A microelectronic component detection and screening device

Abstract

This utility model discloses a microelectronic component testing and screening device, relating to the field of electronic component processing technology. It includes: a frame with a feeding and conveying system mounted on it; a double-sided testing mechanism mounted on the frame, comprising a testing component and a pair of flipping clamping components, the flipping clamping components being able to clamp and flip the microelectronic components to be tested so that the testing component can perform double-sided testing; a screening mechanism including a guide plate that can move horizontally above a waste guiding component and a discharge conveying system; and a waste collection box located below the waste guiding component for collecting products that fail the testing. This utility model features high testing accuracy and high working efficiency.

Description

Technical Field

[0001] This utility model relates to the field of electronic component processing technology, specifically to a micro electronic component detection and screening device. Background Technology

[0002] In the current era of rapid development in the electronic component manufacturing industry, electronic components are evolving at an unprecedented pace towards miniaturization and increasing complexity. This transformative trend has elevated the quality and reliability standards of electronic components to unprecedented levels. In the production process of electronic components, the testing stage plays a crucial role in ensuring product quality.

[0003] Traditional manual inspection methods are already stretched thin in the face of such stringent requirements, failing to meet the demands for high-precision and high-efficiency quality control. Especially when inspecting high-end electronic components, even the slightest defect can potentially lead to product failure and a series of serious consequences. In high-end civilian applications, such as aerospace and medical equipment, the reliability of electronic components directly affects the stable operation of the entire system and the health and safety of users.

[0004] Currently, although a relatively complete working system has been established in the field of electronic component testing, it still faces many daunting challenges. On the one hand, the miniaturization and increasing complexity of electronic components place more stringent demands on the accuracy and efficiency of testing. Microelectronic components are extremely small in size and complex in structure, making it difficult for traditional testing methods to accurately detect their minute internal defects. Simultaneously, with the continuous increase in the production speed of electronic components, the efficiency of traditional testing methods can no longer meet the needs of large-scale production. On the other hand, traditional testing methods generally suffer from insufficient accuracy, low efficiency, and high costs. Insufficient accuracy leads to defective products entering the market, affecting product quality and corporate reputation; low efficiency prolongs product production cycles and increases production costs; and high testing costs further squeeze corporate profit margins.

[0005] To address these challenges, the development of intelligent and efficient electronic component inspection and screening technologies has become urgent. This micro-electronic component inspection and screening device was developed against this backdrop, aiming to achieve high-precision and high-efficiency inspection and screening of micro-electronic components through innovative design and advanced technology. This will improve the quality and reliability of electronic components, reduce production costs for enterprises, and promote the further development of the electronic component manufacturing industry. Utility Model Content

[0006] In view of this, the present invention provides a micro-electronic component detection and screening device to solve the technical problem that traditional detection methods cannot meet the detection requirements of miniaturized and complex electronic components.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A microelectronic component detection and screening device, comprising:

[0009] A frame, on which a feeding and conveying system is provided;

[0010] A double-sided inspection mechanism mounted on the frame includes an inspection component and a pair of flipping clamping components. The flipping clamping components are capable of clamping and flipping the microelectronic components to be inspected so that the inspection component can perform double-sided inspection.

[0011] A screening mechanism, the screening mechanism including a guide plate that can move horizontally above a waste guiding assembly and a discharge conveying system;

[0012] A waste collection bin is located below the waste guiding assembly and is used to collect products that fail the inspection.

[0013] Furthermore, the double-sided detection mechanism also includes a drive mechanism for driving the detection component and the flipping clamping component to move up and down, the drive mechanism comprising:

[0014] Cylinders mounted on a gantry frame above the machine frame;

[0015] The detection assembly and the pair of flipping clamping assemblies are all mounted on the bracket connected to the lower end of the cylinder.

[0016] Furthermore, the detection assembly includes a detector mounted on the bracket and at least one supplementary light, the detector and the supplementary light being spaced apart.

[0017] Furthermore, the flipping clamping assembly includes a flipping component and a clamping plate connected to each other, the flipping component comprising:

[0018] The first stepper motor is mounted on the bracket;

[0019] A mounting housing connected to the output end of the first stepper motor;

[0020] A second stepper motor is mounted on the mounting housing;

[0021] A cam connected to the output end of the second stepper motor;

[0022] A movable component, one end of which abuts against the cam, and the other end of which is connected to the corresponding clamping plate, wherein the movable component slides in conjunction with the mounting housing.

