Semiconductor module testing equipment

Abstract

This application relates to a semiconductor module testing device, comprising a fixture plate for holding a semiconductor module, the fixture plate having an interface for connecting to the pins of various functional devices in the semiconductor module; a test box including a current source, a measurement unit, and a switch module, the switch module connecting the current source and the measurement unit, and also connecting to the interface of the fixture plate; the switch module, through switching, changes the connection relationship between the current source, the measurement unit, and the interface of the fixture plate, enabling the current source and the measurement unit to perform pin contact tests on various functional devices in the semiconductor module; and an insulation withstand voltage tester connected to the switch module, the switch module also changing the connection relationship between the insulation withstand voltage tester and the interface of the fixture plate, enabling the insulation withstand voltage tester to perform insulation tests on the semiconductor module. By simply switching the switch module, pin contact tests and insulation tests on the semiconductor module can be performed separately, improving testing efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a semiconductor module testing device. Background Technology

[0002] Insulation withstand voltage testing typically involves connecting an insulation withstand voltage tester to two locations on the device under test (DUT) to measure the insulation performance between these locations. Insulation withstand voltage testing is a technical method for verifying and evaluating the insulation withstand capability of electrical equipment; simply put, it tests the device's ability to withstand overvoltage. During the test, it's impossible to guarantee that all pins of the semiconductor module will have good contact with the withstand voltage tester, which may lead to false readings. Therefore, pin contact testing of the semiconductor module is necessary.

[0003] Traditional insulation withstand voltage testing methods typically use the Kelvin four-wire method to determine if the pins of the device under test (DUT) are making good contact with the test probes before reconnecting the wires to perform an insulation test to determine the quality of the DUT. This increases the testing time and reduces testing efficiency. Utility Model Content

[0004] Therefore, it is necessary to provide a semiconductor module testing device that can improve testing efficiency to address the above problems.

[0005] A semiconductor module testing device, comprising:

[0006] A fixture plate is used to place a semiconductor module. The fixture plate is provided with an interface that is connected to the pins of each functional device in the semiconductor module.

[0007] The test box includes a current source, a measurement unit, and a switch switching module. The switch switching module connects the current source and the measurement unit, and also connects to the interface of the fixture plate. The switch switching module changes the connection relationship between the current source, the measurement unit, and the interface of the fixture plate by switching the switch, so that the current source and the measurement unit can perform pin contact tests on each functional device in the semiconductor module.

[0008] An insulation withstand voltage tester is connected to the switch switching module. The switch switching module also changes the connection relationship between the interface of the insulation withstand voltage tester and the fixture plate by switching, so that the insulation withstand voltage tester can perform insulation testing on the semiconductor module.

[0009] In one embodiment, the test box further includes a control unit connected to the current source and the measurement unit, which controls the current source to output current to the corresponding functional devices in the semiconductor module, and acquires measurement data output by the measurement unit for detecting the contact status of the semiconductor module pins.

[0010] In one embodiment, the switch switching module includes an output measurement switching unit, a withstand voltage tester switching unit, a high-side bus, a low-side bus, and an interface switching unit. The output measurement switching unit is connected to the current source, the measurement unit, the high-side bus, and the low-side bus. The withstand voltage tester switching unit is connected to the insulation withstand voltage tester, the high-side bus, and the low-side bus. The interface switching unit is connected to the high-side bus, the low-side bus, and the interface of the fixture plate.

[0011] When the switch in the output measurement switching unit is closed, and the relevant switch in the interface switching unit is closed, the current source and the measurement unit perform pin contact tests on the corresponding functional devices in the semiconductor module; when the switch in the withstand voltage tester switching unit is closed, and the relevant switch in the interface switching unit is closed, the insulation withstand voltage tester performs insulation tests on the semiconductor module.

[0012] In one embodiment, the output measurement switching unit includes switches K21A, K22A, K23A, and K24A. A first terminal of switch K21A is connected to the high-side measurement interface of the measurement unit, and a second terminal of switch K21A is connected to the high-side bus. A first terminal of switch K22A is connected to the high-side output interface of the current source, and a second terminal of switch K22A is connected to the high-side bus. A first terminal of switch K23A is connected to the low-side output interface of the current source, and a second terminal of switch K23A is connected to the low-side bus. A first terminal of switch K24A is connected to the low-side measurement interface of the measurement unit, and a second terminal of switch K24A is connected to the low-side bus.

[0013] In one embodiment, the functional device in the semiconductor module includes a half-bridge module, which is connected to interfaces 1, 2, and 3 of the fixture plate; the interface switching unit includes switches K1A, K2A, K3A, K4A, K5A, and K6A, wherein the first end of switch K1A is connected to the high-side bus, and the second end of switch K1A is connected to interface 1 of the fixture plate; the first end of switch K2A is connected to the low-side bus, and the second end of switch K2A is connected to interface 1 of the fixture plate; the first end of switch K3A is connected to the high-side bus, and the second end of switch K3A is connected to interface 2 of the fixture plate; the first end of switch K4A is connected to the low-side bus, and the second end of switch K4A is connected to interface 2 of the fixture plate; the first end of switch K5A is connected to the high-side bus, and the second end of switch K5A is connected to interface 3 of the fixture plate; and the first end of switch K6A is connected to the low-side bus, and the second end of switch K6A is connected to interface 3 of the fixture plate.

