A shock-resistant light-emitting diode reinforced with a metal ring

Abstract

This utility model discloses a metal ring-reinforced impact-resistant light-emitting diode (LED), belonging to the field of LED technology. It includes an epoxy resin core with a first lead and a second lead extending from its bottom; a metal sleeve enclosing the epoxy resin core; an elastic thermally conductive adhesive layer covering the outer wall of the metal sleeve; a buffer layer attached to the outer wall of the elastic thermally conductive adhesive layer; and a metal ring reinforcement member enclosing the outer wall of the buffer layer. The reinforcement with the external metal ring member improves the lifespan of the LED. The high strength of the metal ring member provides safe protection for the internal epoxy resin, while the internal buffer layer enhances the device's impact resistance, preventing internal gold wire breakage due to external vibration, thereby extending the LED's lifespan.

Description

Technical Field

[0001] This utility model relates to the field of light-emitting diode technology, specifically a metal ring-reinforced impact-resistant light-emitting diode. Background Technology

[0002] Light-emitting diodes, or LEDs for short, are semiconductor devices that can directly convert electrical energy into light energy. Their core principle is the release of photons through the recombination of electrons and holes. They are widely used in the lighting field. LEDs can efficiently convert electrical energy into light energy and have a wide range of applications in modern society, such as lighting, flat panel displays, and medical devices.

[0003] Existing light-emitting diodes (LEDs) are mainly composed of a transparent epoxy resin-encapsulated LED chip and pins. The single epoxy resin encapsulation greatly reduces the diode's impact resistance. When subjected to a large external impact, the gold wire inside the encapsulation may break, causing the LED chip to lose power and reducing its lifespan. At the same time, epoxy resin has low strength and is easily deformed by external collisions and compression during use, which may affect the stability of the internal LED chip connection.

[0004] Therefore, this invention provides an impact-resistant light-emitting diode reinforced with a metal ring to solve the above problems. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] This invention provides an impact-resistant light-emitting diode reinforced with a metal ring, aiming to solve the problems mentioned in the background art.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides the following technical solution: a metal ring-reinforced impact-resistant light-emitting diode, comprising an epoxy resin lamp core, wherein the bottom of the epoxy resin lamp core extends with a first pin and a second pin.

[0009] A metal sleeve is provided, which is wrapped around the epoxy resin lamp core. The outer wall of the metal sleeve is covered with an elastic thermally conductive adhesive layer. A buffer layer is attached to the outer wall of the elastic thermally conductive adhesive layer. A metal ring reinforcement is wrapped around the outer wall of the buffer layer.

[0010] As a preferred technical solution of this application, an insulating ring is fixedly connected through the horizontal end of the metal sleeve, a first heat dissipation fin is fixedly connected to the inner wall of the horizontal end of the metal sleeve, and a second heat dissipation fin is fixedly connected to the outer wall of the horizontal end of the metal sleeve.

[0011] As a preferred technical solution of this application, the two insulating rings are respectively inserted with a first pin and a second pin, the extension height of the insulating ring is greater than the height of the first heat dissipation fin, and the extension height of the insulating ring at both ends of the metal sleeve is the same.

[0012] As a preferred technical solution of this application, the first heat dissipation fin is embedded in the bottom of the epoxy resin lamp core, the first heat dissipation fin and the second heat dissipation fin are distributed in the same position, the distance between adjacent first heat dissipation fins is one millimeter, and the height of the first heat dissipation fin is one and a half millimeters.

[0013] As a preferred technical solution of this application, the metal sleeve, the elastic thermally conductive adhesive layer, the buffer layer and the metal ring reinforcement are of the same height, and the buffer layer is uniformly provided with honeycomb holes around its circumference.

[0014] As a preferred technical solution of this application, a first limiting ring is fixedly welded to the top of the metal ring reinforcement, and a second limiting ring is fixedly welded to the bottom of the metal ring reinforcement. The inner diameter of the second limiting ring is larger than the distribution diameter of the second heat dissipation fins, and the inner diameter of the first limiting ring is between the inner diameter and the outer diameter of the elastic thermally conductive adhesive layer.

[0015] (III) Beneficial Effects

[0016] The beneficial effects of this application are as follows:

[0017] 1. This utility model improves the service life of the diode by strengthening it with an external metal ring reinforcement. The high strength of the metal ring reinforcement provides safe protection for the internal epoxy resin. At the same time, the internal buffer layer improves the impact resistance of the device and prevents the internal gold wire from breaking due to external vibration, thereby improving the service life of the light-emitting diode.

