Ultra-thin rolled copper stamped fuse assembly

Abstract

This utility model relates to an ultra-thin rolled copper stamped fuse assembly. The fuse assembly includes a sheet copper substrate made of rolled copper with a thickness in the micrometer range, a first PI thermosetting film and a second PI thermosetting film respectively covering the upper and lower surfaces of the sheet copper substrate; the sheet copper substrate has a wavy fuse portion with a line width of 0.15±0.02mm. This utility model uses a high-precision die-cutting method to punch the ultra-thin rolled copper foil, directly forming a fuse semi-finished product. In particular, the extremely fine fuse portion is punched in one step, avoiding defects such as edge deformation caused by multiple punchings, ensuring stable dimensions and performance of the fuse portion. High-speed rotary die-cutting is then used for efficient and precise production, encapsulating the fuse portion within the film material, exposing the opening area and end area for electrical connection, improving production efficiency and subsequent use efficiency. The overall production efficiency can be increased to 5000pcs / H, and the yield rate to approximately 95%.

Description

Technical fields:

[0001] This utility model relates to the field of fuses and their manufacturing technology, and specifically to an ultra-thin rolled copper stamped fuse assembly. Background technology:

[0002] Traditional fuses mainly include surface mount fuses, blade fuses, tubular fuses, as well as RH block type, RP resistor type, and RY metal-cased resettable fuses. These fuses typically have dimensions of several millimeters or even tens of millimeters or larger. With the development of the electronics industry, the precision requirements for components are increasing. Some high-precision products require specifications below the millimeter level, which traditional fuses cannot meet. For example, batteries, integrated busbars, and wire harnesses used in new energy vehicles and energy storage devices place higher demands on fuse products. Currently, copper-based fuses are manufactured using laser cutting, which has low production efficiency and a low yield rate, approximately 400-500 pieces / hour, with a yield of around 80%. Therefore, there is a need to develop smaller and thinner fuse products and corresponding manufacturing processes. Utility Model Content:

[0003] The purpose of this invention is to overcome the above-mentioned shortcomings of the prior art and provide an ultra-thin rolled copper stamped fuse assembly.

[0004] The technical solution adopted in this utility model is:

[0005] An ultra-thin rolled copper stamped fuse assembly includes a sheet copper substrate made of rolled copper with a thickness of micrometers, a first PI thermosetting film and a second PI thermosetting film respectively covering the upper and lower surfaces of the sheet copper substrate; wherein, the sheet copper substrate is divided into three regions along its length: an opening region, a safety region, and an end region; the opening region has a plurality of through holes arranged in an array at intervals; the safety region includes a width-gradient connecting portion that connects to the opening region and the end region at opposite corners at both ends, and a curved portion connecting the two connecting portions, and the curved portion has a wavy safety portion in the middle, the line width of the safety portion being 0.15±0.02mm and smaller than the line width of the main body of the curved portion; the first PI thermosetting film and the second PI thermosetting film are respectively provided with a plurality of small windows arranged at intervals, each small window region containing a row of through holes in the same direction of the width of the sheet copper substrate and a surrounding area of ​​the through holes; the outer end of the end region protrudes beyond the first PI thermosetting film and the second PI thermosetting film.

[0006] In the aforementioned fuse assembly, two curved perforations are respectively provided on the portions of the first PI thermosetting film and the second PI thermosetting film located in the safety area, along the connecting portion and the outer edge of the curved portion of the safety area.

[0007] In the aforementioned fuse assembly, the fuse section has at least two peaks and two troughs; the length of the opening area accounts for 60% ± 5% of the total length of the sheet copper substrate; the length of the end area accounts for 10% ± 5% of the total length of the sheet copper substrate, and the remaining area is the fuse area; the diameter of the through hole is 0.50 ± 0.05 mm, the through hole array is in 12 groups along the length direction of the sheet copper substrate, with 3 through holes in each group, the spacing between adjacent through holes along the length direction of the sheet copper substrate is 2.00 ± 0.05 mm, and the spacing between adjacent through holes along the width direction of the sheet copper substrate is 1.50 ± 0.05 mm.

