PCB copper plating device with uniform copper plating

Abstract

This utility model discloses a PCB copper plating device for uniform copper plating, including a main body, a copper plating tank inside the main body, multiple agitator bodies mounted on the side of the copper plating tank, agitator blades inside the agitator bodies, a heating block mounted at the bottom of the copper plating tank, a mounting plate at one end of the main body, and multiple board bodies mounted on one end of the mounting plate. Multiple perforations are formed on the side of each board body. This utility model, by setting up agitator bodies and agitator blades, stirs the copper ion solution in the copper plating tank by activating the agitator blades. The copper ion solution in the copper plating tank is uniformly mixed as the multiple agitator blades rotate. A drive device moves the mounting plate to the top of the copper plating tank. After the mounting plate is placed in the copper plating tank, the board bodies are immersed in the solution. The heating block is activated to heat the solution. Heating and stirring ensure uniform mixing of the solution, allowing copper ions to adhere evenly to the surface and perforations of the board bodies.

Description

Technical Field

[0001] This utility model relates to the field of PCB copper plating technology, specifically to a PCB copper plating device for uniform copper plating. Background Technology

[0002] PCB copper plating is a chemical copper plating process. Its principle involves using the reducing properties of formaldehyde in a strongly alkaline environment, and with palladium catalysis, reducing copper ions to copper, thus depositing a thin layer of chemical copper on the hole walls. In modern electronics manufacturing, PCB copper plating is a key technology. By chemically depositing a thin layer of copper on the insulating hole walls, it lays the foundation for subsequent electroplating processes, thereby enabling electrical connections between multilayer circuit boards. As people's performance requirements for electronic devices continue to increase, PCB copper plating equipment with uniform copper plating becomes particularly important. Uniform copper plating ensures reliable electrical connections between different layers of the circuit board. With the increasing complexity of circuit boards and the widespread application of multilayer boards, only by ensuring the uniformity of the copper plating layer can current be transmitted efficiently between layers, meeting the requirements of modern electronic devices for signal integrity and stability. As the substrate for electroplated copper, uniform copper plating can improve peel strength, allowing the circuit board to maintain good performance in harsh environments such as high temperature and high humidity, extending the service life of the circuit board. Uniform copper plating can reduce the scrap rate caused by plating defects, reduce production costs, and improve the economic benefits of enterprises. Therefore, PCB copper plating equipment with uniform copper plating is needed to meet people's needs. Utility Model Content

[0003] The purpose of this invention is to provide a PCB copper plating device that achieves uniform copper plating, in order to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a PCB copper plating device for uniform copper plating, comprising a copper plating device body, a copper plating tank formed inside the copper plating device body, multiple mixer bodies mounted on the side of the copper plating tank, stirring blades installed inside the mixer bodies, a heating block installed at the bottom of the copper plating tank, a mounting plate provided at one end of the copper plating device body, multiple board bodies mounted at one end of the mounting plate, and multiple through holes formed on the side of the board bodies.

[0005] Preferably, one end of the mounting plate is provided with a symmetrical limiting groove, a threaded rod is installed in the limiting groove, and a rotating disk is installed at one end of the threaded rod.

[0006] Preferably, the threaded rod is provided with a plurality of clamping blocks on its side, and the clamping blocks are provided with anti-slip grooves on their side.

[0007] Preferably, the threaded rod is rotatably installed in the limiting groove, and one end of the clamping block is threadedly connected to the side of the threaded rod.

[0008] Preferably, a connecting handle is installed at one end of the mounting plate, and symmetrical rotating disks are rotatably installed on the side of the mounting plate.

[0009] Preferably, one end of one of the main body of the plate is fixed by two clamping blocks, and multiple main bodies of the plate are fixed to one end of the mounting plate by multiple clamping blocks.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] (1) This utility model sets up a mixer body and stirring blades, etc. The stirring blades in the mixer body are started to stir the copper ion solution in the copper immersion tank. When multiple stirring blades rotate, the copper ion solution in the copper immersion tank is mixed evenly. The installation plate is moved to the top of the copper immersion tank by the driving device. After the installation plate is placed in the copper immersion tank, the plate body is immersed in the solution. The heating block is started to heat the solution. The solution is mixed evenly by heating and stirring, so that the copper ions can be evenly attached to the surface and perforations of the plate body.

