A multilayer circuit board lamination and alignment device

Abstract

This utility model relates to the technical field of multilayer circuit board lamination devices, specifically a multilayer circuit board lamination and alignment device. The utility model includes a base, the surface of which is provided with an adjustment mechanism. The adjustment mechanism includes a positioning platform, which is fixedly connected to the surface of the base. The surface of the positioning platform has several vacuum adsorption holes, a vacuum pump is mounted on the surface of the positioning platform, and a pressure gauge plate is mounted on the surface of the positioning platform. By setting up the adjustment mechanism, the device facilitates the lamination of multilayer circuit boards by operators. By combining vacuum adsorption with a drive mechanism using a servo motor and a lead screw transmission system, the alignment accuracy of the multilayer circuit board lamination is greatly improved, effectively reducing the problem of poor circuit connection caused by misalignment. It enables automated and rapid alignment, improving the product qualification rate.

Description

Technical Field

[0001] This utility model relates to the technical field of multilayer circuit board lamination devices, and in particular to a multilayer circuit board lamination alignment device. Background Technology

[0002] With the rapid development of modern electronic technology, the manufacturing process of multilayer circuit boards, as one of the core components, is becoming increasingly important. The lamination process of multilayer circuit boards not only affects the performance and stability of the circuit board, but also directly impacts the overall quality of electronic products.

[0003] In the manufacturing process of multilayer circuit boards, the lamination process is a crucial step. Multilayer circuit boards are made by stacking multiple inner circuit boards and prepregs, etc. Precise alignment is required before lamination to ensure accurate connection of each layer of circuits. Current traditional multilayer circuit board lamination alignment methods have problems. For example, some manual alignment methods are not only inefficient, but also difficult to guarantee alignment accuracy due to human factors, resulting in poor circuit connection and low product qualification rate. On the other hand, some existing automatic alignment equipment has a complex structure, high cost, and difficult maintenance, which is not conducive to large-scale production applications. Therefore, a multilayer circuit board lamination alignment device is proposed to address the above problems. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies where traditional multilayer circuit board lamination and alignment methods mostly rely on manual alignment, which is not only inefficient but also makes it difficult to guarantee alignment accuracy, easily leading to poor circuit connections and low product qualification rates. Therefore, this invention proposes a multilayer circuit board lamination and alignment device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a multilayer circuit board pressing and alignment device, comprising a base, an adjustment mechanism on the surface of the base, the adjustment mechanism comprising a positioning platform, the positioning platform being fixedly connected to the surface of the base, the surface of the positioning platform having a plurality of vacuum adsorption holes, a vacuum pump being installed on the surface of the positioning platform, a pressure gauge being installed on the surface of the positioning platform, a fixing plate being fixedly connected to the surface of the positioning platform, a servo motor being fixedly connected to one side of the fixing plate, a bidirectional threaded rod being fixedly connected to the output end of the servo motor, and two L-shaped brackets being threadedly connected to the arc surface of the bidirectional threaded rod.

[0006] The effects achieved by the above components are as follows: by setting up the adjustment mechanism, it is possible for workers to easily press multi-layer circuit boards. By combining vacuum adsorption with a drive mechanism using a servo motor and lead screw transmission system, the accuracy of multi-layer circuit board pressing and alignment is greatly improved, effectively reducing the problem of poor circuit connection caused by misalignment. It can achieve automated and rapid alignment and improve the product qualification rate.

[0007] Preferably, the surface of the positioning platform is fixedly connected to a slide rail, and the inner surface of the slide rail is slidably connected to two limiting blocks, one side of which is fixedly connected to an L-shaped frame.

[0008] The effect achieved by the above components is that the L-shaped frame drives the limiting block to slide on the inner surface of the slide rail, which prevents the L-shaped frame from rotating with the rotation of the bidirectional threaded rod and improves the stability of the device.

[0009] Preferably, a soft pad is fixedly connected to one side of the L-shaped frame, and the size of the limiting block is adapted to the size of the slide rail.

