A cooling device for thermally conductive structural adhesive

Abstract

This utility model discloses a cooling device for thermally conductive structural adhesive, relating to the field of chemical technology. It includes a guide platform located below a feeding platform. Two rows of heat dissipation pipes are longitudinally arranged on the bottom surface of the guide platform, with an even number of pipes in each row. The heat dissipation pipes penetrate the bottom surface of the guide platform, and their top surfaces are flush with the inner bottom surface of the guide platform. A convection chamber is located at the bottom end of the guide platform, with all heat dissipation pipes located inside the convection chamber. An air inlet is located at the center of the longitudinal end of each heat dissipation pipe in the convection chamber. Multiple first air outlets are located at the transverse ends of each heat dissipation pipe in the convection chamber, with the number of first air outlets equal to the transverse number of heat dissipation pipes. The center of each first air outlet coincides with the center of the side surface of the heat dissipation pipe. This utility model provides a cooling device for thermally conductive structural adhesive by incorporating an air extractor, which directly absorbs some of the heat dissipated by the high-temperature adhesive within the heat dissipation pipes.

Description

Technical Field

[0001] This utility model relates to the field of chemical technology, and in particular to a cooling device for a thermally conductive structural adhesive. Background Technology

[0002] Thermally conductive structural adhesives are special adhesives that combine excellent thermal conductivity with high-strength bonding capabilities. They are widely used in applications requiring efficient heat dissipation and reliable mechanical connections. Thermally conductive structural adhesives can rapidly conduct heat from the heat source to the heat dissipation device, effectively reducing temperature and preventing overheating damage. By forming a good thermal contact interface between the heat-generating element and the heat sink, they reduce localized hot spots and ensure uniform heat distribution throughout the entire heat dissipation system. In addition to excellent thermal conductivity, thermally conductive structural adhesives also possess high mechanical strength, providing reliable bonding to various materials and ensuring a stable connection between components. They are suitable for applications with high dynamic loads, maintaining good adhesion even under vibration or impact. Thermally conductive structural adhesives can be used as sealing materials to prevent dust, moisture, and other contaminants from entering sensitive areas, improving equipment reliability and lifespan. Some types of thermally conductive structural adhesives also possess good electrical insulation properties, ensuring thermal conductivity while preventing short-circuit risks.

[0003] Cooling is a crucial step in the production of structural adhesives, especially during the curing process. Proper cooling can prevent the material from degrading or being damaged due to excessively high temperatures. Because thermally conductive structural adhesives have good heat dissipation and sealing properties, traditional cooling curing methods can lead to a significant temperature difference between the inside and outside of the adhesive during the cooling process, affecting the final product's performance.

[0004] Therefore, a cooling device for thermally conductive structural adhesive is provided, which improves the cooling uniformity of the adhesive and enhances the finished product performance. Utility Model Content

[0005] Therefore, the purpose of this invention is to provide a cooling device for thermally conductive structural adhesives to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a cooling device for thermally conductive structural adhesive, comprising a feeding platform, a guide platform below the feeding platform, two rows of heat dissipation pipes arranged longitudinally on the bottom surface of the guide platform, each row having an even number of heat dissipation pipes laterally, the heat dissipation pipes penetrating the bottom surface of the guide platform, the top surface of the heat dissipation pipes being flush with the inner bottom surface of the guide platform; a convection chamber is provided at the bottom end of the guide platform, the heat dissipation pipes are all located inside the convection chamber, the convection chamber has an air inlet at the center of the longitudinal end of the heat dissipation pipe, and the convection chamber has multiple first air outlets at the transverse end of the heat dissipation pipe, the number of first air outlets being the same as the transverse number of heat dissipation pipes, the center of the first air outlets coinciding with the center of the side of the heat dissipation pipe.

