Front-end loading device and semiconductor processing system

Abstract

The embodiment of the utility model provides a front-end loading device and a semiconductor processing system. The front-end loading device comprises a process equipment shell, first wafer loading equipment and second wafer loading equipment. A process chamber is formed in the process equipment shell, and a butt joint window is formed in a side plate of the process equipment shell; each of the first wafer loading equipment and the second wafer loading equipment is provided with a pick-and-place window, the first wafer loading equipment and the second wafer loading equipment are connected with the process equipment shell in a replaceable manner, and the pick-and-place windows are arranged opposite to the butt joint windows; therefore, the wafer can be transferred between one of the first wafer loading equipment and the second wafer loading equipment and the process chamber through the butt joint window and the pick-and-place window. Therefore, the front-end loading device provided by the embodiment of the utility model has the advantages of reducing the equipment cost and improving the utilization rate of the loading equipment.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a front-end loading device and a semiconductor processing system having the front-end loading device. Background Technology

[0002] In semiconductor manufacturing plants, wafers typically need to be efficiently transferred and positioned between different process modules on the production line. The Equipment Front End Module (EFEM) is a key piece of equipment for accomplishing this task, acting as a bridge between the material handling system and the wafer processing system, enabling accurate transfer of wafers under contamination-free conditions. Loadports for wafer cassettes are installed in front of the wafer processing equipment, working in conjunction with wafer cassette transfer robots and process equipment to achieve wafer loading, unloading, and processing.

[0003] However, due to differences in wafer sizes, the corresponding wafer loading equipment also differs. Related technologies require different models of wafer loading equipment to interface with different process equipment ports. These ports are often not interchangeable, resulting in poor versatility. When processing wafers of different sizes, multiple loading and unloading mechanisms can be arranged side-by-side in front of the wafer process equipment. However, this also increases the footprint of the wafer process equipment, leading to a sharp increase in wafer manufacturing costs. Utility Model Content

[0004] In view of this, the present invention aims to provide a front-end loading device and a semiconductor processing system to solve the problem in the prior art that the front-end loading device has poor versatility and the process equipment has high cost because different wafer loading devices cannot be interchangeably connected to the same process equipment housing.

[0005] This utility model provides a front-end loading device.

[0006] Another aspect of this invention provides a semiconductor processing system.

[0007] The front-end loading device of this utility model embodiment includes a process equipment housing, a first wafer loading device, and a second wafer loading device. A process chamber is formed inside the process equipment housing, and a docking window is provided on the side plate of the process equipment housing. The first wafer loading device and the second wafer loading device are respectively used to load wafers of different sizes. Each of the first wafer loading device and the second wafer loading device has a pick-and-place window. The first wafer loading device and the second wafer loading device are interchangeably connected to the process equipment housing, and the pick-and-place window is positioned opposite the docking window to facilitate the transfer of wafers between one of the first wafer loading device and the second wafer loading device and the process chamber through the docking window and the pick-and-place window.

[0008] The front-end loading device of this utility model interchangeably connects the first wafer loading device and the second wafer loading device to the process equipment housing. When processing wafers of different sizes, wafers of different sizes can be transferred by replacing different wafer loading devices. That is, it is not necessary to increase the size of the process equipment or the number of docking windows; only the wafer loading devices need to be replaced, which helps to improve the overall versatility of the front-end loading device.

[0009] Simultaneously, the first and second wafer loading devices can be interchangeably connected to the process equipment housing, enabling the housing to be compatible with various models of wafer loading devices. This allows the process equipment to handle wafers of various sizes without requiring equipment replacement or complex adjustments. When market demands change, the production line can be quickly adjusted to adapt to new product specifications, reducing downtime and improving responsiveness. A single process equipment unit supporting multiple wafer loading devices means higher utilization. Since one wafer loading device can handle multiple tasks, the need to purchase additional equipment for specific tasks is reduced, thereby lowering construction costs.

[0010] In addition, a unified and standardized interface design helps ensure consistency and reliability for each connection, reducing the risk of operational errors or equipment failures caused by interface incompatibility.

[0011] Therefore, the front-end loading device of this utility model embodiment has the advantages of improving the compatibility between the wafer loading equipment and the process equipment housing and reducing construction costs.

