A heat dissipation receiver housing

Abstract

This utility model relates to a heat-dissipating receiver housing in the field of receivers. It includes a middle housing with a shelf inside. Compression springs are installed on both the left and right sides of the inner wall of the shelf, and clamping plates are attached to the ends of the compression springs. Thermally conductive silicone blocks are installed around the top surface of the shelf. After a circuit board is placed in the inner cavity of the shelf, the compression springs on the shelf drive the clamping plates closer to the circuit board, causing the clamping plates to engage with the outer side of the circuit board. Compared to traditional screw fixing methods, this mechanism allows for quick tool-free assembly and disassembly. The thermally conductive silicone blocks attract and dissipate the heat generated by the circuit board during operation, thus achieving efficient heat dissipation and preventing heat accumulation that accelerates component aging.

Description

Technical Field

[0001] This utility model relates to the field of receivers, specifically to a heat-dissipating receiver housing. Background Technology

[0002] A receiver is an electronic device or component whose main function is to receive and process signals from a signal source (such as a transmitter, sensor, etc.). Receivers are widely used in various fields such as communications, broadcasting, radar, remote control, and audio equipment, and are a crucial link in achieving signal transmission and reception. The receiver casing is the external protective and decorative component of the receiver; it not only protects the internal circuitry and components but also affects the receiver's appearance and user experience.

[0003] The receiver housing consists of a main body, a front panel, an interface area, and a mounting structure. First, align the housing with the receiver body, ensuring the interfaces and buttons are in the correct positions. Use a screwdriver to tighten the pre-drilled screws. The front panel is used for user interaction, such as operation control, status display, or information input. The interface area enables signal input / output or device expansion connections.

[0004] In electronic device applications, receiver housings often face a trade-off between structural strength and functional integration. Furthermore, existing receiver housings mostly employ single-layer injection molding, lacking internal electromagnetic shielding for high-frequency signal transmission. This makes them susceptible to external interference leading to signal attenuation. In addition, their poorly designed heat dissipation channels cause heat buildup in internal electronic components during prolonged operation, accelerating component aging. Inadequate sealing in the interface area allows dust or liquids to easily enter the device, causing short circuits. Moreover, existing receiver housings rely on screws for mounting to the circuit board, resulting in inefficient assembly and the risk of stripped threads from repeated disassembly and reassembly, impacting ease of maintenance. Utility Model Content

[0005] The purpose of this invention is to address the above-mentioned shortcomings by providing a heat-dissipating receiver housing. Through structural optimization, it achieves synergistic improvements in electromagnetic shielding, heat dissipation, and assembly, thus solving the technical problems of existing technologies, such as susceptibility to external interference leading to signal attenuation, heat accumulation in internal electronic components during long-term operation accelerating component aging, inconvenient equipment maintenance, and insufficient sealing.

[0006] The objective of this utility model is achieved through the following means:

[0007] A heat-dissipating receiver housing includes a middle housing, a front cover, and a rear cover. The front cover and rear cover are disposed on the front and back sides of the middle housing, respectively. A conductive mesh layer is added to the back sides of the front and rear covers and the inner wall of the middle housing. Airflow channels and convection holes are respectively opened on the upper and lower surfaces of the middle housing. A shelf is added to the inner cavity of the middle housing. Compression springs are installed on the left and right sides of the inner wall of the shelf. The ends of the compression springs are equipped with clamping plates. Thermally conductive silicone blocks are installed around the upper surface of the shelf. An interface area is opened at the center of the front side of the rear cover. A protective cover plate is attached to the front side of the interface area. The protective cover plate is slidably connected to the front side of the rear cover. Buffer protrusions are inserted and connected around the outer perimeter of the front and rear covers. After placing the circuit board inside the shelf, a compression spring on the shelf moves a locking plate closer to the circuit board, locking the plate against the outer side of the circuit board. Compared to traditional screw fixing, this mechanism allows for tool-free quick assembly and disassembly. Thermally conductive silicone blocks absorb and dissipate the heat generated by the circuit board. The front and rear covers are then connected to the middle housing. A protective cover can be slid upwards at the rear cover, exposing the interface area for connection. When not in use, the back of the protective cover fits tightly against the interface area, ensuring its airtightness and safety during non-use. This is achieved through the gaps in the conductive mesh layer. The gradient design allows for targeted absorption of high-frequency interference signals, while the airflow channels and convection holes enable natural air circulation for heat dissipation. When the casing is dropped, the buffer protrusion contacts the ground first. The microporous energy-absorbing material inside the buffer protrusion reduces the risk of damage to internal components from external impacts, thus achieving efficient heat dissipation and preventing heat accumulation that accelerates component aging. At the same time, the interface area can be sealed to prevent dust or liquid from easily entering the equipment and causing short circuits. In addition, this mechanism does not require screws to fix the circuit board, making disassembly and assembly easy, ensuring convenient equipment maintenance, and preventing signal attenuation caused by external interference.

