least one carrier is provided in each of the drying tanks, and at least one basket carrying silicon wafers is placed in each carrier; each carrier has multiple ventilation holes on its side to facilitate airflow.

[0025] Optionally, each of the drying tanks is provided with a cover assembly that can be opened or closed in a controlled manner.

[0026] Optionally, it also includes a unit frame that surrounds the drying tank and the heating assembly.

[0027] Optionally, an exhaust assembly is also provided at the unit frame to continuously extract gas from the unit frame.

[0028] Optionally, it also includes an air supply component disposed at the drying tank body to supply air to the drying tank body when a negative pressure is formed in the drying tank body.

[0029] The silicon wafer drying device of this solution may include at least one drying tank, at least one heating element, and an air inlet element. In this embodiment, the air inlet element filters and transports the gas, while the heating element heats the filtered gas. The heated gas then enters the drying tank to dry the silicon wafers inside. The heating element is located outside the drying tank, effectively controlling the temperature inside. Furthermore, since the heating element is external, there is no need to place it inside the drying tank, resulting in smooth and efficient gas flow and uniform hot air distribution, thus improving the drying effect. In addition, the air inlet element is positioned above the heating element, fully utilizing the space above the heating element and saving overall machine footprint.

[0030] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0031] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0032] Figure 1 This is a schematic perspective view of a silicon wafer drying apparatus according to a specific embodiment of the present invention;

[0033] Figure 2 This is a front view of a silicon wafer drying apparatus according to a specific embodiment of the present invention;

[0034] Figure 3 This is a partial schematic structural diagram of a drying tank according to a specific embodiment of the present invention;

[0035] Figure 4 This is a left view of a silicon wafer drying apparatus according to a specific embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram of the gas flow principle of the air inlet assembly and the heating assembly according to a specific embodiment of the present invention;

[0037] Figure 6 This is a partial schematic structural diagram of the heating assembly and drying tank at one angle according to a specific embodiment of the present invention;

[0038] Figure 7 This is a partial schematic structural diagram of the heating assembly and drying tank from another angle according to a specific embodiment of the present invention;

[0039] Figure 8 This is a schematic diagram of the gas flow principle of the air intake assembly, heating assembly and drying tank according to a specific embodiment of the present invention;

[0040] Figure 9 This is a cross-sectional schematic diagram of a drying tank according to a specific embodiment of the present invention;

[0041] Figure 10 This is a cross-sectional schematic diagram of a drying tank according to a specific embodiment of the present invention;

[0042] Figure 11 This is a schematic diagram of gas flow inside a drying tank according to a specific embodiment of the present invention;

[0043] Figure 12 This is a schematic cross-sectional view of a silicon wafer drying apparatus according to a specific embodiment of the present invention;

[0044] Figure 13 This is a schematic diagram of gas flow in a silicon wafer drying apparatus according to a specific embodiment of the present invention.

[0045] Explanation of reference numerals in the attached figures:

[0046] Silicon wafer drying device-100, drying tank-200; carrier-210; vent-211; air distribution duct-220; air outlet-221; circulating fan-230; cover plate assembly-240;

[0047] Heating component - 300; heating element - 310; heating medium - 311; gas flow pipe - 312; first pipe - 3121; gas distribution component - 3122; second pipe - 3123; air inlet - 3124; air outlet - 3125;

[0048] High-pressure induced draft fan - 320; Second filter element - 330;

[0049] Air intake assembly - 400; First filter element - 410; Air intake pipe - 420;

[0050] Unit frame - 500; exhaust assembly - 510; air supply component - 600. Detailed Implementation

[0051] In the description of this embodiment, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0052] As a specific embodiment of this utility model, such as Figure 1 and Figure 2 As shown, this embodiment discloses a silicon wafer drying apparatus 100, which may include at least one drying tank 200, at least one heating element 300, and an air inlet element 400. The at least one drying tank 200 is used to contain silicon wafers and dry them using hot gas. Each heating element 300 is disposed on the side of its corresponding drying tank 200. The heating element 300 is connected to the drying tank 200 so that gas heated by the heating element 300 is introduced into the drying tank 200. The air inlet element 400 is disposed above the heating element 300 to filter the gas before introducing it into the corresponding heating element 300 for heating.

