Magnetic integrated devices and electronic equipment

Abstract

This application provides a magnetically integrated device and an electronic device. The magnetically integrated device includes at least a main circuit board and two power conversion groups arranged side by side. Each power conversion group includes a first circuit board, a second circuit board, and a magnetically integrated module. The first and second circuit boards are spaced apart on the main circuit board along a first direction, and the first and second circuit boards fix the magnetically integrated module to the main circuit board. The magnetically integrated module is connected to devices on the first and second circuit boards. By integrating the magnetically integrated module with the circuit board in this manner, the size is optimized, and the spaced arrangement optimizes airflow, improves heat dissipation, and increases device efficiency.

Description

Technical Field

[0001] This application relates primarily to the field of power supply technology, and in particular to magnetic integrated devices and electronic equipment. Background Technology

[0002] Integrated magnetic components and their associated circuitry are key parts of power converters, providing electrical isolation, energy transfer, and directly impacting overall power efficiency. They are widely used in server power supplies, charging stations, and automotive power supplies. Currently widely used DC-DC modules each have their advantages and disadvantages. Traditional magnetic components are typically large and heavy, hindering miniaturization and weight reduction. They also exhibit significant losses at high frequencies, impacting efficiency. Furthermore, traditional magnetic components are often discretely designed, resulting in a large number of components and complex wiring in the system. Utility Model Content

[0003] The main purpose of this application is to provide magnetic integrated devices and electronic equipment to solve problems such as low integration, large size, low efficiency, and poor heat dissipation of transformers, so as to reduce the size of transformers, improve efficiency, obtain good heat dissipation, maintain parameter consistency, and improve the assembly integration of the device.

[0004] To address the aforementioned issues, this application provides a magnetic integration device and an electronic device. The magnetic integration device includes at least a main circuit board and two power conversion groups arranged side-by-side. Each power conversion group includes a first circuit board, a second circuit board, and a magnetic integration module. The first and second circuit boards are spaced apart on the main circuit board along a first direction, and the first and second circuit boards fix the magnetic integration module to the main circuit board. The magnetic integration module is connected to devices on the first and second circuit boards.

[0005] In one embodiment, both the first circuit board and the second circuit are provided with a first protrusion along the second direction; the first protrusion at least partially passes through the hollow area on the magnetic integrated module to fix the magnetic integrated module to the main circuit board; wherein, the second direction faces the main circuit board.

[0006] In one embodiment, the magnetic integration device further includes a coupling component. A first portion of the coupling component is disposed on the end of the first circuit board and the second circuit board away from the main circuit board and is electrically connected to the first circuit board and the second circuit board. A second portion of the coupling component is disposed between the two power conversion groups facing the main circuit board. The coupling component is used to couple the negative terminal of the power supply.

[0007] In one embodiment, a third portion of the coupling component is disposed on the main circuit board and extends in a direction away from the power conversion group.

[0008] In one embodiment, the magnetic integration device further includes a capacitor module disposed on the main circuit board along a third direction, wherein the third direction is the length direction of the main circuit board.

[0009] In one embodiment, the magnetic integration module includes at least a first magnetic core and a second magnetic core; the first magnetic core and the second magnetic core are arranged side by side in a third-direction orientation, and a gap is provided between the first magnetic core and the second magnetic core.

[0010] In one embodiment, any magnetic core includes: a first base plate, a second base plate, a first side post, a second side post, and a winding post; one end of the first side post is connected to the first base plate, and the other end is connected to the second base plate; one end of the second side post is connected to the first base plate, and the other end is connected to the second base plate, forming a ring; a plurality of winding posts are provided inside the ring, and one end of each winding post is connected to the first base plate, and the other end is connected to the second base plate.

[0011] In one embodiment, the first base plate includes a first sub-base plate and a second sub-base plate, with a first magnetic reluctance disposed between the first sub-base plate and the second sub-base plate; the second base plate includes a third sub-base plate and a fourth sub-base plate, with a first magnetic reluctance disposed between the third sub-base plate and the fourth sub-base plate; the first side post includes a first side post and a second side post, with a second magnetic reluctance disposed between the first side post and the second side post; the second side post includes a third side post and a fourth side post, with a second magnetic reluctance disposed between the third side post and the fourth side post.

[0012] In one embodiment, the first magnetic core and the second magnetic core are coupled together, and the first magnetic core and the second magnetic core share a common side post.