[0018] 2. This utility model, through the cooperation of the first heat dissipation fin and the second heat dissipation fin, can improve the efficient heat dissipation of the epoxy resin encapsulation, avoid its service life under continuous high temperature conditions, and further improve the service life of the light-emitting diode. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present utility model;

[0020] Figure 2 This is a schematic diagram of the axial cross-sectional structure of this utility model;

[0021] Figure 3 For the present utility model Figure 2 A magnified structural diagram of A in the middle;

[0022] Figure 4This is a schematic diagram of the exploded structure of this utility model.

[0023] In the picture:

[0024] 1. Epoxy resin lamp core; 11. First pin; 12. Second pin; 2. Metal sleeve; 21. Insulating ring; 22. First heat dissipation fin; 23. Second heat dissipation fin; 3. Elastic thermally conductive adhesive layer; 4. Buffer layer; 5. Metal ring reinforcement; 51. First limiting ring; 52. Second limiting ring. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] like Figure 1-4 As shown, this utility model provides a metal ring-reinforced impact-resistant light-emitting diode, including an epoxy resin lamp core 1, with a first pin 11 and a second pin 12 extending from the bottom of the epoxy resin lamp core 1; a metal sleeve 2, which wraps around the outside of the epoxy resin lamp core 1, with an elastic thermally conductive adhesive layer 3 wrapped around the outer wall of the metal sleeve 2, a buffer layer 4 attached to the outer wall of the elastic thermally conductive adhesive layer 3, and a metal ring reinforcement 5 wrapped around the outer wall of the buffer layer 4. Through the cooperation of the metal sleeve 2 and the metal ring reinforcement 5, the external strength of the epoxy resin lamp core 1 is greatly improved. At the same time, the elastic thermally conductive adhesive layer 3 and the buffer layer 4 are set between the two to play a good buffering role, thereby preventing the device from being damaged when subjected to external impact. At the same time, the buffer protection of the elastic thermally conductive adhesive layer 3 and the buffer layer 4 prevents the breakage of the gold wire inside the epoxy resin lamp core 1, thereby effectively improving the service life of the device.

[0027] Furthermore, an insulating ring 21 is fixedly inserted through the horizontal end of the metal sleeve 2, a first heat dissipation fin 22 is fixedly connected to the inner wall of the horizontal end of the metal sleeve 2, and a second heat dissipation fin 23 is fixedly connected to the outer wall of the horizontal end of the metal sleeve 2. The insulating ring 21 is used for the insertion protection of the first pin 11 and the second pin 12. At the same time, the insulating material of the insulating ring 21 is used to prevent it from conducting electricity in contact with the metal sleeve 2. The metal sleeve 2, the first heat dissipation fin 22 and the second heat dissipation fin 23 are all made of copper, which can achieve rapid heat conduction and heat dissipation of the epoxy resin lamp core 1 through its high thermal conductivity.

[0028] Furthermore, the first pin 11 and the second pin 12 are respectively inserted into the interior of the two insulating rings 21. The extension height of the insulating rings 21 is greater than the height of the first heat sink fin 22. The extension height of the insulating rings 21 at both ends of the metal sleeve 2 is the same. By setting the extension height of the insulating rings 21, the metal parts at the ends of the first pin 11 and the second pin 12 are prevented from contacting the first heat sink fin 22, thereby improving the convenience of the device packaging and effectively preventing the metal parts from contacting and conducting electricity.

[0029] Furthermore, the first heat dissipation fin 22 is embedded in the bottom of the epoxy resin lamp core 1. The first heat dissipation fin 22 and the second heat dissipation fin 23 are distributed in the same position, and the distance between adjacent first heat dissipation fins 22 is one millimeter. The height of the first heat dissipation fin 22 is one and a half millimeters. Through the distribution and arrangement of the first heat dissipation fins 22 and the second heat dissipation fins 23, the contact area with the outside air can be increased, thereby improving its heat dissipation performance. At the same time, the first heat dissipation fin 22 is embedded in the bottom of the epoxy resin lamp core 1, which increases the contact thermal conduction area between the metal sleeve 2 and the epoxy resin lamp core 1, and can better conduct heat from the bottom, further improving the heat dissipation efficiency of the device and avoiding the reduction of its service life when the device is used at high temperatures.

