Power supply device and heat dissipation assembly
By using liquid cooling and thermally conductive materials, the problems of high noise and dust pollution in air-cooled power supplies have been solved, achieving efficient heat dissipation and dust prevention, and improving the service life and reliability of the power supply.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN MEGMEET ELECTRICAL CO LTD
- Filing Date
- 2025-04-02
- Publication Date
- 2026-05-26
AI Technical Summary
Existing microwave power supplies use air-cooled heat dissipation methods, which are noisy and allow dust to easily enter, causing corrosion of components and affecting lifespan and reliability.
The liquid cooling method is adopted. The power device transfers heat to the inner wall of the receiving tank through the second heat-conducting surface of the heat sink. The heat dissipation efficiency is improved by using thermally conductive materials, and the power device is sealed in the receiving tank to prevent dust contamination.
It improves heat dissipation efficiency, reduces noise and dust pollution, and extends the service life and reliability of the power supply unit.
Smart Images
Figure CN224290372U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of power supply technology, and in particular to a power supply device and a heat dissipation component. Background Technology
[0002] A power supply is a device that converts other forms of energy into electrical energy. Power supplies operate on the principle of "magnetism generating electricity," using renewable energy sources such as solar power and non-renewable energy sources such as coal and oil residue. Common power sources include dry cell batteries (direct current) and household 110V-220V AC power supplies. With technological advancements, our demand for power supplies is increasing, but cooling and heat dissipation remain crucial issues in power supply design. Excessive heat can negatively impact the lifespan and operating efficiency of a power supply.
[0003] Current microwave power supplies use air-cooled cooling, which results in loud fan noise during operation. After prolonged use, the fan may become damaged or overheat. This is especially true in dusty environments, where dust can easily enter the power supply and corrode components, leading to a shorter lifespan and increased susceptibility to failure. Utility Model Content
[0004] One objective of this application is to provide a power supply device and a heat dissipation component to reduce the problems of high operating noise and dust pollution caused by air-cooled power supplies.
[0005] In a first aspect, a power supply device is provided, comprising a housing and a power board. The housing includes a top cover and a base, the top cover and the base forming a receiving cavity, the base having a receiving groove. The power board is disposed in the receiving cavity, the power board including a substrate, a heat sink, and a power device, the substrate being disposed at the opening of the receiving groove, the heat sink being disposed on the surface of the substrate facing the receiving groove, the heat sink including a first heat-conducting surface and a second heat-conducting surface disposed opposite to each other, the first heat-conducting surface abutting against the inner wall of the receiving groove, the power device being disposed on the second heat-conducting surface, and a thermally conductive material filling the space between the surface of the power board facing the receiving groove and the inner wall of the receiving groove.
[0006] In one or more of the above optional embodiments, the power supply device further includes a clamping plate, the power device includes a first power device, the clamping plate is disposed opposite to the second heat-conducting surface, and the clamping plate is used to clamp and fix the housing of the first power device to the second heat-conducting surface.
[0007] In one or more of the above optional embodiments, the power supply device includes a locking bolt, the power device includes a second power device, and the locking bolt passes through the housing of the second power device and is screwed to the heat sink to fix the housing of the second power device to the second heat-conducting surface.
[0008] In one or more of the above optional embodiments, the base includes a base plate, side panels and a partition. The base plate is disposed opposite to the top cover and is connected to the side panels. The base plate and the side panels enclose a cavity with an opening at one end. The top cover is disposed on the opening. The partition is disposed in the cavity and divides the cavity into the receiving groove and the empty cavity. The opening of the receiving groove faces the top cover.
[0009] In one or more of the above optional embodiments, the side panel includes a first side panel and a second side panel disposed opposite to each other along a first direction, and a third side panel and a fourth side panel disposed opposite to each other along a second direction. Along the first direction, the opposite ends of the partition are respectively connected to the first side panel and the second side panel, and along the second direction, the opposite ends of the partition are respectively connected to the third side panel and the fourth side panel. The direction from the bottom plate to the top cover, the first direction, and the second direction are all perpendicular to each other.
[0010] In one or more of the above optional embodiments, along the direction from the top cover to the bottom plate, the end of the partition away from the top cover is connected to the bottom plate.
[0011] In one or more of the above optional embodiments, one end of the base plate is recessed towards the top cover with a handle groove.
[0012] In one or more of the above alternative embodiments, the power board includes a transformer disposed on the surface of the substrate facing the receiving slot.
[0013] In one or more of the above optional embodiments, the substrate has a socket on the surface facing away from the receiving groove, the top cover has a through hole, and the socket's insertion port communicates with the through hole of the top cover.
