An inner layer edge structure of a circuit board

Abstract

This utility model relates to the field of printed circuit board technology and discloses an inner layer edge structure of a circuit board, including: a first edge plate body disposed around the substrate body; a plurality of first flow-blocking beads equidistantly arranged on one or both sides of the edge plate body; and a plurality of second flow-blocking beads equidistantly arranged on one or both sides of the first flow-blocking beads, wherein the protruding area of ​​the second flow-blocking beads is larger than that of the first flow-blocking beads, and a first adhesive flow groove is formed between the first flow-blocking beads and the second flow-blocking beads to accommodate the flow of adhesive. This design can not only significantly reduce the flow velocity of the fluid and effectively prevent it from flowing outside the circuit board, thereby avoiding the problem of insufficient adhesive filling of the board pattern, but also the first adhesive flow grooves of different widths formed between the first and second flow-blocking beads of different sizes are interleaved, which can timely and evenly spread the adhesive of the insulating layer along the first adhesive flow groove, thereby ensuring uniform adhesive filling and reducing the probability of defective products.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit boards, and more particularly to an inner layer edge structure of a circuit board. Background Technology

[0002] As electronic products become increasingly miniaturized and integrated, the manufacturing precision and performance requirements for substrates are also rising. In improving substrate performance, researchers have discovered that using semi-cured materials to fill the joints between chips, capacitors, and other components and the PCB board can effectively absorb vibration energy during transportation or use. The adhesive layer also inhibits oxidation on the circuit board surface, reduces the probability of short circuits caused by dust, and allows products to maintain stable operation even in extreme environments ranging from -40℃ to 125℃. This process directly improves performance requirements and greatly promotes chip miniaturization and integration.

[0003] However, in current traditional processes of filling the inner layer edges with semi-cured adhesive, the fast flow rate of the adhesive often leads to uneven filling, resulting in defective boards. Therefore, there is an urgent need to design a new inner layer edge structure to solve the problem of uneven adhesive filling during the inner layer manufacturing process, thereby improving the manufacturing precision and performance of the substrate. Utility Model Content

[0004] The main objective of this invention is to provide an inner layer edge structure for a circuit board, aiming to overcome the shortcomings of the prior art and provide an inner layer edge structure that can effectively prevent insufficient glue filling at the board edge.

[0005] To achieve the above objectives, this utility model provides an inner edge structure for a circuit board, comprising: a first edge plate body disposed around the substrate body; a plurality of first flow-blocking beads disposed in an equidistant array on one or both sides of the edge plate body; and a plurality of second flow-blocking beads disposed in an equidistant array on one or both sides of the first flow-blocking beads, wherein the protruding area of ​​the second flow-blocking beads is larger than the protruding area of ​​the first flow-blocking beads, and a first flow groove for accommodating the flow of adhesive is formed between the first flow-blocking beads and the second flow-blocking beads.

[0006] Optionally, the first choke bead protrudes in a circular shape with a diameter of 340 μm, the second choke bead protrudes in a circular shape with a diameter of 600 μm, and the first choke bead and the second choke bead are spaced 1000 μm apart.

[0007] Optionally, a second edge plate is provided around the first edge plate, and a plurality of first flow-blocking blocks are provided at equal intervals on one or both sides of the second edge plate.

[0008] Optionally, the shape of the first flow-blocking block includes rhombus, square, rectangle, triangle and circle.

[0009] Optionally, when the first flow-blocking block is rhomboid in shape, the length of any side of the first flow-blocking block is greater than 3mm, and the angle of any interior angle of the first flow-blocking block is greater than 60° and less than 120°.

[0010] Optionally, a plurality of second flow-blocking blocks are provided at equal intervals on one or both sides of the second edge plate. The second flow-blocking blocks are disposed on one side of the first flow-blocking block and form a second flow channel for accommodating the flow of the colloid. The second flow channel communicates with the first flow channel.

[0011] Optionally, the first edge plate or the second edge plate is provided with positioning holes.

[0012] Optionally, the first edge plate or the second edge plate is provided with positioning target points, which are used to cooperate with the positioning holes for positioning when the substrate is stacked.

[0013] Optionally, the first edge plate or the second edge plate is provided with a concentric alignment region, which is made of a transparent material and is used to measure the offset when the multilayer circuit boards are stacked.

[0014] Optionally, the edge plate is provided with a clearance area for printing QR codes.

