Vacuum chuck and battery piece handling system
By designing a tubular vacuum chuck, utilizing the structure of raised and recessed sections and adsorption holes, combined with a support plane and an elastic buffer film, the problem of silicon wafers being cracked by particles during transportation was solved, thus improving the quality and safety of the solar cells.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TONGWEI SOLAR ENERGY (CHENGDU) CO LID
- Filing Date
- 2025-05-23
- Publication Date
- 2026-05-22
AI Technical Summary
Existing vacuum chucks are prone to picking up silicon wafer debris and dust particles during the handling of silicon wafers, which makes the silicon wafers easily cracked and affects the quality of the solar cells.
Design a tubular vacuum chuck with alternating raised and recessed sections on the main body, and adsorption holes opened on the top of the raised sections to reduce the contact area with the silicon wafer. At the same time, a support plane and an elastic buffer film can be selected to reduce the risk of particle adhesion and clamping.
This effectively reduces the risk of silicon wafers being cracked by particles, improving the quality and safety of solar cells.
Smart Images
Figure CN224267254U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of photovoltaic technology, and more specifically, to a vacuum suction cup and a solar cell handling system. Background Technology
[0002] In the process of manufacturing photovoltaic cells, silicon wafers need to undergo a series of processes such as cleaning, texturing, amorphous silicon deposition, transparent conductive film deposition, and copper seed layer deposition at different workstations.
[0003] Currently, vacuum chucks are commonly used to move silicon wafers between different workstations. However, silicon wafer debris and dust particles easily adhere to the vacuum chucks and silicon wafers. When the silicon wafers are adsorbed and fixed by the vacuum chucks, they come into large contact with the surface of the vacuum chucks, making the silicon wafers very susceptible to cracking by particles, which seriously affects the quality of the prepared solar cells. Utility Model Content
[0004] The purpose of this invention is to provide a vacuum suction cup that can effectively reduce the risk of silicon wafers being cracked by particles and improve the quality of solar cells.
[0005] Another objective of this invention is to provide a solar cell handling system that can safely handle silicon wafers and improve the quality of solar cells.
[0006] The embodiments of this utility model provide a technical solution:
[0007] A vacuum suction cup includes a tubular body, at least one end of which is used to connect to a vacuum device. The tubular body has a plurality of protruding segments and recessed segments arranged alternately in its extending direction. The plurality of protruding segments protrude from the plurality of recessed segments toward the same side of the tubular body. The top of the protrusions of the plurality of protruding segments is provided with an adsorption hole communicating with the interior of the tubular body.
[0008] In an optional embodiment, a support plane is provided on the outer wall of the protruding section, and the adsorption hole is formed on the support plane.
[0009] In an optional embodiment, the area on the outer side wall of the protruding segment, excluding the supporting plane, is a convex arc surface.
[0010] In an optional embodiment, the support plane is covered with an elastic buffer membrane, and the adsorption holes penetrate the elastic buffer membrane.
[0011] In an optional embodiment, the outer edge of the cross-section of the recessed section is circular.
[0012] In an optional embodiment, the raised section and the recessed section have a smooth transition.
[0013] In an optional embodiment, the tubular body extends in a wavy shape, with the plurality of protruding segments defining a plurality of peaks of the tubular body and the plurality of recessed segments defining a plurality of troughs of the tubular body.
[0014] In an optional embodiment, the vacuum suction cup further includes a manifold, and there are multiple tubular bodies. One end of each of the multiple tubular bodies is connected to the manifold, and they are arranged sequentially at intervals on the manifold. The openings of the multiple adsorption holes are in the same plane, and the manifold is used to connect the multiple tubular bodies to the vacuum device.
[0015] In an optional embodiment, the plurality of adsorption pores corresponding to any two adjacent tubular bodies are aligned one by one in the arrangement direction of the plurality of tubular bodies.