[0013] In one embodiment, the first magnetic core and the second magnetic core are coupled together, and there are no side posts between the first magnetic core and the second magnetic core.

[0014] To address the aforementioned problems, this application also provides an electronic device comprising: a power supply; and a magnetic integrated device coupled to the power supply for power output conversion, wherein the magnetic integrated device is as described in any of the embodiments described above.

[0015] The magnetic integrated device and electronic equipment provided in this application integrate the circuit board and magnetic integrated module to optimize the size, and optimize the airflow, improve heat dissipation, and increase the device efficiency by setting them at intervals. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0017] Figure 1 This is a schematic diagram of the structure of the first embodiment of the magnetic integrated device provided in this application;

[0018] Figure 2 This is a schematic diagram of the structure of a first embodiment of the first circuit board / second circuit board provided in this application;

[0019] Figure 3 This is a schematic diagram of the structure of a second embodiment of the first circuit board / second circuit board provided in this application;

[0020] Figure 4 This is a schematic diagram of the structure of the first embodiment of the magnetic integrated module provided in this application;

[0021] Figure 5 This is a schematic diagram of the structure of the second embodiment of the magnetic integrated device provided in this application;

[0022] Figure 6 This is a schematic diagram of the structure of the third embodiment of the magnetic integrated device provided in this application;

[0023] Figure 7 This is a schematic diagram of the structure of an embodiment of the coupling component provided in this application;

[0024] Figure 8 This is a schematic diagram of the structure of the fourth embodiment of the magnetic integrated device provided in this application;

[0025] Figure 9 This is a schematic diagram of the structure of the second embodiment of the magnetic integrated module provided in this application;

[0026] Figure 10 This is a schematic diagram of the structure of the third embodiment of the magnetic integrated module provided in this application;

[0027] Figure 11 This is a schematic diagram of the structure of the fourth embodiment of the magnetic integrated module provided in this application;

[0028] Figure 12 This is a structural schematic diagram of the fifth embodiment of the magnetic integrated module provided in this application;

[0029] Figure 13 This is a schematic diagram of the structure of the sixth embodiment of the magnetic integrated module provided in this application;

[0030] Figure 14 This is a schematic diagram of the structure of an embodiment of the electronic device provided in this application;

[0031] Figure 15 This is a schematic diagram of the primary and secondary winding distribution structure of an embodiment of the power supply circuit provided in this application;

[0032] Figure 16This is a schematic diagram of the primary-side circuit structure of an embodiment of the power supply circuit provided in this application;

[0033] Figure 17 This is a schematic diagram of the secondary circuit structure of an embodiment of the power supply circuit provided in this application.

[0034] Icon labels:

[0035] 100. Magnetic integrated device; 10. Main circuit board; 20. Power conversion group; 21. First circuit board; 211. First protrusion; 212. Second protrusion; 213. Hollowed-out area; 214. Through hole; 22. Second circuit board; 23. Magnetic integrated module; 231. First magnetic core; 232. Second magnetic core; 234. First base plate; 235. Second base plate; 236. First side post; 237. Second side post; 238. Winding post; 24. Component ; 25. Coupling component; 251. First part; 252. Second part; 253. Third part; 26. Capacitor module; 240. First sub-base plate; 241. Second sub-base plate; 242. Third sub-base plate; 243. Fourth sub-base plate; 244. First sub-side post; 245. Second sub-side post; 246. Third sub-side post; 247. Fourth sub-side post; 248. First magnetoresistive element; 249. Second magnetoresistive element; 300. Electronic device; 400. Power supply. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings, not all structures. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0037] The terms "first," "second," etc., used in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0038] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0039] In traditional magnetic devices, discrete wire-wound magnetic components and corresponding power conversion circuits are typically used. For example, the primary winding of a transformer uses Litz wire wound in series on two columns, while the secondary winding uses copper sheets as windings, connected in parallel for output. However, this approach usually presents several problems, such as: large size: the primary winding coil and winding frame occupy a large proportion of the structure, resulting in low space utilization and a large overall size; low efficiency: the high-frequency power circuit of the transformer is large (the coil is far from the MOS, filter capacitor, etc.), and the losses caused by the high-frequency current of the coil are significant, making it difficult to further improve efficiency; poor heat dissipation: the primary winding has a large proportion of multi-strand insulation, and the multi-layered winding of the coil almost fills the core window, blocking the airflow and resulting in poor heat dissipation. If a heat dissipation channel is added, the size needs to be further increased; poor parameter consistency: the coil winding and assembly are greatly affected by the manufacturing process, and parameters such as parasitic capacitance and leakage inductance of the magnetic components are not easy to control accurately, resulting in large fluctuations in performance during high-frequency applications; low automation: wire-wound magnetic components are generally not easy to assemble automatically, so the performance consistency is also poor.

