A chip heat dissipation device and chip packaging structure

Abstract

This invention provides a chip heat dissipation device and a chip packaging structure. The heat dissipation device includes a first heat dissipation cover and a second heat dissipation cover. The first heat dissipation cover has a first surface and a second surface along its thickness direction. The first surface of the first heat dissipation cover is provided with a fixing groove for accommodating the chip. The second surface of the first heat dissipation cover is provided with a receiving groove for accommodating liquid metal, and the receiving groove corresponds to the fixing groove. The second heat dissipation cover is disposed on the second surface of the first heat dissipation cover and sealably covers the receiving groove. The chip heat dissipation device of this invention solves the leakage problem of liquid metal in FCBGA and FCLGA applications, improving the heat dissipation effect. In addition, the first heat dissipation cover can completely replace the passive component protection cover, improving the reliability of the product.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor packaging technology, specifically relating to a chip heat dissipation device and a chip packaging structure. Background Technology

[0002] With the widespread adoption of high-performance computing devices such as gaming laptops, servers, and high-end PCs, traditional cooling solutions like TIM (Thermal Insulation) or indium foil (IU) have become increasingly limited. Liquid metal thermal conductive materials, due to their high thermal conductivity, low coefficient of thermal expansion, and low thermal resistance, have emerged as a highly competitive cooling solution. However, they also face the risk of leakage. Liquid metal leakage reduces cooling efficiency, and if it flows through the passive component protection cover onto the passive components, it can cause electrical failure of the entire product. Therefore, despite its advantages, the fatal leakage risk of liquid metal has severely hindered its application in FCBGA and FCLGA systems.

[0003] To address the aforementioned issues, it is necessary to propose a chip heat dissipation device and chip packaging structure that is reasonably designed and effectively solves these problems. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and to provide a chip heat sink device and a chip packaging structure.

[0005] One aspect of this utility model provides a chip heat dissipation device, comprising:

[0006] A first heat sink, the first heat sink having a first surface and a second surface along its thickness direction; wherein...

[0007] The first surface of the first heat sink cover is provided with a fixing groove for accommodating the chip; the second surface of the first heat sink cover is provided with a receiving groove for accommodating liquid metal, the receiving groove corresponding to the fixing groove;

[0008] The second heat dissipation cover is disposed on the second surface of the first heat dissipation cover and is sealed over the receiving groove.

[0009] Optionally, the second heat sink cover has a boss corresponding to the receiving groove on the side facing the first heat sink cover, and the boss is sealed and inserted into the receiving groove.

[0010] Optionally, the device further includes a first adhesive layer;

[0011] The first adhesive layer is disposed between the inner sidewall of the fixing groove and the outer sidewall of the chip to fix the chip to the fixing groove.

[0012] Optionally, the top wall of the fixing groove abuts against the top wall of the chip.

[0013] Optionally, the device further includes a second adhesive layer;

[0014] The edge region of the second heat sink is fixed to the edge region of the first heat sink by the second adhesive layer.

[0015] Optionally, the receiving groove is formed by protruding from the second surface of the first heat sink towards the second heat sink.

[0016] Optionally, the fixing groove is formed by recessing from the first surface of the first heat sink towards its second surface.

[0017] Another aspect of this utility model provides a chip packaging structure, comprising:

[0018] substrate;

[0019] The chip is flip-chip mounted on the substrate;

[0020] A first heat sink, the edge region of which is fixed to the substrate; wherein...

[0021] The first heat sink has a first surface and a second surface along its thickness direction. The first surface of the first heat sink is provided with a fixing groove for accommodating the chip, and the second surface of the first heat sink is provided with a receiving groove corresponding to the fixing groove.

[0022] Liquid metal is disposed in the receiving tank;

[0023] The second heat dissipation cover is disposed on the second surface of the first heat dissipation cover and is sealed over the receiving groove.

[0024] Optionally, the second heat sink cover has a boss corresponding to the receiving groove on the side facing the first heat sink cover, and the boss is sealed and inserted into the receiving groove.

[0025] Optionally, the chip may also include a plurality of passive components, which are disposed around the outside of the chip and fixed to the substrate; wherein,

[0026] The first heat sink cover is reused as a passive component protection cover.

[0027] This invention discloses a chip heat sink device and a chip packaging structure. The chip heat sink device includes a first heat sink cover and a second heat sink cover. A first surface of the first heat sink cover has a fixing groove for accommodating the chip, and a second surface of the first heat sink cover has a receiving groove for accommodating liquid metal, the receiving groove corresponding to the fixing groove. The second heat sink cover is disposed on the second surface of the first heat sink cover and sealably covers the receiving groove. This chip heat sink device solves the leakage problem of liquid metal in FCBGA and FCLGA applications, improving heat dissipation. Furthermore, the first heat sink cover can completely replace the passive component protection cover, improving product reliability. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the packaging structure of a chip heat dissipation device according to an embodiment of the present invention. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] like Figure 1 As shown, the first aspect of this utility model provides a chip heat dissipation device, including a first heat dissipation cover 110 and a second heat dissipation cover 120.