[0008] Furthermore, the airflow channel has a honeycomb design, and both the airflow channel and the convection holes are connected to the conductive mesh layer.

[0009] The airflow channels, convection holes, and conductive mesh layer allow airflow to dissipate heat.

[0010] Furthermore, the shelf has an overall conical design, and ventilation holes are evenly distributed at the bottom of the inner cavity.

[0011] Allowing airflow channels or convection holes to flow through the vents along the inside of the shelf can further improve the heat dissipation effect on the circuit board.

[0012] Furthermore, the front end face of the rear end cover has limit grooves on both sides, and the top of each limit groove is connected to an inlet / outlet groove.

[0013] The rear cover allows the corresponding structure to enter the limiting groove through the inlet / outlet slot, and the connecting structure in the limiting groove can be removed through the inlet / outlet slot.

[0014] Furthermore, the protective cover includes a middle cover, and side cover plates are slidably connected to the left and right outer sides of the middle cover. Limit rails are installed on the back of the side cover plates, and the limit rails are slidably connected to the limit grooves and the inlet / outlet grooves.

[0015] When connecting some interfaces in the interface area, the corresponding side cover can be moved on the protective cover, and the limiting rail moves up and down along the corresponding limiting groove with the side cover. This allows for sealing and protection of some unused interfaces. At the same time, when the middle cover can drive the side cover to rise along the limiting groove to the inlet / outlet groove, the limiting rail of the side cover is separated from the limiting groove through the inlet / outlet groove, making it easy to replace the protective cover if it is damaged.

[0016] Furthermore, the bottom end of the buffer protrusion extends inward through the outer wall of the front and rear covers and is connected to a buffer spring, and the ends of the buffer springs are all connected to rubber pads.

[0017] When the receiver casing is dropped and the buffer protrusion comes into contact with the ground, the buffer protrusion will move inwards towards the front and rear covers, compressing the buffer spring. The rubber pad plays a damping role, absorbing the impact and thus further ensuring the safety of the receiver casing during use.

[0018] The beneficial effects of this utility model are:

[0019] This design places the circuit board inside the shelf, and a compression spring on the shelf moves a locking plate close to the circuit board, securing the plate to the outside of the circuit board. Compared to traditional screw fixing, this mechanism allows for tool-free quick assembly and disassembly. Thermally conductive silicone blocks absorb and dissipate the heat generated by the circuit board. The front and rear covers are then connected to the middle housing. A protective cover can slide upwards at the rear cover, exposing the interface area for connection. When not in use, the back of the protective cover fits tightly against the interface area, ensuring its airtightness and safety during non-use. This is achieved through the inter-mesh structure of the conductive mesh layer. The gradient design of the gap allows for targeted absorption of high-frequency interference signals. The airflow channel and convection holes enable natural air circulation for heat dissipation. When the casing is dropped, the buffer protrusion contacts the ground first. The microporous energy-absorbing material inside the buffer protrusion reduces the risk of damage to internal components from external impacts, thus achieving efficient heat dissipation and preventing heat accumulation that accelerates component aging. At the same time, the interface area can be sealed to prevent dust or liquid from easily entering the equipment and causing short circuits. In addition, this mechanism does not require screws to fix the circuit board, making disassembly and assembly easy, ensuring convenient equipment maintenance, and preventing signal attenuation caused by external interference. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of a heat dissipation receiver housing according to the present invention;

[0021] Figure 2 This is a schematic diagram of the separated structure of the middle shell, front cover, and rear cover of a heat dissipation receiver shell according to the present invention.

[0022] Figure 3 This is a schematic diagram of the front and rear cover structures of a heat-dissipating receiver housing according to the present invention.

[0023] Figure 4 This is a schematic diagram of the buffer protrusion and its connection structure of a heat dissipation receiver shell according to the present invention.

[0024] Figure 5 This is a schematic diagram of the rear end cover of a heat-dissipating receiver housing according to the present invention, viewed from the left rear side.

[0025] Figure 6 This is a schematic diagram of the protective cover plate structure of a heat dissipation receiver shell according to the present invention.

[0026] Figure 7 This is a cross-sectional view of the middle shell portion of a heat-dissipating receiver shell according to the present invention.

[0027] Figure 8 This is a schematic diagram of a heat dissipation receiver housing shelf and its connection structure according to the present invention.