[0040] Therefore, this application provides a magnetic integrated device 100 and an electronic device to solve the above-mentioned problems.

[0041] See Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of the first embodiment of the magnetic integrated device provided in this application; wherein, the magnetic integrated device 100 includes at least: a main circuit board 10 and two power conversion groups 20, the two power conversion groups 20 are arranged side by side, and each power conversion group 20 includes: a first circuit board 21, a second circuit board 22 and a magnetic integrated module 23; wherein, the first circuit board 21 and the second circuit board 22 are spaced apart on the main circuit board 10 along a first direction, and the first circuit board 21 and the second circuit board 22 fix the magnetic integrated module 23 on the main circuit board 10; the magnetic integrated module 23 is connected to the device 24 on the first circuit board 21 and the second circuit board 22.

[0042] In this way, the circuit board and magnetic integration module 23 are integrated to optimize the size, and the airflow is optimized, heat dissipation is improved, and device efficiency is increased by setting them at intervals.

[0043] In one specific embodiment, the first circuit board 21 and the second circuit board 22 are disposed at a distance between the two sides of the magnetic integration module 23. For example... Figure 1As shown, an intermittent assembly method is adopted to leave internal air ducts in the magnetic integrated device 100, so as to ensure heat conversion efficiency during heat dissipation and effectively improve the heat dissipation of the magnetic integrated device 100. Furthermore, in the conventional magnetic device 24, the air gap of the magnetic core winding post 238 is set inside the coil, and the clearance distance is not easy to make large, resulting in large eddy current losses. However, in the solution of this application, by setting the first circuit board 21 and / or the second circuit board 22 on both sides of the magnetic integrated module 23, the clearance distance of the air gap is large, the eddy current loss is small, and it is beneficial to improve efficiency.

[0044] In other embodiments, some components 24 of the primary or secondary side of the transformer (i.e., the magnetic integrated device 100) are arranged on the first circuit board 21 and / or the second circuit board 22.

[0045] In one embodiment, taking the first circuit board 21 as an example, as follows: Figure 2 As shown, Figure 2 This is a schematic diagram of the structure of the first embodiment of the first circuit board / second circuit board provided in this application; the first circuit board 21 and the second circuit are both provided with a first protrusion 211 along the second direction; the first protrusion 211 at least partially passes through the hollow area 213 on the magnetic integrated module 23, fixing the magnetic integrated module 23 to the main circuit board 10; wherein, the second direction is towards the main circuit board 10.

[0046] For further details, please refer to [link / reference]. Figure 3 and Figure 4 As shown, Figure 3 This is a schematic diagram of the structure of a second embodiment of the first circuit board / second circuit board provided in this application; Figure 4 This is a structural schematic diagram of the first embodiment of the magnetic integrated module provided in this application; as shown... Figure 3 As shown, the first protrusion includes a through-hole 214 structure; based on this, combined with Figure 4 As shown, where, Figure 4 The magnetic integrated module 23 in the text is only one set of structures; the actual structure consists of two sets of structures arranged side by side. From Figure 4 It can be seen from this that, among them Figure 4 The magnetic integrated module 23 also includes a winding post 238 in the hollow area 213, wherein the winding post 238 passes through... Figure 3 The through hole 214 in the middle couples and fixes the first protrusion and the magnetic integrated module 23.

[0047] In one embodiment, such as Figure 5 As shown, Figure 5This is a schematic diagram of the structure of the second embodiment of the magnetic integrated device provided in this application; the magnetic integrated device 100 further includes a coupling component 25, the first part 251 of the coupling component 25 is disposed at the end of the first circuit board 21 and the second circuit board 22 away from the main circuit board 10, and is electrically connected to the first circuit board 21 and the second circuit board 22; the second part 252 of the coupling component 25 is disposed between the two power conversion groups 20 facing the main circuit board 10; wherein, the coupling component 25 is used to couple the negative terminal of the power supply.