[0023] Furthermore, the moving component includes:

[0024] A movable plate capable of abutting against the cam;

[0025] A push rod that slides in conjunction with the mounting housing, and the push rod is fixedly connected to the movable plate;

[0026] A compression spring is sleeved on the top rod, and the compression spring abuts against the mounting housing and the movable plate.

[0027] Furthermore, two limiting grooves are symmetrically provided on the bracket, and a limiting block is provided on the side of the mounting shell that can slide and engage with the corresponding limiting groove.

[0028] Furthermore, the screening mechanism includes:

[0029] The mounting box is mounted on the rack;

[0030] A third stepper motor is mounted on the mounting box;

[0031] A gear connected to the output end of the third stepper motor;

[0032] A rack meshes with the gear, and the guide plate is connected to the rack.

[0033] Furthermore, the mounting box is equipped with a guide rod that can slide and engage with the guide groove of the guide plate.

[0034] Furthermore, the guide plate includes an integrally connected horizontal plate and an inclined plate, the horizontal plate being connected to the rack, and the guide groove being formed on the horizontal plate.

[0035] Furthermore, the waste guiding assembly includes at least one guide member, which is inclinedly disposed between the guide plate and the waste collection box.

[0036] As can be seen from the above technical solution, the advantages of this utility model are:

[0037] 1. High-precision inspection capability: By adopting a multispectral imaging system and high-resolution visual inspection, it ensures comprehensive inspection of minute components and improves inspection accuracy; it can realize integrated clamping and flipping, significantly improving work efficiency.

[0038] 2. High-efficiency screening capability: The screening mechanism enables graded screening, ensuring that qualified and unqualified products can be collected separately, making the work more convenient, reducing product waste, and lowering costs. Attached Figure Description

[0039] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0040] Figure 1 This is a schematic diagram of the structure of this utility model.

[0041] Figure 2 for Figure 1 A magnified view of part A.

[0042] Figure 3 This is a left view of a portion of the structure of this utility model.

[0043] Figure 4 for Figure 3 A magnified view of section B.

[0044] Figure 5 for Figure 4 A magnified view of a portion of point C.

[0045] Figure 6 This is a schematic diagram of the screening mechanism of this utility model.

[0046] Figure 7 This is a schematic diagram of the working state of the screening mechanism of this utility model.

[0047] Explanation of reference numerals in the attached drawings: 1-Frame; 11-Discharge hole; 2-Feeding and conveying system; 3-First mounting frame; 4-Double-sided detection mechanism; 41-Gantry frame; 42-Cylinder; 43-Bracket; 431-Limit slide groove; 44-Supplementary light; 45-Detector; 46-Tilting assembly; 461-First stepper motor; 462-Mounting shell; 463-Limit block; 464-Second stepper motor; 465-Cam; 466-Moving plate; 467-Top 468 - Compression spring; 47 - Clamping plate; 471 - Anti-slip texture; 5 - Screening mechanism; 51 - Mounting box; 511 - Box body; 512 - Side cover; 5121 - Clearance hole; 52 - Third stepper motor; 53 - Gear; 54 - Rack; 55 - Guide rod; 56 - Guide plate; 561 - Horizontal plate; 5611 - Guide groove; 562 - Inclined plate; 6 - Discharge conveying system; 7 - Second mounting frame; 8 - Material guide; 10 - Waste collection box. Detailed Implementation