[0053] Specifically, the silicon wafer drying apparatus 100 of this embodiment may include at least one drying tank 200, at least one heating component 300, and an air inlet component 400. The silicon wafer drying apparatus 100 of this embodiment uses the air inlet component 400 to filter and transport gas, while the heating component 300 heats the filtered gas. The heated gas enters the drying tank 200 to dry the silicon wafers inside. In this embodiment, the heating component 300 is located outside the drying tank 200, which can effectively control the temperature inside the drying tank 200. Furthermore, since the heating component 300 is located outside the drying tank 200, there is no need to arrange the heating component 300 inside the drying tank 200, resulting in smooth and efficient gas flow and uniform hot air distribution within the drying tank 200, thus improving the drying effect.

[0054] In addition, the air inlet assembly 400 of the silicon wafer drying apparatus 100 in this embodiment is located above the heating assembly 300, which can make full use of the space above the heating assembly 300 and thus save the area occupied by the whole machine.

[0055] As a specific embodiment, the silicon wafer drying device 100 of this embodiment can integrate multiple drying tanks 200 and multiple heating components 300. The air inlet component 400 filters and supplies air to each heating component 300 and then heats it using the heating component 300. The heated air is sent into the corresponding drying tank 200 to dry the silicon wafers in the drying tank 200.

[0056] In this embodiment, each drying tank 200 can be equipped with multiple carriers 210 (such as...). Figure 3 As shown in the diagram, each carrier 210 can contain multiple baskets carrying silicon wafers. When heated gas enters the drying tank 200, the hot gas circulates within the drying tank 200, thereby drying the silicon wafers in the baskets.

[0057] As a specific embodiment of this utility model, such as Figure 1 and Figure 2 As shown, the air intake assembly 400 of this embodiment may include a first filter 410 and at least one air intake pipe 420, wherein the first filter 410 filters the gas. One end of each air intake pipe 420 is connected to the first filter 410, and the other end of each air intake pipe 420 is connected to the corresponding heating assembly 300, so that the gas filtered by the first filter 410 flows into the corresponding heating assembly 300 through the air intake pipe 420.

[0058] Specifically, in this embodiment, the first filter element 410 is a filter screen or other filtration device that can filter the gas. The first filter element 410 can be placed in a clean air area. After the first filter element 410 filters the air, it is then delivered to the heating component 300 through the air inlet pipe 420 to ensure the cleanliness of the gas.

[0059] Specifically, in this embodiment, the number of air inlet pipes 420 matches the number of drying tanks 200 and heating components 300. Specifically, this embodiment includes multiple air inlet pipes 420, one end of which is connected to a first filter element 410, so that the gas entering the air inlet pipe 420 is filtered by the first filter element 410 before entering the air inlet pipe 420. The multiple air inlet pipes 420 can be arranged regularly at the first filter element 410, with the other end extending to different heating components 300, so that different air inlet pipes 420 introduce gas to different heating components 300.

[0060] As a specific embodiment of this utility model, such as Figures 4-5 As shown, the heating assembly 300 in this embodiment may include a heating element 310 and a high-pressure induced draft fan 320. The heating element 310 may include a heating medium 311 and a gas flow pipe 312 located between the heating medium 311. One end of the gas flow pipe 312 is connected to an air inlet pipe 420, and the other end is connected to a drying tank 200 so that the gas after heat exchange within the gas flow pipe 312 flows into the drying tank 200. The high-pressure induced draft fan 320 may include an air inlet and an air outlet. The air inlet is connected to the air inlet pipe 420, and the air outlet is connected to the gas flow pipe 312 to introduce gas from the air inlet pipe 420 into the gas flow pipe 312 and increase the gas flow rate.

[0061] Specifically, in this embodiment, the gas flow pipe 312 is placed inside the heating medium 311, and the gas is then propelled through the gas flow pipe 312 by the high-pressure blower 320. This allows for heat exchange at the heating medium 311, heating the gas flowing through the gas flow pipe 312 and converting the cold gas into hot gas. The gas then flows further into the drying tank 200 to dry the silicon wafers inside the drying tank 200.

