A PCBA board solder paste removal device

Abstract

This utility model discloses a PCBA board solder paste removal device, including a support assembly, a moving assembly, and a removal assembly. The support assembly includes a base and a U-shaped plate disposed on the upper end of the base. A placement groove is formed in the middle of the upper end of the base, and a slot is formed in the middle of the upper end of the U-shaped plate. The moving assembly includes a first motor disposed on the upper side wall of the U-shaped plate, a first lead screw disposed on the output end of the first motor, a first slider threaded outside the first lead screw, a moving plate fixed to the lower end of the first slider and having a sliding groove inside, a second motor disposed on the side wall of the moving plate, and a second lead screw disposed on the output end of the second motor. This PCBA board solder paste removal device controls the movement of the removal assembly through the moving assembly. A hot air gun on the removal assembly locally heats the solder paste to a molten state, and a vacuum pump on the negative pressure suction nozzle causes the negative pressure suction nozzle to adsorb the molten solder paste, thereby efficiently and non-destructively removing the solder paste from the PCBA board.

Description

Technical Field

[0001] This utility model relates to the field of PCBA manufacturing technology, specifically to a PCBA board solder paste removal device. Background Technology

[0002] The entire process of manufacturing a bare PCB, from SMT component mounting to DIP component insertion, is referred to as PCBA. In PCBA manufacturing, solder paste printing is a crucial step in SMT (Surface Mount Technology). However, due to stencil blockage, uneven squeegee pressure, or solder paste quality issues, solder paste residue or poor printing may occur, affecting soldering quality.

[0003] Traditional cleaning methods include manual wiping, ultrasonic cleaning, and chemical solvent cleaning. Among these methods, manual wiping is inefficient and can easily damage PCB pads or stencils; ultrasonic cleaning may impact precision components and requires disassembling the stencil; chemical solvent cleaning is environmentally unfriendly, and residual solvents may corrode the PCB. Existing technologies lack an efficient and non-destructive solder paste removal device, especially suitable for online rework or small-batch production scenarios. Therefore, we propose a PCBA board solder paste removal device. Utility Model Content

[0004] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be used to limit the scope of this utility model.

[0005] In view of the problems existing in the above and / or existing PCBA board solder paste removal devices, this utility model is proposed.

[0006] Therefore, the purpose of this utility model is to provide a PCBA board solder paste removal device, which controls the movement of the removal component by setting a moving component, locally heats the solder paste to a molten state by a hot air gun on the removal component, and uses a vacuum pump on the negative pressure nozzle to adsorb the molten solder paste, thereby efficiently and non-destructively removing the solder paste from the PCBA board.

[0007] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution:

[0008] A PCBA board solder paste removal device, comprising:

[0009] The support assembly includes a base and a U-shaped plate disposed on the upper end of the base. A placement groove is formed in the middle of the upper end of the base, and a slot is formed in the middle of the upper end of the U-shaped plate.

[0010] The moving component includes a first motor disposed on the upper end of the side wall of the U-shaped plate, a first lead screw disposed on the output end of the first motor, a first slider threaded on the outside of the first lead screw, a moving plate fixed to the lower end of the first slider and having a sliding groove inside, a second motor disposed on the side wall of the moving plate, a second lead screw disposed on the output end of the second motor, and a second slider threaded on the outside of the second lead screw.

[0011] The detachment assembly includes a hydraulic push rod fixed to the lower end of the second slider, a lifting plate vertically arranged at the lower end of the hydraulic push rod, a hot air gun arranged on one side of the lower end of the lifting plate, and a negative pressure suction nozzle arranged on the other side of the lower end of the lifting plate, wherein a vacuum pump is provided on the negative pressure suction nozzle.

[0012] In a preferred embodiment of the PCBA board solder paste removal device described in this utility model, a bolt is provided at the upper end of the base, and the bolt penetrates the base.

[0013] As a preferred embodiment of the PCBA board solder paste removal device of the present invention, the placement groove of the base is provided with a plurality of vacuum adsorption holes, which are evenly and equidistantly arranged in the placement groove.

[0014] As a preferred embodiment of the PCBA board solder paste removal device described in this utility model, a slot is provided on the upper outer side of the base, a U-shaped plate is inserted into the slot, and a threaded rod is provided on the outer wall of the base, the threaded rod passing through the base into the U-shaped plate.

