Power supply heat dissipation device and power supply

Abstract

This application provides a power supply cooling device and a power supply, belonging to the power supply field. The power supply cooling device includes a chassis, a fan, and a front panel. A mounting backplate of the chassis is connected between the top panel and the top panel of the battery compartment. A heat dissipation fin is provided on a first side of the mounting backplate, and a power circuit is mounted on a second side opposite to the heat dissipation fins. An air duct is provided on the outer surface of the front panel of the battery compartment, and an air outlet is provided on the top panel, with the outlet portion located above the heat dissipation fins. The fan is positioned below the heat dissipation fins and forms a first preset angle with the bottom of the heat dissipation fins. The front panel is mounted on the front of the chassis, forming an upward airflow channel between the front panel and the air duct. The fan draws in air from the lower end of the airflow channel and exhausts the hot air, which has passed through the heat dissipation fins, from the air outlet. The power supply cooling device provided in this application uses a large fan, reducing the number of fans, thus optimizing heat dissipation and reducing noise.

Description

Technical Field

[0001] This application relates to the field of power supplies, and more particularly to a power supply heat dissipation device and a power supply. Background Technology

[0002] In power supply system design, the selection and placement of cooling fans are crucial to the stable operation and performance of the power supply. Cooling fans effectively reduce the internal temperature of the device through forced convection, preventing electronic components from failing due to overheating. However, in practical applications, the selection and structural design of cooling fans often face many challenges, especially in compact power supplies, where the direct contradiction between space constraints, heat dissipation efficiency, and noise control is particularly prominent.

[0003] Existing heat dissipation risk selection typically requires comprehensive consideration of factors such as structural space, airflow requirements, and operating noise. However, current fan structures have three main drawbacks in practical applications: First, when there is insufficient space in the enclosure, fixing the cooling fan to the enclosure can cause interference with the installation of the exterior panel; second, to meet heat dissipation requirements, high-airflow cooling fans are usually required, but these fans are often large and difficult to adapt to compact spaces. If smaller cooling fans are used, although space can be saved, the airflow of a single cooling fan may be insufficient, requiring an increase in the number of fans, which in turn leads to excessive operating noise; third, to optimize fan installation space, traditional methods include raising the enclosure back wall or adopting a recessed design. However, raising the back wall increases the overall size of the enclosure, affecting the compactness of the equipment; a recessed design may compress the installation space of the rear heatsink, limiting the layout and performance of the heatsink. In compact power supplies with fixed dimensions, the feasibility of such structural optimization methods is low, restricting the improvement of heat dissipation efficiency.

[0004] In summary, existing cooling fans have limitations such as low space utilization, difficulty in balancing heat dissipation and noise, and insufficient flexibility in cabinet design.

[0005] In order to meet the requirements of achieving high heat dissipation and low noise operation in a limited space, while taking into account the rationality of the chassis structure and the overall reliability of the power supply, the industry urgently needs to develop a power supply heat dissipation device and power supply. Utility Model Content

[0006] This application provides a power supply heat dissipation device and a power supply, which solves the technical problems of interference with the installation of the exterior panel caused by fixing the cooling fan to the cabinet when the cabinet space is insufficient, and the increase in the number of cooling fans and excessive operating noise caused by using a small cooling fan.

[0007] The first aspect of this application provides a power supply heat dissipation device, comprising:

[0008] The chassis includes a mounting backplate, a battery compartment, and a top panel; the mounting backplate is connected between the top panel and the top panel of the battery compartment; a heat dissipation fin is provided on a first side of the mounting backplate, and a power circuit is mounted on a second side of the mounting backplate opposite to the heat dissipation fin; an air duct is provided on the outer surface of the front panel of the battery compartment; an air outlet is provided on the top panel, and part of the air outlet is located above the heat dissipation fin;

[0009] A fan is positioned below the heat sink fins and at a first preset angle to the bottom of the heat sink fins;

[0010] The front panel is mounted on the front of the chassis, and the front panel and the chassis air duct form a bottom-to-top airflow channel.

[0011] The fan draws in air from the lower end of the gas flow channel and discharges the hot air through the heat dissipation fins from the air outlet.