[0014] Secondly, a heat dissipation assembly is provided, including a liquid cooling plate and a plurality of the aforementioned power supply devices. The liquid cooling plate is provided with coolant channels, and the base is fixed to the liquid cooling plate.
[0015] The beneficial effects of the embodiments of this application are as follows: The power supply device provided in this application embodiment, by placing the power device on the second heat-conducting surface of the heat sink, allows the heat generated by the power device during operation to be transferred sequentially through the second and first heat-conducting surfaces to the inner wall of the receiving groove, where it is dissipated by the casing. This results in high heat dissipation efficiency. Furthermore, the surface of the power board facing the receiving groove is filled with a thermally conductive material, which transfers the heat from the power board to the inner wall of the receiving groove, further improving the heat dissipation effect of the power device. On the other hand, the power device being located within the receiving groove reduces the risk of damage caused by dust and foreign objects contacting the power device. Compared to traditional power supply devices using air cooling, the power supply device provided in this application embodiment reduces the problems of high operating noise and dust pollution associated with air-cooled power supply devices. Attached Figure Description
[0016] One or more embodiments are illustrated by way of example with reference to the accompanying drawings, which are not intended to limit the embodiments, and elements having the same reference numerals in the drawings are designated as similar elements.
[0017] Figure 1 A schematic diagram of a power supply device provided in an embodiment of this application;
[0018] Figure 2 An exploded view of a power supply device provided in an embodiment of this application;
[0019] Figure 3 for Figure 1 Schematic diagram of the cross section at point BB;
[0020] Figure 4 A partial exploded view of a power supply device provided in an embodiment of this application;
[0021] Figure 5 for Figure 1 Cross-sectional view at point CC;
[0022] Figure 6 for Figure 1 Schematic diagram of the cross section at point DD;
[0023] Figure 7 A schematic diagram of a power supply device provided in an embodiment of this application;
[0024] Figure 8 This is a schematic diagram of a heat dissipation component provided in an embodiment of this application. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and thoroughly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.
[0026] It should be noted that when an element is described as "connected" to another element, it can be directly connected to the other element, or there may be one or more intervening elements. Furthermore, the technical features involved in the various embodiments of this application described below can be combined with each other as long as they do not constitute a conflict.
[0027] Please see Figures 1-4 The power supply device 100 includes a housing 1 and a power board 2. The housing 1 includes a top cover 11 and a base 12, which together form a receiving cavity A. The base 12 has a receiving groove a1. The power board 2 is disposed in the receiving cavity A and includes a substrate 21, a heat sink 22, and a power device 23. The substrate 21 is disposed at the opening of the receiving groove a1, and the heat sink 22 is disposed on the surface of the substrate 21 facing the receiving groove a1. The heat sink 22 includes a first heat-conducting surface 221 and a second heat-conducting surface 222 disposed opposite to each other. The first heat-conducting surface 221 abuts against the inner wall of the receiving groove a1, and the power device 23 is disposed on the second heat-conducting surface 222. A thermally conductive material (not shown) is filled between the surface of the power board 2 facing the receiving groove a1 and the inner wall of the receiving groove a1.
[0028] The power supply device 100 provided in this application embodiment, by placing the power device 23 on the second heat-conducting surface 222 of the heat sink 22, allows the heat generated by the power device 23 during operation to be transferred sequentially through the second heat-conducting surface 222 and the first heat-conducting surface 221 to the inner wall of the receiving groove a1, where it is dissipated by the housing 1, resulting in high heat dissipation efficiency. A thermally conductive material is filled between the surface of the power board 2 facing the receiving groove a1 and the inner wall of the receiving groove a1, transferring the heat from the power board 2 to the inner wall of the receiving groove a1, further improving the heat dissipation effect of the power device 23. Furthermore, the fact that the power device 23 is located within the receiving groove a1 helps reduce the risk of damage to the power device 23 due to contact with dust and foreign objects. Compared to the traditional power supply device 100 using air cooling, the power supply device 100 provided in this application embodiment reduces the problems of high operating noise and dust pollution associated with air-cooled power supply devices 100.
[0029] Please see Figure 4 and Figure 5In some embodiments, the power supply device 100 further includes a clamping plate 3, the power device 23 includes a first power device 231, the clamping plate 3 is disposed opposite to the second heat-conducting surface 222, and the clamping plate 3 is used to clamp and fix the housing of the first power device 231 to the second heat-conducting surface 222.
[0030] In some embodiments, the clamp 3 is screwed to the heat sink 22 along the direction toward the second heat-conducting surface 222.
[0031] In some embodiments, the first power device 231 is an IGBT (insulated gate bipolar transistor).