[0010] The effect achieved by the above components is that by setting up soft pads, scratches on the surface are avoided during the process of guiding the L-shaped frame to the position of the circuit board.

[0011] Preferably, mounting frames are fixedly connected to both sides of the positioning platform, and a baffle is fixedly connected to the surface of the mounting frame. The other end of the baffle is fixedly connected to the L-shaped frame.

[0012] The effect achieved by the above components is as follows: by setting up a baffle, unused vacuum adsorption holes can be flexibly blocked according to the size of the circuit board, avoiding energy waste caused by useless adsorption, further optimizing the vacuum adsorption effect and improving the stability of positioning.

[0013] Preferably, the surface of the positioning platform is provided with a protective mechanism, the protective mechanism including a slide, the slide being fixedly connected to the surface of the positioning platform, a slide rod being slidably connected to the inner surface of the slide, a baffle being fixedly connected to one end of the slide rod, and an elliptical plate being fixedly connected to the end of the slide rod away from the baffle, with a lead screw inserted into the elliptical plate.

[0014] The effect achieved by the above-mentioned components is that by setting up a protective mechanism, the vacuum adsorption holes are covered, preventing dust or debris from accumulating in the vacuum adsorption holes when the positioning platform is idle or the circuit board is not pressed, thus affecting normal use.

[0015] Preferably, a sealing gasket is fixedly connected to one side of the baffle, and the sealing gasket is made of rubber.

[0016] The effect achieved by the above components is that the gap between the baffle and the positioning platform can be sealed by setting a rubber sealing gasket.

[0017] Preferably, a washer is fixedly connected to one end of the lead screw.

[0018] The effect achieved by the above components is that by setting shims, the friction between the lead screw and the carriage is increased, thereby improving the stability of the device.

[0019] In summary, the beneficial effects of this utility model are as follows:

[0020] 1. In this utility model, by setting an adjustment mechanism, the effect of making it easier for workers to press multi-layer circuit boards is achieved. By combining vacuum adsorption with a drive mechanism using a servo motor and a lead screw transmission system, the accuracy of pressing and aligning multi-layer circuit boards is greatly improved, effectively reducing the problem of poor circuit connection caused by misalignment. It can achieve automated and rapid alignment and improve the product qualification rate.

[0021] 2. In this utility model, by setting a protective mechanism, the vacuum adsorption hole is covered, preventing dust or debris from accumulating in the vacuum adsorption hole when the positioning platform is idle or the circuit board is not pressed, thus affecting normal use. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 2 In this utility model Figure 1 Another structural diagram from a different angle;

[0024] Figure 3 This is a schematic diagram of the adjustment mechanism in this utility model;

[0025] Figure 4 This is a partial structural schematic diagram of the adjustment mechanism in this utility model;

[0026] Figure 5 This is a schematic diagram of the protective mechanism in this utility model.

[0027] Legend: 1. Base; 2. Adjustment mechanism; 201. Positioning platform; 202. Vacuum adsorption hole; 203. Vacuum pump; 204. Pressure gauge; 205. Fixing plate; 206. Servo motor; 207. Bidirectional threaded rod; 208. L-shaped frame; 209. Slide rail; 210. Limiting block; 211. Soft pad; 212. Mounting bracket; 213. Protective cloth; 3. Protective mechanism; 31. Slide carriage; 32. Slide rod; 33. Baffle; 34. Elliptical plate; 35. Lead screw; 36. Gasket; 37. Sealing gasket. Detailed Implementation

[0028] Reference Figure 1 and Figure 2As shown, this utility model provides a technical solution: a multi-layer circuit board pressing and alignment device, including a base 1. The surface of the base 1 is provided with an adjustment mechanism 2. By setting the adjustment mechanism 2, the device facilitates the pressing and alignment of multi-layer circuit boards by the operator. By combining vacuum adsorption with a drive mechanism using a servo motor 206 and a lead screw transmission system, the accuracy of multi-layer circuit board pressing and alignment is greatly improved, effectively reducing the problem of poor circuit connection caused by misalignment. It can achieve automated and rapid alignment, improving the product qualification rate. The surface of the positioning platform 201 is provided with a protective mechanism 3. By setting the protective mechanism 3, the vacuum adsorption hole 202 is covered, preventing dust or debris from accumulating in the vacuum adsorption hole 202 when the positioning platform 201 is idle or not pressing the circuit board, thus affecting normal use.