[0014] When the switches in the output measurement switching unit are closed, and switches K1A and K4A are closed, or when the switches in the output measurement switching unit are closed, and switches K2A and K3A are closed, the current source and the measurement unit perform pin contact tests on the upper transistor of the half-bridge module.

[0015] When the switches in the output measurement switching unit are closed, such as switches K3A and K6A, or when the switches in the output measurement switching unit are closed, such as switches K4A and K5A, the current source and the measurement unit perform pin contact tests on the lower transistor of the half-bridge module.

[0016] In one embodiment, the functional device in the semiconductor module further includes a thermistor, which is connected to interface 4 and interface 5 of the fixture plate; the interface switching unit further includes switches K7A, K8A, K9A and K10A, the first end of switch K7A is connected to the high-side bus, the second end of switch K7A is connected to interface 4 of the fixture plate, the first end of switch K8A is connected to the low-side bus, the second end of switch K8A is connected to interface 4 of the fixture plate, the first end of switch K9A is connected to the high-side bus, the second end of switch K9A is connected to interface 5 of the fixture plate, and the first end of switch K10A is connected to the low-side bus, the second end of switch K10A is connected to interface 5 of the fixture plate;

[0017] When the switches in the output measurement switching unit are closed, such as switches K7A and K10A, or when switches K8A and K9A are closed, the current source and the measurement unit perform pin contact tests on the thermistor.

[0018] In one embodiment, the functional device in the semiconductor module further includes a circuit breaker, which is connected to interfaces 6, 7, and 8 of the fixture plate; the interface switching unit further includes switches K11A, K12A, K13A, K14A, K15A, and K16A, wherein the first terminal of switch K11A is connected to the high-side bus, the second terminal of switch K11A is connected to interface 6 of the fixture plate, the first terminal of switch K12A is connected to the low-side bus, and the second terminal of switch K12A is connected to... The first end of switch K13A is connected to the high-end bus, and the second end of switch K13A is connected to the interface 7 of the fixture plate. The first end of switch K14A is connected to the low-end bus, and the second end of switch K14A is connected to the interface 7 of the fixture plate. The first end of switch K15 is connected to the high-end bus, and the second end of switch K15 is connected to the interface 8 of the fixture plate. The first end of switch K16A is connected to the low-end bus, and the second end of switch K16A is connected to the interface 8 of the fixture plate.

[0019] When the switch in the output measurement switching unit is closed, and switch K11A and switch K14A are closed, or when the switch in the output measurement switching unit is closed, and switch K12A and switch K13A are closed, the current source and the measurement unit perform pin contact tests on the diode in the circuit breaker.

[0020] When the switch in the output measurement switching unit is closed, or when switch K13A and switch K16A are closed, or when the switch in the output measurement switching unit is closed, or when switch K14A and switch K15A are closed, the current source and the measurement unit perform pin contact tests on the switching transistors in the circuit breaker.

[0021] In one embodiment, the functional device in the semiconductor module further includes a heat sink, which is connected to interfaces 9 and 10 of the fixture plate; the interface switching unit further includes switches K17A, K18A, K19A, and K20A, the first end of switch K17A is connected to the high-side bus, the second end of switch K17A is connected to interface 9 of the fixture plate, the first end of switch K18A is connected to the low-side bus, the second end of switch K18A is connected to interface 9 of the fixture plate, the first end of switch K19A is connected to the high-side bus, the second end of switch K19A is connected to interface 10 of the fixture plate, and the first end of switch K20A is connected to the low-side bus, the second end of switch K20A is connected to interface 10 of the fixture plate;

[0022] When the switches in the output measurement switching unit are closed, such as switches K17A and K20A, or when the switches in the output measurement switching unit are closed, such as switches K18A and K19A, the current source and the measurement unit perform pin contact tests on the heat sink.

[0023] In one embodiment, the withstand voltage tester switching unit includes switch K25A, switch K26A and a resistor network unit. The first terminal of switch K25A is connected to the positive input terminal of the withstand voltage tester through the resistor network unit, the second terminal of switch K25A is connected to the high-side bus, the first terminal of switch K26A is connected to the negative input terminal of the withstand voltage tester, and the second terminal of switch K26A is connected to the low-side bus.

[0024] When switches K1A, K3A, K5A, K11A, K13A, K15A, K8A, K10A, K25A, and K26A are closed, or when switches K2A, K4A, K6A, K12A, K14A, K16A, K7A, K9A, K25A, and K26A are closed, the insulation withstand voltage tester performs an insulation test on the semiconductor module; and / or

[0025] When switches K1A, K3A, K5A, K11A, K13A, K15A, K7A, K9A, K18A, K20A, K25A, and K26A are closed, or when switches K2A, K4A, K6A, K12A, K14A, K16A, K8A, K10A, K17A, K19A, K25A, and K26A are closed, the insulation withstand voltage tester performs an insulation test on the semiconductor module.