[0008] This invention employs a high-precision die-cutting method to punch ultra-thin rolled copper foil, directly forming a fuse semi-finished product. The extremely fine fuse component is punched in a single pass, avoiding defects such as edge deformation that can occur with multiple punching processes, thus ensuring stable dimensions and performance of the fuse component. High-speed rotary die-cutting further enhances efficiency and precision, encapsulating the fuse component within a membrane material while exposing the opening and end areas for electrical connection, improving both production efficiency and subsequent usability. By installing photoelectric tracking on each rotary die and compensating for adjustments in the X-axis direction, the invention perfectly integrates the metal stamping semi-finished product with the rotary die-cutting process, increasing overall production efficiency to 5000 pieces / hour and yield to approximately 95%, thereby effectively reducing product costs and enhancing market competitiveness. Attached image description:

[0009] Figure 1 , Figure 2 These are exploded structural diagrams and planar structural diagrams of a single fuse assembly unit of this utility model;

[0010] Figure 3 This is a plan view of the copper substrate semi-finished material strip in this utility model; (the shaded area in the figure is the waste material that needs to be removed during stamping).

[0011] Figure 4 This is a schematic diagram of the high-speed rotary die-cutting production process of the fuse assembly in this utility model;

[0012] Figure 4-1 This is a schematic diagram of the blade unfolding and die-cutting effect in the first die-cutting process of this utility model;

[0013] Figure 4-2 This is a schematic diagram of the blade unfolding and die-cutting effect in the second die-cutting process of this utility model;

[0014] Figure 4-3 This is a schematic diagram of the blade unfolding and die-cutting effect of the third die-cutting process in this utility model.

[0015] Figure 4-4This is a schematic diagram of the blade unfolding and die-cutting effect of the fourth die-cutting process in this utility model.

[0016] Figure 4-5 This is a schematic diagram of the blade unfolding and die-cutting effect of the fifth die-cutting process in this utility model.

[0017] Figure 4-6 This is a schematic diagram showing the combined effect of various die-cutting processes in this utility model.

[0018] Figure 4-7 This is a schematic diagram illustrating the superposition effect of the die-cutting effect and the copper substrate semi-finished material strip in the process of this utility model;

[0019] Figure 5 This is a schematic diagram of the single-unit structure of the sheet-like copper substrate in this utility model;

[0020] Figure 6 This is a schematic diagram of the stamping process in step one of this utility model. Figure 6 The red part in the middle is a schematic diagram of the blade;

[0021] Figure 7 This is a schematic diagram showing the superimposed effects of the stamping of rolled copper strip through the second, third, and fourth stations. Detailed implementation method:

[0022] like Figures 1-2As shown, this utility model describes an ultra-thin rolled copper stamped fuse assembly. Each fuse assembly includes a sheet copper substrate 1 made of rolled copper strip 2 with a thickness of micrometers, a first PI thermosetting film 3, and a second PI thermosetting film 4 respectively covering the upper and lower surfaces of the sheet copper substrate. In this embodiment, the PI thermosetting film is a composite tape formed by combining PI film and thermosetting adhesive. The sheet copper substrate 1 is divided into three regions along its length: an opening region 11, a fuse region 12, and an end region 13. The opening region 11 contains a plurality of through holes 111 arranged in an array. The fuse region 12 includes a width-gradient connecting portion 121 that connects to the diagonal ends of the opening region 11 and the end region 13, respectively, and a bent portion 122 connecting the two connecting portions. The bent portion 122... The middle part has a wavy safety section 123 with a line width of 0.15±0.02mm, which is smaller than the line width of the main body of the bent part 122. The first PI thermosetting film 3 and the second PI thermosetting film 4 are respectively provided with a number of small windows 31 (41) arranged at intervals. Each small window area includes a row of through holes 111 in the width direction of the sheet copper substrate 1 and the area around the through holes 111. The outer end of the end area 13 protrudes from the first PI thermosetting film 3 and the second PI thermosetting film 4. That is, through the exposed end area 13 and the exposed through holes 111 and the area around the through holes of the sheet copper substrate 1 in the small window area, an electrical connection is formed with the external circuit. When the instantaneous current is too large and passes through the safety section 123, the safety section 123 will melt under high temperature to cut off the circuit and play a protective role.