[0015] In a preferred embodiment of the PCBA board solder paste removal device described in this utility model, a limiting plate is fixed to the upper end of the first slider, and the two ends of the limiting plate are fixed to the movable plate.

[0016] In a preferred embodiment of the PCBA board solder paste removal device described in this utility model, a connecting part is fixed at the upper middle part of the lifting plate, and the hydraulic push rod is threadedly connected to the connecting part.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: This PCBA board solder paste removal device controls the movement of the removal component through the set moving component, locally heats the solder paste to a molten state through the hot air gun on the removal component, and uses the vacuum pump on the negative pressure nozzle to make the negative pressure nozzle adsorb the molten solder paste, thereby removing the solder paste from the PCBA board efficiently and without damage. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0019] Figure 1 This is a three-dimensional structural diagram of a PCBA board solder paste removal device according to the present invention;

[0020] Figure 2 This is a three-dimensional structural diagram of a PCBA board solder paste removal device according to the present invention.

[0021] Figure 3 This is a three-dimensional structural diagram of a PCBA board solder paste removal device according to the present invention.

[0022] In the diagram: 100, Support assembly; 110, Base; 111, Placement slot; 112, Bolt; 113, Vacuum suction hole; 114, Slot; 115, Threaded rod; 120, U-shaped plate; 121, Slot; 200, Moving assembly; 210, First motor; 220, First lead screw; 230, First slider; 231, Limiting plate; 240, Moving plate; 250, Second motor; 260, Second lead screw; 270, Second slider; 300, Disengagement assembly; 310, Hydraulic push rod; 320, Lifting plate; 321, Connecting part; 330, Hot air gun; 340, Negative pressure suction nozzle. Detailed Implementation

[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0024] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views showing the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0026] This utility model provides a PCBA board solder paste removal device. The removal component is controlled to move by a set moving component. The solder paste is locally heated to a molten state by a hot air gun on the removal component. The molten solder paste is adsorbed by a vacuum pump on a negative pressure nozzle, thereby removing the solder paste from the PCBA board efficiently and without damage.

[0027] Figures 1-3 The diagram shown is a structural schematic of one embodiment of a PCBA board solder paste removal device according to this utility model. Please refer to [link / reference]. Figures 1-3 The main body of the PCBA board solder paste removal device of this embodiment includes a support component 100, a moving component 200 and a removal component 300.

[0028] The support assembly 100 includes a base 110 and a U-shaped plate 120 disposed on the upper end of the base 110. A placement groove 111 is formed in the middle of the upper end of the base 110, and a slot 121 is formed in the middle of the upper end of the U-shaped plate 120. Preferably, in this embodiment, a bolt 112 is provided at the upper end of the base 110, penetrating the base 110. The bolt 112 can fix the base 110 in a designated position, thereby ensuring the stable placement of the base 110. The placement groove 111 of the base 110 has multiple vacuum suction holes 113, which are evenly spaced within the placement groove 111. These vacuum suction holes 113 can be used to fix the PCBA board and prevent its displacement. A slot 114 is provided on the outer side of the upper end of the base 110. The U-shaped plate 120 is inserted into the slot 114. A threaded rod 115 is provided on the outer wall of the base 110. The threaded rod 115 passes through the base 110 and into the U-shaped plate 120. The U-shaped plate 120 is inserted into the base 110 under the action of the slot 114 and is fixed under the action of the threaded rod 115. Later, the operator can remove the U-shaped plate 120 from the base 110 by removing the threaded rod 115 so as to disassemble and repair the moving component 200 and the disengaging component 300 on the U-shaped plate 120.

[0029] The moving assembly 200 includes a first motor 210 disposed on the upper end of the side wall of the U-shaped plate 120, a first lead screw 220 disposed at the output end of the first motor 210, a first slider 230 threaded onto the outside of the first lead screw 220, a moving plate 240 fixed to the lower end of the first slider 230 and having a groove inside, a second motor 250 disposed on the side wall of the moving plate 240, a second lead screw 260 disposed at the output end of the second motor 250, and a second slider 270 threaded onto the outside of the second lead screw 260. Preferably, in this embodiment, a limiting plate 231 is fixed to the upper end of the first slider 230, and both ends of the limiting plate 231 are fixed to the moving plate 240. When the first slider 230 rotates with the first lead screw 220 and drives the moving plate 240 to slide, the limiting plate 231 at its upper end moves synchronously. Since the limiting plate 231 is fixedly connected to the moving plate 240, the stability of the moving plate 240 during the sliding process is ensured.