[0007] As a preferred embodiment of the cooling device for the thermally conductive structural adhesive described in this utility model, one end of the first air outlet pipe coincides with the inner wall of the convection chamber, and the other end of the first air outlet pipe is provided with a first collection platform. The other ends of the two first air outlet pipes are connected to both sides of the first collection platform, and the first air outlet pipes are symmetrical to each other on both sides of the first collection platform.

[0008] As a preferred embodiment of the cooling device for the thermally conductive structural adhesive described in this utility model, the first collecting platform is provided with a second air outlet pipe at the center of one end facing away from the feeding platform. The second air outlet pipe, the first collecting platform, and the first air outlet pipe are interconnected. The second air outlet pipe is frustum-shaped, and the smaller end of the second air outlet pipe is connected to the first collecting platform.

[0009] In a preferred embodiment of the cooling device for the thermally conductive structural adhesive described in this utility model, a guide pipe is provided at the larger end of the second air outlet pipe, and a second collection platform is provided at the other end of the guide pipe. The guide pipes are located on both sides of the second collection platform and are symmetrical to each other on both sides of the second collection platform. The second air outlet pipe, the guide pipe, and the second collection platform are interconnected. A second collection platform exhaust pipe is provided at the center of the end of the second collection platform facing away from the feed platform. An air extractor is provided at the other end of the second collection platform exhaust pipe. Support frames are provided at both ends of the air extractor, and a support pipe is connected between the bottom ends of the support frames.

[0010] As a preferred embodiment of the cooling device for the thermally conductive structural adhesive described in this utility model, one end of the air inlet is flush with the inner wall of the convection chamber, the side of the air inlet coincides with the centerline of the heat dissipation pipe, and a filter plate is provided inside the air inlet, the shape and size of the filter plate being the same as the shape and size of the inner diameter of the air inlet.

[0011] As a preferred embodiment of the cooling device for the thermally conductive structural adhesive described in this utility model, the following is provided: a first guide block is provided on both sides of the inner bottom surface of the guide platform, the edge of the first guide block coincides with the edge of the heat dissipation pipe, and a second guide block is provided between the heat dissipation pipes on the inner bottom surface of the guide platform, the height of the second guide block coincides with the height of the first guide block, and the side of the second guide block coincides with the edge of the heat dissipation pipe.

[0012] As a preferred embodiment of the cooling device for the thermally conductive structural adhesive described in this utility model, a bottom plate is provided on the bottom surface of the convection chamber, and one end of the heat dissipation pipe passes through the bottom plate.

[0013] As a preferred embodiment of the cooling device for the thermally conductive structural adhesive described in this utility model, a second support seat is provided at the center of the bottom surface of the first collection platform, and the other end of the second support seat is flush with the bottom surface of the support tube. A first support seat is provided at the center of the bottom surface of the second collection platform, and the other end of the first support seat is flush with the bottom surface of the support tube.

[0014] The beneficial effects of this utility model are:

[0015] 1. This utility model provides a cooling device for thermally conductive structural adhesive, which uses an air extractor to directly remove some of the heat emitted by the high-temperature adhesive inside the heat dissipation pipe.

[0016] 2. This utility model provides a cooling device for thermally conductive structural adhesive. By setting an air inlet, when the air pump sucks out part of the air inside the convection chamber, the air pressure inside the convection chamber decreases. The cold air outside the convection chamber enters the convection chamber from the air inlet, contacts the side of the heat dissipation pipe and exchanges heat, thereby cooling the adhesive inside the heat dissipation pipe. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0018] Figure 1 This is a schematic diagram of the overall structure of the cooling device for a thermally conductive structural adhesive according to this utility model.