[0026] In one embodiment, the semiconductor module is an IGBT module, wherein the upper and lower transistors of the half-bridge module and the switching transistor of the circuit breaker are all IGBTs.

[0027] The aforementioned semiconductor module testing device connects the interface of the fixture plate to the pins of each functional device in the semiconductor module. A switching module changes the connection between the current source, the measuring unit, and the fixture plate interface via a switch, enabling the current source and measuring unit to perform pin contact tests on each functional device in the semiconductor module. The switching module also changes the connection between the insulation withstand voltage tester and the fixture plate interface via a switch, enabling the insulation withstand voltage tester to perform insulation tests on the semiconductor module. By simply switching the switches using the switching module, pin contact tests and insulation tests can be performed on the semiconductor module separately, reducing testing time and improving testing efficiency. Attached Figure Description

[0028] Figure 1 This is a structural block diagram of a semiconductor module testing device in one embodiment;

[0029] Figure 2 This is a schematic diagram of a half-bridge module in a semiconductor module in one embodiment;

[0030] Figure 3 This is a schematic diagram of a thermistor in a semiconductor module in one embodiment;

[0031] Figure 4 This is a schematic diagram of a circuit breaker in a semiconductor module in one embodiment;

[0032] Figure 5 This is a schematic diagram of a heat sink in a semiconductor module in one embodiment;

[0033] Figure 6 This is a structural block diagram of a semiconductor module testing apparatus in another embodiment;

[0034] Figure 7This is a circuit diagram of a switch switching module in one embodiment. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0037] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0038] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, operations, components, parts, or combinations thereof.

[0039] In one embodiment, such as Figure 1 As shown, a semiconductor module testing device is provided, including a fixture plate 100, a test box 200, and an insulation withstand voltage tester 300. The fixture plate 100 is used to place the semiconductor module and has an interface that connects to the pins of various functional devices in the semiconductor module. The test box 200 includes a current source 210, a measurement unit 220, and a switch module 230. The switch module 230 connects the current source 210 and the measurement unit 220, and is also connected to the interface of the fixture plate 100. The switch module 230 changes the connection relationship between the current source 210, the measurement unit 220, and the interface of the fixture plate 100 by switching, so that the current source 210 and the measurement unit 220 can perform pin contact tests on various functional devices in the semiconductor module. The insulation withstand voltage tester 300 is connected to the switch switching module 230. The switch switching module 230 also changes the connection relationship between the interface of the insulation withstand voltage tester 300 and the fixture plate 100 through switch switching, so that the insulation withstand voltage tester 300 can perform insulation testing on the semiconductor module.

[0040] The semiconductor module can be an IGBT (Insulated Gate Bipolar Transistor) module or other types of modules. The specific structure of the semiconductor module is not unique and can include one or more of the following: a half-bridge module, a thermistor, a circuit breaker, and a heat sink. Taking an IGBT module as an example, the upper and lower transistors of the half-bridge module, as well as the switching transistor of the circuit breaker, are all IGBTs.

[0041] like Figure 2 As shown, for the half-bridge module in the semiconductor module, interface 1 of the fixture board 100 is connected to pins P1, C1, and G1 of the upper U-phase transistor; interface 2 of the fixture board 100 is connected to pin U of the U-phase transistor, pin E1 of the upper U-phase transistor, and pins C2 and G2 of the lower U-phase transistor; interface 3 of the fixture board 100 is connected to pins E2 and N1 of the lower U-phase transistor. For full-bridge and three-phase bridge modules, only two more interfaces need to be added and connected in the same way as the half-bridge module. Figure 3 As shown, for the NTCs (thermistors) in the semiconductor module, the lead-out interface 4 of the fixture board 100 is connected to the first side (pins T1, T3, and T5) of all the NTCs in the semiconductor module, and the lead-out interface 5 is connected to the second side (pins T2, T4, and T6) of all the NTCs. Figure 4 As shown, for the circuit breaker in the semiconductor module, the lead-out interface 6 of the fixture plate 100 is connected to the negative terminal of the diode, the lead-out interface 7 of the fixture plate 100 is connected to the positive terminal of the diode and the C and G pins of the IGBT, and the lead-out interface 8 of the fixture plate 100 is connected to the E pin of the IGBT. Figure 5 As shown, for the heat sink in the semiconductor module, the fixture plate 100 leads out interface 9 and interface 10 at different positions on the heat sink.

[0042] The switch in the switch switching module 230 can be a manual switch or a controlled switch such as a relay or MOSFET. The switch switching module 230 can be used to first disconnect the interface between the insulation withstand voltage tester 300 and the fixture plate 100. Then, by switching the switch, the module 230 changes the connection relationship between the current source 210, the measuring unit 220, and the fixture plate 100, using the current source 210 and the measuring unit 220 to perform pin contact tests on the various functional devices in the semiconductor module. Next, the switch switching module 230 disconnects the interface between the current source 210, the measuring unit 220, and the fixture plate 100, and then switches the switch again, changing the connection relationship between the insulation withstand voltage tester 300 and the fixture plate 100, using the insulation withstand voltage tester 300 to perform insulation tests on the semiconductor module. By simply switching the switch using the switch switching module, pin contact tests and insulation tests on the semiconductor module can be performed separately, reducing the testing time.

