A computing device with heat dissipation on both the front and back.

Abstract

This invention provides a computing device with heat dissipation on both sides, relating to the field of heat dissipation technology for high-heat computing devices. Addressing the problem of high heat generation and poor single-sided heat dissipation in existing computing devices due to highly integrated chips, this device includes a chassis, a computing board, and a heat sink. The chassis has ventilation holes and an intake fan and an exhaust fan on its front and rear panels, respectively. The computing board integrates a computing chip on its front side, with an upper heat-conducting plate and a lower heat-conducting plate fixed to its front and back sides, respectively. The back of the upper heat-conducting plate contacts the chip, and the front side has multiple upper heat sinks extending forward and backward (arranged alternately). The back of the lower heat-conducting plate covers the back of the computing board, and the front side has multiple lower heat sinks extending forward and backward (arranged alternately). The upper heat-conducting plate, computing board, and lower heat-conducting plate are suspended above the chassis bottom plate and located between the intake fan and the exhaust fan. This structure, through double-sided heat conduction, matching the heat sink with the airflow direction, and the suspended design, effectively improves heat dissipation efficiency and ensures the reliability of device operation.

Description

Technical Field

[0001] This utility model belongs to the field of computing device technology, and in particular relates to a computing device that dissipates heat from both the front and back sides. Background Technology

[0002] With the rapid development of fields such as artificial intelligence and high-performance computing, the computing power demand of computing devices is growing exponentially, driving the evolution of high-heat-generating computing chips towards higher integration and higher-density packaging. In high-performance computing devices, the computing board, as the core functional unit, typically integrates multiple computing chips. Due to the significant improvement in chip performance and integration, the heat dissipation density of the computing board increases dramatically when operating at full load. If the heat cannot be dissipated effectively and in a timely manner, the internal temperature of the device will quickly rise to the chip's threshold, leading to chip performance degradation, increased signal transmission delay, and seriously affecting the device's computing accuracy, response speed, and long-term reliability.

[0003] In existing technologies, computing devices primarily dissipate heat from the computing board using a single-sided cooling solution of a fan and heatsink: that is, the heatsink is only placed on the front of the computing board (the side where the chip is located), and airflow is driven by a fan to dissipate heat. This solution has the following limitations:

[0004] 1. Single-sided heat dissipation can only cover the heat-generating area on the front of the computing board, while the back of the computing board still has local heat accumulation due to the distribution of electronic components (such as capacitors and resistors).

[0005] 2. The computing board is usually directly fixed to the chassis base plate. The heat conduction of the base plate will hinder the natural heat dissipation of the bottom of the computing board, further reducing the overall heat dissipation efficiency. Utility Model Content

[0006] Based on this, a computing device with heat dissipation on both the front and back sides is provided to address the aforementioned technical problems.

[0007] The technical solution adopted in this utility model is as follows:

[0008] A computing device with heat dissipation on both sides includes a chassis, a computing board disposed within the chassis, and a heat sink for dissipating heat from the computing board. The front and rear panels of the chassis both have ventilation holes. An intake fan and an exhaust fan are respectively provided on the inner sides of the front and rear panels. A computing chip is disposed on the front side of the computing board. The heat sink comprises an upper heat-conducting plate and a lower heat-conducting plate, which are respectively fixed to the front and back sides of the computing board. The back side of the upper heat-conducting plate contacts the computing chip, and its front side has multiple upper heat sinks extending in a front-to-back direction, arranged alternately from left to right. The back side of the lower heat-conducting plate covers the back side of the computing board, and its front side has multiple lower heat sinks extending in a front-to-back direction, arranged alternately from left to right. The upper heat-conducting plate, the computing board, and the lower heat-conducting plate are suspended above the bottom plate of the chassis and located between the intake fan and the exhaust fan.

