Chip packaging material grinding device

Abstract

The utility model belongs to the technical field of semiconductor packaging, and particularly relates to a chip packaging material grinding device which comprises a polishing disc rotationally connected to a plane grinding and polishing machine body through a driving device, a mold disc is placed on the edge of the top of the polishing disc, and a balancing weight is attached to the top end of the mold disc in a pressing mode. An adjustable guide rotating assembly is installed on the edge of the right side of the top end of the plane grinding and polishing machine body. According to the chip packaging material grinding device disclosed by the utility model, when mold discs with different sizes need to be guided and rotated, a second hand screw can be loosened firstly, and a hand screw rod is operated to rotate by a handle, so that a movable block moves upwards or downwards on the hand screw rod, and two push-pull rods are arranged in a matched manner; and therefore, the two extension rods drive the guide wheels to move away from or towards the direction of the hand-screwing screw rod, and the distances between the two guide wheels and the hand-screwing screw rod can be synchronously adjusted.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor packaging technology, and specifically relates to a chip packaging material grinding device. Background Technology

[0002] In existing chip packaging material grinding and polishing processes, multiple substrates to be processed are typically fixed in a mold disk using wax bonding or vacuum adsorption to ensure stability during rotation. A guide wheel structure restricts the rotation trajectory of the mold disk, ensuring it rotates concentrically with the polishing disk, thus achieving uniform grinding. However, existing technologies have the following significant drawbacks:

[0003] The guide wheel spacing is fixed, resulting in poor adaptability.

[0004] In traditional guide wheel structures, the center distance between two guide wheels is a fixed value, such as matching the diameter of a standard mold plate, which means the device can only guide mold plates of a single size. When processing substrates of different sizes, such as switching from a 200mm diameter mold plate to a 300mm diameter mold plate, the entire guide wheel assembly must be replaced or the equipment structure adjusted. This is cumbersome and results in long downtime, severely impacting production efficiency. Therefore, a chip packaging material grinding device is proposed.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to provide a chip packaging material grinding device to solve the problem that it is difficult to achieve fast, accurate and stable adjustment of the guide roller spacing, which makes it difficult to meet the different production needs of the semiconductor packaging industry.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A chip packaging material grinding apparatus includes a polishing disc rotatably connected to a surface grinding and polishing machine body via a drive device, a mold disc placed at the top edge of the polishing disc, a counterweight pressed against the top of the mold disc, and an adjustable guide assembly installed at the top right edge of the surface grinding and polishing machine body; the adjustable guide assembly is used to guide the rotation of mold discs of different diameters.

[0009] Preferably, the adjustable guide assembly includes a support base fixedly connected to the right edge of the top of the main body of the surface grinding and polishing machine, an adjusting rod is movably inserted on the support base, and an L-shaped bracket is fixedly connected to one end of the adjusting rod away from the support base.

[0010] Preferably, the L-shaped bracket has two extension slots, which are vertically distributed between each other. The vertical cross-section of each extension slot is I-shaped. An extension rod with an I-shaped vertical cross-section is slidably connected in each of the two extension slots. The ends of the two extension rods that are far apart are rotatably connected to guide wheels through a rotating shaft.

[0011] Preferably, the diameter of the guide wheel is larger than the width of the extension rod, and the top of the support base is threaded with a first hand-tightening screw, the bottom end of which, after being tightened, abuts against the top of the adjusting rod.

[0012] Preferably, push-pull rods are rotatably connected to the top ends of the two extension rods at positions away from the pivot, and the top ends of the two push-pull rods are rotatably connected to the outer side of the same movable block. A hand-tightening screw is threaded onto the movable block, a handle is fixed to the top end of the hand-tightening screw, and the bottom end of the hand-tightening screw is rotatably connected to the top end of the L-shaped bracket.