[0031] The first heat sink 110 has a first surface and a second surface along its thickness direction; wherein, the first surface of the first heat sink 110 is provided with a fixing groove 111 for accommodating a chip; the second surface of the first heat sink 110 is provided with a receiving groove 112 for accommodating liquid metal, the receiving groove 112 corresponding to the fixing groove 111.

[0032] Among them. For example, Figure 1 As shown, in this embodiment, both the fixing groove 111 and the receiving groove 112 are located in the central region of the first heat dissipation cover 110. The liquid metal level in the receiving groove 112 is 85% of the height of the receiving groove 112 and cannot exceed the height of the receiving groove 112.

[0033] The second heat dissipation cover 120 is disposed on the second surface of the first heat dissipation cover 110 and is sealed over the receiving groove 112 to prevent leakage of liquid metal in the receiving groove 112.

[0034] This invention relates to a chip heat sink device, comprising a first heat sink cover and a second heat sink cover. The first heat sink cover has a first surface with a fixing groove for accommodating a chip, and a second surface with a receiving groove for accommodating liquid metal, the receiving groove corresponding to the fixing groove. The second heat sink cover is disposed on the second surface of the first heat sink cover and sealably covers the receiving groove. This invention solves the leakage problem of liquid metal in FCBGA and FCLGA applications, improving heat dissipation. Furthermore, the first heat sink cover can completely replace the protective cover for passive components, improving product reliability.

[0035] For example, such as Figure 1 As shown, the second heat sink 120 has a boss 121 corresponding to the receiving groove 112 on the side facing the first heat sink 110. The boss 121 is sealed and inserted into the receiving groove 112. Due to the tension of the liquid metal in the receiving groove 112, the boss 121 is tightly connected to the receiving groove 112, thereby sealing the liquid metal and preventing leakage of the liquid metal.

[0036] For example, such as Figure 1 As shown, the device also includes a first adhesive layer 130, which is disposed between the inner sidewall of the fixing groove 111 and the outer sidewall of the chip 220 to fix the chip 220 to the fixing groove 111.

[0037] For example, such as Figure 1 As shown, the top wall of the fixing groove 111 abuts against the top wall of the chip 220, eliminating the need for an adhesive layer on the top wall of the chip 220, thus achieving better heat dissipation of the chip.

[0038] For example, such as Figure 1 As shown, the device also includes a second adhesive layer 140, and the edge region of the second heat dissipation cover 120 is fixed to the edge region of the first heat dissipation cover 110 by the second adhesive layer 140.

[0039] For example, such as Figure 1 As shown, in this embodiment, the receiving groove 112 protrudes from the second surface of the first heat sink 110 toward the second heat sink 120. That is, the groove wall of the receiving groove 112 protrudes from the second surface of the first heat sink 110.

[0040] For example, such as Figure 1 As shown, the fixing groove 111 is recessed from the first surface of the first heat dissipation cover 110 toward its second surface.

[0041] In this embodiment, the thickness of the first heat sink 110 at the corresponding receiving groove 112 (fixed groove 111) is less than the thickness at other locations, which can better achieve heat dissipation of the chip.

[0042] like Figure 1 As shown, another aspect of this utility model provides a chip packaging structure, including a substrate 210, a chip 220, a first heat sink 110, a second heat sink 120, and liquid metal 230.

[0043] Chip 220 is flip-chip mounted on substrate 210.

[0044] The edge region of the first heat sink 110 is fixed to the substrate 210; wherein, the first heat sink 110 has a first surface and a second surface along its thickness direction, the first surface of the first heat sink 110 is provided with a fixing groove 111 for accommodating the chip 220, and the second surface of the first heat sink 110 is provided with a receiving groove 112 corresponding to the fixing groove 111.

[0045] Liquid metal 230 is disposed in the receiving tank 112.

[0046] The second heat dissipation cover 120 is disposed on the second surface of the first heat dissipation cover 110 and is sealed over the receiving groove 112 to prevent leakage of liquid metal in the receiving groove 112.

[0047] For example, such as Figure 1 As shown, the second heat sink 120 has a boss 121 corresponding to the receiving groove 112 on the side facing the first heat sink 110, and the boss 121 is sealed and inserted into the receiving groove 112.