[0030] Furthermore, the metal sleeve 2, the elastic thermally conductive adhesive layer 3, the buffer layer 4, and the metal ring reinforcement 5 are all at the same height. The buffer layer 4 has honeycomb holes evenly distributed around its circumference. The honeycomb structure of the buffer layer 4 provides a good buffering effect. When the buffer layer 4 is impacted or compressed, its internal hexagonal structure undergoes elastic deformation. This deformation can store some kinetic energy and restore its original shape after the external force is removed, thereby releasing the stored energy. Thus, its buffering performance provides safety protection for the epoxy resin wick 1. The elastic thermally conductive adhesive layer 3 is a silicon-based elastomer containing 30wt% boron nitride. It is filled with vacuum injection to fill the annular cavity between the metal sleeve 2 and the buffer layer 4, forming stress buffering and compensating for thermal expansion differences, further improving its buffering and protective effect.

[0031] Furthermore, a first limiting ring 51 is fixedly welded to the top of the metal ring reinforcement 5, and a second limiting ring 52 is fixedly welded to the bottom of the metal ring reinforcement 5. The inner diameter of the second limiting ring 52 is larger than the distribution diameter of the second heat dissipation fins 23. The inner diameter of the first limiting ring 51 is between the inner and outer diameters of the elastic thermally conductive adhesive layer 3. Through the welding of the first limiting ring 51 and the second limiting ring 52, the metal ring reinforcement 5 can play a good supporting and positioning role. At the same time, the inner wall of the metal ring reinforcement 5 is bonded to the buffer layer 4 with environmentally friendly adhesive, which further improves the installation firmness of the metal ring reinforcement 5. The distribution of the inner diameters of the first limiting ring 51 and the second limiting ring 52 gives it a certain displacement protection effect. When the metal ring reinforcement 5 is subjected to local impact displacement, the first limiting ring 51 and the second limiting ring 52 are prevented from making impact contact with internal components.

[0032] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A metal ring-reinforced impact-resistant light-emitting diode, characterized in that: It includes an epoxy resin lamp core (1), the bottom of which extends a first pin (11) and a second pin (12); A metal sleeve (2) is wrapped around the outside of an epoxy resin lamp core (1). The outer wall of the metal sleeve (2) is wrapped with an elastic thermally conductive adhesive layer (3). The outer wall of the elastic thermally conductive adhesive layer (3) is attached with a buffer layer (4). The outer wall of the buffer layer (4) is wrapped with a metal ring reinforcement member (5).

2. The impact-resistant light-emitting diode reinforced with a metal ring according to claim 1, characterized in that: An insulating ring (21) is fixedly inserted through the horizontal end of the metal sleeve (2), a first heat dissipation fin (22) is fixedly connected to the inner wall of the horizontal end of the metal sleeve (2), and a second heat dissipation fin (23) is fixedly connected to the outer wall of the horizontal end of the metal sleeve (2).

3. The impact-resistant light-emitting diode reinforced with a metal ring according to claim 2, characterized in that: The first pin (11) and the second pin (12) are respectively inserted into the interior of the two insulating rings (21). The extension height of the insulating ring (21) is greater than the height of the first heat dissipation fin (22). The extension height of the insulating ring (21) at both ends of the metal sleeve (2) is the same.

4. The impact-resistant light-emitting diode reinforced with a metal ring according to claim 3, characterized in that: The first heat dissipation fin (22) is fitted to the bottom of the epoxy resin lamp core (1). The first heat dissipation fin (22) and the second heat dissipation fin (23) are distributed in the same position, and the distance between adjacent first heat dissipation fins (22) is one millimeter. The height of the first heat dissipation fin (22) is one and a half millimeters.

5. The impact-resistant light-emitting diode reinforced with a metal ring according to claim 1, characterized in that: The metal sleeve (2), the elastic thermally conductive adhesive layer (3), the buffer layer (4) and the metal ring reinforcement (5) are at the same height, and the buffer layer (4) has honeycomb holes evenly distributed around its circumference.

6. The impact-resistant light-emitting diode reinforced with a metal ring according to claim 5, characterized in that: The top of the metal ring reinforcement (5) is fixedly welded with a first limiting ring (51), and the bottom of the metal ring reinforcement (5) is fixedly welded with a second limiting ring (52). The inner diameter of the second limiting ring (52) is larger than the distribution diameter of the second heat dissipation fins (23), and the inner diameter of the first limiting ring (51) is between the inner diameter and outer diameter of the elastic thermally conductive adhesive layer (3).

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