[0015] In the technical solution provided by this utility model, first and second flow-blocking beads of different sizes are set on the edge of the substrate body. This can not only significantly reduce the flow speed of the fluid and effectively prevent it from flowing outside the circuit board, thereby avoiding the problem of insufficient glue filling in the pattern inside the board, but also the first glue-spreading grooves of different widths formed between the first and second flow-blocking beads of different sizes are interlaced with each other, which can timely spread the glue of the insulating layer along the first glue-spreading grooves evenly, thereby ensuring uniform glue filling and reducing the probability of defective products. Attached Figure Description

[0016] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0017] Figure 1 This is a schematic diagram of one embodiment of the inner layer plate edge structure of this utility model;

[0018] Figure 2 for Figure 1 A partial structural diagram of region A in the middle;

[0019] Figure 3 for Figure 2 A schematic diagram of the local structure of region B in the middle.

[0020] In the figure: 1. Substrate body; 2. First edge plate; 21. First flow barrier bead; 22. Second flow barrier bead; 23. First flow channel; 24. Positioning hole; 3. Second edge plate; 31. First flow barrier block; 32. Second flow barrier block; 33. Second flow channel; 4. Positioning target point; 5. Concentric alignment area; 6. Avoidance area. Detailed Implementation

[0021] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only. In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of indicated technical features. Thus, unless otherwise stated, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0022] Furthermore, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections via an intermediate medium, or internal communication between two components. All technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0023] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0024] Please refer to Figures 1 to 3This utility model provides an inner edge structure of a circuit board, comprising: a first edge plate 2 disposed around the substrate body 1; a plurality of first flow-blocking beads 21 disposed in an equidistant array on one or both sides of the first edge plate 2; and a plurality of second flow-blocking beads 22 disposed in an equidistant array on one or both sides of the first flow-blocking beads 21, wherein the protruding area of ​​the second flow-blocking beads 22 is larger than the protruding area of ​​the first flow-blocking beads 21, and a first flow groove 23 for accommodating the flow of colloid is formed between the first flow-blocking beads 21 and the second flow-blocking beads 22.

[0025] In the technical solution provided by this utility model, first flow-blocking beads 21 and second flow-blocking beads 22 of different sizes are provided on the edge of the substrate body 1. This can not only significantly reduce the flow speed of the fluid and effectively prevent it from flowing outside the circuit board, thereby avoiding the problem of insufficient glue filling in the pattern inside the board, but also the first glue-spreading grooves 23 of different widths formed between the first flow-blocking beads 21 and second flow-blocking beads 22 of different sizes are interlaced with each other, which can timely spread the glue of the insulating layer along the first glue-spreading grooves 23 evenly, thereby ensuring uniform glue filling and reducing the probability of defective products.

[0026] Please refer to Figures 1 to 3 In this embodiment, the first flow-blocking bead 21 has a convex circular shape with a diameter of 340 μm, and the second flow-blocking bead 22 has a convex circular shape with a diameter of 600 μm. Compared with sharp or irregular shapes, the circular edge can effectively disperse local stress. This uniform stress distribution reduces local deformation caused by stress concentration during processing, thereby suppressing overall warping. The first flow-blocking bead 21 and the second flow-blocking bead 22 are spaced 1000 μm apart, which ensures that the support density is sufficient to maintain the rigidity of the plate and avoids the material flow being obstructed due to the small spacing.

[0027] Please refer to Figures 1 to 3In this embodiment, a second edge plate 3 is provided around the first edge plate 2. A plurality of first flow-blocking blocks 31 are provided at equal intervals on one or both sides of the second edge plate 3. The shapes of the first flow-blocking blocks 31 include rhombus, square, rectangle, triangle and circle. Different shapes of flow-blocking blocks are selected according to the different materials of the circuit board and the different application scenarios. For example, for rigid circuit boards, rhombus-shaped flow-blocking blocks are selected due to their high mechanical strength. Any corner of the rhombus can divert the flowing colloid and then re-merge it, effectively blocking the overflow of the colloid. For flexible circuit boards such as FPC boards, circular flow-blocking blocks can be selected. In this case, the contact point between the first flow-blocking block 31 and the second edge plate 3 is arc-shaped rather than straight, so the first flow-blocking block 31 is not easy to scratch the board during bending. When the first flow-blocking block 31 is rhomboid in shape, the length of any side of the first flow-blocking block 31 is 4mm, and the angle of any interior angle of the first flow-blocking block 31 is greater than 60° and less than 120°. The interior angle greater than 60° reduces the stress concentration at the edge of the plate. The length of the diagonal of the rhombus (5.66mm) is significantly greater than the side length (4mm), forming a natural path for the transmission of primary and secondary stresses. The longer diagonal direction can withstand a larger bending moment, effectively dispersing the concentrated stress at the edge of the plate. This design increases the rigidity of the inner plate edge, effectively preventing the occurrence of plate jamming, reducing the requirements for equipment, and saving production input.

[0028] Please refer to Figures 1 to 3 In this embodiment, a plurality of second flow-blocking blocks 32 are equidistantly arranged on one or both sides of the second edge plate 3. The second flow-blocking blocks 32 are disposed on one side of the first flow-blocking block 31 and form a second flow groove 33 for accommodating the flow of adhesive. The second flow groove 33 communicates with the first flow groove 23. During the filling process, the adhesive overflowing from the first flow groove 23 can flow into the second flow groove 33, and will not accumulate in the first flow groove 23 to form an uneven thickness.

