A wire pressing device for manufacturing electronic components

Abstract

This utility model discloses a wire pressing device for electronic component manufacturing, comprising a base plate, a support column fixedly connected to the upper surface of the base plate, a top plate fixedly connected to the upper surface of the support column, a wire pressing mechanism disposed on the upper surface of the top plate, and a worktable fixedly connected to the upper surface of the base plate. A buffer mechanism is disposed inside the worktable. Through this structure, by setting up the wire pressing mechanism and the buffer mechanism, the wire pressing mechanism can use a wire pressing head to press the equipment, and the pressure applied by the wire pressing head to the equipment is monitored and displayed at all times during the wire pressing process. This allows the operator to adjust the hydraulic press according to the required pressure, effectively improving the accuracy of the wire pressing process. Furthermore, the buffer mechanism buffers the pressure when the equipment is subjected to pressure, preventing equipment damage due to sudden excessive pressure, and effectively improving the stability of the wire pressing process.

Description

Technical Field

[0001] This utility model relates to the field of electronic component manufacturing technology, specifically to a wire pressing device for electronic component manufacturing. Background Technology

[0002] With the increasing miniaturization and functionalization of electronic components, the requirements for precision and stability in the manufacturing process are becoming increasingly stringent. In the manufacturing of electronic components, the wire crimping process is a crucial step in connecting fine wires (such as gold or aluminum wires) to chips, circuit boards, or other electronic components. Currently, while existing wire crimping devices on the market can perform basic wire crimping operations, they suffer from problems such as damage due to excessive pressure caused by low control precision, or failure due to insufficient pressure. These issues fail to meet the precision and stability demands of modern electronics manufacturing. Therefore, there is an urgent need to develop a new wire crimping device for electronic component manufacturing to improve the precision and stability of the wire crimping process. Summary of the Invention

[0003] This utility model provides a wire pressing device for electronic component manufacturing. It can use a wire pressing head to press wires onto the equipment through a wire pressing mechanism. During the wire pressing process, the pressure applied by the wire pressing head to the equipment is monitored and displayed in real time, allowing the operator to adjust the hydraulic press at any time according to the required pressure, which effectively improves the accuracy of the wire pressing process. Furthermore, by setting a buffer mechanism, the pressure is buffered when the equipment is subjected to pressure, preventing equipment damage caused by sudden excessive pressure, which effectively improves the stability of the wire pressing process.

[0004] To achieve the above objectives, a wire pressing device for electronic component manufacturing is provided, comprising a base plate, a plurality of support columns fixedly connected to the upper surface of the base plate, a top plate fixedly connected to the upper surface of the support columns, a wire pressing mechanism provided on the upper surface of the top plate, a worktable fixedly connected to the upper surface of the base plate, a protective frame fixedly connected to the upper surface of the worktable, and a buffer mechanism provided inside the worktable. The protective frame is provided to facilitate the protection of the wire pressing groove and the equipment on it.

[0005] According to the aforementioned wire pressing device for manufacturing electronic components, the wire pressing mechanism includes a hydraulic press, a hydraulic rod, a wire pressing plate, a wire pressing head, a tension spring, a force gauge, a display, and a rangefinder. The hydraulic press is fixedly connected to the inner surface of the top plate, and the hydraulic press is provided to facilitate the operation of the hydraulic rod.

[0006] According to the described wire pressing device for manufacturing electronic components, the hydraulic rod is fixedly connected to the lower surface output end of the hydraulic press, the wire pressing plate is fixedly connected to the other end of the hydraulic rod, the wire pressing head is fixedly connected to the lower surface of the wire pressing plate, there are multiple wire pressing heads, and the tension spring is fixedly connected to the lower surface of the hydraulic press. The tension spring is provided to facilitate the detection of the pressure applied by the wire pressing head.

[0007] According to the aforementioned wire pressing device for manufacturing electronic components, the force gauge is fixedly connected to the other end of the tension spring, the display is fixedly connected to the right side surface of the force gauge, and the rangefinder is fixedly connected to the upper surface of the wire pressing plate. The display is provided to facilitate the display of data monitored by the force gauge.

[0008] According to the aforementioned wire pressing device for manufacturing electronic components, the buffer mechanism includes a support plate, a spring sleeve, a buffer spring, a buffer column, a mounting circular plate, a mounting plate, a limiting frame, and a wire pressing groove. The support plate is fixedly connected to the upper surface of the base plate. The support plate is provided to facilitate the installation of the spring sleeve.