[0023] In the above-mentioned fuse assembly, two curved hollow portions 32 (42) are respectively provided on the portion of the first PI thermosetting film 3 and the second PI thermosetting film 4 located in the safety area. These curved hollow portions 32 (42) are provided along the outer edge of the connecting portion 121 and the curved portion 122 of the safety area. The curved hollow portions 32 (42) are beneficial for avoiding other microelectronic components and enhancing the air circulation in the local area, which is conducive to heat dissipation.

[0024] In the above-mentioned fuse assembly, the fuse part 123 has at least two peaks and two troughs; the length of the opening region 11 accounts for 60% ± 5% of the total length of the sheet copper substrate 1; the length of the end region 13 accounts for 10% ± 5% of the total length of the sheet copper substrate 1, and the remaining region is the fuse region 12; the diameter of the through hole is 0.50 ± 0.05 mm, the through hole array is 12 groups along the length direction of the sheet copper substrate, with 3 through holes in each group, the spacing between adjacent through holes 111 along the length direction of the sheet copper substrate 1 is 2.00 ± 0.05 mm, and the spacing between adjacent through holes 111 along the width direction of the sheet copper substrate 1 is 1.50 ± 0.05 mm.

[0025] This utility model also provides a manufacturing process for an ultra-thin rolled copper stamped fuse assembly, which is carried out using a high-speed rotary die-cutting machine. The manufacturing process includes the following steps:

[0026] Step 1: The rolled copper strip with a thickness of micrometers is punched and the waste is removed by the stamping equipment, so that the connecting part, the bending part and the wavy part in the middle of the bending part of the fuse unit in the fuse strip are formed, and all the through holes in the opening area are formed on the rolled copper strip. That is, a copper substrate semi-finished product with uniformly arranged along the length of the strip is formed on the rolled copper strip. After the waste is removed, the first bottom protective film strip is laminated to the lower surface of the strip and then wound up for later use.

[0027] Specifically, combined Figure 3 , Figures 5-7 As shown, the stamping process of the above-mentioned ultra-thin rolled copper stamped fuse semi-finished product is as follows:

[0028] S1, through the first station M1 of the mold, punch out the material strip pitch positioning hole 201 and positioning groove 202 on both sides of the rolled copper strip 2 to remove the corresponding hole waste and edge waste;

[0029] S2, the material strip travels two steps and reaches the second station M2. At the second station M2, two adjacent and spaced first closed areas 21 are punched out on the rolled copper strip 2 through the mold. The inner sides of the two first closed areas 21 form a wavy outline 212, which forms a complete wavy fuse part 123 in the fuse. The waste material corresponding to the first closed areas 21 on both sides is removed. The length of the first closed area is equivalent to the length occupied by the wavy outline, and the width is 8-12 times the line width of the fuse part. The wavy fuse part is formed directly and completely in one step, so that the main body of the fuse part is far away from the subsequent processing area, thereby avoiding the fuse part from flanging, deformation, etc., making the dimensions more stable and ensuring product quality.

[0030] S3, the strip travels five steps to the third station M3. At the third station M3, a second closed region 22 is punched out of the rolled copper strip 2 using the die. This second closed region 22 partially overlaps with the outer side of the first closed region 21 on one side. The two intersection points of the second closed region outline 221 and the first closed region outline 211 are the two endpoints D1 of the wavy outline 201 on that side. The second closed region 22 forms part of the connecting and curved sections along other outlines outside the first closed region 21. The inner frame waste of the second closed region 22 is removed.