[0062] Specifically, in this embodiment, the heating medium 311 can be an electric heating wire or other heat-generating components such as a PTC thermistor element. The gas flow pipe 312, on the other hand, needs to have good thermal conductivity to ensure efficient heat exchange.

[0063] By changing the power of the heating element 310, the temperature of the gas flowing into the heating element 310 can be changed, thereby controlling the temperature inside the drying tank 200.

[0064] More specifically, such as Figures 5-7 As shown, the gas flow pipe 312 in this embodiment may include a first pipe 3121, a gas distributor 3122, and a plurality of second pipes 3123. Specifically, one end of the first pipe 3121 is connected to the inlet pipe 420 and to the outlet of the high-pressure induced draft fan 320. The gas after passing through the high-pressure induced draft fan 320 directly enters the first pipe 3121. The gas distributor 3122 may include an inlet 3124 and a plurality of outlets 3125. The inlet 3124 is connected to the first pipe 3121, so that the gas flowing in from the first pipe 3121 flows into the gas distributor 3122 through the inlet 3124 and then flows out through the plurality of outlets 3125. One end of each second pipe 3123 is connected to the corresponding air outlet 3125. Multiple second pipes 3123 are located at the heating medium 311 so that the gas passing through the second pipe 3123 exchanges heat with the heating medium 311. The other end of the multiple second pipes 3123 extends into the drying tank 200.

[0065] More specifically, in this embodiment, the air inlet pipe 420 extends downward from above the heating assembly 300, and connects with the high-pressure induced draft fan 320 at the heating assembly 300. The first pipe 3121 extends upward from the bottom of the high-pressure induced draft fan 320, and connects with the air outlet of the high-pressure induced draft fan 320 at its bottom. The high-pressure induced draft fan 320 continuously ventilates into the first pipe 3121, causing the gas inside the first pipe 3121 to continuously flow towards the gas distributor 3122. In this embodiment, the gas distributor 3122 is located on the side of the first pipe 3121 and above the heating medium 311. The air inlet 3124 is located above the gas distributor 3122, and the air outlet 3125 is located below the gas distributor 3122. The gas in the first pipe 3121 enters the gas distributor 3122 from above and then flows into the second pipe 3123 from the gas outlet 3125 below the gas distributor 3122. The gas in the second pipe 3123 exchanges heat with the heating medium 311, thereby causing the gas temperature to rise.

[0066] In this embodiment, the air inlet pipe 420 is extended to the bottom of the heating assembly 300 to accommodate the position of the high-pressure induced draft fan 320. Generally, the high-pressure induced draft fan 320 is located at the bottom to facilitate the fan blowing air into the pipe. The air distribution component 3122 is positioned above the heating assembly 310 to allow the gas to be heated by the heating assembly 310 and then directly enter the drying tank 200, thereby minimizing heat loss.

[0067] Furthermore, in this embodiment, the first pipe 3121 is divided into multiple parts by the gas distribution component 3122, and then multiple second pipes 3123 exchange heat with the heating medium 311, which can improve the efficiency of heat exchange.

[0068] Specifically, in this embodiment, the gas distributor 3122 separates the gas from a first pipe 3121 into four second pipes 3123, which then exchange heat with the heating element, thereby improving the heating efficiency.

[0069] As a specific embodiment of this utility model, such as Figures 6-8 As shown, the heating component 300 of this embodiment may further include at least one second filter element 330. Each second filter element 330 is located between the second pipe 3123 of the corresponding heating component 300 and the drying tank 200, so that the gas flowing in the second pipe 3123 passes through the second filter element 330 and then enters the drying tank 200.

[0070] By passing the heated air through the second filter 330 before it is introduced into the drying tank 200, the cleanliness of the air entering the drying tank 200 can be further improved, thus avoiding contamination of the silicon wafers inside the drying tank 200.