[0009] According to the aforementioned wire pressing device for manufacturing electronic components, the spring sleeve is fixedly connected to the upper surface of the support plate, the buffer spring is fixedly connected to the upper surface of the support plate, the buffer column is slidably connected to the inner annular surface of the spring sleeve, and the mounting circular plate is fixedly connected to the upper surface of the buffer column. The buffer spring is provided to facilitate pressure buffering.

[0010] According to the aforementioned wire pressing device for manufacturing electronic components, the mounting plate is fixedly connected to the upper surface of the mounting circular plate, the limiting frame is fixedly connected to the lower surface of the mounting plate, and the wire pressing groove is fixedly connected to the upper surface of the mounting plate. There are multiple wire pressing grooves, and the limiting frame is set to limit the downward buffering distance of the wire pressing groove.

[0011] The beneficial effects of this utility model are as follows: By setting up a pressing mechanism and a buffer mechanism, the pressing mechanism can use a pressing head to press the wire onto the equipment. During the pressing process, the pressure applied by the pressing head to the equipment is monitored and displayed at all times, allowing the operator to adjust the hydraulic press according to the required pressure, which effectively improves the accuracy of the pressing process. Furthermore, by setting up a buffer mechanism, the pressure is buffered when the equipment is subjected to pressure, preventing equipment damage caused by sudden excessive pressure, which effectively improves the stability of the pressing process.

[0012] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0014] Figure 1 This is a schematic diagram of the overall structure of a wire pressing device for manufacturing electronic components according to this utility model;

[0015] Figure 2 This is a front view of the overall structure of a wire pressing device for manufacturing electronic components according to this utility model;

[0016] Figure 3 This is a drawing of the wire pressing mechanism of a wire pressing device for manufacturing electronic components according to this utility model;

[0017] Figure 4 This is a diagram of the buffer mechanism of a wire pressing device for manufacturing electronic components according to this utility model.

[0018] Legend:

[0019] 1. Base plate; 2. Support column; 3. Top plate; 4. Wire pressing mechanism; 401. Hydraulic press; 402. Hydraulic rod; 403. Wire pressing plate; 404. Wire pressing head; 405. Tension spring; 406. Force gauge; 407. Display; 408. Rangefinder; 5. Workbench; 6. Protective frame; 7. Buffer mechanism; 701. Support plate; 702. Spring sleeve; 703. Buffer spring; 704. Buffer column; 705. Mounting round plate; 706. Mounting plate; 707. Limiting frame; 708. Wire pressing groove. Detailed Implementation

[0020] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0021] Reference Figures 1 to 4 This utility model provides a wire pressing device for manufacturing electronic components, which includes a base plate 1, a support column 2 fixedly connected to the upper surface of the base plate 1, multiple support columns 2, a top plate 3 fixedly connected to the upper surface of the support column 2, a wire pressing mechanism 4 provided on the upper surface of the top plate 3, a worktable 5 fixedly connected to the upper surface of the base plate 1, a protective frame 6 fixedly connected to the upper surface of the worktable 5, and a buffer mechanism 7 provided inside the worktable 5.

[0022] The wire pressing mechanism 4 includes a hydraulic press 401, a hydraulic rod 402, a wire pressing plate 403, a wire pressing head 404, a tension spring 405, a force gauge 406, a display 407, and a rangefinder 408. The hydraulic press 401 is fixedly connected to the inner surface of the top plate 3. The hydraulic rod 402 is fixedly connected to the lower output end of the hydraulic press 401. The wire pressing plate 403 is fixedly connected to the other end of the hydraulic rod 402. The wire pressing head 404 is fixedly connected to the lower surface of the wire pressing plate 403. There are multiple wire pressing heads 404. The tension spring 405 is fixedly connected to the lower surface of the hydraulic press 401. The force gauge 406 is fixedly connected to the other end of the tension spring 405. The display 407 is fixedly connected to the right side surface of the force gauge 406. The rangefinder 408 is fixedly connected to the upper surface of the wire pressing plate 403. The wire pressing head 404 is made of high-precision material and has extremely high hardness and wear resistance. The crimping head 404 can be replaced as needed to accommodate different models and specifications of electronic components. The force gauge 406 monitors the data generated during the crimping process in real time, such as pressure, time, and crimping depth, and can store and analyze the data to ensure the quality of crimping. The monitored data will also be displayed on the monitor 407.