[0031] S4, the strip travels four steps to the fourth station M4. At the fourth station M4, a third closed region 23 is punched out of the rolled copper strip 2 using the die. This third closed region 23 partially overlaps with the outer side of the first closed region 21 on the other side. The two intersection points of the third closed region outline 231 and the outline 211 of the first closed region on the other side are the two endpoints D2 of the wavy outline on that side. The other outlines of the third closed region 23 outside the first closed region 21 form another part of the outline of the connecting part and the curved part. The inner frame waste of the third closed region is removed. The third closed region 23 does not intersect with the second closed region 22, and the connecting part 121 and the curved part 122 are formed between them. Simultaneously, the fourth station M4 also forms a positioning mark M42 at the lower edge of the strip. Each positioning mark formed on the strip is spaced one step apart.

[0032] S5, the strip moves two steps to the fifth station M5, and two rows of through holes 111 are punched out on the rolled copper strip 2 through the fifth station M5 of the mold. The two rows of through holes 111 are staggered along the width of the strip, and each through hole 111 is in a different row.

[0033] S6, the strip travels two steps to the sixth station M6, and through the sixth station M6 of the mold, two more rows of through holes 111 are punched out on the rolled copper strip 2. The two rows of through holes 111 are staggered along the width direction of the strip, and the two rows of through holes are symmetrical with respect to the center line of the fuse unit compared with the two rows of through holes in step S5.

[0034] S7, the strip travels three steps to the seventh station M7, and through the seventh station M7 of the die, a row of through holes is punched out on the rolled copper strip 2. The row of through holes is located in the middle of the two rows of through holes formed in steps S5 and S6.

[0035] In step S8, the strip travels two steps to the eighth station M8. At the eighth station M8 of the die, another row of through holes is punched out on the rolled copper strip. This row of through holes is also located in the middle of the two rows of through holes in S5 / S6, and is staggered with the through holes formed in S7. That is, the above-mentioned 12*3 through hole array is formed by four punching operations from S5 to S8. Since they are all 0.5mm-level micro holes, concentrated punching should be avoided as much as possible to avoid damaging the strip. This also optimizes the die design and gives the die more design space.

[0036] The die at the first station M1 has a die-cutting edge positioning groove, a step-pitch positioning hole edge cutting edge M11, and a positioning hole cutting edge M12; the die at the second station M2 has two first closed cutting edges M21 corresponding to the shape of the outline of the first closed area; the die at the third station M3 has a second closed cutting edge M31 corresponding to the shape of the outline of the second closed area; the die at the fourth station M4 has a third closed cutting edge M41 corresponding to the shape of the outline of the third closed area; the dies at the fifth station M5, the sixth station M6, the seventh station M7, and the eighth station M8 are respectively provided with through hole cutting edges M51 corresponding to the through holes being formed.

[0037] There are two empty steps between the first station M1 and the second station M2; five empty steps between the second station M2 and the third station M3; four empty steps between the third station M3 and the fourth station M4; two empty steps between the fourth station M4 and the fifth station M5; two empty steps between the fifth station M5 and the sixth station M6; three empty steps between the sixth station M6 and the seventh station M7; and two empty steps between the seventh station M7 and the eighth station M8. Appropriate empty steps are beneficial for waste discharge and the positioning of the material belt during the process.

[0038] This invention employs a high-precision die-cutting method to punch ultra-thin rolled copper foil, directly forming semi-finished fuses. In particular, the extremely fine fuse parts are punched in one go, avoiding defects such as edge deformation caused by multiple punching, thus ensuring the stability of the fuse parts' dimensions and performance. The semi-finished fuse rolls of this invention are suitable for die-cutting with film materials, allowing the fuse parts to be encapsulated within the film material while exposing the opening areas and end areas for electrical connection, thereby improving production efficiency and subsequent use efficiency.