[0009] The beneficial effects of this utility model are as follows:

[0010] 1. Double-sided heat conduction coverage eliminates local heat accumulation: The upper heat conduction plate is directly attached to the high-heat-generating chip on the front of the computing board, and the lower heat conduction plate fully covers the electronic component area (such as capacitors, resistors, etc.) on the back of the computing board. Through double-sided synchronous heat conduction, the heat on the front and back sides is conducted to the corresponding upper and lower heat sinks respectively, which completely solves the problem of local heat accumulation caused by the distribution of electronic components on the front and back sides due to traditional single-sided heat dissipation, and achieves balanced heat dissipation of the entire surface of the computing board.

[0011] 2. Suspended Structure for Enhanced Bottom Heat Dissipation: The compute board, upper heatsink, and lower heatsink are suspended above the chassis bottom plate, avoiding the "heat conduction obstruction" problem caused by the compute board being directly fixed to the bottom plate in traditional solutions. This design not only preserves the natural heat dissipation channel at the bottom of the compute board but also allows some airflow to flow from below the compute board (coordinating with the main airflow of the intake and exhaust fans), further enhancing overall heat dissipation efficiency.

[0012] 3. Fan-Heater Synergy Improves Heat Dissipation Efficiency: The front panel intake fan and the rear panel exhaust fan form a forced convection system of "front intake and rear blowing". Combined with the design of the upper / lower heatsinks extending in the front and back directions (completely consistent with the airflow direction), it effectively reduces airflow resistance, accelerates the heat dissipation from the heatsink surface, significantly improves heat dissipation efficiency, ensures that the chip operating temperature is stable within the safe threshold, extends the service life of the device and ensures operational stability. Attached Figure Description

[0013] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments:

[0014] Figure 1 An exploded view of a computing device with heat dissipation on both the front and back sides, provided for an embodiment of this utility model;

[0015] Figure 2 A schematic diagram of the internal structure of a computing device with heat dissipation on both the front and back sides, provided for an embodiment of this utility model;

[0016] Figure 3 This is a schematic diagram showing that the upper heat-conducting plate, the calculation board, and the lower heat-conducting plate of this utility model are suspended above the bottom plate of the chassis.

[0017] Figure 4 This is a schematic diagram of the structure of the computing board according to an embodiment of the present invention;

[0018] Figure 5 This is a schematic diagram of the upper heat-conducting plate in an embodiment of the present invention;

[0019] Figure 6 This is a schematic diagram of the structure of the lower heat-conducting plate in an embodiment of the present invention. Detailed Implementation

[0020] The embodiments of this utility model will be described below with reference to the accompanying drawings. It should be noted that the embodiments described in this specification are not exhaustive and do not represent the only embodiments of this utility model. The following corresponding embodiments are only for clearly illustrating the utility model content of this patent and are not intended to limit its implementation. For those skilled in the art, different variations and modifications can be made based on the described embodiments. Any obvious variations or modifications that fall within the technical concept and utility model content of this utility model are also within the protection scope of this utility model.

[0021] like Figure 1 As shown in the figure, this application provides a computing device with heat dissipation on both the front and back sides, including a chassis 1100, an intake fan 1200, an exhaust fan 1300, a computing board 1400, a heat sink 1500, a control board 1600, and a power supply 1700.

[0022] The chassis 1100 is a 2U chassis, such as Figure 1 As shown, it consists of a base plate 1110, left and right side plates 1120, a front panel 1130, a rear panel 1140 and a top plate 1150. The left and right side plates 1120 are integrally formed on the base plate 1110. The front panel 1130 and the rear panel 1140 both have ventilation holes. The front panel 1130 is also provided with a handle 1131.

[0023] The ventilation holes are hexagonal, and multiple ventilation holes are arranged in a honeycomb array, which greatly improves the opening ratio of the front panel 1130 and the rear panel 1140, and can also improve the air delivery efficiency of the fan.

[0024] like Figure 1 and Figure 2As shown, a baffle plate 1111 and a support plate 1112 are vertically fixed on the base plate 1110. Both the baffle plate 1111 and the support plate 1112 are parallel to the left and right side plates 1120 of the chassis. The baffle plate 1111 is located in front of the support plate 1112. The control plate 1600 is fixed on the support plate 1112. The base plate 1110, the top plate 1150, the left side plate 1120, the baffle plate 1111, and the support plate 1112 form a relatively sealed air duct to improve the heat dissipation effect.

