Processing equipment

Abstract

The processing apparatus includes a light source, a mirror module, an image rotation module, and a stage. The light source is adapted to generate a light beam. The image rotation module is disposed downstream of the light source's optical path and includes a first reflector and a second reflector. The first reflector has a first reflective surface. The second reflector is located downstream of the first reflector's optical path and has a second reflective surface inclined relative to the first reflective surface. The stage is disposed downstream of the image rotation module's optical path. The mirror module is disposed in the optical path between the image rotation module and the stage.

Description

Technical Field

[0001] This utility model relates to an apparatus, and more particularly to a processing apparatus. Background Technology

[0002] Micro LEDs are much smaller than traditional LEDs. Therefore, for a display of the same size, the number of micro LEDs can be far greater than that of traditional LEDs, resulting in a brighter and more detailed image. Generally, the manufacturing process of a micro LED display involves growing microdices on a wafer and then mass-transferring the microdices onto a driving substrate.

[0003] Furthermore, to ensure that all microchips on the driving substrate are of good quality, the above process typically includes a defective microchip removal step, followed by the replacement of defective microchips with good ones. As mentioned earlier, because the size of micro LEDs is much smaller than that of traditional LEDs, the process of removing defective microchips is quite time-consuming, increasing product costs. Utility Model Content

[0004] This invention provides a processing device to improve the processing efficiency of microcrystals.

[0005] To achieve one or more of the above-mentioned objectives, or other objectives, an embodiment of the present invention provides a processing apparatus suitable for processing multiple microcrystals. The processing apparatus includes a light source, a light reflector module, an image rotation module, and a stage. The light source is adapted to generate a light beam. The image rotation module is disposed downstream of the light source's optical path and includes a first reflector and a second reflector. The first reflector has a first reflective surface. The second reflector is located downstream of the first reflector's optical path and has a second reflective surface inclined relative to the first reflective surface. The stage is disposed downstream of the image rotation module's optical path and is adapted for mounting the microcrystals. The reflector module is disposed in the optical path between the image rotation module and the stage.

[0006] In one embodiment of the present invention, the above-mentioned processing device may further include two driving elements, wherein the two driving elements are respectively connected to the first reflector and the second reflector, and are adapted to drive the first reflector and the second reflector to rotate.

[0007] In one embodiment of this utility model, the aforementioned reflector module is disposed in the optical path between the image rotation module and the stage, and the reflector module includes a scanning galvanometer module.

[0008] In one embodiment of the present invention, the above-mentioned processing device may further include a first reflector and a second reflector, wherein the first reflector is located downstream of the optical path of the image rotation module, and the second reflector is located downstream of the optical path of the first reflector.

[0009] In one embodiment of this invention, the processing apparatus further includes a spot contour shaping module. The spot contour shaping module is disposed in the optical path between the light source and the image rotation module, and is adapted to convert the incident light beam into a shaped beam.

[0010] In one embodiment of this invention, the aforementioned light spot contour shaping module includes, for example, a light mask, and the light mask has multiple light-transmitting patterns. The light-transmitting patterns have different shapes or sizes, and the light-transmitting patterns are adapted to allow light beams to pass through and form shaped light beams.

[0011] In one embodiment of the present invention, the above-mentioned processing apparatus may further include a beam shaping element, wherein the beam shaping element is located on the transmission path of the beam and is adapted to change the energy distribution of the beam.

[0012] In one embodiment of the present invention, the above-mentioned beam shaping element is adapted to convert the beam into a flat-top beam.

[0013] In one embodiment of the present invention, the image rotation module further includes a third reflector, wherein the third reflector is located downstream of the optical path of the second reflector and has a third reflector surface that is inclined relative to the second reflector surface.

[0014] In one embodiment of the present invention, the above-mentioned processing device further includes a driving element, wherein the driving element is connected to the first reflector, the second reflector and the third reflector, and is adapted to drive the first reflector, the second reflector and the third reflector to rotate.

[0015] In this invention, the processing device employs a reflector module and an image rotation module. The reflector module alters the beam's propagation path, but simultaneously causes the beam's spot to rotate or deform. The image rotation module, through a first and second reflector, rotates the beam's spot and adjusts its shape, ensuring the spot's outline matches the microcrystal. Therefore, the processing device can process any microcrystal on the stage more precisely, thereby improving the microcrystal processing efficiency.

[0016] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0017] Figure 1This is a block diagram of a processing device according to an embodiment of the present invention.

[0018] Figure 2 yes Figure 1 A schematic diagram of the image rotation module.

[0019] Figure 3 yes Figure 1 A schematic diagram of the light spot contour shaping module.

[0020] Figure 4 This is a schematic diagram comparing the light spot of a processing device according to an embodiment of the present invention with that of a processing device in the prior art.