[0039] Step two: The rolled copper strip 2 obtained in step one is combined with the first bottom protective film T1. On a high-speed rotary die-cutting machine, with the rolled copper strip 2 and the first bottom protective film strip T1 as the main strip running direction, the main strip is die-cut by the first circular die-cutting roller group Y1. The first die-cutting cuts out the outline lines Y101 on both sides of the sheet copper substrate and the outline lines Y102 at both ends of the sheet copper substrate around the periphery of each copper substrate semi-finished product on the rolled copper strip 2. The outline lines Y101 on both sides of the sheet copper substrate are the same as those in step one. The outlines of the safety area formed by the pressure discharge intersect; at the same time, a straight break line Y103 is formed on the strip near the outer end of the opening area, and then the copper foil strip waste 201 above the straight break line Y103 is removed, while the rolled copper marking strip containing the positioning corner mark M42 below the straight break line Y103 is retained; a sheet-shaped copper substrate 1 finished product with a complete outline and spaced arrangement, and a rolled copper marking strip containing the positioning corner mark M42 are formed on the first bottom protective film strip T1;

[0040] Step 3: Align and laminate the first PI thermosetting film strip J1 after die-cutting above the main material strip. Specifically: Above the running main material strip, with the self-attached film J11 and thermosetting adhesive side of the first PI thermosetting film strip J1 facing down, laminate the first adhesive protective film strip B1 (with the self-attached film B11 peeled off) and the second bottom protective film strip T2 sequentially onto the non-thermosetting adhesive side of the first PI thermosetting film strip J1. The adhesive side of the first adhesive protective film strip B1 is laminated with the non-thermosetting adhesive side of the first PI thermosetting film strip J1. Then, remove the self-attached film J11 of the first PI thermosetting film strip from below the laminating roller, and then pass it through the second circular die-cutting roller group Y2 to the first... A PI thermosetting film strip J1 and its first adhesive protective film strip B1 and second bottom protective film strip T2 are subjected to a second die-cutting. The cutter rollers of the second circular die-cutting roller group Y2 are located below, meaning that the blades of the second circular die-cutting roller group Y2 cut through the first adhesive protective film strip B1 from the thermosetting adhesive side of the first PI thermosetting film strip J1 upwards. Several sets of spaced first small window outlines Y201 are die-cut on the first PI thermosetting film strip J1 and the first adhesive protective film strip B1. The number and position of each set of first small window outlines Y201 correspond to the number and position of through holes 111 on each sheet copper substrate 1 finished product, i.e. The first small window outline Y201 corresponds to the small window 31 of the first PI thermosetting film 3; at the same time, a continuous upper outline Y202 of the first PI thermosetting film along the length direction of the strip is formed on the first PI thermosetting film strip J1; the upper outline Y202 of the first PI thermosetting film is used to form the end line of the first PI thermosetting film 3 facing the exposed end area of ​​the copper substrate in each fuse assembly; after the second die cutting, the second bottom protective film strip T2 and the first PI thermosetting film waste and the first adhesive protective film waste attached to the first small window outline frame are removed from the top, and the remaining first PI thermosetting film strip J1 with the first small window 31 is left. 1. The first adhesive protective film strip B1 is bonded to the first PI thermosetting film strip J1 and then bonded to the main material strip running below by the first heating roller group H1, so that the position of each group of first small windows 31 on the first PI thermosetting film strip J1 corresponds to the position of each group of through holes 111 on each sheet copper substrate 1 finished product on the main material strip, that is, to ensure that each group of through holes 111 is located in the area of ​​each group of first small windows; then the first adhesive protective film strip B1 is discharged from the top and the first bottom protective film strip T1 is discharged from the bottom, so that the remaining first PI thermosetting film strip J1 on the main material strip and the sheet copper substrate 1 finished products bonded and bonded below it are arranged at intervals.