[0012] Preferably, the power supply heat dissipation device further includes the air duct plate, the air duct plate includes a base plate and a bent portion formed by bending downward along the length direction of the base plate, wherein the base plate and the bent portion are at a second preset angle;

[0013] The substrate is disposed on the outside of the heat dissipation fins and is fixed to the mounting back plate by the first fastener;

[0014] The fan is mounted and fixed on the inner surface of the bent portion, and the bent portion is fixed to the mounting back plate by a second fastener.

[0015] Preferably, a fan mesh opposite to the fan is fixed on the outer surface of the bent portion.

[0016] Preferably, the substrate has a plurality of first through holes; the bent portion has a plurality of second through holes; the first fastener and the second fastener include screws;

[0017] The screw passes through the first through hole and engages with the corresponding nut provided on the mounting back plate, thereby fixing the substrate to the mounting back plate;

[0018] The screw passes through the second through hole and engages with the corresponding nut on the mounting back plate, thereby fixing the bent portion to the mounting back plate.

[0019] Preferably, the connection surface between the top plate and the front panel of the battery box is arc-shaped.

[0020] Preferably, the chassis further includes a right side panel with a cable outlet hole, through which the fan draws in air.

[0021] Preferably, the chassis further includes a mounting plate, which is fixed to the back of the chassis by fasteners. An air inlet is provided on the mounting plate near the cable outlet, so that the fan draws in air from the air inlet.

[0022] Preferably, the heat dissipation fins include two fins, which are located on both sides of the inductor box provided on the first side of the mounting backplate;

[0023] The fan includes two fans, which are respectively disposed below the corresponding fins and at the first preset angle to the bottom of the corresponding fins.

[0024] Preferably, the first preset angle is 45 degrees.

[0025] Preferably, the second preset angle is 135 degrees.

[0026] Preferably, the enclosure air duct includes multiple sub-air ducts, which are spaced apart on the outer surface of the front panel of the battery box.

[0027] A second aspect of this application provides a power supply including the power supply heat dissipation device described in any of the preceding claims.

[0028] The beneficial effects of the embodiments of this application are as follows:

[0029] The power supply cooling device provided in this application includes a chassis, a fan, and a front panel. A mounting backplate of the chassis connects to the top panel and the top panel of the battery compartment. A heatsink fin is mounted on a first side of the mounting backplate, and a power circuit is mounted on a second side opposite to the heatsink fin. An air duct is provided on the outer surface of the front panel of the battery compartment, and an exhaust vent is provided on the top panel, with the exhaust vent located above the heatsink fins. The fan is positioned below the heatsink fins and at a first preset angle to the bottom of the heatsink fins. The front panel is mounted on the front of the chassis, forming an upward airflow channel between the front panel and the air duct. The fan draws in air from the lower end of the airflow channel and exhausts the hot air from the heatsink fins through the exhaust vent. Positioning a large fan between the heatsink fins and the top panel of the battery compartment at a first preset angle effectively utilizes the limited space between the heatsink fins and the top panel of the battery compartment. The large fan provides sufficient airflow, optimizes cooling, and reduces noise. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the power supply heat dissipation device provided in the embodiments of this application;

[0032] Figure 2 This is a structural schematic diagram of the cross-section of the power supply heat dissipation device provided in the embodiments of this application;

[0033] Figure 3 for Figure 2 A magnified view of part A in the image;

[0034] Figure 4 A schematic diagram of the power supply heat dissipation device provided in an embodiment of this application from another perspective;

[0035] Figure 5 This is a schematic diagram of the front view of the power supply heat dissipation device provided in the embodiment of this application;

[0036] Figure 6 This is a schematic diagram of the back of the power supply heat dissipation device provided in the embodiments of this application;

[0037] Figure 7 This is a schematic diagram of the right side of the power supply heat dissipation device provided in the embodiments of this application;

[0038] Figure 8 This is a diagram showing the relative positions of the heat sink fins, inductor housing, and fan provided in an embodiment of this application.