[0016] This utility model also provides a battery cell handling system, including the aforementioned vacuum suction cup. The vacuum suction cup includes a tubular body, at least one end of which is used to connect to a vacuum device. The tubular body has a plurality of protruding segments and recessed segments arranged alternately in its extending direction. The plurality of protruding segments protrude from the plurality of recessed segments toward the same side of the tubular body. The top of the protrusions of the plurality of protruding segments is provided with an adsorption hole communicating with the interior of the tubular body.
[0017] Compared to existing technologies, the vacuum chuck provided by this invention has a smaller horizontal surface area in its tubular body, making it difficult for particles such as silicon wafer debris or dust in the environment to remain on its surface, thus greatly reducing the probability of particles adhering to its surface. Furthermore, the protruding section of the tubular body has adsorption holes, further reducing the contact area between the vacuum chuck and the silicon wafer when adsorbing it, thereby reducing the probability of particles being clamped between the silicon wafer and the vacuum chuck. Therefore, the beneficial effects of the vacuum chuck provided by this invention include: effectively reducing the risk of silicon wafers being cracked by particles and improving the quality of solar cells. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this utility model and therefore should not be considered as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without any creative effort.
[0019] Figure 1 A schematic diagram of the structure of the vacuum suction cup provided for an embodiment of this utility model from one perspective;
[0020] Figure 2 This is a schematic diagram of the vacuum suction cup provided in an embodiment of the present invention from another perspective.
[0021] Icons: 100 - Vacuum suction cup; 110 - Tubular body; 111 - Protruding section; 1111 - Adsorption hole; 1112 - Support plane; 112 - Recessed section; 120 - Manifold. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0023] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0025] In the description of this utility model, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0026] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0027] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0028] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.
[0029] Example
[0030] Please refer to the following: Figure 1 and Figure 2 , Figure 1 The diagram shown is a structural schematic of the vacuum suction cup 100 provided in this embodiment from one perspective. Figure 2 The diagram shown is a structural schematic of the vacuum suction cup 100 from another perspective.
[0031] The vacuum suction cup 100 provided in this embodiment includes a tubular body 110, at least one end of which is used to connect to a vacuum device. The tubular body 110 has a plurality of protruding segments 111 and recessed segments 112 arranged alternately in its extending direction. The plurality of protruding segments 111 protrude from the plurality of recessed segments 112 on the same side of the tubular body 110, and the protruding tops of the plurality of protruding segments 111 are provided with suction holes 1111 that communicate with the interior of the tubular body 110.
[0032] Understandably, in practical applications, after at least one end of the tubular body 110 is connected to the vacuum device, the vacuum device communicates with the adsorption holes 1111 on the tubular body 110. When the vacuum device generates negative pressure, the multiple adsorption holes 1111 can adsorb and fix objects such as silicon wafers and crystal wafers. In this embodiment, the adsorption and fixation of silicon wafers is described as an example.
[0033] Compared to the disc-shaped body of existing suction cups, the vacuum suction cup 100 provided in this embodiment has a tubular body 110, which has a smaller horizontal surface area, thereby reducing the probability of silicon wafer debris and dust particles falling onto its surface. Furthermore, because the surface of the tubular body 110 is smooth, airflow can flow more smoothly over its surface, making it difficult for particles to remain on it and reducing the probability of particles adhering to it.
[0034] Since the raised section 111 on the tubular body 110 is more prominent than the recessed section 112, and the adsorption hole 1111 is opened on the top of the raised section 111, when the silicon wafer is adsorbed and fixed by the adsorption hole 1111, the silicon wafer only contacts the top of the raised section 111, while the rest of the raised section 111 and the recessed section 112 do not contact the silicon wafer. This greatly reduces the contact area between the silicon wafer and the vacuum chuck 100, further reducing the risk of the silicon wafer being cracked by particles when adsorbing the silicon wafer.