[0041] Step four, similarly, involves aligning and laminating the second PI thermosetting film strip J2, which has undergone die-cutting, below the main material strip after step three. Specifically:

[0042] Below the main material belt, the self-contained film J21 and thermosetting adhesive side of the second PI thermosetting film belt J2 face upwards. On the non-thermosetting adhesive side of the second PI thermosetting film belt J2, the second adhesive protective film belt B2 (with self-contained film B21 peeled off) and the third bottom protective film belt T3 are sequentially laminated. The adhesive side of the second adhesive protective film belt B2 is laminated with the non-thermosetting adhesive side of the second PI thermosetting film belt J2. Then, after passing over the upper laminating roller, the self-contained film J21 of the second PI thermosetting film belt J2 is discharged downwards. Finally, the second PI thermosetting film belt J2 and the second adhesive protective film belt on its lower surface are laminated by the third circular die-cutting roller group Y3. B2 and the third bottom protective film strip T3 are subjected to a third die-cutting. The cutter roller of the third circular die-cutting roller group Y3 is located at the top, that is, the blade of the third circular die-cutting roller group Y3 cuts through the second adhesive protective film strip B2 from the thermosetting adhesive side of the second PI thermosetting film strip J2. Several sets of spaced second small window outlines Y301 are die-cut on the second PI thermosetting film strip J2 and the second adhesive protective film strip B2. The number and position of each set of second small window outlines Y301 correspond to the number and position of the through holes 111 on each sheet copper substrate 1 finished product, that is, the second small window corresponding to the second PI thermosetting film 4. Small window outline Y301; simultaneously, a continuous upper outline Y302 of the second PI thermosetting film along the length of the second PI thermosetting film strip J2 is formed on the second PI thermosetting film strip J2; the upper outline Y302 of the second PI thermosetting film is used to form the end line of the second PI thermosetting film 4 in each fuse assembly facing the exposed end area of ​​the copper substrate; after the third die cutting, the third bottom protective film strip T3 and the second PI thermosetting film waste and the second adhesive protective film waste within the frame of the second small window outline Y301 attached thereto are removed from below, leaving the second PI thermosetting film strip J2 with the second small window 41 and the second adhesive protective film strip B 2. Then, the second PI thermosetting film strip J2 is combined with the main strip running above by the second heating roller group H2, so that the position of each group of second small windows 41 on the second PI thermosetting film strip J2 corresponds to the position of each group of through holes 111 of each copper substrate finished product on the lower surface of the main strip, that is, to ensure that each group of through holes is located in the area of ​​each group of small windows; at this time, the main strip from bottom to top is as follows: second adhesive protective film strip B2, second PI thermosetting film strip J2 with second small windows 41 formed, sheet copper substrate 1 finished products and rolled copper marking strip arranged at intervals, and first PI thermosetting film strip J1 with first small windows 31 formed;

[0043] Step 5: After the fourth protective film strip T4 is laminated below the main strip in Step 4, it is die-cut by the fourth circular die-cutting roller group Y4. The blade of the fourth circular die-cutting roller group Y4 cuts through the second adhesive protective film strip B2 from top to bottom, and forms the curved hollow outline Y401 on the first PI thermosetting film strip J1 and the second PI thermosetting film strip J2, which corresponds to the connection part of the safety area of ​​the copper substrate product and the curved hollow outline Y401 on the outer edge of the curved part; and the area where the curved hollow outline Y401 is located is in the safety area 12 of the copper substrate product. The missing part is not cut to the finished copper substrate; then the fourth bottom protective film strip T4 and the first PI thermosetting film waste, the second PI thermosetting film waste, and the second adhesive protective film waste within the outline Y401 of the curved cutout attached to it are removed from below. At this time, the main strips from bottom to top are: the second adhesive protective film strip B2, the second PI thermosetting film strip J2 with the second small window 41 and the curved cutout 42 formed, the finished copper substrate and the rolled copper mark strip arranged at intervals, and the first PI thermosetting film strip J1 with the first small window 31 and the curved cutout 32 formed.