[0032] In some embodiments, the power board 2 further includes a gasket 24 disposed between the housing of the first power device 231 and the heat sink 22. The gasket 24 serves to provide insulation and heat transfer between the second heat-conducting surface 222 and the housing of the first power device 231. In some embodiments, the gasket 24 includes, but is not limited to, a ceramic gasket.
[0033] In other embodiments, the clamping plate 3 includes a connecting portion (not shown) and a supporting portion (not shown). One end of the connecting portion is connected to the housing 1. The supporting portion is disposed opposite to the second heat-conducting surface 222. A clamping space is formed between the supporting portion and the second heat-conducting surface 222. The housing of the first power device 231 is disposed in the clamping space. The supporting portion undergoes elastic deformation in a direction away from the second heat-conducting surface 222 to generate an elastic force that presses the housing of the first power device 231 against the second heat-conducting surface 222.
[0034] Please see Figure 4 and Figure 6 In some embodiments, the power supply device 100 includes a locking bolt 4, and the power device 23 includes a second power device 232. The locking bolt 4 passes through the housing of the second power device 232 and is screwed to the heat sink 22 to fix the housing of the second power device 232 to the second heat-conducting surface 222.
[0035] In some embodiments, the second power device 232 is a rectifier bridge.
[0036] In some embodiments, the housing 1 is made of aluminum.
[0037] In some embodiments, the thermally conductive material includes, but is not limited to, thermally conductive silicone. It is understood that other materials may be selected based on actual needs, as long as the insulation and thermal conductivity requirements between the power board 2 and the housing 1 are met.
[0038] Please see Figure 2 and Figure 3 In some embodiments, the substrate 21 closes the opening of the receiving groove a1.
[0039] In some embodiments, the substrate 21 is provided with an injection hole 211, which extends through the substrate 21. The injection hole 211 is used to inject thermally conductive material into the space formed by the substrate 21 and the inner wall of the receiving groove a1.
[0040] In some embodiments, the thermally conductive material includes, but is not limited to, being formed by filling the space formed by the substrate 21 and the inner wall of the receiving groove a1 through the injection hole 211 using a high-pressure potting process and then solidifying.
[0041] Please see Figure 2 and Figure 3 In some embodiments, the base 12 includes a base plate 121, side panels 122, and a partition 123. The base plate 121 is disposed opposite to the top cover 11 and is connected to the side panels 122. The base plate 121 and the side panels 122 enclose a cavity A1 with an opening A11 at one end. The top cover 11 covers the opening A11. The partition 123 is disposed inside the cavity A1 and divides the cavity A1 into a receiving groove a1 and a cavity a2. The opening of the receiving groove a1 faces the top cover 11. The housing 1 is usually made into a specific shape according to the usage requirements. For example, the housing 1 is generally cubic. The partition 123 divides the cavity A1 into a receiving groove a1 and a cavity a2. Compared with the solid structure of the cavity a2 of the housing 1, it is beneficial to reduce production costs and reduce the weight of the power supply device 100.
[0042] In some embodiments, the side panel 122 includes a first side panel 1221 and a second side panel 1222 disposed opposite to each other along a first direction Y, and a third side panel 1223 and a fourth side panel 1224 disposed opposite to each other along a second direction Z. Along the first direction Y, the opposite ends of the partition 123 are connected to the first side panel 1221 and the second side panel 1222, respectively. Along the second direction Z, the opposite ends of the partition 123 are connected to the third side panel 1223 and the fourth side panel 1224, respectively. The bottom plate 121 is perpendicular to each other in the direction X toward the top cover 11, the first direction Y, and the second direction Z.
[0043] In some embodiments, the heat sink 22 is screwed to the third side plate 1223, and the first heat-conducting surface 221 is attached to the surface of the third side plate 1223 facing the fourth side plate 1224.
[0044] In some embodiments, along the direction X from the bottom plate 121 to the top cover 11, there is a preset distance between the partition 123 and the power board 2. The preset distance is designed based on the electrical insulation gap between the power board 2 and the partition 123, and the preset distance is greater than or equal to the electrical insulation gap.
[0045] In some embodiments, along the direction from the top cover 11 to the bottom plate 121, the end 123a of the partition 123 away from the top cover 11 is connected to the bottom plate 121. In this application, the end 123a of the partition 123 away from the top cover 11 can be one end, one side, or one side of the partition 123 in a certain direction. The connection between the end 123a of the partition 123 away from the top cover 11 and the bottom plate 121 allows the bottom plate 121 to provide support for the partition 123, which helps to improve the structural stability of the partition 123.
