A high-efficiency CPU water cooling structure

Abstract

This utility model belongs to the field of CPU heat dissipation technology, and particularly relates to a high-efficiency CPU water-cooling structure, including a first water-cooling mechanism, a second water-cooling mechanism, and an air-cooling mechanism. The first water-cooling mechanism includes a first water-cooling base, a first heatsink, and a first water-cooling pipe. The second water-cooling mechanism includes a second water-cooling base, a second heatsink, and a second water-cooling pipe. The air-cooling mechanism includes an air-cooling shroud, a first fan, and a second fan. The first fan is fixedly connected to one end of the air-cooling shroud and is in communication with it; the second fan is fixedly connected to the other end of the air-cooling shroud and is in communication with it. The high-efficiency CPU water-cooling structure provided by this application, through the dual arrangement of the first and second water-cooling mechanisms, ensures that both water-cooling bases are in contact with the CPU, enabling simultaneous heat absorption from the CPU surface, forming a dual heat absorption path. Compared to the traditional single heat dissipation path, this increases heat absorption and prevents heat accumulation on the CPU surface, thereby improving heat dissipation efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of CPU heat dissipation technology, and in particular relates to a high-efficiency CPU water cooling structure. Background Technology

[0002] With the rapid development of computer technology, CPU performance has been continuously improving, but its processing speed and power consumption have also increased accordingly, resulting in a significant increase in heat generation. The CPU's heat dissipation effect directly affects its operational stability and lifespan. If heat cannot be dissipated in time, it will cause the CPU temperature to rise, leading to problems such as frequency reduction and lag, and in severe cases, even damage to the hardware.

[0003] Currently, air cooling is a common traditional CPU cooling method. This method primarily relies on a heatsink attached to the CPU to absorb heat, which is then dissipated by a fan that circulates air. However, this single-air cooling method has some drawbacks: firstly, its cooling efficiency is limited by the fan's airflow and air pressure; when the CPU generates a large amount of heat, airflow alone is insufficient to quickly remove it. Secondly, the heat conduction path of the heatsink is singular, making it easy for heat to accumulate on the heatsink and hindering efficient heat dissipation. Utility Model Content

[0004] The purpose of this invention is to provide a high-efficiency CPU water cooling structure, which aims to solve the technical problem that the heat conduction path of the heat sink in the prior art is single, and heat is easy to accumulate on the heat sink, making it impossible to achieve efficient heat dissipation.

[0005] To achieve the above objectives, the high-efficiency CPU water cooling structure provided in this embodiment includes a first water cooling mechanism, a second water cooling mechanism, and an air cooling mechanism, wherein the first water cooling mechanism, the second water cooling mechanism, and the air cooling mechanism are arranged sequentially.

[0006] The first water cooling mechanism includes a first water cooling base, a first heat sink, and a first water cooling pipe. The first water cooling base is used to fit against the CPU and absorb the heat on the CPU. The first heat sink is disposed on the first water cooling base and is used to dissipate the heat absorbed by the first water cooling base. The first water cooling pipe passes through the first heat sink and is used to carry away the heat on the first heat sink.

[0007] The second water cooling mechanism includes a second water cooling base, a second heat sink, and a second water cooling pipe. The second water cooling base is used to fit against the CPU and absorb heat from the CPU. The second heat sink is disposed on the second water cooling base and is used to dissipate the heat absorbed by the second water cooling base. The second water cooling pipe passes through the second heat sink and is used to carry away the heat from the second heat sink.

[0008] As an optional solution of this utility model, the first water-cooled base is provided with a first fixing hole.

[0009] As an optional solution of this utility model, multiple first heat sinks are provided and are fixedly connected to the first water-cooling base in parallel and at intervals, with the spacing between adjacent first heat sinks being 1-5mm.

[0010] As an optional solution of this utility model, the first water-cooling pipe is arranged in an S-shape and is sequentially inserted through a plurality of the first heat sinks; one end of the first water-cooling pipe is provided with a first water inlet and the other end is provided with a first water outlet.