[0044] Step Six: The main material strip from Step Five is die-cut using the fifth circular die-cutting roller group Y5. The blade of the fifth circular die-cutting roller group Y5 cuts through the second PI thermosetting film strip J2 from top to bottom, forming the side and bottom contour lines Y501 of the first PI thermosetting film 3 and the second PI thermosetting film 4 in each component on the first PI thermosetting film strip J1 and the second PI thermosetting film strip J2. The corresponding blade is a semi-closed blade R501 corresponding to the side and bottom contour lines of the first PI thermosetting film and the second PI thermosetting film. These side and bottom contour lines intersect with the upper contour lines Y202 and Y302 of the first PI thermosetting film and the second PI thermosetting film formed in Steps Three and Four, respectively, thus forming a complete closed loop of the first PI thermosetting film 3 and the second PI thermosetting film 4. The fifth die-cutting blade is located outside the outline of the finished copper substrate, and the finished copper substrate is not cut. Then, the waste material J22 outside the frame of the second PI thermosetting film strip, the rolled copper marking strip 200, and the waste material J12 outside the frame of the first PI thermosetting film strip are peeled off from the top. Then, the finished product carrier film strip B3 is laminated from the top (its own film B31 is peeled off), and the second adhesive protective film strip B2 is removed from the bottom. Finally, the finished product isolation film strip L1 is laminated when winding. At this time, the main strips are arranged from bottom to top as follows: finished isolation film strip L1, second PI thermosetting film 4, sheet copper substrate 1 finished product, first PI thermosetting film 3, and finished carrier film strip B3. Among them, the second PI thermosetting film 4, sheet copper substrate 1 finished product, and first PI thermosetting film 3 are the finished fuse unit.

[0045] In the above process, in step two, the main strip formed by the composite of rolled copper strip 2 and the first protective film strip T1 is adjusted in the Y direction by the guide wire C before the first die-cutting, and in the X direction by the first color mark sensor C1 before the first die-cutting; in step three, after the second die-cutting and before the composite of the first heating roller group H1, the main strip is adjusted in the X direction by the second color mark sensor C2; in step four, before the composite of the second heating roller group H2, the main strip is adjusted in the X direction by the third color mark sensor C3; in step five, before the fourth die-cutting, the main strip is adjusted in the X direction by the fourth color mark sensor C4; and in step six, before the fifth die-cutting, the main strip is adjusted in the X direction by the fifth color mark sensor C5. By using multiple color mark sensors to adjust the strip in the X direction before composite and die-cutting, the accuracy of composite and die-cutting can be further enhanced, ensuring the product qualification rate.

[0046] In the above process, in step two, the first circular die-cutting roller group Y1 is provided with a first contour line blade R101 corresponding to the contour lines Y101 on both sides of the sheet copper substrate and the contour lines Y102 at both ends of the sheet copper substrate. A first auxiliary blade R102 for easy waste removal and a second auxiliary blade R103 corresponding to the straight break line Y103 are provided between adjacent first contour line blades R101. A first marking line blade R104 for forming the first positioning marking line Y104 is also provided.

[0047] In steps three and four, the second circular die-cutting roller group Y2 and the third circular die-cutting roller group Y3 are respectively provided with a first small window contour line blade R201 and a second small window contour line blade R301 corresponding to the first small window contour line Y201 and the second small window contour line Y301, and are respectively provided with a first PI thermosetting film upper end contour line blade R302 corresponding to the first PI thermosetting film upper end contour line Y202 and a second PI thermosetting film upper end contour line blade R302 corresponding to the second PI thermosetting film upper end contour line Y302; they are also respectively provided with a second marking line blade R203 for forming the second positioning mark line Y203 and a third marking line blade R303 for forming the third positioning mark line Y303; the heating temperature of the first heating roller group H1 and the second heating roller group H2 can be adjusted as needed;

[0048] In step five, the fourth circular die-cutting roller group Y4 has a hollowing contour line blade R401 corresponding to the curved hollowing contour line Y401, and a fourth marking line blade R402 for forming the fourth positioning marking line Y402.