[0012] In one embodiment, both the first wafer loading device and the second wafer loading device include a loading positioning frame, a carrier stage, and a wafer cassette. The wafer cassette is disposed on the carrier stage and is used to stack wafers at intervals along the Z-direction. The loading positioning frame has the pick-and-place window. The loading positioning frame of the first wafer loading device and the loading positioning frame of the second wafer loading device are connected to the process equipment housing. The carrier stage is connected to one side of the loading positioning frame.

[0013] In one embodiment, the housing of the process equipment is provided with a plurality of positioning parts on the wall surface where the docking window is opened, and the loading positioning plate frame of each of the first wafer loading equipment and the second wafer loading equipment is provided with a plurality of mating parts, and the plurality of mating parts and the plurality of positioning parts are connected one-to-one by connectors.

[0014] In one embodiment, the central axis of the pick-and-place window of the first wafer loading device is at the same height as the central axis of the fixed pick-and-place window of the second wafer loading device.

[0015] In one embodiment, the first wafer loading device further includes a door opener disposed on the side of the loading positioning plate frame of the first wafer loading device near the process equipment housing, and the door opener is closably disposed on the pick-and-place window.

[0016] In one embodiment, the wafer cassette includes a housing and a cover that is fastened to the housing. The cover has a lock hole. The door opener includes an opening plate, an unlocking component, a lifting platform, and a suction component. The opening plate can move between a first position and a second position under the drive of the lifting platform. In the first position, the door opener closes the pick-up and put-out window. In the second position, the door opener opens the pick-up and put-out window. The unlocking component passes through the opening plate and can be inserted into the lock hole. The opening plate is provided with the suction component, which is disposed on the side of the opening plate opposite to the wafer cassette. The suction component can fit against the cover.

[0017] In one embodiment, the wafer cassette includes an outer housing and a wafer rack disposed within the outer housing. The second wafer loading device further includes a cover and a drive unit. The outer housing is connected to the upper surface of the cover. The wafer rack is disposed on the support platform. The cover is movable relative to the support platform along the Z-direction. The cover changes between a closed state and an open state under the drive of the drive unit. In the closed state, the cover closes the wafer rack. In the open state, the cover moves upward to expose the wafer rack.

[0018] In one embodiment, the driving element includes a motor and a lead screw. The motor is mounted on the support platform, the lead screw is connected to the output end of the motor, and the cover is driven by the lead screw to drive the cover to move along the Z direction.

[0019] In another embodiment, the drive element includes a cylinder, the output shaft of which is connected to the housing.

[0020] In one embodiment, one of the housing and the support platform has a guide rail, and the other of the housing and the support platform has a guide groove extending in the Z direction, and the guide rail slides in the guide groove in the Z direction.

[0021] The semiconductor processing system of this utility model embodiment includes a transfer robot, a processing device, and a front-end loading device as described above. The transfer robot and the processing device are both disposed in the process chamber, and the transfer robot is capable of picking up and placing wafers between the processing device and one of the first wafer loading device and the second wafer loading device. Attached Figure Description

[0022] Figure 1 This is a layout diagram of the front-end loading device according to an embodiment of the present utility model.

[0023] Figure 2 This is a schematic diagram of the side wall of the process equipment housing according to an embodiment of the present invention.

[0024] Figure 3 This is a perspective view of the first wafer loading device according to an embodiment of the present invention.

[0025] Figure 4 This is a front view of the first wafer loading device according to an embodiment of the present invention.

[0026] Figure 5 This is a rear view of the first wafer loading device according to an embodiment of the present invention.

[0027] Figure 6 yes Figure 5 A cross-sectional view along line AA.

[0028] Figure 7 This is a perspective view of the door opener according to an embodiment of the present utility model.

[0029] Figure 8 This is a perspective view of the second wafer loading device according to an embodiment of the present invention.

[0030] Figure 9 This is a side view of the second wafer loading device according to an embodiment of the present invention.

[0031] Figure 10This is a rear view of the second wafer loading device according to an embodiment of the present invention.