[0043] In one embodiment, such as Figure 6As shown, the test box 200 also includes a control unit 240. The control unit 240 is connected to the current source 210 and the measurement unit 220. It controls the current source 210 to output current to the corresponding functional devices in the semiconductor module, and acquires the measurement data output by the measurement unit 220 for detecting the contact status of the semiconductor module pins. The type of control unit 240 is not unique; it can be an FPGA, MCU, or CPU, etc. Furthermore, the control unit 240 can also be connected to a host computer, a switch switching module 230, and an insulation withstand voltage tester 300. It performs relevant test control according to the instructions of the host computer, such as controlling the current source 210 to output different currents, controlling the switch switching module 230 to switch different test circuits to meet the contact test and insulation test requirements of different pins, and controlling the insulation withstand voltage tester 300 to perform insulation tests on the semiconductor module, etc. After receiving the relevant measurement data output by the measurement unit 220 and the insulation withstand voltage tester 300, the control unit 240 can perform local pin contact test analysis and insulation test analysis based on the measurement data, or it can upload the measurement data to a host computer for pin contact test analysis and insulation test analysis. In addition, the test box 200 may also include a power module 250, which connects to the current source 210, the measurement unit 220, the switch module 230, and the control unit 240. The power module 250 converts the 220V AC mains power into DC power required by the various modules within the test box 200.

[0044] Furthermore, such as Figure 7 As shown, the switch switching module 230 includes an output measurement switch unit 232, a withstand voltage tester switch unit 234, a high-side bus H, a low-side bus L, and an interface switch unit 236. The output measurement switch unit 232 is connected to the current source 210, the measurement unit 220, the high-side bus H, and the low-side bus L. The withstand voltage tester switch unit 234 is connected to the insulation withstand voltage tester 300, the high-side bus H, and the low-side bus L. The interface switch unit 236 is connected to the high-side bus H, the low-side bus L, and the interface of the fixture plate 100. When the switch in the output measurement switch unit 232 is closed, and the relevant switch in the interface switch unit 236 is closed, the current source 210 and the measurement unit 220 perform pin contact tests on the corresponding functional devices in the semiconductor module. When the switch in the withstand voltage tester switch unit 234 is closed, and the relevant switch in the interface switch unit 236 is closed, the insulation withstand voltage tester 300 performs insulation tests on the semiconductor module.

[0045] Specifically, the output measurement switching unit 232 includes switches K21A, K22A, K23A, and K24A. The first terminal of switch K21A is connected to the high-side measurement interface of the measurement unit 220 via terminal VI_HS, and the second terminal of switch K21A is connected to the high-side bus H. The first terminal of switch K22A is connected to the high-side output interface of the current source 210 via terminal VI_HF, and the second terminal of switch K22A is connected to the high-side bus H. The first terminal of switch K23A is connected to the low-side output interface of the current source 210 via terminal VI_LF, and the second terminal of switch K23A is connected to the low-side bus L. The first terminal of switch K24A is connected to the low-side measurement interface of the measurement unit 220 via terminal VI_LS, and the second terminal of switch K24A is connected to the low-side bus L. When performing pin contact tests on the corresponding functional devices in the semiconductor module, switches K21A, K22A, K23A, and K24A are closed, the current source 210 outputs current, and the measurement unit 220 detects voltage signals to acquire measurement data.

[0046] In one embodiment, the functional device in the semiconductor module includes a half-bridge module, which is connected to interfaces 1, 2, and 3 of the fixture board 100. The interface switching unit 236 includes switches K1A, K2A, K3A, K4A, K5A, and K6A. The first end of switch K1A is connected to the high-side bus H, and the second end of switch K1A is connected to interface 1 of the fixture board 100 via terminal OUT_HV1. The first end of switch K2A is connected to the low-side bus L, and the second end of switch K2A is connected to interface 1 of the fixture board 100 via terminal OUT_HV1. The first end of switch K3A is connected to the high-side bus H, and the second end of switch K3A is connected to interface 2 of fixture plate 100 through terminal OUT_HV2. The first end of switch K4A is connected to the low-side bus L, and the second end of switch K4A is connected to interface 2 of fixture plate 100 through terminal OUT_HV2. The first end of switch K5A is connected to the high-side bus H, and the second end of switch K5A is connected to interface 3 of fixture plate 100 through terminal OUT_HV3. The first end of switch K6A is connected to the low-side bus L, and the second end of switch K6A is connected to interface 3 of fixture plate 100 through terminal OUT_HV3. When the switches in the output measurement switching unit 232 are closed, either switches K1A and K4A, or switches K2A and K3A, the current source 210 and the measurement unit 220 perform pin contact tests on the upper transistor of the half-bridge module. When the switches in the output measurement switching unit 232 are closed, either switches K3A and K6A, or switches K4A and K5A, the current source 210 and the measurement unit 220 perform pin contact tests on the lower transistor of the half-bridge module.