[0013] Preferably, a second hand-tightening screw is threaded onto one end of the movable block near the support base, and the end of the second hand-tightening screw, after being tightened, abuts against the outside of the hand-tightening screw.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] (1) When the chip packaging material grinding device of this utility model needs to guide the rotation of mold disks of different sizes, the second hand screw can be loosened first, and the handle can be operated to rotate the hand screw, so that the movable block moves up or down on the hand screw. With the setting of two push-pull rods, the two extension rods can drive the guide wheels to move away from or towards the hand screw, so that the distance between the two guide wheels and the hand screw can be adjusted synchronously. Then, the first hand screw can be loosened to finely adjust the position of the two guide wheels after the spacing is adjusted, and ensure that the bottom of the mold disk can be fully attached to the top of the polishing disk.

[0016] In summary, the adjustable guide roller assembly enables the chip packaging material grinding device to achieve rapid, precise, and stable adjustment of the guide roller spacing, while simultaneously meeting the diverse production needs of the semiconductor packaging industry, thus greatly expanding the device's applicability. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall three-dimensional first-view structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the overall three-dimensional first-view structure of this utility model;

[0019] Figure 3This is an enlarged structural diagram of point A of this utility model;

[0020] Explanation of key figure labels:

[0021] 1. Main body of the surface grinding and polishing machine; 11. Polishing disc; 12. Mold disc; 13. Counterweight; 2. Adjustable guide assembly; 21. Support base; 22. Adjusting rod; 23. L-shaped bracket; 24. First hand-tightening screw; 25. Extension rod; 26. Guide wheel; 27. Push-pull rod; 28. Movable block; 29. ​​Hand-tightening screw; 210. Second hand-tightening screw. Detailed Implementation

[0022] The technical solution of this utility model patent will be clearly and completely described below. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0023] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] The guide rollers have a fixed spacing, resulting in poor adaptability.

[0026] In the traditional guide wheel 26 structure, the center distance between the two guide wheels 26 is a fixed value, for example, matching the diameter of the standard mold plate 12. This means that the device can only guide mold plates 12 of a single specification. When processing substrates of different sizes, such as switching from a 200mm diameter mold plate 12 to a 300mm diameter mold plate 12, the entire guide wheel 26 assembly must be replaced or the equipment structure adjusted. This is cumbersome and results in long downtime, severely impacting production efficiency.

[0027] See attached document Figure 1-3A chip packaging material grinding device includes a polishing disc 11 rotatably connected to a surface grinding and polishing machine body 1 via a drive device, a mold disc 12 placed at the top edge of the polishing disc 11, a counterweight block 13 pressed onto the top of the mold disc 12, and an adjustable guide component 2 installed at the top right edge of the surface grinding and polishing machine body 1; the adjustable guide component 2 is used to guide the rotation of mold discs 12 of different diameters.

[0028] The mold plate 12 ensures the stability of the substrate during rotation by using existing wax bonding or vacuum adsorption technology, which will not be described in detail here. After fixing, the bottom end of the fixed substrate is placed and attached to the top of the polishing plate 11.

[0029] The drive unit generally uses a geared motor, and a geared motor with waterproof function is used because when the polishing disc 11 rotates, polishing agent needs to be manually sprayed onto the top edge of the polishing disc 11. The model of the geared motor can be selected from the market.

[0030] Furthermore, such as Figure 1-3 As shown, in order to adjust the distance between the two guide wheels 26 and simultaneously adjust the distance between the two guide wheels 26 and the center of the polishing disc 11 after the distance is adjusted, an adjustable guide assembly 2 is provided, including a support base 21 fixed to the right edge of the top of the main body 1 of the surface grinding and polishing machine. An adjusting rod 22 is movably inserted on the support base 21. An L-shaped bracket 23 is fixed to the end of the adjusting rod 22 away from the support base 21. The L-shaped bracket 23 has two extension slots, which are vertically distributed between each other. The vertical cross-section of the extension slots is I-shaped. An extension rod 25 with an I-shaped vertical cross-section is slidably connected in each of the two extension slots. The ends of the two extension rods 25 that are far apart are rotatably connected to the guide wheels 26 through a rotating shaft. The diameter of 26 is larger than the width of extension rod 25. The top of support base 21 is threaded with a first hand-tightening screw 24. After the first hand-tightening screw 24 is tightened, its bottom end abuts against the top of adjustment rod 22. The tops of the two extension rods 25 are rotatably connected to push-pull rods 27 at positions away from the pivot. The tops of the two push-pull rods 27 are rotatably connected to the outside of the same movable block 28. The movable block 28 is threaded with a hand-tightening screw 29. The top of the hand-tightening screw 29 is fixed with a handle. The bottom end of the hand-tightening screw 29 is rotatably connected to the top of L-shaped bracket 23. The end of the movable block 28 near support base 21 is threaded with a second hand-tightening screw 210. After the second hand-tightening screw 210 is tightened, its end abuts against the outside of the hand-tightening screw 29.