[0030] The detachment assembly 300 includes a hydraulic push rod 310 fixed to the lower end of the second slider 270, a lifting plate 320 vertically disposed at the lower end of the hydraulic push rod 310, a hot air gun 330 disposed on one side of the lower end of the lifting plate 320, and a negative pressure suction nozzle 340 disposed on the other side of the lower end of the lifting plate 320. A vacuum pump is disposed on the negative pressure suction nozzle 340. Preferably, in this embodiment, a connecting part 321 is fixed to the middle of the upper end of the lifting plate 320. The hydraulic push rod 310 is threadedly connected to the connecting part 321. Under the action of the connecting part 321, the lifting plate 320 is threadedly installed at the lower end of the hydraulic push rod 310. Later, the operator can manually rotate the lifting plate 320 to remove it from the lower end of the hydraulic push rod 310 for disassembly and maintenance.

[0031] Combination Figures 1-3 The solder paste removal device for PCBA boards according to this embodiment is used as follows: The PCBA board is placed in the placement groove 111 of the base 110, and the PCBA board is adsorbed and fixed through the vacuum adsorption hole 113 in the placement groove 111. The entire removal assembly 300 is moved by the first motor 210, the first lead screw 220, the first slider 230, the moving plate 240, the second motor 250, the second lead screw 260, and the second slider 270. The hydraulic push rod 310 drives the lifting plate 320 to move downward, which in turn drives the hot air gun 330 and the negative pressure suction nozzle 340 to move downward. The hot air gun 330 locally heats the solder paste to a molten state, and the vacuum pump on the negative pressure suction nozzle 340 causes the negative pressure suction nozzle 340 to adsorb the molten solder paste, thereby removing the solder paste from the PCBA board efficiently and without damage.

[0032] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A PCBA board solder paste separation device, characterized in that, include: The support assembly (100) includes a base (110) and a U-shaped plate (120) disposed on the upper end of the base (110). The upper end of the base (110) has a placement groove (111) in the middle, and the upper end of the U-shaped plate (120) has a slot (121) in the middle. The moving assembly (200) includes a first motor (210) disposed on the upper end of the side wall of the U-shaped plate (120), a first lead screw (220) disposed on the output end of the first motor (210), a first slider (230) threaded on the outside of the first lead screw (220), a moving plate (240) fixed on the lower end of the first slider (230) and having a groove inside, a second motor (250) disposed on the side wall of the moving plate (240), a second lead screw (260) disposed on the output end of the second motor (250), and a second slider (270) threaded on the outside of the second lead screw (260). The detachment assembly (300) includes a hydraulic push rod (310) fixed to the lower end of the second slider (270), a lifting plate (320) vertically arranged at the lower end of the hydraulic push rod (310), a hot air gun (330) arranged on one side of the lower end of the lifting plate (320), and a negative pressure suction nozzle (340) arranged on the other side of the lower end of the lifting plate (320), wherein a vacuum pump is provided on the negative pressure suction nozzle (340).

2. The PCBA board solder paste removal device according to claim 1, characterized in that, The upper end of the base (110) is provided with a bolt (112), which penetrates the base (110).

3. The PCBA board solder paste removal device according to claim 1, characterized in that, The base (110) has a plurality of vacuum adsorption holes (113) inside the placement groove (111), and the plurality of vacuum adsorption holes (113) are evenly and equidistantly arranged in the placement groove (111).

4. The PCBA board solder paste removal device according to claim 1, characterized in that, The upper outer side of the base (110) is provided with a slot (114), and the U-shaped plate (120) is inserted into the slot (114). The outer wall of the base (110) is provided with a threaded rod (115), which passes through the base (110) to the U-shaped plate (120).

5. A PCBA board solder paste removal device according to claim 1, characterized in that, The upper end of the first slider (230) is fixed with a limiting plate (231), and the two ends of the limiting plate (231) are fixed on the moving plate (240).

6. A PCBA board solder paste removal device according to claim 1, characterized in that, The upper middle part of the lifting plate (320) is fixed with a connecting part (321), and the hydraulic push rod (310) is threadedly connected to the connecting part (321).

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