[0019] Figure 2 This is a top view of a cooling device for a thermally conductive structural adhesive according to this utility model;

[0020] Figure 3 This is a bottom view of a cooling device for a thermally conductive structural adhesive according to this utility model;

[0021] Figure 4 This is a partial cross-sectional view of a cooling device for a thermally conductive structural adhesive according to this utility model;

[0022] Figure 5 This is a partial structural schematic diagram of a cooling device for a thermally conductive structural adhesive according to this utility model.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Feeding platform; 11. Guide platform; 12. First guide block; 13. Second guide block; 2. Heat dissipation pipe; 3. Convection chamber; 31. Air inlet; 32. Filter plate; 33. Base plate; 4. First air outlet pipe; 41. First collection platform; 42. Second air outlet pipe; 43. Guide pipe; 44. Second collection platform; 45. Exhaust pipe; 46. Air extractor; 47. Support frame; 48. Support pipe; 5. First support base; 51. Second support base. Detailed Implementation

[0025] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0026] Reference Figure 1-5 This invention provides a cooling device for a thermally conductive structural adhesive. The cooling device includes a feeding platform 1, a guide platform 11 below the feeding platform 1, two rows of heat dissipation pipes 2 arranged longitudinally on the bottom surface of the guide platform 11, each row having an even number of heat dissipation pipes 2 in the lateral direction, the heat dissipation pipes 2 penetrating the bottom surface of the guide platform 11, and the top surface of the heat dissipation pipes 2 being flush with the inner bottom surface of the guide platform 11; a convection chamber 3 is provided at the bottom end of the guide platform 11, the heat dissipation pipes 2 are all located inside the convection chamber 3, the convection chamber 3 has an air inlet 31 at the center of the longitudinal end of the heat dissipation pipes 2, and the convection chamber 3 has multiple first air outlet pipes 4 at the lateral end of the heat dissipation pipes 2, the number of first air outlet pipes 4 being the same as the lateral number of heat dissipation pipes 2, and the center of the first air outlet pipes 4 coinciding with the center of the side of the heat dissipation pipes 2.

[0027] Specifically, a guide platform 11 is provided below the feeding platform 1. Two rows of heat dissipation pipes 2 are longitudinally arranged on the bottom surface of the guide platform 11, with an even number of pipes in each row. The heat dissipation pipes 2 penetrate the bottom surface of the guide platform 11, and their top surfaces are flush with the inner bottom surface of the guide platform 11. The guide platform 11 is frustum-shaped, facilitating the flow of the colloid from the feeding platform 1 to the heat dissipation pipes 2 at the bottom of the guide platform 11, and the discharge of the colloid through the heat dissipation pipes 2. A convection chamber 3 is provided at the bottom end of the guide platform 11, and all heat dissipation pipes 2 are located inside the convection chamber 3. 2. The material with good thermal conductivity is used to facilitate the centralized treatment of the heat dissipated by the colloid in the heat dissipation pipe 2 through the convection chamber 3. The convection chamber 3 is provided with an air inlet 31 at the center of the longitudinal end of the heat dissipation pipe 2, and multiple first air outlet pipes 4 are provided at the transverse end of the heat dissipation pipe 2. The number of first air outlet pipes 4 is the same as the transverse number of heat dissipation pipes 2. The center of the first air outlet pipe 4 coincides with the center of the side of the heat dissipation pipe 2. Through the cooperation of the air inlet 31 and the first air outlet pipes 4, the convection exchange of air inside and outside the convection chamber 3 is realized, which facilitates the removal of heat from inside the convection chamber 3.

[0028] One end of the first exhaust pipe 4 coincides with the inner wall of the convection chamber 3, and the other end of the first exhaust pipe 4 is provided with a first collection platform 41. The other ends of the two first exhaust pipes 4 are connected to the two sides of the first collection platform 41, and the first exhaust pipes 4 are symmetrical to each other on both sides of the first collection platform 41.

[0029] Specifically, the heat dissipated by the heat dissipation pipes 2 corresponding to the two first air outlet pipes 4 can be carried out simultaneously through the first collection platform 41.

[0030] The first collection platform 41 has a second air outlet 42 at the center of the end facing away from the feeding platform 1. The second air outlet 42, the first collection platform 41 and the first air outlet 4 are connected to each other. The second air outlet 42 is frustum-shaped, and the smaller end of the second air outlet 42 is connected to the first collection platform 41.