[0048] Combination Figure 3 and Figure 5 As shown, the first circuit board 21 and the second circuit board 22 are provided with a second protrusion 212 in the direction away from the second direction, and the coupling component 25 couples the first circuit board 21 and the second circuit board 22 together through the second protrusion 212. It can be understood that in another embodiment, the first circuit board 21 and the second circuit board 22 of the two power conversion groups 20 are also coupled together in this way.

[0049] In one embodiment, such as Figure 6 As shown, Figure 6 This is a schematic diagram of the structure of the third embodiment of the magnetic integrated device provided in this application; the third part 253 of the coupling component 25 is disposed on the main circuit board 10 and extends in the direction away from the power conversion group 20.

[0050] Combination Figure 5 and Figure 6 As shown, the coupling component 25 includes a plurality of first portions 251, each of which is coupled together by a second protrusion 212 of a first circuit board 21 and a second circuit board 22.

[0051] Specifically, such as Figure 7 As shown, Figure 7 This is a schematic diagram of the structure of an embodiment of the coupling component provided in this application; it can be seen from... Figure 7 As can be seen from this embodiment, the first part 251, the second part 252 and the third part 253 of the coupling component 25 are coupled together by the second part 252; in another embodiment, the second part 252 and the third part 253 are integrally formed.

[0052] Understandably, the secondary output pin of the magnetic integrated device 100 faces upward to facilitate connection with the coupling component 25, and the MOSFET has a better airflow for heat dissipation.

[0053] like Figure 7 As shown, the third part 253 of the coupling component 25 is also provided with a protruding part along the second direction to achieve fitting and coupling with the main circuit board 10.

[0054] Understandably, in the above embodiments, a large current can be transferred to the output port via the coupling component 25 (copper busbar). This method involves lower impedance, better heat dissipation, and lower power loss. In other embodiments, the magnetic integrated module 23 and the corresponding first circuit board 21 and / or second circuit board 22 are installed in reverse. That is, the output pins of the secondary side are inserted into the main circuit board 10 along the second direction and transferred to the output port through the main circuit board 10, thereby eliminating the need for the coupling component 25.

[0055] In one embodiment, such as Figure 6 and Figure 8 As shown, Figure 8 This is a schematic diagram of the structure of the fourth embodiment of the magnetic integrated device provided in this application; the magnetic integrated device 100 further includes a capacitor module 26, which is disposed on the main circuit board 10 along a third direction, wherein the third direction is the length direction of the main circuit board 10. The capacitor module 26 is mainly used for filtering, coupling, decoupling and energy storage.

[0056] Understandably, in traditional transformer (magnetic integrated device 100) designs, the high-frequency power circuit of the transformer is relatively large (the coil is far from the MOSFET, filter capacitor, etc.), resulting in significant losses due to the high-frequency current in the coil, making it difficult to further improve efficiency. In one embodiment, device 24 may include a rectifier MOSFET, filter capacitor, etc. Specifically, the secondary side of the transformer (PCB copper foil, i.e., the copper foil integrated on the first circuit board 21 or the second circuit board 22) is directly connected to device 24. This connection method allows for high-frequency current, a short path, and low losses, thus achieving higher efficiency. The PCB copper foil has low thermal resistance due to its multiple strands, and the dual PCBs (circuit boards, i.e., the first circuit board 21 and the second circuit board 22) are assembled separately on both sides, with good airflow in the middle and on both sides, ensuring good heat dissipation for the magnetic core, the PCB, and the device 24 mounted on it. The copper foil has a relatively low insulation ratio, resulting in good heat dissipation. In other embodiments, the current density can be appropriately increased, and the overall coil volume is small.

[0057] In one embodiment, the coupling component 25 described above adopts a copper busbar structure; specifically, in another embodiment, such as... Figure 5 The second part 252 shown is centrally assembled and has good current sharing. In other embodiments, the copper busbars of the coupling components 25 can be arranged in a non-centralized manner, that is, respectively arranged on both sides of the two power conversion groups 20; or, all of them can be arranged on either side of the two power conversion groups 20, that is, Figure 5 The left or right side of the middle.

