A packaging substrate, a combination board, and electronic devices

Abstract

This utility model relates to the field of electronic packaging technology, and discloses a packaging base, a combination board, and an electronic device. The packaging base includes an insulating substrate, which includes a base and a frame. The base has a first surface, and the frame has a second surface. The outer side wall of the base is connected to the outer side wall of the frame to form an outer side surface. The first surface and / or the second surface are connected to the outer side surface through a dividing bevel. An annular metal layer is included. One end of a first wiring is connected to the annular metal layer, and the other end extends to the outer side surface to form a first exposed portion, which is located away from the dividing bevel. The beneficial effects of this utility model are: it maintains the continuity of the electroplated wiring structure between adjacent packaging bases within the packaging base combination board, and avoids the electroplated wiring structure from being exposed on the surface of the dividing groove, as well as the adhesion of the electroplated wiring between adjacent packaging bases during the electroplating process. It facilitates the division of individual packaging bases, improves production efficiency, and simplifies the electroplated wiring structure, thereby reducing production costs.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging technology, and in particular to a packaging base, a combination board, and an electronic device. Background Technology

[0002] Packaging substrates are commonly used to encapsulate electronic components such as quartz crystals and semiconductor chips. The encapsulated components (such as semiconductor devices, temperature compensated oscillators (TCXO), tuning fork resonators, thermistor resonators, automotive components, general-purpose oscillators (OSC), pressure compensated oscillators (VCXO), etc.) are widely used in a wide variety of electronic devices.

[0003] The packaging substrate is typically fabricated on a large-size insulating substrate to obtain a packaging substrate assembly board composed of multiple packaging substrates. The conductive patterns on adjacent packaging substrates are connected by electroplated wiring structures on the packaging substrate assembly board to achieve electroplating of all packaging substrates. After electroplating, the assembly board can be divided into individual packaging substrates using pre-set dividing slots on the packaging substrate assembly board.

[0004] However, in current electroplated wiring structures, when connecting adjacent package bases, some of the electroplated wiring structure is exposed on the surface of the dividing groove. This causes the electroplated wiring of adjacent package bases to stick together in the area exposed on the surface of the dividing groove during the electroplating process. This makes it difficult to divide the composite board into individual package bases, reducing production efficiency. In addition, the structure of electroplated wiring is relatively complex, resulting in higher production costs. Utility Model Content

[0005] The purpose of this utility model is to provide a packaging base, a combination board, and electronic devices. Within the packaging base combination board, the electroplated wiring structure of adjacent packaging bases is kept conductive, and the electroplated wiring structure is prevented from being exposed on the surface of the dividing groove. Furthermore, the electroplated wiring of adjacent packaging bases does not stick together during the electroplating process, making it easier to divide individual packaging bases, improving production efficiency, and simplifying the electroplated wiring structure to reduce production costs.

[0006] To achieve the above objectives, this utility model provides a packaging base, including...

[0007] An insulating substrate includes a base and a frame. The bottom of the base has a first surface, and the top of the frame has a second surface. The outer side wall of the base is connected to the outer side wall of the frame to form an outer side surface. The base and the frame are plate-like structures, and the frame is an annular structure. The base and the frame together form a cavity. The first surface and / or the second surface are connected to the outer side surface by a dividing bevel.

[0008] An annular metal layer is located on the second surface and surrounds the cavity;

[0009] A first wiring is provided inside the frame portion. One end of the first wiring is connected to the annular metal layer, and the other end extends to the outer side to form a first exposed portion. The first exposed portion is disposed away from the dividing slope.

[0010] Furthermore, the first wiring is in the form of a strip structure, extending from one end connected to the annular metal layer to the first exposed portion, and the distance between the first wiring and the annular metal layer gradually increases in the first direction.

[0011] Furthermore, the length of the insulating substrate in the first direction is T, and the minimum distance between the first exposed portion and the second surface is D1, where 0.1 ≤ D1 / T ≤ 0.5.

[0012] Furthermore, the length of the frame in the second direction is W, and the minimum distance between the end of the first wiring connected to the annular metal layer and the outer side surface is D2, where 0.5 ≤ D2 / W ≤ 0.8.