[0031] Specifically, the heat inside the first collection platform 41 is dissipated more quickly through the frustum-shaped second vent pipe 42.

[0032] The larger end of the second exhaust pipe 42 is provided with a guide pipe 43, and the other end of the guide pipe 43 is provided with a second collection platform 44. The guide pipe 43 is located on both sides of the second collection platform 44 and is symmetrical to each other on both sides of the second collection platform 44. The second exhaust pipe 42, the guide pipe 43 and the second collection platform 44 are connected to each other. The center of the end of the second collection platform 44 facing away from the feed platform 1 is provided with a second collection platform exhaust pipe 45. The other end of the second collection platform exhaust pipe 45 is provided with a vacuum pump 46. The two ends of the vacuum pump 46 are provided with support frames 47, and the bottom ends of the support frames 47 are connected by a support pipe 48.

[0033] Specifically, the gas is drawn outward from the second collection platform 44 by the vacuum pump 46, so that the high-temperature gas inside the multiple first collection platforms 41 is concentrated and drawn into the second collection platform 44, and then drawn outward from the exhaust pipe 45 of the second collection platform. The vacuum pump 46 is supported by the support frame 47 and the support pipe 48.

[0034] One end of the air inlet 31 is flush with the inner wall of the convection chamber 3, and the side of the air inlet 31 coincides with the center line of the heat dissipation pipe 2. A filter plate 32 is installed inside the air inlet 31, and the shape and size of the filter plate 32 are the same as the shape and size of the inner diameter of the air inlet 31.

[0035] Specifically, after the air pump 46 extracts the gas from the convection chamber 3, the air pressure inside the convection chamber 3 decreases, and the low-temperature air from the outside enters the interior of the convection chamber 3 from the air inlets 31 on both sides, covering all the sides of the heat dissipation pipes 2 for cooling, and then simultaneously cooling the colloid inside the heat dissipation pipes 2; the air entering the convection chamber 3 is filtered through the filter plate 32.

[0036] The inner bottom surface of the guide platform 11 is provided with two sides of the first guide block 12, the edge of the first guide block 12 coincides with the edge of the heat sink 2, and the inner bottom surface of the guide platform 11 is provided with a second guide block 13 between the heat sink 2, the height of the second guide block 13 coincides with the height of the first guide block 12, and the side of the second guide block 13 coincides with the edge of the heat sink 2.

[0037] Specifically, the first guide block 12 and the second guide block 13 facilitate the entry of the colloid inside the guide platform 11 into the heat dissipation pipe 2.

[0038] The bottom surface of the convection chamber 3 is provided with a bottom plate 33, and one end of the heat dissipation pipe 2 passes through the bottom plate 33.

[0039] Specifically, one end of the heat pipe 2 is fixed by the base plate 33.

[0040] A second support base 51 is provided at the center of the bottom surface of the first assembly platform 41, and the other end of the second support base 51 is flush with the bottom surface of the support tube 48. A first support base 5 is provided at the center of the bottom surface of the second assembly platform 44, and the other end of the first support base 5 is flush with the bottom surface of the support tube 48.

[0041] Specifically, the first support base 5 and the second support base 51 provide support for the second assembly platform 44 and the first assembly platform 41, respectively.

[0042] During use, the high-temperature colloid enters the guide platform 11 from the feeding platform 1 and is then added to each heat dissipation pipe 2. Before the colloid enters the heat dissipation pipe 2, the air pump 46 is started to circulate air inside and outside the convection chamber 3. After the colloid enters the heat dissipation pipe 2, the air pump 46 first absorbs some of the heat, and then the outside cold air enters the interior of the convection chamber 3 from the air inlet 31 to exchange with the heat inside the convection chamber 3, and together cool the heat dissipation pipe 2.

