Robots and robotic arms for glass wafers

Abstract

This utility model discloses a robotic arm for glass wafers, comprising: a first pedal with a rounded outer edge, inwardly arranged a first and a second bearing step, and a third bearing step in the middle, the third bearing step cooperating with the second bearing step to bear a glass wafer of a first size; and a fourth bearing step at the base of the first pedal, the fourth bearing step cooperating with the first bearing step to bear a glass wafer of a second size. The first and fourth bearing steps have the same tread height, located at a first height, while the second and third bearing steps have the same tread height, located at a second height, with the first height being higher than the second height. By forming two sets of bearing surfaces at different heights through the bearing steps, a single robotic arm can bear and transport two different sizes of glass wafers, improving the flexibility and efficiency of the production line.

Description

Technical Field

[0001] This utility model relates to the field of glass manufacturing and processing, and in particular to a robotic arm and robot for glass wafers. Background Technology

[0002] In the semiconductor manufacturing and glass processing industries, glass wafers are key materials, and their handling and transportation processes require a high degree of precision and stability.

[0003] Traditional robotic arm designs are often designed to work on glass wafers of a single size, which limits the flexibility and efficiency of the production line. Utility Model Content

[0004] The technical problem to be solved by this utility model embodiment is to provide a robot for glass wafers, so as to improve the versatility and work efficiency of the robot for carrying glass wafers.

[0005] To address the aforementioned technical problems, this utility model provides a robotic arm for glass wafers, the arm body having a stepped structure, comprising:

[0006] The first foot pedal has a rounded outer edge, and inwardly it has a first support step and a second support step, and a third support step in the middle. The third support step cooperates with the second support step to support a glass wafer of the first size. The root of the first foot pedal has a fourth support step, which cooperates with the first support step to support a glass wafer of the second size. The first support step and the fourth support step have the same tread height, which is located at the first height. The second support step and the third support step have the same tread height, which is located at the second height. The first height is higher than the second height.

[0007] The second pedal is integrally connected to the first pedal via a kick plate. Its height is higher than that of the first pedal, and a connector for connecting to an external output shaft is fixed at its base.

[0008] Furthermore, the connector includes:

[0009] A circular base is fixed to the root of the second pedal;

[0010] Locking element, integrally formed with the circular base, includes:

[0011] The fixing part is formed by a partial axial extension of the inner side of the circular base;

[0012] The pressing part is formed by extending circumferentially from the outer side of the annular base of the fixing part, and includes a first pressing member and a second pressing member. The ends of the first pressing member and the second pressing member have gaps, and the first pressing member and the second pressing member are provided with corresponding screw holes.

[0013] Furthermore, the connection between the third and fourth load-bearing steps is a telescopic structure, and a limit fixing component is provided on the telescopic structure.

[0014] Furthermore, the tilt angle of the kick plate corresponding to the third bearing step and the second bearing step matches the circumference of the first-sized glass wafer, and the tilt angle of the kick plate corresponding to the fourth bearing step and the first bearing step matches the circumference of the second-sized glass wafer.

[0015] Furthermore, the first pedal is a hollow frame shape.

[0016] Furthermore, the second pedal and kick plate feature a hollowed-out design.

[0017] Furthermore, it includes a three-axis robotic arm and a robotic hand mounted on the output shaft of the three-axis robotic arm.

[0018] Furthermore, it also includes a limiting ring fixed to the external output shaft to limit the installation height of the locking element.

[0019] Furthermore, the output shaft is a structure that can both rotate and be raised / lowered.

[0020] Furthermore, multiple mounting grooves are formed along the axial direction on the outer surface of the end of the output shaft.

[0021] This utility model embodiment proposes a robotic arm for glass wafers. By sequentially setting a first bearing step, a second bearing step, a third bearing step, and a fourth bearing step on a first pedal, with the first and fourth bearing steps being higher than the second and third bearing steps, it can meet the bearing requirements of two different sizes of glass wafers. This enables a single robotic arm to carry and transport two different sizes of glass wafers, improving the flexibility and efficiency of the production line. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the robotic arm according to an embodiment of this utility model.

[0023] Figure 2 This is a schematic diagram of the structure of the first pedal in an embodiment of this utility model.

[0024] Figure 3 yes Figure 1 A schematic diagram showing the placement of a glass wafer.

[0025] Figure 4 This is a schematic diagram of the overall structure of the robotic arm and robot for glass wafers according to an embodiment of this utility model.

[0026] Figure 5 This is a schematic diagram of the overall structure of the robot for glass wafers according to an embodiment of this utility model.