[0039] Figure 9 for Figure 8 Front view;

[0040] Figure 10 for Figure 8 Side view;

[0041] Figure 11 for Figure 8 Back view;

[0042] Figure 12 This is a schematic diagram of the inner side of the air duct plate provided in the embodiment of this application;

[0043] Figure 13 This is a schematic diagram of the outer side of the air duct plate provided in an embodiment of this application. Detailed Implementation

[0044] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0045] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0046] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0047] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0048] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0049] In one embodiment of this utility model, a power supply heat dissipation device is provided. For details, please refer to [link / reference needed]. Figure 1 The diagram shown is a structural schematic of the power supply heat dissipation device provided in the embodiment of this application. Figure 2 The diagram shown is a cross-sectional view of the power supply heat dissipation device provided in the embodiment of this application. Figure 3 As shown Figure 2 A magnified view of part A in the image. Figure 4The diagram shown is a structural schematic of the power supply heat dissipation device provided in the embodiment of this application from another perspective. Figure 8 The diagram shown illustrates the relative positions of the heat sink fins, inductor housing, and fan provided in the embodiments of this application. Figure 9 shown Figure 6 Front view, Figure 10 shown Figure 8 Side view and Figure 11 shown Figure 8 The rear view is shown. A power supply cooling device according to an embodiment of this utility model includes a chassis, a fan 3, and a front panel 6. The chassis includes a mounting back plate 43, a battery compartment 40, a top panel 45, a left side panel, a right side panel, and a bottom panel, wherein the top panel 45 and the bottom panel are arranged opposite each other, and the left side panel and the right side panel are arranged opposite each other. The top panel is connected between the top ends of the left side panel and the top ends of the right side panel, and the bottom panel is connected between the bottom ends of the left side panel and the bottom ends of the right side panel. The mounting back plate 43 is connected between the top panel and the top panel of the battery compartment 40.

[0050] The mounting backplate 43 has heat dissipation fins 46 on its first side, which is the front side of the chassis. Specifically, the heat dissipation fins 46 can be fixed to the first side of the mounting backplate 43 by a heat-conducting plate. In some embodiments, the heat dissipation fins 46 are directly fixed to the mounting backplate 43, in which case the mounting backplate 43 can act as a heat-conducting plate.

[0051] A power circuit 7 is mounted on the second side of the mounting backplate 43, opposite to the heat sink 46, wherein the second side of the mounting backplate 43 is located on the back of the chassis. The power circuit 7 may be an inverter circuit and / or a boost circuit, etc., which generates a large amount of heat during its operation. The heat sink 46 is arranged opposite to it to dissipate heat from the power circuit 7.

[0052] In this embodiment, the connection point between the mounting backplate 43 and the top panel 45 is located near the middle of the top panel 45, and the mounting backplate 43 is perpendicular to the top panel 45 and parallel to its long side. Specifically, the position of the connection point between the mounting backplate 43 and the top panel 45 is determined by the space occupied by the power circuits 7 and heat dissipation fins 46 provided on the two sides of the mounting backplate 45.

[0053] The battery box 40 is used to house battery modules for supplying power to the power supply or storing excess power. An air duct 41 is provided on the outer surface of the front panel of the battery box 40. Specifically, the battery box 40 is located in the lower half of the chassis, and its top plate is connected to the left and right side panels of the chassis, as well as the mounting back plate 43. The bottom plate of the battery box 40 is shared with the bottom panel of the chassis, and the two side panels of the battery box 40 share portions of the left and right side panels of the chassis, respectively. The front panel of the battery box 40 is connected to the two side panels, top plate, and bottom plate on one side of the front of the chassis. An air duct 41, which is a long, narrow groove running from the top plate to the bottom plate of the battery box 40, is formed on the outer surface of the front panel of the battery box 40.

[0054] Furthermore, the connection surface 42 between the top plate and the front panel of the battery box 40 is arc-shaped. Specifically, the cross-section of the connection surface is an arc, which helps to reduce airflow resistance and further reduce noise.

[0055] The top panel is provided with an air outlet 451, and part of the air outlet 451 is located above the heat dissipation fins 46. Specifically, the part of the air outlet 451 on the top panel 45 of the chassis located between the long side of the top panel 45 near the front of the chassis and the connection between the top panel 45 and the mounting back plate 43 can be processed into a grid by processes such as laser cutting, water jet cutting or CNC cutting to form the air outlet 451.

[0056] The fan 3 is positioned below the heat sink 46 and at a first preset angle, such as 45 degrees, to the bottom of the heat sink 46, where the bottom of the heat sink 46 is the end of the heat sink 46 furthest from the top panel 45 of the chassis. Specifically, the fan 3 is located between the bottom of the heat sink 46 and the top panel of the battery compartment 40. In this embodiment, the air blown by the fan 3 is at the first preset angle to the bottom of the heat sink 46, but the overall airflow is from the bottom to the top of the heat sink 46, effectively utilizing the limited space between the bottom of the heat sink 46 and the top panel of the battery compartment 40. A large fan can also be used to provide sufficient airflow, optimizing heat dissipation while reducing noise. When the fan 3 is at the first preset angle to the bottom of the heat sink 46, the heat dissipation effect is better and the noise is lower.