[0028] In the diagram, 1. Middle shell; 2. Front cover; 3. Rear cover; 4. Conductive mesh layer; 5. Airflow channel; 6. Convection hole; 7. Shelf; 8. Ventilation hole; 9. Compression spring; 10. Clamping plate; 11. Thermally conductive silicone block; 12. Interface area; 13. Limiting groove; 14. Inlet / outlet groove; 15. Protective cover plate; 16. Middle cover plate; 17. Side cover plate; 18. Limiting rail; 19. Buffer protrusion; 20. Buffer spring; 21. Rubber pad. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0030] In this embodiment, refer to Figures 1-8The specific implementation of the heat dissipation receiver shell includes a middle shell 1, a front cover 2, and a rear cover 3. The front cover 2 and the rear cover 3 are disposed on the front and back sides of the middle shell 1, respectively. A conductive mesh layer 4 is added to the back side of the front cover 2 and the rear cover 3 and the inner wall of the middle shell 1. An airflow channel 5 and a convection hole 6 are respectively opened on the upper and lower surfaces of the middle shell 1. A shelf 7 is added to the inner cavity of the middle shell 1. Compression springs 9 are installed on the left and right sides of the inner wall of the shelf 7. A clamping plate 10 is added to the end of each compression spring 9. Thermal conductive silicone blocks 11 are installed around the upper surface of the shelf 7. An interface area 12 is opened at the center of the front side of the rear cover 3. A protective cover plate 15 is attached to the front side of the interface area 12. The protective cover plate 15 is slidably connected to the front side of the rear cover 3. Buffer protrusions 19 are inserted and connected around the outer sides of the front cover 2 and the rear cover 3. After placing the circuit board inside the shelf 7, the compression spring 9 on the shelf 7 drives the locking plate 10 closer to the circuit board, so that the locking plate 10 is locked to the outside of the circuit board. Compared with the traditional screw fixing method, this mechanism can realize tool-free quick disassembly and assembly. The thermally conductive silicone block 11 can attract and dissipate the heat generated by the circuit board during operation. Then, the front cover 2 and the rear cover 3 are connected to the middle shell 1. The protective cover 15 can be slid upward at the rear cover 3 to expose the interface area 12 to the outside for connection. When the interface area 12 is not in use, the back of the protective cover 15 is tightly attached to the interface area 12, and the protective cover 15 ensures the airtightness and safety of the interface area 12 when not in use. The gradient design of the grid gaps on the electrical grid layer 4 directionally absorbs high-frequency interference signals. The airflow channel 5 and convection holes 6 enable natural air circulation for heat dissipation. When the shell is dropped, the buffer protrusion 19 first contacts the ground. The microporous energy-absorbing material filled inside the buffer protrusion 19 reduces the risk of damage to internal components from external impacts, thereby achieving efficient heat dissipation and preventing heat accumulation that accelerates component aging. At the same time, it can seal the interface area 12 to prevent dust or liquid from easily entering the equipment and causing short circuits. In addition, this mechanism does not require screws to fix the circuit board, which facilitates disassembly and assembly, ensures convenient equipment maintenance, and prevents the equipment from being affected by signal attenuation due to external interference.

[0031] like Figure 7 , Figure 8 As shown, the airflow channel 5 has a honeycomb design, and both the airflow channel 5 and the convection holes 6 are connected to the conductive mesh layer 4. This allows airflow through the airflow channel 5, convection holes 6, and conductive mesh layer 4 for heat dissipation. The shelf 7 has an overall conical design, and ventilation holes 8 are evenly distributed at the bottom of the inner cavity of the shelf 7. This allows the airflow channel 5 or the convection holes 6 to flow through the ventilation holes 8 along the inside of the shelf 7, further improving the heat dissipation effect on the circuit board.

[0032] like Figure 5As shown, the front end cover 3 has limiting grooves 13 on both sides of its front end face, and the top of each limiting groove 13 is connected to an inlet / outlet groove 14. The rear end cover 3 allows the corresponding structure to enter the limiting groove 13 through the inlet / outlet groove 14, and the connecting structure in the limiting groove 13 can be removed through the inlet / outlet groove 14. The protective cover plate 15 includes a middle cover plate 16, and side cover plates 17 are slidably connected to the left and right outer sides of the middle cover plate 16. Limiting rails 18 are installed on the back of each side cover plate 17, and the limiting rails 18 are slidably connected to the limiting grooves 13 and the inlet / outlet grooves 14. When connecting some interfaces in interface area 12, the corresponding side cover plate 17 can be moved on the protective cover plate 15, and the limiting rail 18 moves up and down along the corresponding limiting groove 13 with the side cover plate 17, so that some unused interfaces can be sealed and protected. At the same time, when the middle cover plate 16 drives the side cover plate 17 to rise along the limiting groove 13 to the inlet / outlet groove 14, the limiting rail 18 of the side cover plate 17 is separated from the limiting groove 13 through the inlet / outlet groove 14, which facilitates the replacement operation when the protective cover plate 15 is damaged.