[0047] In one embodiment, the functional device in the semiconductor module further includes a thermistor, which is connected to interface 4 and interface 5 of the fixture plate 100; the interface switching unit 236 further includes switches K7A, K8A, K9A and K10A, the first end of switch K7A is connected to the high-side bus H, and the second end of switch K7A is connected to interface 4 of the fixture plate 100 through terminal OUT_HV4, the first end of switch K8A is connected to the low-side bus L, and the second end of switch K8A is connected to interface 4 of the fixture plate 100 through terminal OUT_HV4, the first end of switch K9A is connected to the high-side bus H, and the second end of switch K9A is connected to interface 5 of the fixture plate 100 through terminal OUT_HV5, the first end of switch K10A is connected to the low-side bus L, and the second end of switch K10A is connected to interface 5 of the fixture plate through terminal OUT_HV5. When the switches in the output measurement switching unit 232 are closed, or when switches K7A and K10A are closed, or when switches K8A and K9A are closed, the current source 210 and the measurement unit 220 perform pin contact tests on the thermistor.

[0048] In one embodiment, the functional device in the semiconductor module further includes a circuit breaker, which is connected to interfaces 6, 7, and 8 of the fixture plate 100; the interface switching unit 236 further includes switches K11A, K12A, K13A, K14A, K15A, and K16A. The first terminal of switch K11A is connected to the high-side bus H, and the second terminal of switch K11A is connected to interface 6 of the fixture plate 100 via terminal OUT_HV6. The first terminal of switch K12A is connected to the low-side bus L, and the second terminal of switch K12A is connected to interface 6 of the fixture plate 100 via terminal OUT_HV6. 6. The first terminal of switch K13A is connected to the high-side bus H, and the second terminal of switch K13A is connected to the interface 7 of fixture plate 100 through terminal OUT_HV7. The first terminal of switch K14A is connected to the low-side bus L, and the second terminal of switch K14A is connected to the interface 7 of fixture plate 100 through terminal OUT_HV7. The first terminal of switch K15 is connected to the high-side bus H, and the second terminal of switch K15 is connected to the interface 8 of fixture plate 100 through terminal OUT_HV8. The first terminal of switch K16A is connected to the low-side bus L, and the second terminal of switch K16A is connected to the interface 8 of fixture plate 100 through terminal OUT_HV8. When the switches in the output measurement switching unit 232 are closed, or when switches K11A and K14A are closed, or when switches K12A and K13A are closed, the current source 210 and the measurement unit 220 perform pin contact tests on the diodes in the circuit breaker; when the switches in the output measurement switching unit 232 are closed, or when switches K13A and K16A are closed, or when switches K14A and K15A are closed, the current source 210 and the measurement unit 220 perform pin contact tests on the switching transistors in the circuit breaker.

[0049] In one embodiment, the functional device in the semiconductor module further includes a heat sink, which is connected to interfaces 9 and 10 of the fixture plate 100; the interface switching unit 236 further includes switches K17A, K18A, K19A and K20A, the first end of switch K17A is connected to the high-side bus H, and the second end of switch K17A is connected to interface 9 of the fixture plate 100 through terminal OUT_HV9, the first end of switch K18A is connected to the low-side bus L, and the second end of switch K18A is connected to interface 9 of the fixture plate 100 through terminal OUT_HV9, the first end of switch K19A is connected to the high-side bus H, and the second end of switch K19A is connected to interface 10 of the fixture plate 100 through terminal OUT_HV10, the first end of switch K20A is connected to the low-side bus L, and the second end of switch K20A is connected to interface 10 of the fixture plate 100 through terminal OUT_HV10. When the switches in the output measurement switching unit 232 are closed, or when switches K17A and K20A are closed, or when switches K18A and K19A are closed, the current source 210 and the measurement unit 220 perform pin contact tests on the heat sink.

[0050] Specifically, during pin contact testing, a current source 210 within the test box 200 applies current to the fixture board 100, and a measurement unit 220 measures the voltage value on the fixture board 100 to determine whether the semiconductor module and the fixture board 100 are making good contact. When the measured voltage value is within the corresponding set range, the device is considered to have good contact and be normal; when the measured voltage value exceeds the corresponding set range or reaches the full-scale bias voltage of the current source 210, the device is considered abnormal or has poor contact. By switching different channels on the fixture board 100 using the switch switching module 230, the contact test of each pin can be completed.

