A heat dissipation structure for servers

Abstract

This utility model discloses a heat dissipation structure for servers, relating to the field of heat dissipation structures. It includes a heat sink and a lower plate. The lower plate is located at the bottom of the heat sink, and the heat sink and lower plate together form a VC (Vibration Ventilation Coil) heat exchanger. Side plates are installed on both sides of the heat sink, and multiple sets of heat dissipation fins are provided on the top of the heat sink, with the fins fixed to the heat sink by welding. This utility model solves the problem of existing air-cooled heat dissipation methods. The heat sink and lower plate combined into a VC heat exchanger allows for better heat dissipation, and the heat dissipation fins increase the contact area with air, resulting in even better heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structures, specifically a heat dissipation structure for servers. Background Technology

[0002] With the evolution of semiconductor technology, the wattage of CPU processors has been increasing day by day, and the power consumption has been growing. Heat dissipation design has also become a major field and issue. Heat dissipation is the key to determining whether a server can reduce long-term costs and achieve stable performance. Poor heat dissipation can lead to the failure of system components and a reduction in system lifespan. At the same time, the electricity cost of data center cooling will also increase significantly, which may bring unpredictable risks.

[0003] With increasingly limited space for heat dissipation in modern server devices and a sharp increase in CPU heat flux density, air-cooled products have become the mainstream design method for electronic heat dissipation due to their simple production structure, high mass production capability, and low cost. However, air-cooled heat dissipation has low efficiency, which leads to poor heat dissipation effect. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a heat dissipation structure for servers to solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation structure for a server, comprising a heat dissipation plate and a lower plate, wherein the lower plate is provided at the bottom of the heat dissipation plate, and the heat dissipation plate and the lower plate form a VC heat dissipation plate, side plates are installed on both sides of the heat dissipation plate, and multiple sets of heat dissipation fins are provided on the top of the heat dissipation plate, and the heat dissipation fins are fixed to the heat dissipation plate by welding.

[0006] By adopting the above technical solution, the existing air-cooled heat dissipation method is solved. The heat sink and the lower plate are combined to form a VC heat dissipation plate. The VC heat dissipation plate can better dissipate heat. At the same time, the heat dissipation fins can increase the contact area with the air, which can make the heat dissipation effect even better.

[0007] The present invention is further configured such that a protruding plate is fixed at the bottom of the heat dissipation fins, and the length of the protruding plate is the same as the length of the heat dissipation fins.

[0008] Preferably, the raised plate facilitates contact between the heat dissipation fins and the heat dissipation plate.

[0009] The present invention is further configured such that a base plate is fixed to the bottom of each of the heat dissipation fin protrusions.

[0010] Preferably, the base plate can increase the heat dissipation fins and the contact area with the heat dissipation plate, thereby facilitating the conduction of heat.

[0011] The present invention is further configured such that multiple sets of baffles are fixed on the top of the heat dissipation fins.

[0012] Preferably, the baffle not only allows the two sets of heat dissipation fins that are close to each other to come into contact, but also allows the heat dissipation fins to come into contact with each other, increasing the contact area with the air and making the heat dissipation effect better.

[0013] The present invention is further configured such that the cross-section of the side plate is L-shaped, and both the outer walls of the side plate and the heat sink are provided with through holes, and the side plate is connected to the heat sink by bolts.

[0014] Preferably, the side plate is fixed to the heat sink with bolts, or it can be fixed to one side of the CPU processor with bolts.

[0015] In summary, the present invention has the following main advantages:

[0016] This invention solves the problem of existing air-cooled heat dissipation methods by incorporating a heat sink, side plate, and heat dissipation fins. The heat sink and lower plate together form a VC heat dissipation plate, which can better dissipate heat. At the same time, the heat dissipation fins can increase the contact area with the air, thus improving the heat dissipation effect. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram showing the connection between the heat sink and the side plate of this utility model;

[0019] Figure 3 This is a schematic diagram showing the connection between the heat sink and the lower plate of this utility model;

[0020] Figure 4 This is a perspective view of the heat dissipation fins of this utility model.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1. Heat sink; 2. Side plate; 3. Bottom plate; 4. Through hole; 5. Heat sink fins; 6. Baffle; 7. Bolt; 8. Base plate; 9. Raised plate. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0024] The embodiments of this utility model will be described below based on its overall structure.