[0043] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A cooling device for heat conductive structural adhesive comprising a feeding table (1), characterized in that: Below the feeding platform (1) is a guide platform (11). Two rows of heat dissipation pipes (2) are arranged longitudinally on the bottom surface of the guide platform (11). The number of heat dissipation pipes (2) in each row is even. The heat dissipation pipes (2) penetrate the bottom surface of the guide platform (11). The top surface of the heat dissipation pipes (2) is flush with the inner bottom surface of the guide platform (11). A convection chamber (3) is arranged at the bottom end of the guide platform (11). The heat dissipation pipes (2) are all located inside the convection chamber (3). An air inlet (31) is arranged at the center of the longitudinal end of the heat dissipation pipes (2). Multiple first air outlet pipes (4) are arranged at the transverse end of the heat dissipation pipes (2). The number of first air outlet pipes (4) is the same as the transverse number of the heat dissipation pipes (2). The center of the first air outlet pipe (4) coincides with the center of the side of the heat dissipation pipe (2).

2. The cooling device of the heat-conductive structural adhesive according to claim 1, characterized in that: One end of the first exhaust pipe (4) overlaps with the inner wall of the convection chamber (3), and the other end of the first exhaust pipe (4) is provided with a first collection platform (41). The other ends of the two first exhaust pipes (4) are connected to the two sides of the first collection platform (41), and the first exhaust pipes (4) are symmetrical to each other on both sides of the first collection platform (41).

3. The cooling device of a heat-conductive structural adhesive according to claim 2, characterized in that: The first collection platform (41) has a second air outlet (42) at the center of one end facing away from the feeding platform (1). The second air outlet (42), the first collection platform (41) and the first air outlet (4) are connected to each other. The second air outlet (42) is frustum-shaped. The smaller end of the second air outlet (42) is connected to the first collection platform (41).

4. The cooling device of a heat-conductive structural adhesive according to claim 3, characterized in that: The larger end of the second air outlet pipe (42) is provided with a guide pipe (43), and the other end of the guide pipe (43) is provided with a second collection platform (44). The guide pipe (43) is located on both sides of the second collection platform (44). The guide pipes (43) are symmetrical on both sides of the second collection platform (44). The second air outlet pipe (42), the guide pipe (43) and the second collection platform (44) are connected to each other. The center of the end of the second collection platform (44) facing away from the feed table (1) is provided with a second collection platform exhaust pipe (45). The other end of the second collection platform exhaust pipe (45) is provided with a vacuum pump (46). The two ends of the vacuum pump (46) are provided with support frames (47). The bottom ends of the support frames (47) are connected by a support pipe (48).

5. A cooling device for a thermally conductive structural adhesive according to claim 4, characterized in that: One end of the air inlet (31) is flush with the inner wall of the convection chamber (3), the side of the air inlet (31) coincides with the center line of the heat dissipation pipe (2), and a filter plate (32) is provided inside the air inlet (31). The shape and size of the filter plate (32) are the same as the shape and size of the inner diameter of the air inlet (31).

6. The cooling device for a thermally conductive structural adhesive according to claim 5, characterized in that: The inner bottom surface of the guide platform (11) is provided with a first guide block (12) on both sides. The edge of the first guide block (12) coincides with the edge of the heat sink (2). The inner bottom surface of the guide platform (11) is provided with a second guide block (13) between the heat sink (2). The height of the second guide block (13) coincides with the height of the first guide block (12). The side of the second guide block (13) coincides with the edge of the heat sink (2).

7. A cooling device for a thermally conductive structural adhesive according to claim 6, characterized in that: The bottom surface of the convection chamber (3) is provided with a bottom plate (33), and one end of the heat dissipation pipe (2) passes through the bottom plate (33).

8. The cooling device for a thermally conductive structural adhesive according to claim 7, characterized in that: A second support base (51) is provided at the center of the bottom surface of the first collection platform (41), and the other end of the second support base (51) is flush with the bottom surface of the support tube (48). A first support base (5) is provided at the center of the bottom surface of the second collection platform (44), and the other end of the first support base (5) is flush with the bottom surface of the support tube (48).

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