[0051] First, for the half-bridge module, close switches K1A and K4A (or switches K2A and K3A), then close switches K21A-K24A. Connect current source 210 / measuring unit 220 to interface 1 and interface 2 of fixture plate 100. The current direction on fixture plate 100 is from interface 1 to interface 2, which can complete the contact test of pins C1, G1, and E1 of the upper U-phase transistor. Then, close switches K3A and K6A (or switches K4A and K5A), then close switches K21A-K24A. Connect current source 210 / measuring unit 220 to interface 2 and interface 3 of fixture plate 100. The current direction on fixture plate 100 is from interface 2 to interface 3, which can complete the contact test of pins C2, G2, and E2 of the lower U-phase transistor, and simultaneously determine whether the IGBT is functioning correctly. The testing principle is the same for both full-bridge and three-phase bridges. Only the interfaces of phase V and phase W need to be added, and the interfaces of phase U P1 and N1 can be reused.

[0052] For thermistors, close switches K7A and K10A (or switches K8A and K9A), close switches K21A-K24A, and connect current source 210 / measuring unit 220 to interface 4 and interface 5 of fixture plate 100. The current direction on fixture plate 100 is from interface 4 to interface 5 (or from interface 5 to interface 4). This can complete the contact test of the thermistor. The resistance value calculated by Ohm's law is the value of three thermistors in parallel. If the resistance is normal, the other values ​​are abnormal.

[0053] For the circuit breaker, close switches K12A and K13A (or switches K11A and K14A), then close switches K21A-K24A. Connect current source 210 / measuring unit 220 to interfaces 6 and 7 of fixture plate 100. The current direction on fixture plate 100 is from interface 7 to interface 6. Measuring unit 220 tests the voltage across the diode. If the test voltage is at full deflection of the range, the connection is abnormal; if the test voltage is the diode's forward voltage, the connection is normal. Close switches K13A and K16A (or switches K14A and K15A), then close switches K21A-K24A. Connect current source 210 / measuring unit 220 to interfaces 7 and 8 of fixture plate 100. The current direction on fixture plate 100 is from interface 7 to interface 8. Measuring unit 220 tests the VTH value of the IGBT. If the test voltage is at full deflection of the range, the connection is abnormal; if the test voltage is the IGBT's VTH value, the connection is normal.

[0054] For the heat sink, close switches K17A and K20A (or switches K18A and K19A), close switches K21A-K24A, and connect current source 210 / measuring unit 220 to interface 9 and interface 10 of fixture plate 100. The current direction on fixture plate 100 is from interface 9 to interface 10 (or from interface 10 to interface 9). Measuring unit 220 tests the voltage difference between these two points. If the test voltage is at full deflection of the range, the connection is abnormal; if the test voltage is close to 0, the connection is normal.

[0055] In one embodiment, continue to refer to Figure 7The withstand voltage tester switching unit 234 includes switches K25A and K26A, and a resistor network unit. The first terminal of switch K25A is connected to the positive input terminal of the withstand voltage tester 300 via the resistor network unit, and the second terminal of switch K25A is connected to the high-side bus H. The first terminal of switch K26A is connected to the negative input terminal of the withstand voltage tester 300, and the second terminal of switch K26A is connected to the low-side bus L. When switches K1A, K3A, K5A, K11A, K13A, K15A, K8A, K10A, K25A, and K26A are closed, switches K2A, K4A, K6A, K12A, K14A, and K16A are closed. When switches K7A, K9A, K25A, and K26A are closed, the insulation withstand voltage tester 300 performs an insulation test on the semiconductor module; and / or, when switches K1A, K3A, K5A, K11A, K13A, K15A, K7A, K9A, K18A, K20A, K25A, and K26A are closed / when switches K2A, K4A, K6A, K12A, K14A, K16A, K8A, K10A, K17A, K19A, K25A, and K26A are closed, the insulation withstand voltage tester 300 performs an insulation test on the semiconductor module.

[0056] Specifically, the resistor network unit may include resistors R43, R44, R45, R46, R47, R48, R49, R50, R51, R52, R53, and R54. Resistors R43, R44, R45, R46, R47, and R48 are connected in series. The other end of resistor R43 is connected to the positive input terminal of the insulation withstand voltage tester 300 via terminal HV_IN+. The other end of resistor R48 is connected to the first terminal of switch K25A. Resistors R49 and R43 are connected in parallel; resistors R50 and R44 are connected in parallel; resistors R51 and R45 are connected in parallel; resistors R52 and R46 are connected in parallel; resistors R53 and R47 are connected in parallel; and resistors R54 and R48 are connected in parallel. The first terminal of switch K26A is connected to the negative input terminal of the insulation withstand voltage tester 300 via terminal HV_IN-.