[0032] Explanation of reference numerals in the attached figures:

[0033] Process equipment housing 1; process chamber 11; positioning part 12; docking window 13;

[0034] First wafer loading device 21; door opener 211; box opener 2111; unlocking assembly 2112; lifting platform 2113; adsorption assembly 2114;

[0035] Second wafer loading device 22; housing 221;

[0036] Loading positioning plate frame 201; bearing platform 202;

[0037] Wafer box 203; outer casing 2031; wafer rack 2032;

[0038] Pick-and-place window 204; mating part 205. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0040] The following is for reference. Figures 1-10 The following describes, by way of example, the front-end loading device and semiconductor processing system of this utility model. Here, a wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits.

[0041] The front-end loading device of this utility model embodiment includes a process equipment housing 1, a first wafer loading device 21, and a second wafer loading device 22. A process chamber 11 is formed inside the process equipment housing 1, and a docking window 13 is provided on the side plate of the process equipment housing 1. The first wafer loading device 21 and the second wafer loading device 22 are respectively used to load wafers of different sizes. Each of the first wafer loading device 21 and the second wafer loading device 22 has a pick-and-place window 204. The first wafer loading device 21 and the second wafer loading device 22 are interchangeably connected to the process equipment housing 1, and the pick-and-place window 204 is positioned opposite the docking window 13 to transfer the wafer between one of the first wafer loading device 21 and the second wafer loading device 22 and the process chamber 11 through the docking window 13 and the pick-and-place window 204.

[0042] The front-end loading device of this embodiment connects the first wafer loading device 21 and the second wafer loading device 22 interchangeably to the process equipment housing 1. When processing wafers of different sizes, the device can transfer wafers of different sizes by replacing different wafer loading devices. That is, it does not require increasing the size of the process equipment or the number of docking windows 13; only the wafer loading devices need to be replaced, which helps to improve the overall versatility of the front-end loading device.

[0043] Simultaneously, the first wafer loading device 21 and the second wafer loading device 22 can be interchangeably connected to the process equipment housing 1, enabling compatibility with various models of wafer loading devices. This allows the process equipment to handle wafers of various sizes without requiring replacement of process equipment or complex adjustments. When market demands change, the production line can be quickly adjusted to adapt to new product specifications, reducing downtime and improving response speed. A single process equipment unit supporting multiple wafer loading devices means higher utilization. Since one wafer loading device can handle multiple tasks, the need to purchase additional equipment for specific tasks is reduced, thereby lowering construction costs.

[0044] In addition, a unified and standardized interface design helps ensure consistency and reliability for each connection, reducing the risk of operational errors or equipment failures caused by interface incompatibility.

[0045] Therefore, the front-end loading device of this utility model embodiment has the advantages of improving the compatibility between the wafer loading equipment and the process equipment housing 1 and reducing construction costs.

[0046] Furthermore, there can be multiple first wafer loading devices 21 and second wafer loading devices 22. For example, the first wafer loading device 21 can hold 12-inch wafers, and the second wafer loading device 22 can hold 6-inch, 8-inch, and 12-inch wafers.

[0047] like Figures 3 to 10 As shown, both the first wafer loading device 21 and the second wafer loading device 22 include a loading positioning plate frame 201, a support platform 202, and a wafer box 203. The wafer box 203 is disposed on the support platform 202 and is used to stack wafers at intervals along the Z direction. The loading positioning plate frame 201 has a pick-and-place window 204. The loading positioning plate frame 201 of the first wafer loading device 21 and the loading positioning plate frame 201 of the second wafer loading device 22 are interchangeably connected to the process equipment housing 1 through connectors. The support platform 202 is connected to one side of the loading positioning plate frame 201.

[0048] The front-end loading device of this utility model divides the first wafer loading device 21 and the second wafer loading device 22 into a loading positioning frame 201, a support platform 202, and a wafer box 203. That is, the loading positioning frame 201 of different wafer loading devices is docked with the process equipment housing 1. During production, the size of the loading positioning frame 201 is kept constant, and only the design of the support platform 202 and the wafer box 203 is changed according to different wafers. This helps to reduce the assembly time of the wafer loading device and facilitates the standardized production and processing of the wafer loading device.

[0049] Specifically, the wafer cassette 203 is equipped with a wafer rack 2032 for stacking wafers. Multiple wafers are stacked at intervals along the Z-axis on the wafer rack 2032 to facilitate the handling of wafers in the wafer cassette 203 by a transfer robot. The bottom of the support platform 202 may be equipped with casters to facilitate the replacement of different wafer loading devices.