[0058] Through the above methods, the copper foil on the first circuit board 21 and / or the second circuit board 22 can be designed with a larger current density, reducing the space occupied by the winding. Simultaneously, the primary and secondary side MOSFETs, filter capacitors, and control chips can be arranged close to the first circuit board 21 and / or the second circuit board 22, reducing the overall volume of the power conversion section by more than 30%. Furthermore, the large copper foil on the first circuit board 21 and / or the second circuit board 22 has lower thermal resistance due to its larger number of strands. Also, the first circuit board 21 and the second circuit board 22 are assembled separately on both sides, with good airflow in the middle and on both sides, ensuring good heat dissipation for the magnetic core, the first circuit board 21 and the second circuit board 22, and the components 24 on them. Moreover, the dimensional tolerances of the first circuit board 21 and / or the second circuit board 22 are smaller than those of traditional wire winding, resulting in better consistency of automated processing parameters. For high-frequency applications, the circuit stability is good, the magnetic component structure is simple, and automated assembly is easily adopted, improving processing efficiency and performance consistency.

[0059] Furthermore, in the cascaded configuration of the two transformers (i.e., the two-way power conversion group 20), the secondary winding output is rectified and connected in parallel, and the total current is shunted to each secondary winding. At the same time, the coil, rectifier MOS, and filter capacitor form a minimum high-frequency power loop, thereby significantly reducing the total loss of the secondary winding. Magnetic cores are symmetrically mounted on one side of the first circuit board 21 and the second circuit board 22, with a reserved air duct in the middle to enhance overall heat dissipation. Cooling improves efficiency. Magnetic cores are symmetrically mounted on one side of the first circuit board 21 and the second circuit board 22, with the main air gap in the middle and the windings avoiding the air gap by 3 to 5 times the distance to reduce eddy current losses. The two conversion modules have a 90-degree phase difference and are connected in parallel to reduce ripple current and losses by more than 20%.

[0060] In one embodiment, such as Figure 9 As shown, Figure 9 This is a schematic diagram of the structure of the second embodiment of the magnetic integrated module provided in this application; the magnetic integrated module 23 includes at least a first magnetic core 231 and a second magnetic core 232; the first magnetic core 231 and the second magnetic core 232 are arranged side by side in the third direction, and a gap is provided between the first magnetic core 231 and the second magnetic core 232.

[0061] Understandable, combined Figure 8 and Figure 9 As shown, the magnetic integrated module 23 is mounted on the main circuit board 10 using a recessed assembly method and local support to make full use of space to improve the power density of the power supply.

[0062] In one embodiment, such as Figure 10 As shown, Figure 10This is a structural schematic diagram of the third embodiment of the magnetic integrated module provided in this application; any magnetic core includes at least: a first base plate 234, a second base plate 235, a first side post 236, a second side post 237, and a winding post 238; one end of the first side post 236 is connected to the first base plate 234, and the other end is connected to the second base plate 235; one end of the second side post 237 is connected to the first base plate 234, and the other end is connected to the second base plate 235, forming a ring; a plurality of winding posts 238 are provided inside the ring, one end of each winding post 238 is connected to the first base plate 234, and the other end is connected to the second base plate 235.

[0063] In one embodiment, such as Figure 11 As shown, Figure 11 This is a schematic diagram of the structure of the fourth embodiment of the magnetic integrated module provided in this application; the first base plate 234 includes a first sub-base plate 240 and a second sub-base plate 241, and a first magnetic reluctance 248 is disposed between the first sub-base plate 240 and the second sub-base plate 241; the second base plate 235 includes a third sub-base plate 242 and a fourth sub-base plate 243, and a first magnetic reluctance 248 is disposed between the third sub-base plate 242 and the fourth sub-base plate 243; the first side post 236 includes a first side post 244 and a second side post 245, and a second magnetic reluctance 249 is disposed between the first side post 244 and the second side post 245; the second side post 237 includes a third side post 246 and a fourth side post 247, and a second magnetic reluctance 249 is disposed between the third side post 246 and the fourth side post 247.

[0064] The first magnetoresistive element 248 and the second magnetoresistive element 249 may include, but are not limited to, the bonding air gap, or any material with a permeability smaller than μr (relative permeability) of the main magnetic core, such as glass bead adhesive bonding to create an air gap, or composite bonding of magnetic cores with a lower μr, or magnetic powder adhesive bonding, magnetic ink filling, etc., and may also be divided into multi-segment bonding forms.