[0057] The fan mesh 1 is fixed to the surface of the fan 3 with screws. This surface is close to the side of the heat sink fins 46. It can prevent foreign objects from being sucked in, reduce dust entry, reduce air turbulence entering the fan, make the airflow more stable, improve the efficiency of the fan, and help reduce noise.

[0058] The front panel 6 is mounted on the front of the chassis. The front panel 6 and the chassis air duct 41 form a bottom-to-top airflow channel. The fan 3 draws in air from the lower end of this airflow channel and exhausts the hot air, which has passed through the heat sink fins 46, from the exhaust port 451. Specifically, after the front panel 6 is mounted on the front of the chassis, there is an air inlet between the bottom of the front panel 6 and the bottom plate of the battery compartment 40. This air inlet is the lower end of the airflow channel. As the fan 3 rotates, it draws in air from the lower end of the airflow channel and pushes the air towards the heat sink fins 46. Heat exchange occurs at the heat sink fins 46, and the hot air is then exhausted to the outside of the chassis from the exhaust port 451, effectively achieving heat dissipation and noise reduction.

[0059] Furthermore, the enclosure air duct 41 includes multiple sub-air ducts, which are spaced apart on the outer surface of the front panel of the battery box 40. Specifically, multiple sub-air ducts, such as elongated grooves, are formed on the outer surface of the front panel of the battery box 40, extending from the top and bottom plates. These elongated grooves are spaced apart to provide more air to the fan 3, which is more conducive to heat dissipation.

[0060] In this embodiment, the limited space between the bottom of the heat dissipation fins 46 and the top plate of the battery box 40 allows the large fan to be positioned below the heat dissipation fins 46, forming a first preset angle with the bottom of the heat dissipation fins 46. In addition, the front panel 6 is mounted on the front of the chassis, so that the front panel 6 and the chassis air duct 41 form an air flow channel from bottom to top. This allows the fan 3 to draw in air from the lower end of the air flow channel and discharge the heat-exchanged hot air from the air outlet 451 through the heat dissipation fins 46. This more effectively and rationally utilizes the space, optimizes heat dissipation, meets heat dissipation requirements, and also reduces noise.

[0061] Reference Figure 8-11 The heat dissipation fins 46 include two fins located on either side of the inductor box 47 provided on the first side of the mounting backplate 43. Specifically, the inductor box 47 can be integrally formed with the heat-conducting plate and fixed to the first side of the mounting backplate 43 by the heat-conducting plate. In other embodiments, the inductor box 47 is integrally formed with the mounting backplate 43. A power circuit 7 is mounted on the second side of the mounting backplate 43, wherein the power circuit 7 includes an inverter circuit and a boost circuit. The two fins correspond to the inverter circuit and the boost circuit, respectively. Since the inverter circuit and the boost circuit generate a lot of heat, a heat dissipation device is needed to dissipate heat to prevent the power circuit from malfunctioning due to overheating. In this embodiment, the number of fins is related to the power circuit that needs to be cooled, and the number of fins is not limited here.

[0062] The fan 3 includes two fans, each positioned below a corresponding fin and at a first preset angle (e.g., 45 degrees) to the bottom of the fin. Specifically, each fan draws in air from the lower end of the gas flow channel and pushes it towards the corresponding fin, where heat exchange occurs. The heated air is then discharged through the air outlet 451, effectively solving the problem of insufficient installation space for large fans, optimizing heat dissipation, and reducing noise.

[0063] Please refer to Figure 5 The diagram shown is a front view of the power supply heat dissipation device provided in the embodiment of this application. Figure 12 The diagram shown is a structural schematic of the inner side of the air duct plate provided in the embodiment of this application; Figure 13 The diagram shown is a schematic representation of the outer structure of the air duct plate provided in this embodiment of the application. The power supply cooling device further includes an air duct plate 2, which comprises a base plate 22 and a bent portion 23 formed by bending downwards along the length of the base plate 22. The base plate 22 and the bent portion 23 form a second predetermined angle, for example, 135 degrees. Specifically, the air duct plate 2 is a die-cast part, and the base plate 22 and the bent portion 23 can be integrally formed from a profile. The material of the air duct plate 2 can be a metal material. The air duct plate 22 also includes a side plate connecting the base plate 22 and the bent portion 23.