[0048] For example, such as Figure 1 As shown, the chip packaging structure also includes multiple passive components 240, which surround the outside of the chip 220 and are fixed to the substrate 210; wherein, the first heat dissipation cover 110 is reused as a passive component protective cover, which protects the passive component 240.

[0049] In this embodiment, as Figure 1 As shown, the packaging process of the chip packaging structure can be as follows:

[0050] 1) Chip 220 is flip-chip disposed in the central region of substrate 210, and passive component 240 is disposed on the outside of chip 220 and connected to substrate 210.

[0051] 2) The edge region of the first heat sink 110 is fixed to the substrate 210 using adhesive 250, thereby achieving interconnection between the first heat sink 110 and the substrate 210. The chip 220 is disposed in the fixing groove 111 on the first surface of the first heat sink 110, and the sidewall of the chip 220 is fixed to the inner sidewall of the fixing groove 111 by the first adhesive layer 130. The first heat sink 110 also serves as a passive component protection cover, protecting the passive component 240.

[0052] 3) Inject an appropriate amount of liquid metal 230 into the receiving tank 112, wherein the liquid level of the liquid metal 230 is 85% of the height of the receiving tank 112 and shall not exceed the height of the receiving tank 112.

[0053] 4) The edge area of ​​the second heat sink 120 is fixed to the edge area of ​​the first heat sink 110 through the second adhesive layer 140, and the protrusion 121 of the second heat sink 120 is inserted into the receiving groove 112. Due to the influence of the tension of the liquid metal in the receiving groove 112, the protrusion 121 and the receiving groove 112 are tightly connected to achieve the sealing of the liquid metal, thereby preventing the leakage of liquid metal.

[0054] 5) Balls are placed on the surface of the substrate 210 away from the chip 220 to form multiple solder balls 260, so as to complete the packaging of the chip packaging structure.

[0055] The chip packaging structure of this utility model solves the leakage problem of liquid metal in FCBGA and FCLGA by adopting a first heat sink and a second heat sink, thereby improving the chip heat dissipation effect. In addition, the first heat sink can completely replace the passive component protection cover, improving the reliability of the product.

[0056] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A chip heat dissipating device, characterized by comprising: include: A first heat sink, the first heat sink having a first surface and a second surface along its thickness direction; wherein... The first surface of the first heat sink cover is provided with a fixing groove for accommodating the chip; the second surface of the first heat sink cover is provided with a receiving groove for accommodating liquid metal, the receiving groove corresponding to the fixing groove; The second heat dissipation cover is disposed on the second surface of the first heat dissipation cover and is sealed over the receiving groove; wherein the receiving groove is formed by protruding from the second surface of the first heat dissipation cover toward the second heat dissipation cover. The device further includes a first adhesive layer; The first adhesive layer is disposed between the inner sidewall of the fixing groove and the outer sidewall of the chip to fix the chip to the fixing groove.

2. The chip heat dissipation device according to claim 1, characterized in that, The second heat sink cover has a boss on the side facing the first heat sink cover that corresponds to the receiving groove, and the boss is sealed and inserted into the receiving groove.

3. The chip heat dissipation device according to claim 1, characterized in that, The top wall of the fixing groove abuts against the top wall of the chip.

4. The chip heat dissipation device according to any one of claims 1 to 3, characterized in that, The device further includes a second adhesive layer; The edge region of the second heat sink is fixed to the edge region of the first heat sink by the second adhesive layer.

5. The chip heat dissipation device according to any one of claims 1 to 3, characterized in that, The fixing groove is formed by recessing from the first surface of the first heat sink towards its second surface.

6. A chip packaging structure, characterized in that, The chip heat dissipation device according to any one of claims 1 to 5, wherein the chip packaging structure comprises: substrate; The chip is flip-chip mounted on the substrate; A first heat sink, the edge region of which is fixed to the substrate; wherein... The first heat sink has a first surface and a second surface along its thickness direction. The first surface of the first heat sink is provided with a fixing groove for accommodating the chip, and the second surface of the first heat sink is provided with a receiving groove corresponding to the fixing groove. Liquid metal is disposed in the receiving tank; The second heat dissipation cover is disposed on the second surface of the first heat dissipation cover and is sealed over the receiving groove.

7. The chip packaging structure according to claim 6, characterized in that, The second heat sink cover has a boss on the side facing the first heat sink cover that corresponds to the receiving groove, and the boss is sealed and inserted into the receiving groove.

8. The chip packaging structure according to claim 6, characterized in that, It also includes multiple passive components, which surround the outside of the chip and are fixed to the substrate; wherein, The first heat sink cover is reused as a passive component protection cover.

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