A leveling mechanism for surface mount capacitors based on thick adhesive plates

The roller leveling mechanism rolls and levels the end faces of the chip capacitors inside the thick adhesive plate, solving the problem of uneven end faces of the chip capacitors inside the thick adhesive plate, improving the sealing quality and consistency of the amount of adhesive, and achieving a better leveling effect.

CN224288038UActive Publication Date: 2026-05-26ZHAOQING YINGTUO AUTOMATION EQUIP TECH CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHAOQING YINGTUO AUTOMATION EQUIP TECH CO LTD
Filing Date
2025-05-22
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

During the sealing process of surface mount capacitors, it is difficult to make the end faces of the surface mount capacitors in the thick adhesive plate flush, resulting in poor sealing quality and inconsistent adhesive application. Existing leveling equipment has the problem of poor leveling effect.

Method used

A roller leveling mechanism based on a thick plastic sheet is adopted. The moving seat drives the leveling roller to move horizontally to roll and level the end of the chip capacitor. Combined with the meshing structure of the drive rack, gear and rack, it ensures effective contact and pressing between the roller and the chip capacitor. The fixed clamp is used to stabilize the thick plastic sheet to ensure the uniformity and consistency of the leveling process.

Benefits of technology

This effectively solves the problem of large height differences between the end faces of surface-mount capacitors inside thick adhesive boards, ensuring that the end faces of surface-mount capacitors are flush, improving the consistency of sealing quality and paste application, and avoiding deformation of thick adhesive boards during the leveling process.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224288038U_ABST
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Abstract

This utility model discloses a roller leveling mechanism for chip capacitors based on a thick adhesive plate, including a thick adhesive plate fixing device and a roller device. The thick adhesive plate fixing device has a mounting position for mounting the thick adhesive plate, and the mounting position can move up and down relative to the roller device. The roller device includes a mounting base, a movable seat, and leveling rollers. The movable seat is horizontally mounted on the top of the mounting base, and the direction of movement of the movable seat is parallel to the extension direction of the mounting base. The leveling rollers are rotatably mounted on the top of the movable seat, and the mounting position is located above the movement range of the movable seat. This technical solution uses the movable seat to drive the leveling rollers to move horizontally along the mounting base, so that the leveling rollers can roll and level the ends of the chip capacitors protruding from the lower surface of the thick adhesive plate row by row. This solves the problem of large height differences in previous flat plate leveling products, and the thick adhesive plate is not easily deformed during the leveling process, ensuring uniform force on the chip capacitors and better consistency in the leveling effect.
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