[0050] like Figure 1 , Figure 2 , Figure 5 and Figure 10 As shown, the process equipment housing 1 has multiple positioning parts 12 on the wall surface where the docking window 13 is opened. Each of the first wafer loading equipment 21 and the second wafer loading equipment 22 has multiple mating parts 205 on the loading positioning plate frame 201. The multiple mating parts 205 and the multiple positioning parts 12 are connected one-to-one by connectors.

[0051] The front-end loading device of this utility model embodiment is matched and connected by multiple positioning parts 12 of the process equipment housing 1 and multiple mating parts 205 of the loading positioning plate frame 201, thereby improving the stability of the connection between the process equipment housing 1 and the corresponding wafer loading device.

[0052] Furthermore, the docking window 13 is roughly rectangular, and multiple positioning parts 12 can be provided on both sides of the width direction of the docking window 13. For example, three positioning holes are provided on both sides of the width direction of the docking window 13, and the loading positioning plate frame 201 of each of the first wafer loading device 21 and the second wafer loading device 22 has three mating holes on both sides of the width direction. The multiple mating holes and the multiple positioning holes are fixed by dropping.

[0053] Furthermore, the central axis of the pick-and-place window 204 of the first wafer loading device 21 is at the same height as the central axis of the fixed pick-and-place window 204 of the second wafer loading device 22. Ensuring the consistency of the central axis height of the pick-and-place windows 204 of different wafer loading devices reduces the need for manual adjustments, making docking simpler and faster. Moreover, it ensures that the central axis can be used as a reference line during each replacement, avoiding cumulative errors caused by multiple docking attempts and guaranteeing docking accuracy.

[0054] The wafer cassette 203 is a storage device used to temporarily store wafers and maintain their sealed state during wafer transfer. The wafer cassette 203 of the first wafer loading device 21 typically includes a side-opening housing, a cover that can be sealed to cover the side opening, and a base plate disposed at the bottom of the housing, with the cover being completely detachable from the housing. Currently, the commonly used wafer cassette 203 is a front-opening unified pod (FOUP).

[0055] Furthermore, the mating portion 205 and pick-and-place window 204 of the first wafer loading device 21 are the same in size and position as the mating portion 205 and pick-and-place window 204 of the second wafer loading device 22. This further avoids the cumulative errors caused by multiple docking operations, improving docking accuracy and efficiency.

[0056] like Figures 3 to 7 As shown, the first wafer loading device 21 also includes a door opener 211, which is disposed on the side of the loading positioning plate frame 201 of the first wafer loading device 21 near the process equipment housing 1. The door opener 211 is closable on the pick-up and drop-off window 204. It can be understood that the door opener 211 can form a barrier between the process chamber 11 and the wafer loading device.

[0057] The front-end loading device of this embodiment of the invention, through the door opener 211, can form an effective physical barrier between the process chamber 11 and the external environment, preventing dust, particulate matter, and other contaminants from entering the high-cleanliness process chamber 11. This helps maintain the required ultra-clean environment within the process chamber 11. Consequently, it helps improve the quality and yield of wafer processing.

[0058] like Figures 3 to 7 As shown, the wafer cassette (not shown) includes a housing and a cover. The housing has a load port on the side facing the loading / unloading window 204. The cover is fastened to the load port and has a lock hole. The door opener 211 includes an opening plate 2111, an unlocking component 2112, a lifting platform 2113, and a suction component 2114. The opening plate 2111 can move between a first position and a second position under the drive of the lifting platform 2113. In the first position, the door opener 211 closes the loading / unloading window 204. In the second position, the door opener 211 opens the loading / unloading window 204. The unlocking component 2112 passes through the opening plate 2111 and can be inserted into the lock hole. The opening plate 2111 is provided with a suction component 2114. The suction component 2114 is located on the side of the opening plate 2111 opposite to the wafer cassette 203 and can fit against the cover.