[0065] In one embodiment, the first base plate 234 and the second base plate 235 are arranged in parallel, and the first base plate and the second side post 237 are arranged in parallel; in another embodiment, the first base plate 234 is arranged perpendicular to the first side post 236, and similarly, it is also arranged perpendicular to the second side post 237; the second base plate 235 is arranged in the same way as the first base plate 234.

[0066] In one embodiment, such as Figure 12 As shown, Figure 12 This is a schematic diagram of the structure of the fifth embodiment of the magnetic integrated module provided in this application; the first magnetic core 231 and the second magnetic core 232 are coupled together, and the first magnetic core and the second magnetic core 232 share a side post.

[0067] The first magnetic core 231 and the second magnetic core 232 share a common side post, which can be achieved by bonding the left and right parts of the first magnetic core 231 and the second magnetic core 232 together. Specifically, this can be achieved through the coupling method using the first magnetoresistive element 248 described above. For example... Figure 12 As shown, where Figure 12 A first reluctance 248 is used to couple the first base plate 234 between the first magnetic core 231 and the second magnetic core 232, and the same applies to the second base plate 235; similarly, the side posts can be coupled as follows. Figure 12 The diagram shows two sub-pillars coupled via a second magnetoresistive element 249. In other embodiments, a single pillar can also be used. In another embodiment, the first magnetic core 231 and the second magnetic core 232 share a pillar, and the base plate of the two magnetic cores and the shared pillar can be an integral structure.

[0068] In one embodiment, such as Figure 13 As shown, Figure 13 This is a schematic diagram of the sixth embodiment of the magnetic integrated module provided in this application; the first magnetic core 231 and the second magnetic core 232 are coupled, and there are no side posts between the first magnetic core 231 and the second magnetic core 232. The base plate between the first magnetic core 231 and the second magnetic core 232 can be coupled by setting a first magnetic reluctance 248. The implementation method of the first magnetic reluctance 248 in the coupling part is the same as in the above embodiments, and will not be described in detail here. For example... Figure 13 As shown, Figure 13 The two are coupled together, with the coupling part using a first magnetoresistive element 248. In another embodiment, the base plate between the first magnetic core 231 and the second magnetic core 232 can also be an integral structure.

[0069] It is understandable that, for the magnetic integrated module 23 in the above embodiments, the magnetic flux direction of each winding post 238 generated by coil excitation can be adjusted according to the actual usage and scenario, i.e., as long as the usage requirements are met. The magnetic flux direction can also be reversed simultaneously as a whole.

[0070] To address the aforementioned problems, this application also provides an electronic device 300, such as... Figure 14 As shown, Figure 14 This is a schematic diagram of the structure of an embodiment of the electronic device provided in this application; the electronic device 300 includes: a power supply 400; a magnetic integrated device 100, the magnetic integrated device 100 being coupled to the power supply 400 to convert the output power of the power supply 400, and the magnetic integrated device 100 being the magnetic integrated device 100 as described in any of the embodiments described above.

[0071] To address the aforementioned problems, this application also provides a power supply circuit, such as... Figure 15 , Figure 16 and Figure 17 As shown, Figure 15 This is a schematic diagram of the primary and secondary winding distribution structure of an embodiment of the power supply circuit provided in this application; Figure 16 This is a schematic diagram of the primary-side circuit structure of an embodiment of the power supply circuit provided in this application; Figure 17 This is a schematic diagram of the secondary circuit structure of an embodiment of the power supply circuit provided in this application; it can be understood that this power supply circuit adopts a primary-side full-bridge LLC, a secondary-side full-wave rectifier with a center tap, and a parallel secondary-side output. Wherein, as... Figure 17 As shown, Figure 17 Rectification is only applied to the output of one secondary side. Figure 17 The three ports on the left are connected accordingly. Figure 15 In, any three-terminal interface, that is, Figure 15 The corresponding ports 5, 6, 7, or 8, 9, 10, or 11, 12, 13, up to 26, 27, 28, should be connected. In other words, the power supply circuit should include at least eight ports. Figure 17 The circuit structure shown is shown.

[0072] In other embodiments, the power supply circuit corresponds to one of the power conversions, which can actually be two paths interleaved in parallel at 90 degrees, or three or more paths in parallel.