[0011] As an optional solution of this utility model, the second water-cooling base is provided with a second fixing hole.

[0012] As an optional solution of this utility model, multiple second heat sinks are provided and are fixedly connected to the second water-cooling base in parallel and at intervals, with the spacing between adjacent second heat sinks being 1-5mm.

[0013] As an optional solution of this utility model, the second water-cooling pipe is arranged in an S-shape and is sequentially inserted into a plurality of the second heat sinks; one end of the second water-cooling pipe is provided with a second water inlet and the other end is provided with a second water outlet.

[0014] As an optional solution of this utility model, the air-cooling mechanism includes an air-cooling shroud, a first fan, and a second fan. The air-cooling shroud is installed on the second water-cooling base. The first fan is fixedly connected to one end of the air-cooling shroud and is in communication with the air-cooling shroud. The first fan is located above the second heat sink. The second fan is fixedly connected to the other end of the air-cooling shroud and is in communication with the air-cooling shroud.

[0015] The high-efficiency CPU water cooling structure provided in this embodiment of the utility model has at least one of the following technical effects:

[0016] The high-efficiency CPU water cooling structure provided in this application, through the dual setting of the first water cooling mechanism and the second water cooling mechanism, with both water cooling bases in contact with the CPU, can simultaneously absorb heat from the CPU surface, forming a dual heat absorption path. Compared with the traditional single heat dissipation path, it can increase the amount of heat absorption, avoid heat accumulation on the CPU surface, and thus improve heat dissipation efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A perspective view of the high-efficiency CPU water cooling structure provided in the embodiment of this utility model.

[0019] Figure 2 A perspective view of the high-efficiency CPU water cooling structure provided in the embodiment of this utility model.

[0020] Figure 3 A perspective view of the first and second water-cooling mechanisms of the high-efficiency CPU water-cooling heat dissipation structure provided in the embodiments of this utility model.

[0021] The following are the labeling elements in the figure:

[0022] 1. First water-cooling mechanism; 2. Second water-cooling mechanism; 3. Air-cooling mechanism;

[0023] 11. First water-cooling bracket; 12. First heat sink; 13. First water-cooling tube;

[0024] 21. Second water-cooling bracket; 22. Second heat sink; 23. Second water-cooling pipe;

[0025] 31. Air-cooled shroud; 32. First fan; 33. Second fan;

[0026] 111. First fixing hole;

[0027] 131. First inlet; 132. First outlet;

[0028] 211. Second fixing hole;

[0029] 231. Second inlet; 232. Second outlet. Detailed Implementation

[0030] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of this utility model, and should not be construed as limiting the utility model.

[0031] In the description of the embodiments of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0034] In one embodiment of this utility model, such as Figures 1-3 As shown, a high-efficiency CPU water cooling structure is provided, including a first water cooling mechanism 1, a second water cooling mechanism 2, and an air cooling mechanism 3, which are arranged sequentially.

[0035] The first water cooling mechanism 1 includes a first water cooling base 11, a first heat sink 12, and a first water cooling pipe 13. The first water cooling base 11 is used to fit against the CPU and absorb the heat on the CPU. The first heat sink 12 is disposed on the first water cooling base 11 and is used to dissipate the heat absorbed by the first water cooling base 11. The first water cooling pipe 13 passes through the first heat sink 12 and is used to carry away the heat on the first heat sink 12.

[0036] The second water cooling mechanism 2 includes a second water cooling base 21, a second heat sink 22, and a second water cooling pipe 23. The second water cooling base 21 is used to fit against the CPU and absorb the heat on the CPU. The second heat sink 22 is disposed on the second water cooling base 21 and is used to dissipate the heat absorbed by the second water cooling base 21. The second water cooling pipe 23 passes through the second heat sink 22 and is used to carry away the heat on the second heat sink 22.

[0037] The high-efficiency CPU water cooling structure provided in this application, through the dual setting of the first water cooling mechanism 1 and the second water cooling mechanism 2, has two water cooling bases that are in contact with the CPU, and can absorb heat from the CPU surface at the same time, forming a dual heat absorption path. Compared with the traditional single heat dissipation path, it can increase the amount of heat absorption, avoid heat accumulation on the CPU surface, and thus improve the heat dissipation efficiency.