[0049] In step six, the fifth circular die-cutting roller group Y5 has a semi-enclosed blade R501 on the blade roller corresponding to the contour lines Y501 on both sides and the bottom of the first PI thermosetting film and the second PI thermosetting film, and a fifth marking line blade R502 for forming the fifth positioning marking line Y502.

[0050] The positions of the first positioning mark line Y104, the second positioning mark line Y203, the third positioning mark line Y303, the fourth positioning mark line Y403, and the fifth positioning mark line Y502 correspond to the positions of the five adjacent positioning corner marks M42 on the rolled copper strip.

[0051] The aforementioned molded small window and hollowed-out part have ejector pins in the cutting edge area of ​​the die to facilitate waste removal.

[0052] This invention employs a high-precision die-cutting method to punch ultra-thin rolled copper foil, directly forming a fuse semi-finished product. The extremely fine fuse component is punched in a single pass, avoiding defects such as edge deformation that can occur with multiple punching processes, thus ensuring stable dimensions and performance of the fuse component. High-speed rotary die-cutting further enhances efficiency and precision, encapsulating the fuse component within a membrane material while exposing the opening and end areas for electrical connection, improving both production efficiency and subsequent usability. By installing photoelectric tracking on each rotary die and compensating for adjustments in the X-axis direction, the invention perfectly integrates the metal stamping semi-finished product with the rotary die-cutting process, increasing overall production efficiency to 5000 pieces / hour and yield to approximately 95%, thereby effectively reducing product costs and enhancing market competitiveness.

[0053] This utility model fuse assembly can be used in CCS modules, also known as battery cover assemblies, integrated busbars or wire harness board assemblies, new energy vehicles, and energy storage equipment. Its working principle is that under abnormal current conditions, a large amount of heat is generated, the temperature rises, and the fuse melts, thus cutting off the circuit and protecting other circuit components.

[0054] The above embodiments are merely exemplary implementations used to illustrate the principles of this utility model; however, this utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. An ultra-thin rolled copper stamped fuse assembly, characterized by: The fuse assembly includes a sheet copper substrate made of rolled copper with a thickness of micrometers, a first PI thermosetting film and a second PI thermosetting film respectively covering the upper and lower surfaces of the sheet copper substrate; wherein, the sheet copper substrate is divided into three regions along its length: an opening region, a safety region, and an end region; the opening region has a plurality of through holes arranged in an array at intervals; the safety region includes a width-gradient connecting portion that connects to the opening region and the end region at opposite corners at both ends, and a curved portion connecting the two connecting portions, and the curved portion has a wavy safety portion in the middle, the line width of the safety portion being 0.15±0.02mm and smaller than the line width of the main body of the curved portion; the first PI thermosetting film and the second PI thermosetting film are respectively provided with a plurality of small windows arranged at intervals, each small window region containing a row of through holes in the width direction of the sheet copper substrate and a surrounding area of ​​the through holes; the outer end of the end region protrudes beyond the first PI thermosetting film and the second PI thermosetting film.

2. The ultra-thin rolled copper stampfoam fuse assembly of claim 1, wherein: On the first PI thermosetting film and the second PI thermosetting film, in the portion located in the insurance area, there are two connecting parts along the insurance area and two curved hollow parts set on the outer edge of the curved part.

3. The ultra-thin rolled copper stampfoam fuse assembly of claim 1, wherein: The insurance section has at least two peaks and two troughs.

4. The ultra-thin rolled copper stampfoam fuse assembly of claim 1, wherein: The length of the opening area accounts for 60% ± 5% of the total length of the sheet copper substrate; the length of the end area accounts for 10% ± 5% of the total length of the sheet copper substrate, and the remaining area is the safety area.

5. The ultra-thin rolled copper stampfoam fuse assembly of claim 1, wherein: The diameter of the through hole is 0.50±0.05mm. The through hole array consists of 12 groups of 3 holes along the length of the sheet copper substrate. The spacing between adjacent through holes along the length of the sheet copper substrate is 2.00±0.05mm, and the spacing between adjacent through holes along the width of the sheet copper substrate is 1.50±0.05mm.

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