[0023] The buffer mechanism 7 includes a support plate 701, a spring sleeve 702, a buffer spring 703, a buffer post 704, a mounting circular plate 705, a mounting plate 706, a limiting frame 707, and a pressure groove 708. The support plate 701 is fixedly connected to the upper surface of the base plate 1. The spring sleeve 702 is fixedly connected to the upper surface of the support plate 701, the buffer spring 703 is fixedly connected to the upper surface of the support plate 701, the buffer post 704 is slidably connected to the inner annular surface of the spring sleeve 702, and the mounting circular plate 705 is fixedly connected to the upper surface of the buffer post 704. The mounting plate 706 is fixedly connected to the upper surface of the mounting circular plate 705, the limiting frame 707 is fixedly connected to the lower surface of the mounting plate 706, and the pressure groove 708 is fixedly connected to the upper surface of the mounting plate 706. There are multiple pressure grooves 708. The limiting frame 707 is used to prevent the pressure groove 708 from exceeding the set position, thereby preventing the pressure head 404 from contacting the pressure groove 708.

[0024] Working principle: In use, first place the device to be crimped into the crimping groove 708, then connect the thin wire to the device in the crimping groove 708, and then start the crimping mechanism 4. The hydraulic press 401 drives the hydraulic rod 402 to move downward, thereby driving the crimping head 404 to move downward. When the hydraulic rod 402 moves downward, the tension spring 405 is stretched and transmits the tension data to the force sensor 406. After being processed by the force sensor 406, the data is transmitted to the display 407 for display. The rangefinder 408 will also adjust the pressure according to the hydraulic pressure. The length of the pressure rod movement is displayed on a scale. When the pressure head 404 contacts the thin wire and presses it, in order to prevent the pressure applied by the pressure head 404 from being too great, the pressure groove 708 is subjected to pressure and the buffer spring 703 will contract to drive the pressure groove 708 to move downward. However, the limit frame 707 will limit the downward movement distance of the pressure groove 708. During the buffering process, the pressure applied by the hydraulic device 401 is adjusted according to the pressure displayed by the rangefinder 408 and the downward movement distance of the pressure groove 708. After the pressing is completed, the pressure head 404 can be reset.

[0025] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A wire pressing device for manufacturing electronic components, characterized in that, Includes a base plate (1), on the upper surface of the base plate (1) are fixedly connected to a support column (2), there are multiple support columns (2), on the upper surface of the support column (2) are fixedly connected to a top plate (3), on the upper surface of the top plate (3) are provided with a pressing mechanism (4), on the upper surface of the base plate (1) are fixedly connected to a workbench (5), on the upper surface of the workbench (5) are fixedly connected to a protective frame (6), and a buffer mechanism (7) is provided inside the workbench (5).

2. The wire pressing device for manufacturing electronic components according to claim 1, characterized in that, The wire pressing mechanism (4) includes a hydraulic press (401), a hydraulic rod (402), a wire pressing plate (403), a wire pressing head (404), a tension spring (405), a force measuring device (406), a display (407), and a rangefinder (408). The hydraulic press (401) is fixedly connected to the inner surface of the top plate (3).

3. The wire pressing device for manufacturing electronic components according to claim 1, characterized in that, The hydraulic rod (402) is fixedly connected to the lower output end of the hydraulic press (401), the pressure plate (403) is fixedly connected to the other end of the hydraulic rod (402), the pressure head (404) is fixedly connected to the lower surface of the pressure plate (403), there are multiple pressure heads (404), and the tension spring (405) is fixedly connected to the lower surface of the hydraulic press (401).

4. The wire pressing device for manufacturing electronic components according to claim 1, characterized in that, The force gauge (406) is fixedly connected to the other end of the tension spring (405), the display (407) is fixedly connected to the right side surface of the force gauge (406), and the rangefinder (408) is fixedly connected to the upper surface of the pressure plate (403).

5. The wire pressing device for manufacturing electronic components according to claim 1, characterized in that, The buffer mechanism (7) includes a support plate (701), a spring sleeve (702), a buffer spring (703), a buffer column (704), a mounting circular plate (705), a mounting plate (706), a limiting frame (707), and a pressure groove (708). The support plate (701) is fixedly connected to the upper surface of the base plate (1).

6. The wire pressing device for manufacturing electronic components according to claim 1, characterized in that, The spring sleeve (702) is fixedly connected to the upper surface of the support plate (701), the buffer spring (703) is fixedly connected to the upper surface of the support plate (701), the buffer column (704) is slidably connected to the inner annular surface of the spring sleeve (702), and the mounting circular plate (705) is fixedly connected to the upper surface of the buffer column (704).

7. The wire pressing device for manufacturing electronic components according to claim 1, characterized in that, The mounting plate (706) is fixedly connected to the upper surface of the mounting circular plate (705), the limiting frame (707) is fixedly connected to the lower surface of the mounting plate (706), and the pressure groove (708) is fixedly connected to the upper surface of the mounting plate (706). There are multiple pressure grooves (708).

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