[0035] To ensure stable adsorption of the silicon wafer, in this embodiment, a supporting plane 1112 is provided on the outer wall of the protrusion 111, and the adsorption hole 1111 is formed on the supporting plane 1112. It can be understood that the supporting plane 1112 is the top surface of the protrusion 111, and the supporting planes 1112 of multiple protrusions 111 are located in the same plane. When the vacuum chuck 100 adsorbs and fixes the silicon wafer, the supporting planes 1112 of multiple protrusions 111 are all in contact with the silicon wafer.
[0036] The outer wall of the protruding section 111, except for the supporting plane 1112, is a convex arc surface, allowing particles to easily slide off when they fall on the area other than the supporting plane 1112. In fact, the vacuum suction cup 100 provided in this embodiment has a circular tubular structure in its tubular body 110, and the outer edge of the cross-section of the protruding section 111, excluding the supporting plane 1112, is circular, as is the outer edge of the cross-section of the recessed section 112.
[0037] In another embodiment, the structure of the tubular body 110 can be adjusted according to the actual application conditions. The outer edge of its cross-section can also be elliptical or the other areas on the side where the support plane 1112 is located on the outer wall of the tubular body 110 can be set as convex arc surfaces.
[0038] Considering that particulate matter may still adhere to the support plane 1112 or the silicon wafer surface, when the silicon wafer is adsorbed by the adsorption hole 1111, there is still a possibility that the support plane 1112 and the silicon wafer may trap particulate matter, meaning that the silicon wafer still has a low probability of being cracked. To further reduce the risk of the silicon wafer being cracked, in another embodiment, an elastic buffer film can also be covered on the support plane 1112, with the adsorption hole 1111 penetrating through the elastic buffer film.
[0039] Understandably, if particulate matter exists between the elastic buffer film and the silicon wafer surface during the silicon wafer adsorption process, the elastic buffer film can absorb and disperse the localized high pressure formed by the particulate matter, thereby preventing the silicon wafer from being cracked due to excessive localized stress. Furthermore, the elastic buffer film also has a shock-absorbing effect, absorbing instantaneous impact forces during the silicon wafer adsorption process, further protecting the silicon wafer from damage.
[0040] The elastic buffer membrane can be made of low-hardness materials such as silicone and polyurethane, which have good elasticity and recovery properties. It can quickly return to its original shape after being subjected to pressure, which not only ensures the adsorption effect, but also provides reliable buffer protection for the silicon wafer.
[0041] In this embodiment, to further reduce the likelihood of particulate matter adhering to the tubular body 110, the raised section 111 and the recessed section 112 have a smooth transition. It is understood that the smooth transition between the raised section 111 and the recessed section 112, meaning there is no abrupt structural change at their connection point, prevents particulate matter from remaining at this location.
[0042] Preferably, in this embodiment, the tubular body 110 extends in a wave shape, with multiple protruding segments 111 defining multiple peaks of the tubular body 110 and multiple recessed segments 112 defining multiple troughs of the tubular body 110.
[0043] like Figure 2 As shown, the tubular body 110 is composed of multiple alternating and connected protruding segments 111 and recessed segments 112. The tubular body 110 extends in a wavy shape with a smooth surface and no structural abrupt changes, which can significantly reduce the probability of being attached to particles in the environment, thereby reducing the risk of the silicon wafer being cracked by particles when adsorbing silicon wafers.
[0044] The supporting plane 1112 with adsorption holes 1111 is located at the crest position, i.e. Figure 2 The highest position in the tubular body 110 ensures that, during silicon wafer adsorption, all areas except the supporting plane 1112 on the tubular body 110 do not contact the silicon wafer, thereby further reducing the risk of the silicon wafer being cracked by particles during adsorption.
[0045] In this embodiment, the vacuum suction cup 100 further includes a manifold 120. Multiple tubular bodies 110 are included, with one end of each tubular body 110 connected to the manifold 120 and arranged sequentially at intervals on the manifold 120. The other end of each tubular body 110 is closed. The openings of multiple suction holes 1111 are located in the same plane. The manifold 120 is used to connect the multiple tubular bodies 110 to a vacuum device.