[0064] The substrate 22 is disposed on the outer side of the heat dissipation fins 10 and is fixed to the mounting backplate 43 by a first fastener. Specifically, the air duct plate 2 covers the outer side of the two fins and the inductor box 47, so that the two fins and the inductor box 47 are completely covered by the air duct plate, and is fixed to the mounting backplate 43 by the first fastener. The outer side is the side of the fins away from the first side of the mounting backplate 43. The air duct plate 2 allows the fan 3 to blow more air onto the fins, optimizing heat dissipation and improving the heat dissipation effect.

[0065] The fan 3 is mounted and fixed on the inner surface of the bent portion 23, and the bent portion 23 is fixed to the mounting back plate 43 by a second fastener. Specifically, the two fans are fixed to the inner surface of the bent portion 23 by fasteners, such as screws, and the bent portion 23 is fixed to the mounting back plate 43 by the second fastener, so that the fan and the bottom of the fins are at a first preset angle.

[0066] By confining the air beneath the air duct plate 2, sufficient airflow is provided to the fins, maximizing air contact between the air and the fins for heat exchange and better cooling. Additionally, the presence of the air duct plate 2 provides better support for fan installation.

[0067] Furthermore, a fan mesh 1, opposite to the fan 3, is fixedly installed on the outer surface of the bent portion 23. The fan mesh 1 can prevent foreign objects from being sucked in, reduce dust entry, reduce air turbulence entering the fan, make the airflow more stable, improve the efficiency of the fan, and further help reduce noise.

[0068] Furthermore, the substrate 22 has a plurality of first through holes 21; the bent portion 23 has a plurality of second through holes 24; the first fastener and the second fastener are screws.

[0069] The screw passes through the first through hole 21 and engages with the corresponding nut on the mounting back plate 43 to fix the base plate 22 onto the mounting back plate 12.

[0070] After the screw passes through the second through hole 24 and engages with the corresponding nut on the mounting back plate 43, it fixes the bent part 23 onto the mounting back plate 12.

[0071] Reference Figure 7 The diagram shown is a schematic representation of the right side of the power supply heat dissipation device provided in the embodiment of this application, and is combined with... Figure 1 As shown, a cable outlet 44 is provided on the right side panel of the chassis, allowing the fan 3 to draw air in through the cable outlet 44. Specifically, the cable outlet 44 is located on a section of the right side panel that is not shared with the side panel of the battery box 40. Inside the chassis corresponding to the cable outlet 44, there is an accommodating space for wiring, facilitating the routing of wires connected to terminals from the cable outlet 44 to the outside of the chassis for connection to external devices. A first air duct exists between the cable outlet 44 and the fan 3, allowing the fan 3 to draw air in from the cable outlet 44, increasing airflow, improving heat dissipation efficiency, optimizing airflow path, reducing noise, and improving space utilization.

[0072] Reference Figure 6 The diagram shown is a structural schematic of the back of the power supply heat dissipation device provided in the embodiment of this application, and is combined with... Figure 4 and Figure 5 The chassis also includes a mounting plate 5, which is fixed to the back of the chassis by fasteners. The mounting plate 5 may have an air inlet 51, allowing the fan 3 to draw in air from the air inlet 51. A portion of the accommodating space extends through the front and back of the chassis. An air inlet 51 is provided on the mounting plate 5 corresponding to this portion. A second air duct exists between the air inlet 51 and the fan 3, allowing the fan 3 to draw in air from the air inlet 51, increasing airflow, improving heat dissipation efficiency, optimizing airflow path, reducing noise, and improving space utilization.

[0073] In this embodiment, by placing the fan below the heatsink fins at a predetermined angle to the bottom of the fins, the insufficient space between the heatsink fins and the top plate of the battery compartment is effectively solved, improving space utilization, reducing noise, and optimizing heat dissipation. By creating an airflow channel on the outer surface of the battery compartment's front, and mounting a front panel on the front of the chassis, an airflow channel is formed between the front panel and the airflow channel. The fan draws air in through this channel and pushes it towards the heatsink fins for heat exchange. The hot air is then exhausted to the outside of the chassis through the exhaust vent, achieving heat dissipation and reducing noise. Making the connection surface between the top plate and the front panel of the battery compartment rounded reduces airflow resistance, further reducing noise. The fan can draw air from the lower end of the airflow channel, the cable outlet, and the air inlet, increasing airflow, improving heat dissipation efficiency, optimizing airflow path, reducing noise, and improving space utilization.