[0038] In another embodiment of the present invention, a first fixing hole 111 is provided on the first water-cooling base 11, so as to facilitate the positioning of the first water-cooling base 11.

[0039] In another embodiment of this utility model, multiple first heat sinks 12 are provided and fixedly connected to the first water-cooling base 11 in parallel and at intervals. The distance between adjacent first heat sinks 12 is 1-5mm, preferably 3mm. The first water-cooling pipes 13 are arranged in an S-shape and are sequentially inserted through the multiple first heat sinks 12. One end of the first water-cooling pipe 13 is provided with a first water inlet 131 and the other end is provided with a first water outlet 132. Multiple heat sinks can significantly increase the contact area with air, allowing the heat conducted from the first water-cooling base 11 to be dissipated into the surrounding air more quickly. Secondly, the 3mm spacing can provide a suitable channel for airflow, ensuring smooth airflow to carry away heat, while avoiding the reduction in the number of heat sinks and insufficient heat dissipation area due to excessive spacing, or the obstruction of airflow due to excessive spacing, thereby efficiently utilizing the heat dissipation function of the heat sinks. The S-shaped design extends the contact path and contact area between the first water-cooling pipe 13 and the multiple first heat sinks 12, allowing the coolant flowing in the first water-cooling pipe 13 to fully absorb the heat on the first heat sinks 12. The first inlet 131 and the first outlet 132 serve as the inflow and outflow channels for the coolant, respectively, allowing the coolant that has absorbed heat to be discharged in time, while new low-temperature coolant continuously enters, forming a circulation and efficiently carrying away the heat from the heat sinks.

[0040] In another embodiment of the present invention, a second fixing hole 211 is provided on the second water-cooling base 21, so as to facilitate the positioning of the second water-cooling base 21.

[0041] In another embodiment of this utility model, multiple second heat sinks 22 are provided and fixedly connected to the second water-cooling base 21 in parallel and at intervals. The distance between adjacent second heat sinks 22 is 1-5mm, preferably 3mm. The second water-cooling pipes 23 are arranged in an S-shape and are sequentially inserted through the multiple second heat sinks 22. One end of the second water-cooling pipe 23 is provided with a second water inlet 231, and the other end is provided with a second water outlet 232. Multiple heat sinks can significantly increase the contact area with air, efficiently receive the heat conducted by the second water-cooling base 21 and dissipate it into the air. The 3mm spacing can ensure the number of heat sinks and the heat dissipation area while reserving appropriate space for airflow, avoiding the problem that the spacing is too large, resulting in insufficient number of heat sinks and reduced heat dissipation capacity, or too small, hindering airflow, and ensuring that heat can be dissipated in a timely manner through airflow. The S-shaped design extends the contact length and range between the second water-cooling pipe 23 and the second heat sink 22, allowing the coolant inside the pipe to fully absorb the heat from the heat sink. The second inlet 231 can introduce low-temperature coolant, and the second outlet 232 can discharge high-temperature coolant after absorbing heat, forming a continuous water-cooling cycle that quickly removes heat from the second heat sink 22, further improving heat dissipation efficiency.

[0042] In another embodiment of this utility model, the air-cooling mechanism 3 includes an air-cooling shroud 31, a first fan 32, and a second fan 33. The air-cooling shroud 31 is mounted on the second water-cooling base 21. The first fan 32 is fixedly connected to one end of the air-cooling shroud 31 and is in communication with the air-cooling shroud 31. The first fan 32 is positioned above the second heat sink 22. The second fan 33 is fixedly connected to the other end of the air-cooling shroud 31 and is in communication with the air-cooling shroud 31. One end of the first water-cooling base 11 is fixedly connected to the air-cooling shroud 31.