[0071] Specifically, in this embodiment, a first filter element 410 is provided before the heating component 300, and a second filter element 330 is provided after the heating component 300. The dual filtration ensures that the drying tank 200 has a high degree of cleanliness.

[0072] As a specific embodiment of this utility model, such as Figures 6-9 As shown, in this embodiment, the drying tank 200 is provided with at least one air distribution pipe 220 located at the bottom of the drying tank 200. One end of each air distribution pipe 220 is connected to the second filter element 330, so that the gas filtered by the second filter element 330 enters the air distribution pipe 220. The pipe wall of the air distribution pipe 220 is provided with multiple air outlets 3125, and the gas passing through the air distribution pipe 220 flows into the drying tank 200 through the air outlets 3125.

[0073] Specifically, in this embodiment, after the gas passes through the second filter element 330, it is uniformly introduced into the drying tank 200 through the air distribution pipe 220. Therefore, at least one air distribution pipe 220 can be provided. Specifically, the number of air distribution pipes 220 can be one or more, each extending from one side of the drying tank 200 to the other. Each air distribution pipe 220 is provided with multiple air outlets 221, through which gas continuously enters the drying tank 200, ensuring the uniformity of the hot gas inside the drying tank 200. Furthermore, the shape of the cross-section of the air distribution pipe 220 is not limited and can be designed according to the internal space of the drying tank 200.

[0074] Preferably, in this embodiment, there are two air distribution pipes 220, which are arranged on both sides of the bottom of the drying tank 200, and the cross-section of the air distribution pipes 220 in this embodiment is circular. Furthermore, in this embodiment, the air outlet 221 on each air distribution pipe 220 can be arranged above the corresponding air distribution pipe 220, and the size of each air outlet 221 is the same, and the air outlets 221 are evenly distributed along the axial direction of the air distribution pipe 220 (e.g., ...). Figure 6 and Figure 7 As shown), this ensures that the hot air entering the drying tank 200 is evenly distributed (e.g., Figure 8 and Figure 9 As shown, there are no areas with concentrated high temperatures, so the temperature resistance level inside the drying tank 200 can be reduced, thus reducing manufacturing costs and the risk of damage and deformation to the drying tank 200.

[0075] Specifically, in this embodiment, all four second pipes 3123 lead to the second filter element 330, and then the second filter element 330 performs filtration. The second filter element 330 is connected to two uniform air pipes 220, and the filtered gas flows into the drying tank 200 through the two uniform air pipes 220.

[0076] As a specific embodiment of this utility model, such as Figures 9-11 As shown, each drying tank 200 in this embodiment is provided with a circulating fan 230 at the bottom. The circulating fan 230 blows the gas blown out of the air distribution pipe 220 to circulate within the drying tank 200.

[0077] Specifically, in this embodiment, a circulating fan 230 is provided at the bottom of the drying tank 200, which allows the hot air flowing into the drying tank 200 from the air distribution pipe 220 to circulate continuously within the drying tank 200 under the drive of the circulating fan 230, thereby ensuring the drying of the silicon wafers.

[0078] Specifically, such as Figure 11 As shown, in this embodiment, the circulating fan 230 continuously blows air to the side. Due to the obstruction of the side wall of the drying tank 200, the gas flows upwards from the side, then downwards from the center, and re-enters the circulating fan 230, continuously circulating within the drying tank 200. The specific gas flow path is as follows... Figure 11 As shown by the arrow in the image.

[0079] Specifically, in this embodiment, at least one carrier 210 is provided in each drying tank 200, and at least one basket carrying silicon wafers is placed in each carrier 210; each carrier 210 has a plurality of ventilation holes 211 on its side to facilitate airflow.

[0080] Specifically, such as Figure 11As shown, multiple carriers 210 can be arranged side by side within each drying tank 200, and multiple flower baskets are arranged side by side on each carrier 210. There is a certain gap between the carrier 210 near the side wall of the drying tank 200 and the side wall of the drying tank 200, and there is also a certain gap between two carriers 210. Multiple ventilation holes 211 are provided on the side wall and bottom wall of the carrier 210. This ensures that the gas can continuously circulate within the carrier 210 to dry the silicon wafers in the flower baskets. Specifically, in this embodiment, hot gas continuously flows into the carrier 210 from the side and then flows back down from the center of the carrier 210, continuously circulating.