[0029] The specific settings and functions of its adjustment mechanism 2 and protection mechanism 3 will be explained in detail below.

[0030] Reference Figure 3 and Figure 4 As shown in this embodiment: the adjustment mechanism 2 includes a positioning platform 201, which is fixedly connected to the surface of the base 1. The surface of the positioning platform 201 is provided with a plurality of vacuum adsorption holes 202. A vacuum pump 203 is installed on the surface of the positioning platform 201. A pressure gauge 204 is installed on the surface of the positioning platform 201. A fixing plate 205 is fixedly connected to the surface of the positioning platform 201. A servo motor 206 is fixedly connected to one side of the fixing plate 205. A bidirectional threaded rod 207 is fixedly connected to the output end of the servo motor 206. Two L-shaped brackets 208 are threadedly connected to the arc surface of the bidirectional threaded rod 207. A slide rail 209 is fixedly connected to the surface of the positioning platform 201. Two limiting blocks 210 are slidably connected to the inner surface of the slide rail 209. One side of the limiting block 210 is fixedly connected to the L-shaped bracket 208. The L-shaped frame 208 drives the limiting block 210 to slide on the inner surface of the slide rail 209, preventing the L-shaped frame 208 from rotating with the bidirectional threaded rod 207, thus improving the stability of the device. A soft pad 211 is fixedly connected to one side of the L-shaped frame 208, and the size of the limiting block 210 is adapted to the size of the slide rail 209. By setting the soft pad 211, scratches on the surface of the circuit board during the L-shaped frame 208's guidance of the circuit board position are avoided. Mounting brackets 212 are fixedly connected to both sides of the positioning platform 201, and a baffle 213 is fixedly connected to the surface of the mounting bracket 212. The other end of the baffle 213 is fixedly connected to the L-shaped frame 208. By setting the baffle 213, unused vacuum adsorption holes 202 can be flexibly covered according to the size of the circuit board, avoiding energy waste caused by useless adsorption, further optimizing the vacuum adsorption effect, and improving the stability of positioning.

[0031] Reference Figure 5As shown, specifically, the protective mechanism 3 includes a slide 31, which is fixedly connected to the surface of the positioning platform 201. A slide rod 32 is slidably connected to the inner surface of the slide 31. A baffle 33 is fixedly connected to one end of the slide rod 32, and an elliptical plate 34 is fixedly connected to the end of the slide rod 32 away from the baffle 33. A lead screw 35 is threaded into the elliptical plate 34. A sealing gasket 37 made of rubber is fixedly connected to one side of the baffle 33. By setting the rubber sealing gasket 37, the gap between the baffle 33 and the positioning platform 201 can be sealed. A washer 36 is fixedly connected to one end of the lead screw 35. By setting the washer 36, the friction between the lead screw 35 and the slide 31 is increased, improving the stability of the device.

[0032] Working principle: When the operator presses the circuit board, the base 1 is fixed on the workbench to ensure that the base 1 is horizontal and stable. After installing the positioning platform 201, the vacuum adsorption system is connected, and the vacuum adsorption hole 202 is checked to ensure that it is working properly. Then, the multilayer circuit board to be pressed is placed on the positioning platform 201, and the vacuum pump 203 is started to firmly adsorb the circuit board onto the positioning platform 201. Then, the servo motor 206 is started, which drives the bidirectional threaded rod 207. The bidirectional threaded rod 207 drives the L-shaped frame 208 to move. The L-shaped frame 208 drives the limit block 210 to slide on the inner surface of the slide rail 209. At this time, the L-shaped frame 208... The device 8 moves with the soft pad 211 until the circuit board is positioned in the appropriate position. At this time, the baffle 213 can flexibly cover the unused vacuum adsorption holes 202 according to the size of the circuit board, avoiding energy waste caused by useless adsorption and further optimizing the vacuum adsorption effect. Finally, pressing is performed, which achieves the effect of making it easy for workers to press multi-layer circuit boards. By setting up vacuum adsorption and using a drive mechanism with a servo motor 206 and a lead screw transmission system, the accuracy of multi-layer circuit board pressing and alignment is greatly improved, effectively reducing the problem of poor circuit connection caused by misalignment. It can realize automated and fast alignment and improve the product qualification rate.