[0025] The base plate 1110 has multiple support columns 1113 located within the air duct, see [reference]. Figure 3 .

[0026] There are three intake fans 1200 and three exhaust fans 1300, which are arranged side by side at the front and rear ends of the air duct and are fixed to the inside of the front panel 1130 and the rear panel 1140 respectively by bolts.

[0027] The computing board 1400 and the heat sink 1500 are located in the air duct, that is, between the intake fan 1200 and the exhaust fan 1300.

[0028] like Figure 4 As shown, the front of the computing board 1400 has multiple computing chips 1410, which are arranged in three rows: front, middle and back.

[0029] Heat sink 1500 is used to dissipate heat for computing board 1400, and includes upper heat conduction plate 1510 and lower heat conduction plate 1520, see [link / reference] Figure 1 .

[0030] The upper heat-conducting plate 1510 and the lower heat-conducting plate 1520 are located on the front and back sides of the calculation plate 1400, respectively, and the three are fixed together by bolts. Figure 5 As shown, the reverse side of the upper heat-conducting plate 1510 has three rectangular protrusions 1511 (front, middle, and rear), which contact the front, middle, and rear rows of chips respectively. The front side of the upper heat-conducting plate 1510 has multiple upper heat sinks 1512 extending in the front-to-back direction, which are arranged alternately from left to right. The reverse side of the lower heat-conducting plate 1520 covers the reverse side of the computing board 1400, and its front side has multiple lower heat sinks 1521 extending in the front-to-back direction, which are arranged alternately from left to right. See [reference needed]. Figure 6 The reverse edge of the lower heat-conducting plate 1520 also has fixing holes corresponding to multiple support columns 1113, so as to fix it to the multiple support columns 1113, thereby making the upper heat-conducting plate 1510, the calculation plate 1400 and the lower heat-conducting plate 1520 suspended above the base plate 1110.

[0031] The computing board 1400 can use an aluminum substrate, allowing heat to be effectively transferred to the upper heat-conducting plate 1510 and the lower heat-conducting plate 1520 on both sides. The front sections of the upper heat sink 1512 and the lower heat sink 1521 are beveled sections that gradually widen in the vertical direction from front to back. The beveled sections of each upper heat sink 1512 are of equal length, and the beveled sections of each lower heat sink 1521 are of equal length. This structure can disrupt the laminar boundary layer on the solid surface, increase turbulence, stabilize airflow speed and direction, and enhance convective heat transfer, thereby efficiently removing heat from the heat sink.

[0032] The power supply 1700 is located on the right side and is fixed to the chassis 1100 by bolts. It is used to supply power to the internal equipment.

[0033] As can be seen from the above, the computing device with heat dissipation on both the front and back sides provided in this application embodiment has the following beneficial effects:

[0034] 1. Double-sided heat conduction coverage eliminates local heat accumulation: The upper heat conduction plate is directly attached to the high-heat-generating chip on the front of the computing board, and the lower heat conduction plate fully covers the electronic component area (such as capacitors, resistors, etc.) on the back of the computing board. Through double-sided synchronous heat conduction, the heat on the front and back sides is conducted to the corresponding upper and lower heat sinks respectively, which completely solves the problem of local heat accumulation caused by the distribution of electronic components on the front and back sides due to traditional single-sided heat dissipation, and achieves balanced heat dissipation of the entire surface of the computing board.

[0035] 2. Suspended Structure for Enhanced Bottom Heat Dissipation: The compute board, upper heatsink, and lower heatsink are suspended above the chassis bottom plate, avoiding the "heat conduction obstruction" problem caused by the compute board being directly fixed to the bottom plate in traditional solutions. This design not only preserves the natural heat dissipation channel at the bottom of the compute board but also allows some airflow to flow from below the compute board (coordinating with the main airflow of the intake and exhaust fans), further enhancing overall heat dissipation efficiency.