[0073] Furthermore, in other embodiments, the topology, transformer turns (number of turns in the 238-coil winding), rectification method, and secondary output connection method can be flexibly adjusted according to the application. Specifically, this includes, but is not limited to: primary-side full-bridge or half-bridge topologies, secondary-side bridge or center-tapped rectification, and secondary-side outputs connected in parallel, partially in series, or fully in series.

[0074] This application provides a magnetic integrated device 100 and an electronic device 300. Utilizing a structural assembly method comprising a main circuit board 10, a first circuit board 21, a second circuit board 22, and a magnetic integrated module 23, the integration density of the magnetic integrated device 100 is improved, thereby reducing its size and improving heat dissipation. Furthermore, a dual-path power conversion group 20 is employed, with symmetrical mounting of the magnetic core on one side, increasing the clearance between air gaps, reducing eddy current losses, and improving the efficiency of the power supply 400. Moreover, the structure described in this application results in smaller dimensional tolerances in the circuit board processing, better consistency of processing parameters, and easier automated assembly, thus improving production efficiency.

[0075] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A magnetic integrated device, characterized in that, The magnetic integration device includes at least: The main circuit board and two power conversion groups are arranged side by side. Each of the power conversion groups includes: a first circuit board, a second circuit board and a magnetic integrated module; The first circuit board and the second circuit board are disposed at a distance from each other on the main circuit board along a first direction, and the first circuit board and the second circuit board fix the magnetic integrated module on the main circuit board; the magnetic integrated module is connected to the devices on the first circuit board and the second circuit board.

2. The magnetic integrated device according to claim 1, characterized in that, Both the first circuit board and the second circuit board are provided with a first protrusion along the second direction; the first protrusion at least partially passes through the hollow area on the magnetic integrated module, fixing the magnetic integrated module to the main circuit board; wherein, the second direction faces the main circuit board.

3. The magnetic integrated device according to claim 1, characterized in that, The magnetic integration device further includes a coupling component, a first part of which is disposed at the end of the first circuit board and the second circuit board away from the main circuit board and is electrically connected to the first circuit board and the second circuit board; The second part of the coupling component is disposed between the two power conversion groups, facing the main circuit board; The coupling component is used to couple the negative terminal of the power supply.

4. The magnetic integrated device according to claim 3, characterized in that, The third part of the coupling component is disposed on the main circuit board and extends in a direction away from the power conversion group.

5. The magnetic integrated device according to claim 1, characterized in that, The magnetic integration device further includes a capacitor module, which is disposed on the main circuit board along a third direction, wherein the third direction is the length direction of the main circuit board.

6. The magnetic integrated device according to claim 1, characterized in that, The magnetic integration module includes at least a first magnetic core and a second magnetic core; the first magnetic core and the second magnetic core are arranged side by side in a third direction, and a gap is provided between the first magnetic core and the second magnetic core.

7. The magnetic integrated device according to claim 6, characterized in that, Any of the magnetic cores comprises: First base plate, second base plate, first side post, second side post, and winding post; One end of the first side post is connected to the first base plate, and the other end is connected to the second base plate; one end of the second side post is connected to the first base plate, and the other end is connected to the second base plate, forming a ring. The annular ring is provided with a plurality of winding posts, one end of each winding post being connected to the first base plate and the other end being connected to the second base plate.

8. The magnetic integrated device according to claim 7, characterized in that, The first base plate includes a first sub-base plate and a second sub-base plate, and a first magnetic reluctance is provided between the first sub-base plate and the second sub-base plate; The second base plate includes a third sub-base plate and a fourth sub-base plate, and a first magnetic reluctance is provided between the third sub-base plate and the fourth sub-base plate; The first side post includes a first sub-side post and a second sub-side post, and a second magnetic reluctance is provided between the first sub-side post and the second sub-side post; The second side post includes a third sub-side post and a fourth sub-side post, and a second magnetic reluctance is provided between the third sub-side post and the fourth sub-side post.

9. The magnetic integrated device according to claim 6, characterized in that, The first magnetic core and the second magnetic core are coupled together, and the first magnetic core and the second magnetic core share a common side post.

10. The magnetic integrated device according to claim 6, characterized in that, The first magnetic core and the second magnetic core are coupled together, and there are no side posts between the first magnetic core and the second magnetic core.

11. An electronic device, characterized in that, The electronic device includes: power supply; A magnetic integrated device coupled to the power supply for converting the output power of the power supply, the magnetic integrated device being the magnetic integrated device as claimed in any one of claims 1-10.

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