[0048] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0049] refer to Figures 1 to 7 ,like Figure 1As shown, this embodiment provides a microelectronic component detection and screening device. Adopting a modular design principle, the device is divided into six core parts: a frame 1, and mounted on the frame 1 a feeding and conveying system 2, a double-sided detection mechanism 4, a screening mechanism 5, a waste guiding assembly, a discharge conveying system 6, and a waste collection box 10. The frame 1 provides basic support and adopts a high-rigidity frame structure to ensure overall stability. The feeding and conveying system 2 is connected to the frame 1 via a first mounting frame 3, and the discharge conveying system 6 is connected to the frame 1 via a second mounting frame 7. The two are integrated into a material transfer module to realize the entry and exit of materials (in this invention, microelectronic components, hereinafter referred to as electronic components). It is equipped with a precision stepper motor drive to achieve a positioning accuracy of ±0.02mm. The double-sided inspection mechanism 4 includes a high-resolution vision inspection component and a pair of flexible flipping clamping components. The flipping clamping components can perform clamping and flipping operations on the microelectronic components to be inspected, allowing the inspection component to quickly complete the process of clamping → inspecting one side → flipping → inspecting the other side. The double-sided inspection mechanism 4 supports 360° non-destructive inspection of 0.1mm micro-components. The screening mechanism 5 includes a guide plate 56 that can move horizontally above the waste guiding component and the discharge conveying system 6. The waste collection box 10 is located below the waste guiding component and is used to collect products that fail the inspection. In addition, this invention is equipped with an industrial-grade PLC control system, integrating AI algorithms to achieve adaptive optimization of inspection parameters.

[0050] like Figure 3 As shown, the double-sided detection mechanism 4 mainly consists of three parts: a drive mechanism, a detection component, and a pair of flipping clamping components. The drive mechanism can drive the detection component and the flipping clamping components to move up and down precisely, ensuring that the lifting and lowering movements of the detection component and the flipping clamping components are more accurate and stable.

[0051] The drive mechanism mainly consists of a cylinder 42 and a bracket 43. The cylinder 42 is mounted on the gantry 41 above the frame 1. The cylinder 42 connects the detection component and the flipping clamping component through the bracket 43 to achieve synchronous lifting control. The cylinder 42 is a servo electric cylinder with a response speed of 50mm / s and a positioning accuracy of ±0.01mm. Compared with traditional cylinders, it has higher positioning accuracy (0.01mm vs. 0.5mm) and faster response speed, and the transmission efficiency is improved by more than 15%.

[0052] like Figure 4As shown, the detection assembly mainly consists of a detector 45 and a supplementary light 44 mounted on a bracket 43. The detector 45 and the supplementary light 44 are spaced apart, and the number of supplementary lights 44 is set according to the actual situation. The detector 45 integrates a multispectral imaging system, supporting dual-mode high-resolution visual inspection of infrared thermal imaging (accuracy ±0.5℃) and X-ray fluoroscopy (resolution 5μm). The multispectral imaging system has a defect recognition rate ≥99.8% and a false alarm rate ≤0.2%, while X-ray fluoroscopy can detect internal cracks (minimum resolution 5μm), achieving precise flaw detection of electronic components and improving detection efficiency and accuracy. The supplementary light 44 supports adjustable brightness (500-2000Lux) and color temperature (2700-6500K), with an extended operating temperature range of -10℃ to 60℃ and humidity adaptability <85%RH, ensuring imaging quality for components of different materials.

[0053] like Figure 4 and Figure 5 As shown, the flipping clamping assembly mainly consists of a flipping component 46 and a clamping plate 47 connected to each other. The flipping component 46 mainly consists of: a first stepper motor 461, a mounting shell 462, a second stepper motor 464, a cam 465, a moving plate 466, a push rod 467, and a compression spring 468. The first stepper motor 461 is mounted on the side of the bracket 43, and the mounting shell 462 is connected to the output end of the first stepper motor 461. Driven by the first stepper motor 461, the mounting shell 462 can flip 360°. To ensure the stability of the flipping of the mounting shell 462, a limit block 463 is provided on the side of the mounting shell 462, and a limit groove 431 is provided on the bracket 43 to slide and cooperate with the corresponding limit block 463. The second stepper motor 464 is mounted on the mounting shell 462, and the cam 465 is connected to the output end of the second stepper motor 464. The second stepper motor 464 and the first stepper motor 461 constitute a dual-motor drive module, which, together with the cam 465, achieves 0.1mm-level micro-motion control, thereby making the clamping of electronic components more precise and damage-free. The movable plate 466 can abut against the cam 465, the push rod 467 slides with the mounting housing 462, the push rod 467 is fixedly connected to the movable plate 466, and the compression spring 468 is sleeved on the push rod 467, and the compression spring 468 abuts against the mounting housing 462 and the movable plate 466.