[0057] After confirming that the pin contact is normal, the insulation withstand voltage tester 300 switches different output circuits to the semiconductor module through the switch switching module 230 inside the test box 200. The insulation withstand voltage tester 300 outputs high voltage between each pair of IGBT / diode, thermistor, and heat sink in the module to test the leakage current in the circuit, in order to determine whether the insulation performance of the semiconductor module is good. Close switches K1A, K3A, K5A, K11A, K13A, K15A, K8A, K10A, K25A, and K26A (or close switches K2A, K4A, K6A, K12A, K14A, K16A, K7A, K9A, K25A, and K26A), and connect fixture plate 100 to insulation withstand voltage tester 300. Insulation withstand voltage tester 300 applies high voltage from interfaces 1, 2, 3, 6, 7, and 8 of fixture plate 100 to interfaces 4 and 5 (or applies high voltage from interfaces 4 and 5 to interfaces 1, 2, 3, 6, 7, and 8), which can test the leakage current value between each chip in the module and the thermistor. If the leakage current value exceeds the set limit, the module insulation test is deemed to have failed; if the leakage current value is within the set limit, the module insulation test is deemed to have passed. When switches K1A, K3A, K5A, K11A, K13A, K15A, K7A, K9A, K18A, K20A, K25A, and K26A are closed (or switches K2A, K4A, K6A, K12A, K14A, K16A, K8A, K10A, K17A, K19A, K25A, and K26A are closed), the insulation withstand voltage tester 300 applies high voltage from interfaces 1, 2, 3, 4, 5, 6, 7, and 8 of the fixture plate 100 to interfaces 9 and 10 (or applies high voltage from interfaces 9 and 10 to interfaces 1, 2, 3, 4, 5, 6, 7, and 8), which can test the leakage current value from each pin in the module to the heat sink housing. If the leakage current value exceeds the set limit, the module insulation test is deemed to have failed; if the leakage current value is within the set limit, the module insulation test is deemed to have passed.

[0058] It is understood that the above only provides some embodiments of the functional device pins and switch switching module 230 in the semiconductor module. If the pin and interface grouping method of the semiconductor module is slightly changed, or only some of the above-mentioned operations are performed without performing the complete operation, the pin contact test and insulation test of the semiconductor module can also be performed.

[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A semiconductor module testing device, characterized in that, include: A fixture plate is used to place a semiconductor module. The fixture plate is provided with an interface that is connected to the pins of each functional device in the semiconductor module. The test box includes a current source, a measurement unit, and a switch switching module. The switch switching module connects the current source and the measurement unit, and also connects to the interface of the fixture plate. The switch switching module changes the connection relationship between the current source, the measurement unit, and the interface of the fixture plate by switching the switch, so that the current source and the measurement unit can perform pin contact tests on each functional device in the semiconductor module. An insulation withstand voltage tester is connected to the switch switching module. The switch switching module also changes the connection relationship between the interface of the insulation withstand voltage tester and the fixture plate by switching, so that the insulation withstand voltage tester can perform insulation testing on the semiconductor module.

2. The apparatus according to claim 1, characterized in that, The test box also includes a control unit, which is connected to the current source and the measurement unit. The control unit controls the current source to output current to the corresponding functional devices in the semiconductor module, and acquires the measurement data output by the measurement unit for detecting the contact status of the semiconductor module pins.

3. The apparatus according to claim 1, characterized in that, The switching module includes an output measurement switching unit, a withstand voltage tester switching unit, a high-side bus, a low-side bus, and an interface switching unit. The output measurement switching unit is connected to the current source, the measurement unit, the high-side bus, and the low-side bus. The withstand voltage tester switching unit is connected to the insulation withstand voltage tester, the high-side bus, and the low-side bus. The interface switching unit is connected to the high-side bus, the low-side bus, and the interface of the fixture plate. When the switch in the output measurement switching unit is closed, and the relevant switch in the interface switching unit is closed, the current source and the measurement unit perform pin contact tests on the corresponding functional devices in the semiconductor module; when the switch in the withstand voltage tester switching unit is closed, and the relevant switch in the interface switching unit is closed, the insulation withstand voltage tester performs insulation tests on the semiconductor module.

4. The apparatus according to claim 3, characterized in that, The output measurement switching unit includes switches K21A, K22A, K23A, and K24A. The first end of switch K21A is connected to the high-side measurement interface of the measurement unit, and the second end of switch K21A is connected to the high-side bus. The first end of switch K22A is connected to the high-side output interface of the current source, and the second end of switch K22A is connected to the high-side bus. The first end of switch K23A is connected to the low-side output interface of the current source, and the second end of switch K23A is connected to the low-side bus. The first end of switch K24A is connected to the low-side measurement interface of the measurement unit, and the second end of switch K24A is connected to the low-side bus.

5. The apparatus according to claim 3, characterized in that, The functional devices in the semiconductor module include a half-bridge module, which is connected to interfaces 1, 2, and 3 of the fixture plate. The interface switching unit includes switches K1A, K2A, K3A, K4A, K5A, and K6A. The first end of switch K1A is connected to the high-side bus, and the second end of switch K1A is connected to interface 1 of the fixture plate. The first end of switch K2A is connected to the low-side bus, and the second end of switch K2A is connected to interface 1 of the fixture plate. The first end of switch K3A is connected to the high-side bus, and the second end of switch K3A is connected to interface 2 of the fixture plate. The first end of switch K4A is connected to the low-side bus, and the second end of switch K4A is connected to interface 2 of the fixture plate. The first end of switch K5A is connected to the high-side bus, and the second end of switch K5A is connected to interface 3 of the fixture plate. The first end of switch K6A is connected to the low-side bus, and the second end of switch K6A is connected to interface 3 of the fixture plate. When the switches in the output measurement switching unit are closed, and switches K1A and K4A are closed, or when the switches in the output measurement switching unit are closed, and switches K2A and K3A are closed, the current source and the measurement unit perform pin contact tests on the upper transistor of the half-bridge module. When the switches in the output measurement switching unit are closed, such as switches K3A and K6A, or when the switches in the output measurement switching unit are closed, such as switches K4A and K5A, the current source and the measurement unit perform pin contact tests on the lower transistor of the half-bridge module.