[0043] The high-efficiency CPU water cooling structure provided in this application works as follows:

[0044] The air-cooling shroud 31 is installed on the second water-cooling base 21, guiding the directional flow of air, preventing airflow dispersion, and ensuring that the airflow energy is concentrated on the area of ​​the second heat sink 22. The first fan 32 is fixed to one end of the air-cooling shroud 31 and connected to it, and is also positioned above the second heat sink 22. During operation, it can draw in low-temperature external air into the air-cooling shroud 31 and blow it directly onto the second heat sink 22, accelerating the airflow on the surface of the second heat sink 22 and quickly removing the heat dissipated from the second heat sink 22 into the air. The second fan 33 is fixed to the other end of the air-cooling shroud 31 and connected to it, and can promptly expel the hot air that has absorbed heat inside the air-cooling shroud 31, forming an airflow cycle of "drawing in low-temperature air - expelling hot air" with the first fan 32. The three work together to enhance the air convection around the second heat sink 22, further improving the heat dissipation efficiency of the second heat sink 22, and forming a synergistic heat dissipation effect with the second water-cooling mechanism 2.

[0045] The high-efficiency CPU water cooling structure provided in this application, through the dual setting of the first water cooling mechanism 1 and the second water cooling mechanism 2, has two water cooling bases that are in contact with the CPU, and can absorb heat from the CPU surface at the same time, forming a dual heat absorption path. Compared with the traditional single heat dissipation path, it can increase the amount of heat absorption, avoid heat accumulation on the CPU surface, and thus improve the heat dissipation efficiency.

[0046] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-efficiency CPU water-cooling heat dissipation structure, characterized in that, It includes a first water-cooling mechanism, a second water-cooling mechanism, and an air-cooling mechanism, which are arranged sequentially. The first water cooling mechanism includes a first water cooling base, a first heat sink, and a first water cooling pipe. The first water cooling base is used to fit against the CPU and absorb the heat on the CPU. The first heat sink is disposed on the first water cooling base and is used to dissipate the heat absorbed by the first water cooling base. The first water cooling pipe passes through the first heat sink and is used to carry away the heat on the first heat sink. The second water cooling mechanism includes a second water cooling base, a second heat sink, and a second water cooling pipe. The second water cooling base is used to fit against the CPU and absorb heat from the CPU. The second heat sink is disposed on the second water cooling base and is used to dissipate the heat absorbed by the second water cooling base. The second water cooling pipe passes through the second heat sink and is used to carry away the heat from the second heat sink.

2. The high-efficiency CPU water-cooling structure according to claim 1, characterized in that, The first water-cooled base is provided with a first fixing hole.

3. The high-efficiency CPU water-cooling structure according to claim 1, characterized in that, Multiple first heat sinks are provided and are fixedly connected to the first water-cooling base in parallel and at intervals, with a spacing of 1-5mm between adjacent first heat sinks.

4. The high-efficiency CPU water-cooling structure according to claim 3, characterized in that, The first water-cooling pipe is S-shaped and is sequentially inserted into multiple first heat sinks; one end of the first water-cooling pipe is provided with a first water inlet and the other end is provided with a first water outlet.

5. The high-efficiency CPU water-cooling structure according to claim 1, characterized in that, The second water-cooling base is provided with a second fixing hole.

6. The high-efficiency CPU water-cooling structure according to claim 1, characterized in that, Multiple second heat sinks are provided and are fixedly connected to the second water-cooling base in parallel and at intervals, with a spacing of 1-5mm between adjacent second heat sinks.

7. The high-efficiency CPU water-cooling structure according to claim 1, characterized in that, The second water-cooling pipe is S-shaped and is sequentially inserted into multiple second heat sinks; one end of the second water-cooling pipe is provided with a second water inlet and the other end is provided with a second water outlet.

8. The high-efficiency CPU water-cooling structure according to claim 1, characterized in that, The air-cooling mechanism includes an air-cooling shroud, a first fan, and a second fan. The air-cooling shroud is mounted on the second water-cooling base. The first fan is fixedly connected to one end of the air-cooling shroud and is in communication with the air-cooling shroud. The first fan is positioned above the second heat sink. The second fan is fixedly connected to the other end of the air-cooling shroud and is in communication with the air-cooling shroud.

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