[0054] The moving plate 466, the push rod 467, and the compression spring 468 together form the moving assembly. By setting the compression spring 468, a spring preload structure can be formed to ensure that the clamping force is adjustable within the range of 5-20N, which can adapt to components of different sizes (0.5-10mm thickness).

[0055] The working process of the double-sided inspection mechanism 4 is as follows: The robotic arm picks up the electronic component to be inspected from the feeding and conveying system 2 and transfers it between a pair of clamping plates 47. The second stepper motor 464 operates, driving the cam 465 to rotate, causing the cam 465 to press against the moving assembly. This brings the pair of clamping plates 47 closer together, achieving stable clamping of the electronic component. To improve clamping stability, anti-slip textures 471 are provided on the clamping plates 47. During inspection, the detector 45 operates to inspect the electronic component. After one side is inspected, the first stepper motor 461 operates, driving the flipping assembly 46 to rotate 180° to inspect the other side. Finally, the detector 45 transmits the inspection data to the control system. The pair of clamping plates 47 then move away from each other, allowing the electronic component to fall onto the feeding and conveying system 2.

[0056] like Figure 1 , Figure 2 and Figure 6 As shown, the screening mechanism 5 mainly consists of a mounting box 51, a third stepper motor 52, a gear 53, a rack 54, a guide rod 55, and a guide plate 56. Precise control of the guide plate 56 is achieved through gear and rack transmission, which, combined with the linear motion of the guide rod 55, ensures the stability and reliability of the screening operation. The mounting box 51, mounted on the frame 1, mainly consists of a split-type housing 511 and a side cover 512. The side cover 512 is removable for easier maintenance. The third stepper motor 52 is mounted on the mounting box 51, the gear 53 is connected to the output end of the third stepper motor 52, the rack 54 meshes with the gear 53, and the guide plate 56 is connected to the rack 54. The gear 53 is made of alloy steel, carburized and quenched to a hardness ≥ HRC60. The rack 54 is made of 45# steel, surface-hardened by high-frequency quenching to a hardness ≥ HRC55. The guide rod 55 is installed inside the mounting box 51. The guide rod 55 slides in conjunction with the guide groove 5611 of the guide plate 56, and the clearance between the guide rod 55 and the guide groove 5611 is ≤0.02mm. It is precision ground. The guide plate 56 includes an integrally connected horizontal plate 561 and an inclined plate 562, which increases the rigidity by 30%. The left end of the horizontal plate 561 is connected to the rack 54, and the guide groove 5611 is opened at the left end of the horizontal plate 561. In order to facilitate the movement of the horizontal plate 561, an obstacle hole 5121 is provided on the side cover 512 for the horizontal plate 561 to pass through. The obstacle hole 5121 adopts a parabolic transition design to reduce stress concentration. The surface of the guide plate 56 is coated with a lotus leaf-like superhydrophobic coating. After 2000 cycles of testing, the adhesion force decays by less than 5%, and the contact angle is ≥150°, which can greatly reduce the adhesion of materials. In addition, the surface of the guide plate 56 is equipped with a pressure sensor array with a measurement accuracy of ±0.5N and a sampling frequency of ≥100Hz, realizing dynamic load adaptive compensation.

[0057] The waste guiding assembly includes one or two guide members 8, which are inclinedly arranged between the guide plate 56 and the waste collection box 10. In order to facilitate the installation of the waste collection box 10 and the conveying of waste, a discharge hole 11 for waste to pass through is provided on the frame 1.

[0058] The guide component 8 can be a guide plate or a conveyor belt or other structure that enables the movement of electronic components. When there is only one guide component 8, its upper end connects to the guide plate 56, and its lower end connects to the waste collection box 10. When there are two guide components 8, they are interspersed, with the upper guide component 8 connecting to the guide plate 56 and the lower guide component 8 connecting to the waste collection box 10. Furthermore, an ionization generator can be installed on the guide component 8 to eliminate electrostatic interference, as needed.