[0081] More specifically, such as Figure 12 As shown, each drying tank 200 in this embodiment is provided with a cover assembly 240 above it, which can be opened or closed in a controlled manner. When a flower basket needs to be placed, the cover assembly 240 is opened by a drive mechanism. After the flower basket is placed, the cover assembly 240 is closed by the drive assembly. The control of the cover assembly 240 by the lid can maintain the temperature inside the tank to the maximum extent.

[0082] As a specific embodiment of the present invention, the silicon wafer drying device 100 of this embodiment may further include a unit frame 500, which is wrapped around the drying tank 200 and the heating component 300.

[0083] The unit frame 500 encloses all the drying tanks 200 and heating components 300. The design of the unit frame 500 serves two purposes: firstly, to avoid exposing all components and affecting the overall aesthetics of the equipment; and secondly, to secure the heating components 300 and the drying tanks 200, facilitating the discharge of acids, alkalis, and hot gases.

[0084] Specifically, such as Figure 13 As shown, the unit frame 500 in this embodiment is also provided with an exhaust assembly 510 to continuously extract gas from the unit frame 500.

[0085] Specifically, the exhaust assembly 510 may include an exhaust fan and an exhaust valve. Opening the exhaust valve and exhaust fan extracts gas from within the unit frame 500, thereby removing hot exhaust gas, acidic gas, and alkaline gas from within the unit frame 500. The specific gas flow direction is as follows: Figure 13 The direction indicated by the arrow in the diagram. The acid or alkali carried inside the gas is a small amount of acid and alkali carried away from the silicon wafer by the hot gas. The exhaust valve in this embodiment can adjust the airflow of the extracted gas, thereby ensuring the balance between air intake and exhaust, while maintaining a constant space temperature within the unit frame 500.

[0086] Specifically, such as Figure 9 and Figure 10As shown, the silicon wafer drying apparatus 100 of this embodiment may further include an air supply component 600, which is disposed at the drying tank 200 to supply air to the drying tank 200 when a negative pressure is formed in the drying tank 200.

[0087] Specifically, the gas inside the drying tank 200 generally includes gas blown in by the high-pressure induced draft fan 320 and the circulating fan 230, while the external exhaust assembly 510 continuously draws gas from the unit frame 500, causing gas from the drying tank 200 to continuously flow into the unit frame 500. If an equilibrium is not reached, positive or negative pressure can easily occur inside the drying tank 200. When negative pressure forms inside the drying tank 200 for a long time, the internal structure of the drying tank 200 is easily damaged, so timely gas replenishment is necessary. Specifically, in this embodiment, the gas replenishment component 600 can introduce dry and clean nitrogen into the drying tank.

[0088] Specifically, the operating steps of the entire silicon wafer drying device 100 are as follows:

[0089] With the cover assembly 240 closed, the high-pressure exhaust fan 320, heating assembly 300, and circulating fan 230 are turned on. The high-pressure exhaust fan 320 draws in clean air from the clean area. The air flows into the heating assembly 300 after passing through the first filter 410. The heating assembly 300 heats the air rapidly. After being filtered by the second filter 330, the hot air is sent to both sides of the drying tank 200. With the action of the circulating fan 230 inside the drying tank 200, the hot air will continuously circulate inside the drying tank 200. As the hot air continues to enter the drying tank 200, the air inside the drying tank 200 will be quickly preheated to the set temperature, approximately 80°C.

[0090] Once the temperature inside the drying tank 200 reaches the set temperature, the baskets to be dried are placed on the carrier 210 inside the drying tank 200 using a robotic arm or other device. Then, the cover assembly 240 is closed by controlling the drive mechanism, causing the temperature inside the drying tank 200 to drop. Due to the continuous blowing of hot air, the temperature drop is relatively small. After the hot airflow circulates and blows, the air will be heated to the set temperature (80-85℃) in about 2 minutes during normal operation. The temperature measuring device arranged inside the drying tank 200 can accurately control the power of the heating component 300 to control the temperature inside the drying tank 200. By comprehensively adjusting the temperature and the fan airflow, the expected drying effect can generally be achieved within 500 seconds.