[0059] The front-end loading device of this embodiment divides the door opener 211 into an opening plate 2111, an unlocking component 2112, a lifting platform 2113, and an adsorption component 2114. Through the cooperation of these components, various types of tasks can be handled collaboratively, reducing the need for specialized equipment and saving equipment costs. Furthermore, it reduces the possibility of wafer contamination and damage caused by human or environmental factors. Consequently, it helps maintain high wafer quality and yield.

[0060] The opening plate 2111 is responsible for opening or closing the channel between the process chamber 11 and the external environment. This effectively isolates the process chamber 11 from the external environment, preventing particulate matter and other contaminants from entering the high-cleanliness process chamber 11. The unlocking assembly 2112 is used to unlock and lock FOUP or other types of wafer carriers. The adsorption assembly 2114 can adsorb the lid, simultaneously opening the lid of the wafer cassette 203 while unlocking.

[0061] Specifically, the box cover has two lock holes. The box opening plate 2111 cooperates with the loading and unloading window 204, and the box opening plate 2111 is located on the rear side of the loading positioning plate frame 201. Two adsorption components 2114 corresponding to the box cover are also fixedly connected to the side of the box opening plate 2111 facing the wafer box 203. Two unlocking components 2112 corresponding to the lock holes are movably connected to the box opening plate 2111. The two unlocking components 2112 are connected by a first driving member. For example, the first driving member can be a cylinder, and part of the side wall of the box can be made of transparent material.

[0062] like Figures 8 to 10 As shown, the wafer cassette 203 includes an outer cover 2031 and a wafer carrier 2032 disposed within the outer cover 2031. The second wafer loading device 22 also includes a housing 221 and a drive unit. The outer cover 2031 is connected to the upper surface of the housing 221. The wafer carrier 2032 is disposed on the support platform 202. The housing 221 is movable relative to the support platform 202 in the Z-direction. Driven by the drive unit, the housing 221 changes between a closed state and an open state. In the closed state, the housing 221 closes the wafer carrier 2032. In the open state, the housing 221 moves upward to expose the wafer carrier 2032. It can be understood that the drive unit drives the outer cover 2031 to move upward in the opening direction, so that the height of the support platform 202 and the wafer carrier 2032 does not change during the opening process, reducing the required range of movement of the transfer robot in the Z-direction, which is beneficial to reducing the cost and adaptability of the transfer robot.

[0063] The front-end loading device of this embodiment, through the cover 221 of the second wafer loading device 22, when the cover 221 descends and covers the wafer rack 2032, acts as a physical barrier to prevent dust, particulate matter, and other contaminants from the external environment from entering the wafer cassette 203, thus helping to maintain a high cleanliness standard in the wafer processing area. Furthermore, the front-end loading device of this embodiment further reduces the scrap rate.

[0064] The driving components include a motor and a lead screw. The motor is mounted on the support platform 202, and the lead screw is connected to the output end of the motor. The cover 221 is driven by the lead screw to move along the Z direction.

[0065] The front-end loading device of this utility model, by dividing the driving components into a motor and a lead screw, and setting a cover 221 on the wafer loading equipment to achieve lifting through the lead screw structure, not only provides a precise and stable operating experience, but also has the advantages of high reliability, high efficiency and energy saving, and good adaptability.

[0066] This utility model is not limited to this. In other embodiments, the driving component includes a cylinder, and the output shaft of the cylinder is connected to the cover 221.

[0067] One of the housing 221 and the support platform 202 has a guide rail, and the other of the housing 221 and the support platform 202 has a guide groove extending in the Z direction, and the guide rail slides in the guide groove in the Z direction.

[0068] The front-end loading device of this embodiment uses a guide groove and guide rail between the cover 221 and the support platform 202 for limiting movement. This effectively restricts the cover 221 to move only along a predetermined path, preventing offset and tilting due to lateral forces and reducing vibration and shaking of the support platform 202. This ensures the consistency and reliability of the transfer robot's operation.

[0069] Optionally, the guide rail can be a cylindrical body or a circular sliding column. There can be multiple guide rails and guide grooves, with multiple guide rails slidingly fitted into the guide grooves in a one-to-one correspondence.

[0070] The semiconductor processing system of this utility model embodiment includes a transfer robot, a processing device, and a front-end loading device according to any one of the above. The transfer robot and the processing device are both disposed in the process chamber 11, and the transfer robot is capable of picking up and placing wafers between one of the first wafer loading device 21 and the second wafer loading device 22 and the processing device.