[0012] (2) This utility model sets up a limiting groove and a threaded rod, etc. By rotating the rotating disk, the threaded rod is driven to rotate in the limiting groove, which can drive multiple clamping blocks to rotate and adjust the distance between two adjacent clamping blocks. This helps to better arrange and place the main body of the plate. After one end of the main body of the plate is inserted between two clamping blocks, it is pressed against the side wall of the anti-slip groove to fix the main body of the plate on the mounting plate. By installing the main body of the plate with clamping blocks of the same spacing, it can avoid the distance between the main bodies of the plate being too close or too far, and prevent uneven copper deposition due to poor solution flow. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the PCB copper plating device for uniform copper plating proposed in this utility model.

[0014] Figure 2 This is a schematic diagram of the structure of the stirring blade and copper plating tank of the PCB copper plating device for uniform copper plating proposed in this utility model.

[0015] Figure 3 This is a schematic diagram of the main body of the PCB copper plating device for uniform copper plating proposed in this utility model, including the structure of the board body and the perforations.

[0016] Figure 4 for Figure 3 Enlarged view of point A.

[0017] In the diagram: 1. Main body of the copper plating device; 2. Main body of the mixer; 3. Mixing blade; 4. Copper plating tank; 5. Heating block; 6. Mounting plate; 7. Limiting groove; 8. Threaded rod; 9. Rotating disc; 10. Clamping block; 11. Anti-slip groove; 12. Main body of the plate; 13. Perforation; 14. Connecting handle. Detailed Implementation

[0018] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1: Please refer to Figure 1-4This utility model provides a technical solution: a PCB copper plating device for uniform copper plating, comprising a copper plating device body 1, a copper plating tank 4 inside the copper plating device body 1, multiple agitator bodies 2 mounted on the side of the copper plating tank 4, stirring blades 3 installed inside the agitator bodies 2, a heating block 5 installed at the bottom of the copper plating tank 4, a mounting plate 6 at one end of the copper plating device body 1, multiple board bodies 12 mounted on one end of the mounting plate 6, multiple perforations 13 on the side of the board bodies 12, one end of the board bodies 12 being fixed by two clamps 10, and multiple board bodies 12 being fixed to one end of the mounting plate 6 by multiple clamps 10. When copper plating is required, the mixed solution is poured into the copper plating tank 4, and the multiple agitator bodies 2 are started to drive the stirring blades 3 to rotate, thus uniformly dissolving the copper plating solution. The liquid is stirred to ensure thorough mixing of the copper plating solution, avoiding excessively high or low copper ion concentrations and ensuring the uniformity of the copper plating layer. Simultaneously, the stirring intensity of the stirring blades 3 is controlled to prevent excessive stirring and air bubbles from entering the solution, affecting the quality of the copper plating. The main body 12 of the board is fixed to the mounting plate 6 and installed using clamps 10 with equal spacing. This prevents the main bodies 12 from being too close or too far apart, avoiding uneven copper plating due to poor solution flow. The main body 12 is then inserted into the copper plating tank 4 for immersion using a crane or similar equipment installed at one end of the connecting handle 14. Simultaneously, the stirring blades 3 and heating blocks 5 operate to heat and stir the solution, accelerating the deposition of copper ions on the surface of the main body 12 and the inner wall of the perforations 13, resulting in more uniform copper plating.