[0027] Figure 6yes Figure 1 A magnified view of a portion of area A of the robot used for glass wafers.

[0028] Explanation of icon numbers

[0029] Hand 1 First pedal 11 First load-bearing step 111 Second bearing step 112 Third load-bearing step 113 Fourth load-bearing step 114 Second pedal 12 Connector 13 Circular base 131 Locking part 132 Fixing part 1321 Pressure section 1322 Robot 2 Three-axis robotic arm 21 Output shaft 22 Mounting slot 221 Limiting ring 23 Detailed Implementation

[0030] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other. The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] In this embodiment of the invention, directional indicators (such as up, down, left, right, front, back, etc.) are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indicators will also change accordingly.

[0032] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Example 1

[0033] like Figures 1 to 2 As shown, this embodiment provides a robotic arm for glass wafers. The arm body 1 has a stepped structure and includes:

[0034] The first foot pedal 11 has a rounded outer edge, and inwardly it is provided with a first bearing step 111 and a second bearing step 112, and a third bearing step 113 in the middle. The third bearing step 113 cooperates with the second bearing step 112 to support a glass wafer of a first size. The first foot pedal 11 has a fourth bearing step 114 at its base, and the fourth bearing step 114 cooperates with the first bearing step 111 to support a glass wafer of a second size. The first bearing step 111 and the fourth bearing step 114 have the same tread height, which is located at the first height. The second bearing step 112 and the third bearing step 113 have the same tread height, which is located at the second height. The first height is higher than the second height.

[0035] The first footplate 11 is square, and from the edge of the arc edge to the root, a first bearing step 111, a second bearing step 112, a third bearing step 113, and a fourth bearing step 114 are arranged sequentially. The step height of the first bearing step 111 and the second bearing step 112 decreases step by step. The third bearing step 113 is located in the middle part of the first footplate 11, and the fourth bearing step 114 is located at the root. Therefore, the distance between the second bearing step 112 and the third bearing step 113 is small, which facilitates the stable placement of the first-size wafer. The distance between the first bearing step 111 and the fourth bearing step 114 is large, which meets the bearing requirements of the second-size wafer, so that it can be used for both sizes of wafers at the same time. The structure is compact and the operation is convenient.

[0036] The glass wafer can be picked up by inserting the bottom of the first step 11 through the back of the glass wafer. The width of the bearing step is less than 2 mm, so that the circumferential edge of the glass wafer contacts the step surface and the kick plate, which effectively ensures the contact between the suspended part and the equipment, effectively avoids scratches or contamination on the wafer surface, and improves the product yield.

[0037] The second pedal 12 is integrally connected to the first pedal 11 via a kick plate. Its height is higher than that of the first pedal 11, and a connector 13 for connecting to the external output shaft 22 is fixed at its base. By connecting the first pedal 11 and the second pedal 12 at different heights via the kick plate, the robot can pick up and place glass wafers in different equipment or environments, improving operational flexibility and adaptability.

[0038] It should be explained here that the first-size glass wafer and the second-size glass wafer refer to glass wafers with different diameters. For example, the first-size glass wafer is 4 inches and the second-size glass wafer is 6 inches. Of course, other sizes are also possible.

[0039] The robotic arm provided in this embodiment includes a hand body 1 and a connector 13. The hand body has a stepped structure with different bearing steps, enabling it to carry and transport glass wafers of two different sizes. This hand body can adapt to various sizes of glass wafers, completing the handling tasks of different sized glass wafers without replacement, greatly improving work efficiency. Example 2

[0040] This embodiment is a further optimization based on Embodiment 1. For example... Figure 3 As shown, this embodiment also improves the connector 13, which includes:

[0041] The circular base 131 is fixedly mounted at the base of the second pedal 12;

[0042] Locking component 132, integrally formed with the circular base 131, includes:

[0043] The fixing part 1321 is formed by a partial axial extension of the inner side of the annular base 131;

[0044] The pressing part 1322 is formed by circumferentially extending the outer portion of the annular base 131 of the fixing part 1321, and includes a first pressing member and a second pressing member. The ends of the first and second pressing members have gaps, and corresponding screw holes are provided on the first and second pressing members. Specifically, the annular base 131 is fixed to the root of the second pedal 12 by screws. The locking member 132 includes a gap that matches its height. The pressing part 1322 of the locking member 132 is movably disposed on the annular base 131. A first pressing member and a second pressing member are formed around this gap. The first and second pressing members are quarter-circles and do not contact each other. Because they are movable, they can be adjusted within a range relative to the gap position, thereby achieving the locking function.