[0033] When the positioning platform 201 is idle or not pressing the circuit board, the baffle 33 is pushed to drive the slide rod 32 to slide on the inner surface of the slide 31. The baffle 33 drives the sealing gasket 37 to move until the sealing gasket 37 completely covers the vacuum adsorption hole 202. At this time, the rotating screw 35 moves in the elliptical plate 34. The screw 35 drives the gasket 36 to move until the gasket 36 abuts against the slide 31, achieving the effect of covering the vacuum adsorption hole 202. This prevents external dust or debris from accumulating in the vacuum adsorption hole 202 when the positioning platform 201 is idle or not pressing the circuit board, thus affecting normal use.

[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

Claims

1. A multi-layer circuit board press alignment device comprising a base (1), characterized in that: The base (1) is provided with an adjustment mechanism (2) on its surface. The adjustment mechanism (2) includes a positioning platform (201). The positioning platform (201) is fixedly connected to the surface of the base (1). The surface of the positioning platform (201) is provided with a plurality of vacuum adsorption holes (202). A vacuum pump (203) is installed on the surface of the positioning platform (201). A pressure gauge (204) is installed on the surface of the positioning platform (201). A fixing plate (205) is fixedly connected to the surface of the positioning platform (201). A servo motor (206) is fixedly connected to one side of the fixing plate (205). A bidirectional threaded rod (207) is fixedly connected to the output end of the servo motor (206). Two L-shaped brackets (208) are threadedly connected to the arc surface of the bidirectional threaded rod (207).

2. The laminating alignment apparatus for a multi-layer circuit board according to claim 1, wherein: The surface of the positioning platform (201) is fixedly connected to a slide rail (209), and two limiting blocks (210) are slidably connected to the inner surface of the slide rail (209). One side of the limiting block (210) is fixedly connected to the L-shaped frame (208).

3. The multilayer circuit board lamination and alignment device according to claim 2, characterized in that: A soft pad (211) is fixedly connected to one side of the L-shaped frame (208), and the size of the limiting block (210) is adapted to the size of the slide rail (209).

4. The multilayer circuit board lamination and alignment device according to claim 1, characterized in that: The positioning platform (201) is fixedly connected to two sides of the mounting frame (212), and a baffle (213) is fixedly connected to the surface of the mounting frame (212). The other end of the baffle (213) is fixedly connected to the L-shaped frame (208).

5. The multilayer circuit board lamination and alignment device according to claim 1, characterized in that: The surface of the positioning platform (201) is provided with a protective mechanism (3). The protective mechanism (3) includes a slide (31). The slide (31) is fixedly connected to the surface of the positioning platform (201). A slide rod (32) is slidably connected to the inner surface of the slide (31). A baffle (33) is fixedly connected to one end of the slide rod (32). An elliptical plate (34) is fixedly connected to the end of the slide rod (32) away from the baffle (33). A lead screw (35) is threaded into the elliptical plate (34).

6. The multilayer circuit board lamination and alignment device according to claim 5, characterized in that: A sealing gasket (37) is fixedly connected to one side of the baffle (33), and the sealing gasket (37) is made of rubber.

7. The multilayer circuit board lamination and alignment device according to claim 5, characterized in that: A washer (36) is fixedly connected to one end of the lead screw (35).

Images