[0021] Figure 5 This is a block diagram of a processing device according to another embodiment of the present invention.

[0022] Figure 6 yes Figure 5 A schematic diagram of the image rotation module.

[0023] Figure 7 This is a block diagram of a processing device according to another embodiment of the present invention.

[0024] Figure 8 This is a block diagram of a processing device according to another embodiment of the present invention. Detailed Implementation

[0025] Figure 1 This is a block diagram of a processing device according to an embodiment of the present invention. Figure 2 yes Figure 1 A schematic diagram of the image rotation module. Please refer to it. Figure 1 and Figure 2 The processing apparatus 100 is suitable for processing multiple microcrystals G. The processing apparatus 100 includes a light source 110, a mirror module 120, an image rotation module 130, and a stage 140. The light source 110 is suitable for generating a light beam L1. The image rotation module 130 is disposed downstream of the optical path of the light source 110, and includes a first reflector 131 and a second reflector 132. The first reflector 131 has a first reflecting surface RS1. The second reflector 132 is located downstream of the optical path of the first reflector 131 and has a second reflecting surface RS2 inclined relative to the first reflecting surface RS1. The stage 140 is disposed downstream of the optical path of the image rotation module 130 and is suitable for placing the microcrystals G. The mirror module 120 is disposed in the optical path between the image rotation module 130 and the stage 140.

[0026] Light source 110 may include, for example, a laser light source, but in other embodiments, light source 110 may employ other high-energy light sources, and the present invention does not impose any restrictions on this.

[0027] The processing apparatus 100 in this embodiment may further include a beam shaping element D, which is located on the transmission path of the beam L1 and is adapted to change the energy distribution of the beam L1. For example, the beam shaping element D in this embodiment converts the beam L1 into a flat-top beam Lt. Specifically, the beam L1 generated by the light source 110 may include a Gaussian beam, and the beam shaping element D may be disposed on the transmission path of the Gaussian beam and convert the Gaussian beam into a flat-top beam Lt, thereby improving the uniformity of light energy and further enhancing the processing accuracy and efficiency of the processing apparatus 100 on the microcrystal G. In this embodiment, the beam shaping element D may include a diffractive optical element (DOE), but the present invention is not limited thereto.

[0028] Figure 3 yes Figure 1 A schematic diagram of the light spot contour shaping module. Please refer to... Figure 1 and Figure 3 The processing apparatus 100 further includes a spot contour shaping module 150. In this embodiment, the spot contour shaping module 150 is disposed in the optical path between the light source 110 and the image rotation module 130, and is adapted to convert the incident light beam (e.g., a flat-top beam Lt) into a shaped beam L2. The spot contour shaping module 150 can change the spot contour or shape of the incident light beam (flat-top beam Lt). For example, the spot contour shaping module 150 in this embodiment may include a photomask 151, and the photomask 151 has multiple light-transmitting patterns, while Figure 3 Examples include four light-transmitting patterns P1, P2, P3, and P4. These patterns have different shapes or sizes and are adapted to allow a flat-top beam Lt to pass through, forming a shaping beam L2 so that the beam's outline or shape better matches the microcrystal G to be processed. For example, patterns P1, P2, and P3 may have different shapes, while patterns P3 and P4 may have the same shape but different sizes. Furthermore, the photomask 151 can move in a straight line so that any one of the light-transmitting patterns P1, P2, P3, and P4 is located on the transmission path of the flat-top beam Lt, thereby forming the shaping beam L2. In one embodiment, the light-transmitting patterns P1, P2, P3, and P4 may be arranged in a ring, and the photomask 151 can be rotated so that any one of the light-transmitting patterns P1, P2, P3, and P4 is located on the transmission path of the flat-top beam Lt. The spot contour shaping module 150 can be moved or rotated by a drive element M, wherein the drive element M may include, but is not limited to, an electric motor.

[0029] Please refer to this again. Figure 1 and Figure 2In this embodiment, the image rotation module 130 sequentially reflects the shaping beam L2 through the first reflector 131 and the second reflector 132 to rotate the spot of the shaping beam L2, and can also adjust the contour of the spot, thereby generating a beam L3 whose spot contour is more matched to the processing beam L3 of the microcrystal G. For example, the flat-top beam Lt passes through Figure 3 After the light-transmitting pattern P2 is formed, a shaping beam L2 is formed, and the shaping beam L2, after passing through the image rotation module 130, can form an image similar to the light-transmitting pattern P2 on the stage 140.