[0031] The second hand-tightening screw 210 is designed to facilitate the tightening of the hand-tightening screw 29 after adjustment and rotation, so as to prevent the hand-tightening screw 29 from deflecting due to vibration generated during equipment operation, which would affect the guiding stability of the guide wheel 26.

[0032] The outer circumferential surface of the guide wheel 26 can be laser-engraved with grid patterns or knurling (not shown in the attached figure, which is existing technology) to increase the coefficient of friction between it and the outer circumference of the mold disk 12. This allows the mold disk 12 to deflect when the polishing disk 11 rotates, in conjunction with the design of the guide wheel 26 structure, so as to achieve grinding of the ceramic substrate surface.

[0033] In actual use, when it is necessary to guide the rotation of mold discs 12 of different sizes, the second hand-tightening screw 210 can be loosened first, and the handle can be operated to rotate the hand-tightening screw 29, so that the movable block 28 moves up or down on the hand-tightening screw 29. With the setting of the two push-pull rods 27, the two extension rods 25 can drive the guide wheels 26 to move away from or towards the hand-tightening screw 29, so that the distance between the two guide wheels 26 and the hand-tightening screw 29 can be adjusted synchronously. Then, the first hand-tightening screw 24 can be loosened to fine-tune the position of the two guide wheels 26 after the spacing is adjusted, and ensure that the bottom of the mold disc 12 can be fully attached to the top of the polishing disc 11.

[0034] The foregoing description of specific exemplary embodiments of the present invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the present invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the present invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the present invention, as well as various different choices and variations. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A chip packaging material grinding apparatus, comprising a polishing disc (11) rotatably connected to a planar grinding and polishing machine body (1) via a drive device, a mold disc (12) placed at the top edge of the polishing disc (11), and a counterweight (13) pressed against the top of the mold disc (12), characterized in that, An adjustable guide assembly (2) is installed at the top right edge of the main body (1) of the surface grinding and polishing machine. The adjustable guide assembly (2) is used to guide the rotation of mold disks (12) of different diameters; The adjustable guide assembly (2) includes a support base (21) fixed at the right edge of the top of the main body (1) of the plane grinding and polishing machine. An adjustment rod (22) is movably inserted on the support base (21), and an L-shaped bracket (23) is fixed at one end of the adjustment rod (22) away from the support base (21). The L-shaped bracket (23) has two extension slots, which are vertically distributed between each other. The vertical cross-section of each extension slot is I-shaped. Each extension slot is slidably connected with an extension rod (25) with an I-shaped vertical cross-section. The ends of the two extension rods (25) that are far apart are rotatably connected to guide wheels (26) through a rotating shaft.

2. The chip packaging material grinding apparatus according to claim 1, characterized in that, The diameter of the guide wheel (26) is larger than the width of the extension rod (25). The top of the support base (21) is threaded with a first hand screw (24). After the first hand screw (24) is tightened, its bottom end abuts against the top of the adjusting rod (22).

3. The chip packaging material grinding apparatus according to claim 2, characterized in that, The top ends of the two extension rods (25) are rotatably connected to push-pull rods (27) at positions away from the pivot. The top ends of the two push-pull rods (27) are rotatably connected to the outside of the same movable block (28). A hand-tightening screw (29) is threaded onto the movable block (28). A handle is fixed to the top end of the hand-tightening screw (29). The bottom end of the hand-tightening screw (29) is rotatably connected to the top end of the L-shaped bracket (23).

4. The chip packaging material grinding apparatus according to claim 3, characterized in that, A second hand-tightening screw (210) is threaded onto one end of the movable block (28) near the support base (21), and the end of the second hand-tightening screw (210) after being tightened abuts against the outside of the hand-tightening screw (29).

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