[0046] In fact, each tubular body 110 extends in a wavy shape in the first straight direction and is arranged sequentially at intervals in the second straight direction. Figure 1 The direction indicated by the X arrow is the first straight line direction, and the direction indicated by the Y arrow is the second straight line direction. The supporting plane 1112 is parallel to the plane defined by the first and second straight line directions.
[0047] In this embodiment, the multiple adsorption holes 1111 corresponding to any two adjacent tubular bodies 110 are aligned one-to-one in the arrangement direction of the multiple tubular bodies 110, that is, aligned one-to-one in the second straight line direction. It can be seen that in this embodiment, by arranging multiple tubular bodies 110, an array arrangement of multiple supporting planes 1112 in the same plane is achieved, ensuring a stable and reliable adsorption effect on the silicon wafer.
[0048] In another embodiment, the extension direction of different tubular bodies 110 may differ from that in this embodiment, and the arrangement of multiple tubular bodies 110 may also differ, as long as the multiple supporting planes 1112 are in the same plane. The number of tubular bodies 110 may also be only one, and by adjusting its extension trajectory, an array arrangement of multiple supporting planes 1112 in the same plane can also be achieved.
[0049] In summary, the vacuum chuck 100 provided in this embodiment can effectively reduce the risk of silicon wafers being cracked by particles and improve the quality of solar cells.
[0050] In addition, this embodiment also provides a solar cell handling system for handling silicon wafers during the fabrication of photovoltaic solar cells. The solar cell handling system includes a vacuum device and the aforementioned vacuum chuck 100, with the vacuum device connected to the manifold 120 of the vacuum chuck 100 via a pipeline.
[0051] Thanks to the beneficial effects of the vacuum chuck 100, the solar cell handling system provided in this embodiment can safely handle silicon wafers and improve the quality of solar cells.
[0052] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A vacuum suction cup, characterized in that, The device includes a tubular body (110), at least one end of which is used to connect to a vacuum device. The tubular body (110) has a plurality of protruding segments (111) and recessed segments (112) arranged alternately in its extending direction. The plurality of protruding segments (111) protrude from the plurality of recessed segments (112) toward the same side of the tubular body (110). The protruding top of the plurality of protruding segments (111) is provided with an adsorption hole (1111) communicating with the interior of the tubular body (110).
2. The vacuum suction cup according to claim 1, characterized in that, A support plane (1112) is provided on the outer wall of the protruding section (111), and the adsorption hole (1111) is opened on the support plane (1112).
3. The vacuum suction cup according to claim 2, characterized in that, The area on the outer side wall of the protruding section (111), except for the supporting plane (1112), is a convex arc surface.
4. The vacuum suction cup according to claim 2, characterized in that, The support plane (1112) is covered with an elastic buffer membrane, and the adsorption hole (1111) penetrates the elastic buffer membrane.
5. The vacuum suction cup according to claim 1, characterized in that, The outer edge of the cross-section of the recessed section (112) is circular.
6. The vacuum suction cup according to claim 1, characterized in that, The raised section (111) and the recessed section (112) have a smooth transition.
7. The vacuum suction cup according to claim 1, characterized in that, The tubular body (110) extends in a wave shape, with multiple protruding segments (111) defining multiple peaks of the tubular body (110) and multiple recessed segments (112) defining multiple troughs of the tubular body (110).
8. The vacuum suction cup according to claim 1, characterized in that, The vacuum suction cup (100) further includes a manifold (120). There are multiple tubular bodies (110). One end of each of the multiple tubular bodies (110) is connected to the manifold (120) and they are arranged sequentially at intervals on the manifold (120). The openings of the multiple adsorption holes (1111) are in the same plane. The manifold (120) is used to connect the multiple tubular bodies (110) to the vacuum device.
9. The vacuum chuck according to claim 8, characterized in that, The adsorption holes (1111) corresponding to any two adjacent tubular bodies (110) are aligned one by one in the arrangement direction of the tubular bodies (110).
10. A battery cell handling system, characterized in that, Includes the vacuum chuck (100) as described in any one of claims 1-9.