[0046] Please see Figure 2 In some embodiments, the surface of the substrate 21 facing away from the receiving groove a1 is provided with a socket 26, and the top cover 11 is provided with a through hole 111. The socket 261 of the socket 26 communicates with the through hole 111 of the top cover 11. The socket 26 is used to provide electrical connection between the power board 2 and other devices.
[0047] Please see Figure 3 In some embodiments, the power board 2 includes a transformer 25 disposed on the surface of the substrate 21 facing the receiving groove a1.
[0048] Please see Figure 7 In some embodiments, a handle groove 124 is recessed at one end of the base plate 121 toward the top cover 11. The handle groove 124 is used to facilitate the user to pick up and put down the power device 100. The handle groove 124 is formed by the recess of the base plate 121 toward the top cover 11. Compared with other embodiments where the handle is provided on the outside of the housing 1, it is beneficial to reduce the overall space occupied by the power device 100 and improve the simplicity and aesthetics of the appearance of the power device 100.
[0049] In some embodiments, the bottom plate 121 is recessed into the top cover 11 at one end near the first side plate 1221, with a handle groove 124 recessed therein.
[0050] Please see Figure 2 , Figure 3 and Figure 8 Based on the same inventive concept, this application also provides a heat dissipation component 1000, including a liquid cooling plate 200 and several power supply devices 100 in any of the above embodiments. The liquid cooling plate 200 is provided with a coolant channel (not shown in the figure) for coolant to pass through. The base 12 is fixed to the liquid cooling plate 200.
[0051] In some embodiments, the base 12 is screwed to the liquid cooling plate 200.
[0052] In some embodiments, the liquid cooling plate 200 is provided with a cooling surface 201, and the surface of the base plate 121 facing away from the top cover 11 is attached to the cooling surface 201 along the direction from the top cover 11 to the base 12.
[0053] In some embodiments, at least two power supply devices 100 are arranged sequentially along the second direction Z.
[0054] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.
Claims
1. A power supply device, characterized in that, include: The housing includes a top cover and a base, the top cover and the base forming a receiving cavity, and the base having a receiving groove; A power board is disposed in the receiving cavity. The power board includes a substrate, a heat sink, and a power device. The substrate is disposed at the opening of the receiving groove. The heat sink is disposed on the surface of the substrate facing the receiving groove. The heat sink includes a first heat-conducting surface and a second heat-conducting surface disposed opposite to each other. The first heat-conducting surface abuts against the inner sidewall of the receiving groove. The power device is disposed on the second heat-conducting surface. A thermally conductive material is filled between the surface of the power board facing the receiving groove and the inner wall of the receiving groove.
2. The power supply device according to claim 1, characterized in that, The power supply device further includes a clamping plate, and the power device includes a first power device. The clamping plate is disposed opposite to the second heat-conducting surface, and the clamping plate is used to clamp and fix the outer shell of the first power device to the second heat-conducting surface.
3. The power supply device according to claim 1, characterized in that, The power supply device includes a locking bolt, and the power device includes a second power device. The locking bolt passes through the housing of the second power device and is screwed to the heat sink to fix the housing of the second power device to the second heat-conducting surface.
4. The power supply device according to claim 1, characterized in that, The base includes a base plate, side panels, and a partition. The base plate is disposed opposite to the top cover and is connected to the side panels. The base plate and the side panels enclose a cavity with an opening at one end. The top cover is placed over the opening. The partition is disposed in the cavity and divides the cavity into a receiving groove and a hollow cavity. The opening of the receiving groove faces the top cover.
5. The power supply device according to claim 4, characterized in that, The side panel includes a first side panel and a second side panel arranged opposite to each other along a first direction, and a third side panel and a fourth side panel arranged opposite to each other along a second direction. Along the first direction, the opposite ends of the partition are respectively connected to the first side panel and the second side panel, and along the second direction, the opposite ends of the partition are respectively connected to the third side panel and the fourth side panel. Wherein, the direction from the bottom plate to the top cover, the first direction, and the second direction are all perpendicular to each other.
6. The power supply device according to claim 5, characterized in that, Along the direction from the top cover to the bottom plate, the end of the partition away from the top cover is connected to the bottom plate.
7. The power supply device according to claim 5, characterized in that, One end of the base plate is recessed towards the top cover and has a handle groove.
8. The power supply device according to claim 1, characterized in that, The power board includes a transformer, which is disposed on the surface of the substrate facing the receiving slot.
9. The power supply device according to claim 1, characterized in that, The substrate has a socket on the surface facing away from the receiving groove, and the top cover has a through hole, with the socket's insertion port communicating with the through hole of the top cover.
10. A heat dissipation component, characterized in that, include: Liquid cooling plate, equipped with coolant channels; Several power supply devices as described in any one of claims 1-9, wherein the base is fixed to the liquid cooling plate.