[0045] In addition, the first and second pressing members are provided with corresponding screw holes, so that the first and second pressing members can be fixed together by passing bolts through the screw holes to prevent the first and second pressing members from shifting. Example 3

[0046] This embodiment is a further optimization based on Embodiment 1. This embodiment also improves the third bearing step 113 and the fourth bearing step 114. The connection between the third bearing step 113 and the fourth bearing step 114 is a telescopic structure, with a limit fixing component on the telescopic structure, adopting the telescopic structure described in paragraph

[20] of patent number CN215190027U. Thus, when it is necessary to grasp a glass wafer, the distance between the third bearing step 113 and the fourth bearing step 114 can be changed by adjusting the telescopic structure, so that the second-sized glass wafer can smoothly fall between the first pedal 11 and the second pedal 12, improving the applicability and flexibility of the robotic arm. Example 4

[0047] This embodiment is a further optimization based on Embodiment 1. For example... Figures 1 to 2 As shown, this embodiment also improves the third bearing step 113 and the fourth bearing step 114. The kick plate tilt angles of the third bearing step 113 and the second bearing step 112 are matched with the circumference of the first-size glass wafer, and the kick plate tilt angles of the fourth bearing step 114 and the first bearing step 111 are matched with the circumference of the second-size glass wafer. This can effectively cope with a certain degree of warping deformation of the wafer during processing, further reduce the contact area between the wafer and the robot, and reduce the risk of scratches on the wafer surface.

[0048] The kick plate of the bearing step is perpendicular to the tread surface. Because the size of the first-size glass wafer is smaller than that of the second-size glass wafer, the tilt angle and size configuration between the first bearing step 111 and the fourth bearing step 114 and the second bearing step 112 and the third bearing step 113 ensure that the outer edge of the glass wafer can be firmly placed on the tread surface and closely fitted with the kick plate, thereby improving the bearing stability and preventing slippage.

[0049] The second and third bearing steps 112 and 113, together with the first and fourth bearing steps 111 and 114, form two sets of concentric bearing surfaces in the first pedal 1, and the radius of the first-sized glass wafer is smaller than that of the second-sized glass wafer. In this way, regardless of the size of the glass wafer being grasped, it can be ensured that the glass wafer lands smoothly on the hand body 1, avoiding shaking or even falling. Example 5

[0050] This embodiment is a further optimization based on Embodiment 1. For example... Figures 1 to 2 As shown, this embodiment also improves the first pedal 11, which is now a hollow frame. This reduces the overall weight of the hand body 1 and facilitates cleaning, preventing the accumulation of contaminants that could affect wafer quality.

[0051] It is worth noting that a stepped surface is provided on the side of the hollow frame structure of the first pedal 11 near the outer edge. The stepped surface extends inward from the first bearing step 111 to form an arc edge that accommodates the circumference of the glass wafer, and is connected to the kick plate of the first bearing step 111 and the second bearing step 112 respectively. Example 6

[0052] This embodiment is a further optimization based on Embodiment 1. For example... Figures 1 to 3 As shown, this embodiment also improves the second pedal 12 and the kick plate. The second pedal 12 and the kick plate adopt a hollow structure design. The second pedal 12 is composed of a tread surface and a pedal that are perpendicular to each other, forming an "L" shaped structure. At the perpendicular intersection of the tread surface and the kick plate, there are hollow areas that extend to the root of the first pedal 11 and the root of the second pedal 12 respectively. The hollow areas are two square vertical L-shaped structures to reduce the overall weight of the hand body 1, and also to facilitate cleaning, which is conducive to improving the working efficiency of the robot. Example 7

[0053] like Figures 4 to 6As shown, this embodiment provides a robot for glass wafers, including a three-axis robotic arm 21 and a robotic hand mounted on the output shaft 22 of the three-axis robotic arm 21 as described in the above embodiment. This robot 2, by precisely controlling the movement of the three-axis robotic arm 21, can achieve movements at different angles, thereby ensuring that the robotic hand can flexibly control the hand body 1 to complete the gripping and placement of glass wafers.

[0054] This embodiment provides a robot for glass wafers, which also includes a limiting ring 23 fixed on an external output shaft 22 to limit the installation height of the locking member 132. The output shaft 22 of the robot 2 is connected to the locking member 132 of the second pedal 12. The limiting ring 23 is provided on the output shaft 22 to prevent the locking member 132 connected to the output shaft 22 from rising excessively and directly contacting the robot 2, causing the locking member 132 to jam.