[0025] Please see Figures 1-4 The heat sink includes a heat sink 1 and a lower plate 3. The lower plate 3 is located at the bottom of the heat sink 1, and the heat sink 1 and the lower plate 3 form a VC heat dissipation plate. Side plates 2 are installed on both sides of the heat sink 1. The heat sink 1, side plates 2, lower plate 3, and heat dissipation fins 5 are made of copper. A solution chamber is provided between the heat sink 1 and the lower plate 3. The liquid is heated and evaporated into gas on the side closer to the CPU processor. After moving to a place away from the CPU processor, it is cooled and condensed into water droplets. The liquid is then absorbed back to the side closer to the chip through capillary action, thereby achieving the purpose of heat dissipation. The top of the heat sink 1 is provided with multiple sets of heat dissipation fins 5, and the heat dissipation fins 5 are fixed to the heat sink 1 by welding.

[0026] For details regarding the above embodiments, please refer to [link / reference]. Figure 4 The bottom of the heat dissipation fin 5 is fixed with a protruding plate 9, which facilitates the contact between the heat dissipation fin 5 and the heat dissipation plate 1.

[0027] For details regarding the above embodiments, please refer to [link / reference]. Figure 4 Both the heat dissipation fins 5 and the raised plate 9 are fixed with a base plate 8. The base plate 8 increases the contact area between the heat dissipation fins 5 and the heat dissipation plate 1, thus facilitating the conduction of heat.

[0028] For details regarding the above embodiments, please refer to [link / reference]. Figure 1 and Figure 4 Multiple sets of baffles 6 are fixed on the top of each heat dissipation fin 5. The baffles 6 can not only bring two sets of heat dissipation fins 5 into contact, but also make the heat dissipation fins 5 into contact, increasing the contact area with the air and making the heat dissipation effect better.

[0029] For details regarding the above embodiments, please refer to [link / reference]. Figure 2 The side plate 2 has an L-shaped cross section, and both the side plate 2 and the outer wall of the heat sink 1 have through holes 4. The side plate 2 is connected to the heat sink 1 by bolts 7. The L-shaped side plate 2 can be easily snapped into the outer wall of the heat sink 1. The side plate 2 and the heat sink 1 are fixed by bolts 7, and it can also be fixed to one side of the CPU processor by bolts.

[0030] In practical operation, the side plate 2 is snapped onto both sides of the heat sink 1 and connected by bolts 7. Then, the heat sink fins 5 are welded to the top of the heat sink 1 and the side plate 2. The protruding plate 9 at the bottom of the heat sink fins 5 is located between the two sets of side plates 2. The bottom plate 8 on one side of the protruding plate 9 and the bottom plate 8 of the heat sink fin bottom plate are in contact with the heat sink 1 and the side plate 2. Then, the heat sink fins 5 are arranged and welded in sequence. When close to the bolts 7, the heat sink 1 is installed on one side of the CPU to dissipate heat from the CPU.

[0031] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A heat dissipation structure for a server, comprising a heat sink (1) and a lower plate (3), wherein the lower plate (3) is disposed at the bottom of the heat sink (1), and the heat sink (1) and the lower plate (3) form a VC heat dissipation plate, and a solution cavity is disposed between the heat sink (1) and the lower plate (3), characterized in that: Side plates (2) are installed on both sides of the heat sink (1), and multiple sets of heat sink fins (5) are provided on the top of the heat sink (1), and the heat sink fins (5) are fixed to the heat sink (1) by welding.

2. The server heat dissipation structure according to claim 1, characterized in that: A protruding plate (9) is fixed to the bottom of the heat dissipation fins (5).

3. The server heat dissipation structure according to claim 2, characterized in that: The bottom of the heat dissipation fins (5) and the protrusions (9) are fixed with a base plate (8).

4. The server heat dissipation structure according to claim 3, characterized in that: Multiple sets of baffles (6) are fixed to the top of the heat dissipation fins (5).

5. The server heat dissipation structure according to claim 1, characterized in that: The side plate (2) has an L-shaped cross section, and both the side plate (2) and the heat sink (1) have through holes (4) on their outer walls. The side plate (2) is connected to the heat sink (1) by bolts (7).

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