[0030] The reflector module 120 includes a scanning galvanometer module 121. The scanning galvanometer module 121 may include galvanometers 1211 and 1212 and a projection lens 1213. Galvanometers 1211 and 1212, for example, oscillate around different axes within a preset angle range, causing the processing beam L3 to irradiate different positions within a preset working range. However, other embodiments do not specifically limit the number of galvanometers. Furthermore, in this embodiment, the projection lens 1213 can guide the processing beam L3 to be incident on the microcrystal G on the stage 140.

[0031] The processing apparatus 100 may further include two driving elements 160, wherein the two driving elements 160 are respectively connected to the first reflector 131 and the second reflector 132, and are adapted to drive the first reflector 131 and the second reflector 132 to rotate. In this way, the spot shape of the processing beam L3 can be better matched to the microcrystal G to be processed. The driving element 160 includes, for example, an electric motor, but other embodiments are not limited thereto.

[0032] Please continue to refer to this. Figure 1 The stage 140 is movable, positioning the microcrystal G to be processed along the transmission path of the processing beam L3. For example, the stage 140 may be electrically connected to a control unit (not shown) to control its movement. The aforementioned control unit may include a central processing unit, but the present invention is not limited thereto.

[0033] Compared to existing technologies, in this embodiment, the processing apparatus 100 employs a reflector module 120 and an image rotation module 130 to adjust the light beam L1 generated by the light source 110. The reflector module 120 can change the propagation path of the light beam, but this also causes the beam spot to rotate or deform. The image rotation module 130 can rotate the beam spot through the first reflector 131 and the second reflector 132, and adjust the shape of the beam spot so that its outline matches the microcrystal G. Therefore, the processing apparatus 100 can process any microcrystal G on the stage 140 more precisely, thereby improving the processing efficiency of the microcrystal G.

[0034] Figure 4 This is a schematic diagram comparing the light spot of a processing device according to an embodiment of the present invention with that of a processing device in the prior art. Please refer to it. Figure 1 and Figure 4 The light spot SP0 is formed by a light beam emitted from a processing device of the prior art, while the light spot SP1 is formed by a light beam emitted from the processing device 100. Since the processing device 100 is equipped with an image rotation module 130, the contour of the light spot SP1 can match the contour of the microcrystal G to be processed compared with the light spot SP0, thereby improving the processing efficiency of the processing device 100 on the microcrystal G.

[0035] It should be noted that the processing apparatus 100 can be used for steps such as separating all or specific microcrystals G from the carrier plate, including steps such as removing defective microcrystals, mass transfer, and filling with good microcrystals. Furthermore, the length, width, and thickness of each microcrystal G are, for example, less than 100 μm, and may even be less than 50 μm, such as less than 10 μm, but this invention is not limited thereto.

[0036] Furthermore, this embodiment may also be configured with an imaging device CA to provide image confirmation of whether the processing beam L3 is aligned with the microcrystal G to be processed. The imaging device CA is, for example, configured on the side of the stage 140 away from the scanning galvanometer module 121; however, in one embodiment, the imaging device CA may be configured on the side of the scanning galvanometer module 121 away from the stage 140. In one embodiment, the imaging device CA may be electrically connected to a drive element 160 and moved relative to the stage 140 by the drive element 160. In this embodiment, the microcrystal G is disposed on the side of the stage 140 opposite to the imaging device CA; however, in another embodiment, the microcrystal G may be disposed on the side of the stage 140 facing the imaging device CA.

[0037] Figure 5 This is a block diagram of a processing device according to another embodiment of the present invention. Figure 6 yes Figure 5 A schematic diagram of the image rotation module. The structure and advantages of the processing apparatus 100a in this embodiment are similar to those of the image rotation module. Figure 1 The following describes only the differences in the embodiments. Please refer to... Figure 5 and Figure 6The image rotation module 130a further includes a third reflector 133, which is located downstream of the optical path of the second reflector 132 and has a third reflector RS3 that is inclined relative to the second reflector RS2. Thus, the processing apparatus 100a can provide different exit paths for the processing beam L3 through the third reflector RS3. The features of the third reflector 133 are similar to those of the first reflector 131 and the second reflector 132, and related descriptions are omitted here. In one embodiment, the image rotation module 130a may be configured with four, five, six, or more reflectors, and the present invention does not impose a specific limit on the number. In this embodiment, the driving element 160a of the processing apparatus 100a is connected to the first reflector 131, the second reflector 132, and the third reflector 133, and is adapted to drive the first reflector 131, the second reflector 132, and the third reflector 133 to rotate. In one embodiment, the driving element 160a may also be connected to the spot contour shaping module 150 to drive the spot contour shaping module 150 to move or rotate.