[0033] like Figure 4 As shown, the bottom end of the buffer protrusion 19 extends inward through the outer wall of the front cover 2 and the rear cover 3, and is connected to a buffer spring 20. Each end of the buffer spring 20 is connected to a rubber pad 21. When the receiver casing is dropped and the buffer protrusion 19 contacts the ground, the buffer protrusion 19 moves inward into the front cover 2 and the rear cover 3, compressing the buffer spring 20. The rubber pad 21 plays a damping role, absorbing the impact and further ensuring the safety of the receiver casing during use.

[0034] The working process of the heat dissipation receiver shell in this embodiment is as follows: After the circuit board is placed in the inner cavity of the shelf 7, the compression spring 9 on the shelf 7 drives the clamping plate 10 close to the circuit board, so that the clamping plate 10 is clamped and connected to the outside of the circuit board. The thermally conductive silicone block 11 can attract and dissipate the heat generated by the circuit board. Then, the front cover 2 and the rear cover 3 are connected to the middle shell 1. The protective cover 15 can be slid upward at the rear cover 3 to expose the interface area 12 to the outside for connection and use. When the interface area 12 is not in use, the back of the protective cover 15 is tightly attached to the interface area 12. The gradient design of the grid gap on the conductive grid layer 4 is used to directionally absorb high-frequency interference signals. The airflow channel 5 and the convection hole 6 can realize natural air circulation for heat dissipation. When the shell is dropped, The buffer protrusion 19 first contacts the ground, etc. Through the microporous energy-absorbing material filled inside the buffer protrusion 19, the buffer protrusion 19 will move into the front cover 2 and the rear cover 3, squeezing the buffer spring 20. The rubber pad 21 plays a damping role, absorbing the impact and reducing the risk of damage to internal components from external impact. When connecting some interfaces in the interface area 12, the corresponding side cover 17 can be moved on the protective cover 15, and the limiting rail 18 moves up and down along the corresponding limiting groove 13 with the side cover 17, so that some unused interfaces can be sealed and protected. At the same time, the middle cover 16 can drive the side cover 17 to rise along the limiting groove 13 to the inlet and outlet groove 14, so that the limiting rail 18 of the side cover 17 separates from the limiting groove 13 through the inlet and outlet groove 14.

[0035] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A heat-dissipating receiver face cover, comprising a middle shell, a front end cover and a back end cover, the front end cover and the back end cover are arranged on the front end surface and the back surface of the middle shell, the back surfaces of the front end cover and the back end cover and the inner wall of the middle shell are provided with conductive grid layers, and the upper surface and the lower surface of the middle shell are respectively provided with an air flow channel and a convection hole, characterized in that: The inner cavity of the middle shell is equipped with a shelf, and compression springs are installed on both the left and right sides of the inner wall of the shelf. Each compression spring has a retaining plate at its end. Thermally conductive silicone blocks are installed around the upper surface of the shelf. An interface area is opened at the center of the front end face of the rear end cover. A protective cover plate is attached to the front end face of the interface area. The protective cover plate is slidably connected to the front end face of the rear end cover. Buffer protrusions are inserted and connected around the outer perimeter of both the front end cover and the rear end cover.

2. The heat-dissipating receiver housing according to claim 1, characterized in that: The airflow channel has a honeycomb design, and both the airflow channel and the convection holes are connected to the conductive mesh layer.

3. The heat-dissipating receiver housing according to claim 1, characterized in that: The shelf has a tapered design, and ventilation holes are evenly distributed at the bottom of the inner cavity.

4. The heat-dissipating receiver housing according to claim 1, characterized in that: The front end face of the rear end cover has limit grooves on both sides, and the top of each limit groove is connected to an inlet / outlet groove.

5. The heat-dissipating receiver housing according to claim 4, characterized in that: The protective cover includes a middle cover, and side cover plates are slidably connected to the left and right outer sides of the middle cover. Limit rails are installed on the back of the side cover plates, and the limit rails are slidably connected to the limit grooves and the inlet / outlet grooves.

6. The heat-dissipating receiver housing according to claim 1, characterized in that: The bottom end of the buffer protrusion extends inward through the outer wall of the front and rear covers and is connected to a buffer spring. The ends of the buffer springs are all connected to rubber pads.

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