[0055] This embodiment provides a robot for glass wafers, with an output shaft 22 that is both rotatable and liftable. The robot 2 can not only perform multi-axis linkage, but also achieve more precise positioning and gripping through the rotation of the output shaft 22 in conjunction with the lifting structure, ensuring the stability and reliability of the glass wafers during handling and improving overall work efficiency.

[0056] This embodiment also provides another robot for glass wafers. The outer surface of the end of the output shaft 22 has multiple mounting grooves 221 along the axial direction, so that the output shaft 22 can not only install the locking component 132, but also flexibly adapt to various auxiliary tools such as clamps and sensors according to different needs, further expanding the function and application range of the robot 2, improving the flexibility and adaptability of operation, and ensuring that tasks can be completed efficiently in various complex environments.

[0057] Working principle: First, the robotic arm is preset to the position of the glass wafer. When it is necessary to grasp the first-sized glass wafer, the output shaft 22 is controlled to descend. Through the preset position with the first-sized glass wafer and the rotation adjustment of the output shaft 22 to the corresponding position, the bottom of the first pedal 11 passes through the back of the first-sized glass wafer, thereby locking the first-sized glass wafer between the second support step 112 and the third support step 113. Then, the output shaft 22 drives the entire robotic arm to rise, thereby picking up the first-sized glass wafer from the worktable. When it is necessary to grasp the second-sized glass wafer, the output shaft 22 is similarly controlled to descend. Through the preset position with the second-sized glass wafer, the first pedal 11 passes through the back of the second-sized glass wafer, thereby locking the second-sized glass wafer between the first pedal 11 and the second pedal 12. That is, the second-sized glass wafer will contact the first support step 111 and the fourth support step 114 at both ends of the first pedal 11. Then, the output shaft 22 drives the entire robotic arm to rise, thereby picking up the second-sized glass wafer from the worktable.

[0058] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A robotic arm for glass wafers, characterized in that, The hand (1) has a stepped structure, including: The first foot pedal (11) has a rounded edge on its outer side, and is provided with a first bearing step (111) and a second bearing step (112) in sequence inward. A third bearing step (113) is provided in the middle. The third bearing step (113) cooperates with the second bearing step (112) to support a glass wafer of the first size. A fourth bearing step (114) is provided at the root of the first foot pedal (11). The fourth bearing step (114) cooperates with the first bearing step (111) to support a glass wafer of the second size. The first bearing step (111) and the fourth bearing step (114) have the same tread height and are located at the first height. The second bearing step (112) and the third bearing step (113) have the same tread height and are located at the second height. The first height is higher than the second height. The second pedal (12) is integrally connected to the first pedal (11) via a kick plate. Its height is higher than that of the first pedal (11), and a connector (13) for connecting to the external output shaft is fixed at its base.

2. The robotic arm according to claim 1, characterized in that, The connector (13) includes: A circular base (131) is fixed to the root of the second pedal (12); Locking element (132), integrally formed with the annular base (131), includes: The fixing part (1321) is formed by a partial axial extension of the inner side of the annular base (131); The pressing part (1322) is formed by extending circumferentially from the outer side of the annular base (131) of the fixing part (1321), and includes a first pressing member and a second pressing member. The ends of the first pressing member and the second pressing member have gaps, and corresponding screw holes are provided on the first pressing member and the second pressing member.

3. The robotic arm according to claim 1, characterized in that, The connection between the third bearing step (113) and the fourth bearing step (114) is a telescopic structure, and a limit fixing component is provided on the telescopic structure.

4. The robotic arm according to claim 1, characterized in that, The kick plate tilt angles of the third bearing step (113) and the second bearing step (112) are matched with the circumference of the first-sized glass wafer, and the kick plate tilt angles of the fourth bearing step (114) and the first bearing step (111) are matched with the circumference of the second-sized glass wafer.

5. The robotic arm according to claim 1, characterized in that, The first pedal (11) is a hollow frame.

6. The robotic arm according to claim 1, characterized in that, The second pedal (12) and kick plate adopt a hollow structure design.

7. A robot for glass wafers, characterized in that, It includes a three-axis robotic arm (21) and a robotic hand mounted on the output shaft (22) of the three-axis robotic arm (21) as described in any one of claims 1 to 6.

8. The robot according to claim 7, characterized in that, It also includes a limiting ring (23) fixed on the external output shaft (22) to limit the installation height of the locking element.

9. The robot according to claim 7, characterized in that, The output shaft (22) is a structure that can be both rotated and raised.

10. The robot according to claim 7, characterized in that, Multiple mounting grooves (221) are provided on the outer surface of the end of the output shaft (22) along the axial direction.

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