[0036] 3. Fan-Heater Synergy Improves Heat Dissipation Efficiency: The front panel intake fan and the rear panel exhaust fan form a forced convection system of "front intake and rear blowing". Combined with the design of the upper / lower heatsinks extending in the front and back directions (completely consistent with the airflow direction), it effectively reduces airflow resistance, accelerates the heat dissipation from the heatsink surface, significantly improves heat dissipation efficiency, ensures that the chip operating temperature is stable within the safe threshold, extends the service life of the device and ensures operational stability.

[0037] 4. Beveled Section Design Enhances Convection Heat Transfer Efficiency: The upper and lower heat sinks feature beveled sections that gradually widen from front to back (with consistent length across all sections). By altering the contact angle between the heat sink and the airflow, this effectively disrupts the laminar boundary layer on the solid surface (laminar boundary layers result in low near-wall velocity and poor heat transfer efficiency due to fluid viscosity), causing the airflow to transition from laminar to turbulent. The intense mixing of fluid particles in the turbulent flow significantly enhances the lateral heat transfer capability. Simultaneously, the consistent length of the beveled sections ensures uniform airflow distribution among the heat sinks, preventing sudden changes in velocity or turbulent flow direction. Compared to traditional straight-section heat sinks, this structure can increase the convective heat transfer coefficient by 20%-30%, further accelerating heat removal from the heat sink surface. Combined with double-sided cooling and a suspended design, the overall heat dissipation efficiency is significantly improved.

[0038] In addition, the embodiments of this application have high space utilization, which greatly saves costs and also has the effect of weight reduction.

[0039] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A computing device with heat dissipation on both sides, comprising a chassis, a computing board disposed within the chassis, and a heat sink for dissipating heat from the computing board, wherein the front and rear panels of the chassis each have ventilation holes, and an intake fan and an exhaust fan are respectively disposed on the inner sides of the front and rear panels, and a computing chip is disposed on the front side of the computing board, characterized in that, The heat sink includes an upper heat-conducting plate and a lower heat-conducting plate, which are fixed to the front and back sides of the computing board, respectively. The back side of the upper heat-conducting plate is in contact with the computing chip, and its front side has multiple upper heat sinks extending in the front-back direction, which are arranged alternately from left to right. The back side of the lower heat-conducting plate covers the back side of the computing board, and its front side has multiple lower heat sinks extending in the front-back direction, which are arranged alternately from left to right. The upper heat-conducting plate, the computing board, and the lower heat-conducting plate are suspended above the bottom plate of the chassis and located between the intake fan and the exhaust fan.

2. A computing device with heat dissipation on both sides according to claim 1, characterized in that, The front sections of the upper and lower heat sinks are oblique cut sections that gradually widen in the vertical direction from front to back. The oblique cut sections of each upper heat sink are of equal length, and the oblique cut sections of each lower heat sink are of equal length.

3. A computing device with heat dissipation on both sides according to claim 1, characterized in that, A baffle plate and a support plate are vertically fixed on the bottom plate of the chassis. The baffle plate and the support plate are parallel to the left and right side plates of the chassis, and the baffle plate is located in front of the support plate. A control plate is fixed on the support plate. The bottom plate, top plate, one of the side plates, the baffle plate and the support plate of the chassis form an air duct. The heat sink and the computing board are located in the air duct. The intake fan and the exhaust fan are located at the front and rear ends of the air duct.

4. A computing device with heat dissipation on both sides according to claim 1, characterized in that, The chassis has multiple support columns on its bottom plate, and the lower heat-conducting plate is fixed to the multiple support columns.

5. A computing device with heat dissipation on both sides according to claim 1, characterized in that, The ventilation holes are hexagonal, and multiple ventilation holes are arranged in an array.

6. A computing device with heat dissipation on both sides according to claim 1, characterized in that, The chassis is a 2U chassis.

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