[0074] This application also provides a power supply, including the power supply heat dissipation device described above.

[0075] The power supply provided in this application, by employing the aforementioned power supply heat dissipation device, can improve heat dissipation efficiency, increase space utilization, and reduce noise.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A power supply heat dissipation device, characterized in that, include: The chassis includes a mounting backplate (43), a battery box (40), and a top panel (45); the mounting backplate (43) is connected between the top panel (45) and the top plate of the battery box (40); a heat dissipation fin (46) is provided on the first side of the mounting backplate (43), and a power circuit (7) opposite to the heat dissipation fin (46) is mounted on the second side of the mounting backplate (43); a chassis air duct (41) is provided on the outer surface of the front panel of the battery box (40); an air outlet (451) is provided on the top panel, and part of the air outlet (451) is located above the heat dissipation fin (46); The fan (3) is located below the heat dissipation fins (46) and at a first preset angle to the bottom of the heat dissipation fins (46); The front panel (6) is mounted on the front of the chassis, and the front panel (6) and the chassis air duct (41) form a bottom-to-top air flow channel. The fan (3) draws in air from the lower end of the gas flow channel and discharges the hot air through the heat dissipation fins (46) from the air outlet (451).

2. The power supply heat dissipation device according to claim 1, characterized in that, The power supply heat dissipation device further includes a duct plate (2), the duct plate (2) includes a base plate (22) and a bent portion (23) formed by bending downward along the length direction of the base plate (22), wherein the base plate (22) and the bent portion (23) are at a second preset angle; The substrate (22) is disposed on the outside of the heat dissipation fins (46) and fixed to the mounting back plate (43) by the first fastener; The fan (3) is mounted and fixed on the inner surface of the bent portion (23), and the bent portion (23) is fixed on the mounting back plate (43) by a second fastener.

3. The power supply heat dissipation device according to claim 2, characterized in that, A fan mesh (1) opposite to the fan (3) is installed and fixed on the outer surface of the bent part (23).

4. The power supply heat dissipation device according to claim 2, characterized in that, The substrate (22) has a plurality of first through holes (21); the bent portion (23) has a plurality of second through holes (24); the first fastener and the second fastener include screws; The screw passes through the first through hole (21) and engages with the corresponding nut provided on the mounting back plate (43), so that the base plate (22) is fixed on the mounting back plate (43); The screw passes through the second through hole (24) and engages with the corresponding nut provided on the mounting back plate (43), so that the bent part (23) is fixed on the mounting back plate (43).

5. The power supply heat dissipation device according to claim 1, characterized in that, The connection surface (42) between the top plate and the front panel of the battery box (40) is arc-shaped.

6. The power supply heat dissipation device according to claim 1, characterized in that, The chassis also includes a right side panel with a cable outlet (44) for the fan (3) to draw in air through the cable outlet (44).

7. The power supply heat dissipation device according to claim 6, characterized in that, The chassis also includes a mounting plate (5), which is fixed to the back of the chassis by fasteners. An air inlet (51) is provided on the mounting plate (5) near the cable outlet (44), so that the fan (3) draws in air from the air inlet (51).

8. The power supply heat dissipation device according to claim 1, characterized in that, The heat dissipation fins (46) include two fins, which are located on both sides of the inductor box (47) provided on the first side of the mounting backplate (43); The fan (3) includes two fans, which are respectively disposed below the corresponding fins and at the first preset angle with the bottom of the corresponding fins.

9. The power supply heat dissipation device according to claim 1, characterized in that, The first preset angle is 45 degrees.

10. The power supply heat dissipation device according to claim 2, characterized in that, The second preset angle is 135 degrees.

11. The power supply heat dissipation device according to claim 1, characterized in that, The enclosure air duct (41) includes multiple sub-air ducts, which are spaced apart on the outer surface of the front panel of the battery box (40).

12. A power supply, characterized in that, Includes the power supply heat dissipation device as described in any one of claims 1 to 11.

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