[0022] Example 2: Figure 2-4 As shown, one end of the mounting plate 6 has a symmetrical limiting groove 7, and a threaded rod 8 is installed in the limiting groove 7. A rotating disk 9 is installed at one end of the threaded rod 8, and multiple clamping blocks 10 are installed on the side of the threaded rod 8. The side of the clamping blocks 10 has an anti-slip groove 11. The threaded rod 8 is rotatably installed in the limiting groove 7, and one end of the clamping block 10 is threadedly connected to the side of the threaded rod 8. One end of the mounting plate 6 is installed with a connecting handle 14, and the side of the mounting plate 6 is rotatably installed with a symmetrical rotating disk 9. When the main body of the plate 12 is taken out, rotating the rotating disk 9 drives the threaded rod 8 to rotate, which in turn drives the multiple clamping blocks 10 to slide in the limiting groove 7. By rotating the threaded rod 8, the distance between two adjacent clamping blocks 10 can be adjusted to help to better arrange the main body of the plate 12. One end of the main body of the plate 12 is inserted between two clamping blocks 10, and the main body of the plate 12 is prevented from sliding by pressing against the side wall of the anti-slip groove 11. The remaining features are the same as in Embodiment 1.

[0023] The working principle is as follows: When copper plating is required, the mixed solution is poured into the copper plating tank 4. Multiple agitators 2 are started, driving the agitator blades 3 to rotate and stir the solution, ensuring thorough mixing and preventing the copper ion concentration from being too high or too low, thus ensuring the uniformity of the copper plating layer. Simultaneously, the stirring intensity of the agitator blades 3 is controlled to prevent excessive stirring and air bubbles from entering the solution, affecting the copper plating quality. The board body 12 is then removed, and the rotating disk 9 drives the threaded rod 8 to rotate, which in turn drives multiple clamping blocks 10 to slide within the limiting groove 7. The distance between adjacent clamping blocks 10 is adjusted by rotating the threaded rod 8, helping to better arrange and place the board body 12. One end is inserted between two clamping blocks 10. By squeezing against the side wall of the anti-slip groove 11, the main body of the plate 12 is prevented from sliding, thereby fixing the main body of the plate 12 onto the mounting plate 6. The main body of the plate 12 is installed by clamping blocks 10 with the same spacing, which can avoid the distance between the main bodies of the plate 12 being too close or too far, and prevent uneven copper deposition due to poor solution flow. The main body of the plate 12 is installed at one end of the connecting handle 14 by a crane or other equipment, and is inserted into the copper deposition tank 4 for immersion. At the same time, the stirring blade 3 and the heating block 5 work to heat and stir the solution, which accelerates the deposition of copper ions on the surface of the main body of the plate 12 and the inner wall of the perforation 13, making the copper deposition more uniform.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A PCB copper plating apparatus for uniform copper plating, comprising a main body of the copper plating apparatus (1), characterized in that: The copper plating device body (1) has a copper plating tank (4) inside. Multiple mixer bodies (2) are installed on the side of the copper plating tank (4). Mixing blades (3) are installed inside the mixer bodies (2). A heating block (5) is installed at the bottom of the copper plating tank (4). A mounting plate (6) is provided at one end of the copper plating device body (1). Multiple plate bodies (12) are installed at one end of the mounting plate (6). Multiple perforations (13) are opened on the side of the plate bodies (12).

2. The PCB copper plating apparatus for uniform copper plating according to claim 1, characterized in that: The mounting plate (6) has a symmetrical limiting groove (7) at one end, a threaded rod (8) is installed in the limiting groove (7), and a rotating disk (9) is installed at one end of the threaded rod (8).

3. The PCB copper plating apparatus for uniform copper plating according to claim 2, characterized in that: The threaded rod (8) has multiple clamping blocks (10) installed on its side, and the clamping blocks (10) have anti-slip grooves (11) on their side.

4. The PCB copper plating apparatus for uniform copper plating according to claim 3, characterized in that: The threaded rod (8) is rotatably installed in the limiting groove (7), and one end of the clamping block (10) is threadedly connected to the side of the threaded rod (8).

5. The PCB copper plating apparatus for uniform copper plating according to claim 2, characterized in that: A connecting handle (14) is installed at one end of the mounting plate (6), and a symmetrical rotating disk (9) is rotatably installed on the side of the mounting plate (6).

6. The PCB copper plating apparatus for uniform copper plating according to claim 3, characterized in that: One end of one of the plate bodies (12) is fixed by two clamps (10), and multiple plate bodies (12) are fixed to one end of the mounting plate (6) by multiple clamps (10).

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