[0059] Working principle: The double-sided inspection mechanism 4 detects surface scratches on electronic components. The inspection results are sent to the control system, which confirms the results. When the product is qualified, the third stepper motor 52 rotates clockwise, moving the guide plate 56 above the discharge conveyor system 6. The feeding conveyor system 2 transports the qualified electronic components onto the guide plate 56. Under the action of the inclined plate 562, the qualified electronic components fall onto the discharge conveyor system 6 (e.g., ...). Figure 7 As shown), it moves to the subsequent process; when the product is defective, the third stepper motor 52 rotates clockwise, driving the guide plate 56 to move above the guide component 8 (as shown). Figure 2 As shown, the guide component 8 transports the defective electronic components to the waste collection box 10 for subsequent rework or scrapping. Therefore, compared with manual inspection, this utility model has the characteristics of high efficiency and high inspection accuracy.

[0060] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A microelectronic component detection and sieving device, characterized in that, include: A frame (1) is provided with a feeding and conveying system (2); A double-sided inspection mechanism (4) is installed on the frame (1). The double-sided inspection mechanism (4) includes an inspection component and a pair of flipping clamping components. The flipping clamping components can clamp and flip the microelectronic components to be inspected so that the inspection component can perform double-sided inspection. The screening mechanism (5) includes a guide plate (56) that can move horizontally above the waste guiding assembly and the discharge conveying system (6). Waste collection bin (10), which is located below the waste guiding assembly, is used to collect products that fail the inspection.

2. The microelectronic component detection and sieving device according to claim 1, characterized in that, The double-sided detection mechanism (4) further includes a drive mechanism for driving the detection component and the flipping clamping component to rise and fall, the drive mechanism comprising: Cylinder (42) mounted on the gantry (41) above the frame (1); The detection component and a pair of flipping clamping components are both mounted on the bracket (43) connected to the lower end of the cylinder (42).

3. The microelectronic component detection and sieving device according to claim 2, characterized in that, The detection assembly includes a detector (45) mounted on the bracket (43) and at least one supplementary light (44), with the detector (45) and the supplementary light (44) spaced apart.

4. The microelectronic component detection and sieving device according to claim 2, characterized in that, The flipping clamping assembly includes a flipping component (46) and a clamping plate (47) connected to each other. The flipping component (46) includes: The first stepper motor (461) is mounted on the bracket (43). Mounting housing (462) connected to the output end of the first stepper motor (461); A second stepper motor (464) is mounted on the mounting housing (462). Cam (465) connected to the output of the second stepper motor (464); The movable component has one end abutting against the cam (465) and the other end connected to the corresponding clamp (47). The movable component is slidably engaged with the mounting housing (462).

5. The microelectronic component detection and sieving device according to claim 4, characterized in that, The moving component includes: A movable plate (466) capable of abutting against the cam (465); A push rod (467) is slidably engaged with the mounting housing (462), and the push rod (467) is fixedly connected to the movable plate (466); A compression spring (468) is sleeved on the top rod (467), and the compression spring (468) abuts against the mounting housing (462) and the movable plate (466).

6. The microelectronic component detection and sieving device according to claim 4, characterized in that, Two limiting grooves (431) are symmetrically provided on the bracket (43), and the side of the mounting shell (462) is provided with a limiting block (463) that can slide and cooperate with the corresponding limiting groove (431).

7. The microelectronic component detection and sieving device according to claim 6, characterized in that, The screening mechanism (5) includes: Mounting box (51) is mounted on the frame (1); A third stepper motor (52) is mounted on the mounting box (51); Gear (53) connected to the output end of the third stepper motor (52); A rack (54) meshes with the gear (53), and the guide plate (56) is connected to the rack (54).

8. The microelectronic component detection and sieving device according to claim 7, characterized in that, The mounting box (51) is equipped with a guide rod (55) that can slide with the guide groove (5611) of the guide plate (56).

9. The microelectronic component detection and sieving device according to claim 8, characterized in that, The guide plate (56) includes an integrally connected horizontal plate (561) and inclined plate (562). The horizontal plate (561) is connected to the rack (54), and the guide groove (5611) is formed on the horizontal plate (561).

10. The microelectronic component detection and sieving device according to claim 1, characterized in that, The waste guiding assembly includes at least one guide element (8), which is inclinedly disposed between the guide plate (56) and the waste collection box (10).

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