6. The apparatus according to claim 5, characterized in that, The functional devices in the semiconductor module also include a thermistor, which is connected to interface 4 and interface 5 of the fixture plate; the interface switching unit also includes switches K7A, K8A, K9A and K10A, the first end of switch K7A is connected to the high-side bus, the second end of switch K7A is connected to interface 4 of the fixture plate, the first end of switch K8A is connected to the low-side bus, the second end of switch K8A is connected to interface 4 of the fixture plate, the first end of switch K9A is connected to the high-side bus, the second end of switch K9A is connected to interface 5 of the fixture plate, and the first end of switch K10A is connected to the low-side bus, the second end of switch K10A is connected to interface 5 of the fixture plate; When the switches in the output measurement switching unit are closed, such as switches K7A and K10A, or when switches K8A and K9A are closed, the current source and the measurement unit perform pin contact tests on the thermistor.

7. The apparatus according to claim 6, characterized in that, The functional devices in the semiconductor module also include a circuit breaker, which is connected to interfaces 6, 7, and 8 of the fixture plate. The interface switching unit also includes switches K11A, K12A, K13A, K14A, K15A, and K16A. The first terminal of switch K11A is connected to the high-side bus, and the second terminal of switch K11A is connected to interface 6 of the fixture plate. The first terminal of switch K12A is connected to the low-side bus, and the second terminal of switch K12A is connected to the fixture. Interface 6 of the board; the first end of switch K13A is connected to the high-end bus; the second end of switch K13A is connected to interface 7 of the fixture plate; the first end of switch K14A is connected to the low-end bus; the second end of switch K14A is connected to interface 7 of the fixture plate; the first end of switch K15 is connected to the high-end bus; the second end of switch K15 is connected to interface 8 of the fixture plate; the first end of switch K16A is connected to the low-end bus; the second end of switch K16A is connected to interface 8 of the fixture plate. When the switch in the output measurement switching unit is closed, and switch K11A and switch K14A are closed, or when the switch in the output measurement switching unit is closed, and switch K12A and switch K13A are closed, the current source and the measurement unit perform pin contact tests on the diode in the circuit breaker. When the switch in the output measurement switching unit is closed, or when switch K13A and switch K16A are closed, or when the switch in the output measurement switching unit is closed, or when switch K14A and switch K15A are closed, the current source and the measurement unit perform pin contact tests on the switching transistors in the circuit breaker.

8. The apparatus according to claim 7, characterized in that, The functional components in the semiconductor module also include a heat sink, which is connected to interfaces 9 and 10 of the fixture plate; the interface switching unit also includes switches K17A, K18A, K19A and K20A, the first end of switch K17A is connected to the high-side bus, the second end of switch K17A is connected to interface 9 of the fixture plate, the first end of switch K18A is connected to the low-side bus, the second end of switch K18A is connected to interface 9 of the fixture plate, the first end of switch K19A is connected to the high-side bus, the second end of switch K19A is connected to interface 10 of the fixture plate, the first end of switch K20A is connected to the low-side bus, and the second end of switch K20A is connected to interface 10 of the fixture plate; When the switches in the output measurement switching unit are closed, such as switches K17A and K20A, or when the switches in the output measurement switching unit are closed, such as switches K18A and K19A, the current source and the measurement unit perform pin contact tests on the heat sink.

9. The apparatus according to claim 8, characterized in that, The withstand voltage tester switching unit includes switch K25A, switch K26A and a resistor network unit. The first terminal of switch K25A is connected to the positive input terminal of the withstand voltage tester through the resistor network unit. The second terminal of switch K25A is connected to the high-side bus. The first terminal of switch K26A is connected to the negative input terminal of the withstand voltage tester. The second terminal of switch K26A is connected to the low-side bus. When switches K1A, K3A, K5A, K11A, K13A, K15A, K8A, K10A, K25A, and K26A are closed, or when switches K2A, K4A, K6A, K12A, K14A, K16A, K7A, K9A, K25A, and K26A are closed, the insulation withstand voltage tester performs an insulation test on the semiconductor module. and / or When switches K1A, K3A, K5A, K11A, K13A, K15A, K7A, K9A, K18A, K20A, K25A, and K26A are closed, or when switches K2A, K4A, K6A, K12A, K14A, K16A, K8A, K10A, K17A, K19A, K25A, and K26A are closed, the insulation withstand voltage tester performs an insulation test on the semiconductor module.

10. The apparatus according to any one of claims 1-9, characterized in that, The semiconductor module is an IGBT module, in which the upper and lower transistors of the half-bridge module and the switching transistor of the circuit breaker are all IGBTs.

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