[0071] Therefore, the semiconductor processing system of this utility model embodiment has the advantages of improving the compatibility between the wafer loading equipment and the process equipment housing 1 and reducing construction costs.

[0072] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications or equivalent substitutions made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

[0073] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0074] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0075] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0076] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0077] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0078] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A front end loader characterized by, include A process equipment housing, wherein a process chamber is formed inside the process equipment housing, and a docking window is provided on the side plate of the process equipment housing; A first wafer loading device and a second wafer loading device are used to load wafers of different sizes, respectively. Each of the first wafer loading device and the second wafer loading device has a pick-and-place window. The first wafer loading device and the second wafer loading device are interchangeably connected to the process equipment housing, and the pick-and-place window is arranged opposite to the docking window so as to transfer the wafer between one of the first wafer loading device and the second wafer loading device and the process chamber through the docking window and the pick-and-place window.

2. The front-end loading device according to claim 1, characterized in that, Both the first wafer loading device and the second wafer loading device include a loading positioning plate frame, a carrier stage, and a wafer cassette. The wafer cassette is disposed on the carrier stage and is used to stack wafers at intervals along the Z-direction. The loading positioning plate frame has the pick-and-place window. The loading positioning plate frame of the first wafer loading device and the loading positioning plate frame of the second wafer loading device are connected to the process equipment housing. The carrier stage is connected to one side of the loading positioning plate frame.

3. The front-end loading device according to claim 2, characterized in that, The housing of the process equipment has multiple positioning parts on the wall surface where the docking window is opened. Each of the first wafer loading equipment and the second wafer loading equipment has multiple mating parts on the loading positioning plate frame. The multiple mating parts and the multiple positioning parts are connected one-to-one by connectors.

4. The front-end loading device according to claim 2, characterized in that, The central axis of the pick-and-place window of the first wafer loading device is at the same height as the central axis of the fixed pick-and-place window of the second wafer loading device.

5. The front-end loading device according to claim 2, characterized in that, The first wafer loading device also includes a door opener, which is disposed on the side of the loading positioning plate frame of the first wafer loading device near the process equipment housing, and the door opener is closable on the pick-up and drop-off window.

6. The front-end loading device according to claim 5, characterized in that, The wafer cassette includes a housing and a lid that is fastened to the housing. The lid has a lock hole. The door opener includes an opening plate, a locking component, a lifting platform, and a suction component. The opening plate can move between a first position and a second position under the drive of the lifting platform. In the first position, the door opener closes the pick-up and drop-off window. In the second position, the opening plate is provided with the suction component, which is located on the side of the opening plate opposite to the wafer cassette. The suction component can fit against the lid. The opening plate opens the pick-up and drop-off window. The locking component passes through the opening plate and can be inserted into the lock hole.

7. The front-end loading device according to claim 2, characterized in that, The wafer cassette includes an outer cover and a wafer rack disposed within the outer cover. The second wafer loading device further includes a housing and a drive unit. The outer cover is connected to the upper surface of the housing. The wafer rack is disposed on the support platform. The housing is movable relative to the support platform along the Z-axis. The housing changes between a closed state and an open state under the drive of the drive unit. In the closed state, the outer cover closes the wafer rack. In the open state, the housing moves upward to expose the wafer rack within the housing.

8. The front-end loading device according to claim 7, characterized in that, The driving component includes a motor and a lead screw. The motor is mounted on the support platform, the lead screw is connected to the output end of the motor, and the cover is driven by the lead screw to drive the cover to move along the Z direction. Alternatively, the driving component may include a cylinder, the output shaft of which is connected to the housing.

9. The front-end loading device according to claim 7, characterized in that, One of the housing and the support platform has a guide rail, and the other of the housing and the support platform has a guide groove extending in the Z direction, and the guide rail slides in the guide groove in the Z direction.

10. A semiconductor processing system, characterized by comprising: The device includes a transfer robot, processing equipment, and a front-end loading device as described in any one of claims 1-9, wherein the transfer robot and the processing equipment are both disposed within the process chamber, and the transfer robot is capable of picking up and placing wafers between one of the first wafer loading equipment and the second wafer loading equipment and the processing equipment.

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