[0091] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Thus, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A silicon wafer drying apparatus, characterized in that, include: At least one drying tank for holding silicon wafers and drying the silicon wafers using hot gas; At least one heating element, each of the heating elements being disposed on the side of a corresponding drying tank; each heating element includes a heating element and a high-pressure blower, and includes a heating medium and a gas flow pipe located between the heating medium; and An air intake assembly is disposed above the heating assembly. The air intake assembly includes a first filter and at least one air intake pipe. The first filter filters the gas. One end of each air intake pipe is connected to the first filter, and the other end of each air intake pipe is connected to the corresponding heating assembly, so that the gas filtered by the first filter flows into the corresponding heating assembly through the air intake pipe. The gas flow pipe is connected at one end to the air inlet pipe and at the other end to the drying tank so that the gas after heat exchange in the gas flow pipe flows into the drying tank.

2. The silicon wafer drying apparatus according to claim 1, characterized in that, The high-pressure induced draft fan includes an air inlet and an air outlet. The air inlet is connected to the air intake pipe, and the air outlet is connected to the gas flow pipe, so as to introduce the gas from the air intake pipe into the gas flow pipe and increase the gas flow velocity in the gas flow pipe.

3. The silicon wafer drying apparatus according to claim 2, characterized in that, The gas flow conduit includes: The first pipe has one end connected to the air outlet of the high-pressure induced draft fan; The gas distributor includes an air inlet and multiple air outlets. The air inlet is connected to the first pipe so that gas flowing in from the first pipe flows into the gas distributor through the air inlet and then flows out through the multiple air outlets. A plurality of second pipes, one end of each second pipe being connected to a corresponding air outlet, the plurality of second pipes being located at the heating medium so that the gas passing through the second pipes exchanges heat with the heating medium, and the other end of the plurality of second pipes extending into the drying tank.

4. The silicon wafer drying apparatus according to claim 3, characterized in that, The heating assembly further includes at least one second filter element, each second filter element being located between the second pipe of the corresponding heating assembly and the drying tank, such that the gas flowing through the second pipe passes through the second filter element before entering the drying tank.

5. The silicon wafer drying apparatus according to claim 4, characterized in that, The drying tank is provided with at least one air distribution pipe located at the bottom of the drying tank. One end of each air distribution pipe is connected to the second filter element so that the gas filtered by the second filter element enters the air distribution pipe. Each of the air distribution pipes has multiple air outlets on its pipe wall, and the gas passing through the air distribution pipes flows into the drying tank through the air outlets.

6. The silicon wafer drying apparatus according to claim 5, characterized in that, There are two air distribution pipes, which are set on both sides of the bottom of the drying tank.

7. The silicon wafer drying apparatus according to claim 5, characterized in that, Each of the drying tanks is equipped with a circulating fan at the bottom, which blows the gas from the air distribution pipe to circulate within the drying tank.

8. The silicon wafer drying apparatus according to claim 1, characterized in that, Each of the drying tanks is provided with at least one carrier, and at least one basket containing silicon wafers is placed at each carrier; each carrier has multiple ventilation holes on its side to facilitate airflow.

9. The silicon wafer drying apparatus according to claim 1, characterized in that, Each of the drying tanks is provided with a cover plate assembly, which can be opened or closed in a controlled manner.

10. The silicon wafer drying apparatus according to claim 1, characterized in that, It also includes a unit frame, which is wrapped around the drying tank and the heating assembly.

11. The silicon wafer drying apparatus according to claim 10, characterized in that, The unit frame is also equipped with an exhaust system to continuously extract gas from the unit frame.

12. The silicon wafer drying apparatus according to claim 1, characterized in that, It also includes an air replenishment component, which is installed at the drying tank body to replenish the drying tank body with air when a negative pressure is formed in the drying tank body.

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