[0029] Please refer to Figures 1 to 3 In this embodiment, the first edge plate 2 or the second edge plate 3 is provided with positioning holes 24. The positioning holes 24 cooperate with the positioning structure of the glue filling equipment to achieve precise positioning of the substrate plate in the glue filling process, which can effectively solve the problem of glue overflow caused by the offset between the glue gun and the plate.

[0030] Please refer to Figures 1 to 3 In this embodiment, the first edge plate 2 or the second edge plate 3 is provided with positioning target points 4, which are used to cooperate with positioning holes 24 for positioning during substrate stacking. The positioning target points 4 can be used for alignment with the glue filling equipment in the glue filling process, and can also be used for stacking alignment between multilayer boards in the stacking process.

[0031] Please refer to Figures 1 to 3In this embodiment, the first edge plate 2 or the second edge plate 3 is provided with a concentric alignment region 5, which is made of a transparent material. The concentric alignment region 5 is used to measure the offset during the stacking of multilayer circuit boards. In the lamination process, the interlayer offset can be quickly compared using optical instruments (such as a CCD camera) or manual visual inspection. Operators can adjust the relative positions between layers in real time by observing the stacking state of the concentric alignment region 5, thus avoiding the cumbersome process of repeated disassembly and inspection required in traditional processes.

[0032] Please refer to Figures 1 to 3 In this embodiment, the edge plate is provided with an avoidance area 6 for printing QR codes. This area is a wide copper surface etching area. With the help of laser direct imaging technology, the QR code can be printed to track the substrate in real time during the glue filling process. With the help of visual inspection equipment, the glue filling defective board can be quickly screened out.

[0033] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Under the concept of this utility model, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this utility model as described above. For the sake of brevity, they are not provided in detail. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. An inner layer edge structure of a circuit board, characterized in that, include: The first edge plate (2) is disposed on the periphery of the substrate body (1); Several first flow-blocking beads (21) are arranged in an equidistant array on one or both sides of the first edge plate (2); A plurality of second flow-blocking beans (22) are arranged in an equidistant array on one or both sides of the first flow-blocking bean (21). The protruding area of ​​the second flow-blocking bean (22) is larger than that of the first flow-blocking bean (21). A first flow channel (23) for accommodating the flow of colloid is formed between the first flow-blocking bean (21) and the second flow-blocking bean (22).

2. The inner layer edge structure of the circuit board according to claim 1, characterized in that, The first flow-blocking bead (21) has a convex shape of a circle with a diameter of 340 μm, and the second flow-blocking bead (22) has a convex shape of a circle with a diameter of 600 μm. The first flow-blocking bead (21) and the second flow-blocking bead (22) are 1000 μm apart.

3. The inner layer edge structure of the circuit board according to claim 2, characterized in that, The first edge plate (2) is surrounded by a second edge plate (3), and the second edge plate (3) has a plurality of first flow blocking blocks (31) equidistantly arranged on one or both sides.

4. The inner layer edge structure of the circuit board according to claim 3, characterized in that, The first flow-blocking block (31) has shapes including rhombus, square, rectangle, triangle and circle.

5. The inner layer edge structure of the circuit board according to claim 4, characterized in that, When the first flow blocking block (31) is rhomboid in shape, the length of any side of the first flow blocking block (31) is greater than 3mm, and the angle of any interior angle of the first flow blocking block (31) is greater than 60° and less than 120°.

6. The inner layer edge structure of the circuit board according to any one of claims 3 to 5, characterized in that, The second edge plate (3) has a plurality of second flow blocking blocks (32) equidistantly arranged on one or both sides. The second flow blocking blocks (32) are disposed on one side of the first flow blocking block (31) and form a second flow channel (33) for accommodating the flow of the colloid. The second flow channel (33) communicates with the first flow channel (23).

7. The inner layer edge structure of the circuit board according to claim 6, characterized in that, The first edge plate (2) or the second edge plate (3) is provided with positioning holes (24).

8. The inner layer edge structure of the circuit board according to claim 7, characterized in that, The first edge plate (2) or the second edge plate (3) is provided with a positioning target (4), which is used to cooperate with the positioning hole (24) for positioning when the substrate is stacked.

9. The inner layer edge structure of the circuit board according to claim 1, characterized in that, The first edge plate (2) or the second edge plate (3) is provided with a concentric alignment area (5), which is made of transparent material and is used to measure the offset when the multilayer circuit board is stacked.

10. The inner layer edge structure of the circuit board according to claim 1, characterized in that, The edge plate is provided with a clearance area (6) for printing QR codes.

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