[0038] Figure 7 This is a block diagram of a processing apparatus according to another embodiment of the present invention. The structure and advantages of the processing apparatus 100b in this embodiment are similar to those of other apparatuses. Figure 5 The following describes only the differences in the embodiments. Please refer to... Figure 7 The processing apparatus 100b may further include a first reflector 170 and a second reflector 180, wherein the first reflector 170 is located on the transmission path of the processing beam L3 and is adapted to reflect the processing beam L3 to the second reflector 180. The second reflector 180 is adapted to reflect the processing beam L3 to the stage 140. Thus, the optical path of the processing beam L3 can be moved by the first reflector 170 and the second reflector 180, allowing the spot of the processing beam L3 to be more accurately incident on the microcrystal G to be processed on the stage 140. In this embodiment, the first reflector 170 and the second reflector 180 can move or rotate relative to the image rotation module 130, thereby changing the optical path of the processing beam L3. In one embodiment, the first reflector 170 and the second reflector 180 can be electrically connected to... Figure 1 The driving element 160 is used to drive the mirror, and the mirror moves or rotates as driven by the driving element 160. Incidentally, in one embodiment, the first reflector 170 and the second reflector 180 can be coupled. Figure 1 Image rotation module 130.

[0039] Figure 8 This is a block diagram of a processing apparatus according to another embodiment of the present invention. The structure and advantages of the processing apparatus 100c in this embodiment are similar to those of other apparatuses. Figure 1 The following describes only the differences in the embodiments. Incidentally, besides Figure 1 Besides the scanning galvanometer module 121, any reflecting mirror in the beam path can cause beam distortion. For example, please refer to... Figure 8 The reflector module 120c is disposed in the optical path between the light source 110 and the image rotation module 130. For example, the reflector module 120c may include multiple reflectors (not shown), each of which is disposed on the transmission path of the flat-top beam Lt to guide the flat-top beam Lt to be incident on the spot contour shaping module 150. In this way, the relative position between the light source 110 and the image rotation module 130 can be easily changed by the reflector module 120c, making the optical path design of the processing apparatus 100c more flexible.

[0040] In summary, this invention employs a reflector module and an image rotation module in its processing apparatus. The reflector module alters the beam's propagation path, but simultaneously causes the beam's spot to rotate or deform. The image rotation module, through the first and second reflectors, rotates the beam's spot and adjusts its shape, ensuring the spot's outline matches the microcrystal. Therefore, the processing apparatus can more precisely process any microcrystal on the stage, thereby improving the microcrystal processing efficiency.

[0041] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the methods and techniques disclosed above without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A processing apparatus suitable for processing multiple microcrystals, characterized in that, The processing device includes: A light source is suitable for producing a beam of light; An image rotation module is disposed downstream of the light source's optical path. The image rotation module includes a first reflector and a second reflector. The first reflector has a first reflective surface, and the second reflector is located downstream of the first reflector's optical path and has a second reflective surface that is inclined relative to the first reflective surface. A stage, positioned downstream of the optical path of the image rotation module, and adapted to accommodate the micro-granules; and A mirror module is disposed in an optical path between the image rotation module and the stage.

2. The processing apparatus as described in claim 1, characterized in that, The processing device further includes two driving elements, wherein the two driving elements are respectively connected to the first reflector and the second reflector, and are adapted to drive the first reflector and the second reflector to rotate.

3. The processing apparatus as described in claim 1, characterized in that, The mirror module is disposed in the optical path between the image rotation module and the stage, and the mirror module includes a scanning galvanometer module.

4. The processing apparatus as described in claim 1, characterized in that, The processing device further includes a first reflector and a second reflector, wherein the first reflector is located downstream of the optical path of the image rotation module, and the second reflector is located downstream of the optical path of the first reflector.

5. The processing apparatus as described in claim 1, characterized in that, The processing apparatus further includes a spot contour shaping module, wherein the spot contour shaping module is disposed in an optical path between the light source and the image rotation module, and is adapted to convert an incident light beam into a shaped light beam.

6. The processing apparatus as described in claim 5, characterized in that, The light spot contour shaping module includes a light mask with multiple light-transmitting patterns having different shapes or sizes, which are adapted to allow the light beam to pass through and form the shaped light beam.

7. The processing apparatus as described in claim 1, characterized in that, The processing apparatus further includes a beam shaping element, wherein the beam shaping element is located on the transmission path of the beam and is adapted to change the energy distribution of the beam.

8. The processing apparatus as described in claim 7, characterized in that, The beam shaping element is adapted to convert the beam into a flat-top beam.

9. The processing apparatus as described in claim 1, characterized in that, The image rotation module further includes a third reflector located downstream of the optical path of the second reflector and having a third reflector surface that is inclined relative to the second reflector surface.

10. The processing apparatus as described in claim 9, characterized in that, The processing apparatus further includes a driving element, wherein the driving element is connected to the first reflector, the second reflector and the third reflector, and is adapted to drive the first reflector, the second reflector and the third reflector to rotate.

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