[0013] Furthermore, it also includes a second wiring, one end of which is located in the frame portion and connected to the annular metal layer, and the other end of which extends to the base portion.

[0014] Furthermore, one end of the first wiring is connected to the annular metal layer and the end of the second wiring located in the frame.

[0015] Furthermore, it also includes a plurality of external connection terminals, which are disposed on the first surface, and the second wiring is connected to one of the external terminals at one end of the base through a through-hole conductor.

[0016] Furthermore, the insulating substrate includes a first corner region and a third corner region arranged diagonally, as well as a second corner region and a fourth corner region arranged diagonally. The first corner region is provided with the first wiring, and the second corner region is provided with the third wiring. One end of the third wiring is located inside the frame portion, and the other end extends to the outer side surface to form a second exposed portion. The second exposed portion is disposed away from the dividing slope, and the third wiring is insulated from the annular metal layer.

[0017] This utility model also provides a packaging base assembly plate, which is composed of a plurality of packaging bases as described in any one of the above claims, wherein the dividing bevels disposed opposite to each other on adjacent packaging bases cooperate to form intersecting dividing grooves in a second direction and a third direction, wherein the second direction intersects the third direction perpendicularly;

[0018] The first wiring is provided on the edge area of ​​the packaging base, and the first wiring is electrically connected to each other between adjacent edges of the packaging base;

[0019] Alternatively, the first wiring is provided in the first corner region and the third corner region of the packaging base, and the third wiring is provided in the second corner region of the packaging base. The first wirings of the diagonally adjacent packaging bases are electrically connected through the third wirings of the side-adjacent packaging bases.

[0020] This utility model also provides an electronic device, including the packaging base described in any of the above claims, further including electronic components disposed in the cavity, and a cover plate sealing the cavity.

[0021] Compared with the prior art, the present invention, which discloses a packaging base, a combination board, and electronic devices, has the following advantages: one end of the first wiring is connected to the annular metal layer, and the other end extends to the outer surface to form a first exposed portion. By setting the first exposed portion, the first wiring is electrically connected between adjacent packaging bases in the combination board composed of multiple packaging bases, thereby realizing the electroplating conductive connection of the annular metal layers on each packaging base in the combination board. In addition, the first exposed portion is set away from the dividing slope, that is, the first wiring will not be exposed on the surface of the dividing groove, avoiding the adhesion of electroplated wiring of adjacent packaging bases during the electroplating process, facilitating the division of individual packaging bases, improving production efficiency, and at the same time, the first wiring structure is simple, simplifying the electroplating wiring structure and reducing production costs. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the packaging base according to an embodiment of the present invention;

[0023] Figure 2 This is a perspective view of the packaging base according to an embodiment of the present utility model;

[0024] Figure 3 This is a schematic diagram of the conductive pattern of the packaging base according to an embodiment of the present invention;

[0025] Figure 4 This is a top view of the packaging base according to an embodiment of the present invention;

[0026] Figure 5 This is a top-view perspective view of the packaging base according to an embodiment of the present utility model;

[0027] Figure 6 This is the book Figure 5 Sectional view at point BB;

[0028] Figure 7 This is a front view of the packaging base according to an embodiment of the present invention;

[0029] Figure 8 This is a partial structural schematic diagram of the packaging base assembly plate according to an embodiment of the present utility model;

[0030] Figure 9 This is a schematic diagram of the conductive pattern of the encapsulation base assembly plate according to an embodiment of the present utility model;

[0031] Figure 10 This is a top perspective view of the packaging base assembly plate according to an embodiment of the present utility model;

[0032] Figure 11 yes Figure 10 Sectional view at CC;

[0033] Figure 12 yes Figure 10 Sectional view at point DD;

[0034] Figure 13 yes Figure 10 Sectional view at EE.

[0035] In the figure, 1 is an insulating substrate; 100 is an outer surface; 101 is a cavity; 102 is a dividing bevel; 103 is a first corner region; 104 is a second corner region; 105 is a third corner region; 106 is a fourth corner region; 11 is a base; 111 is a first surface; 12 is a frame; 121 is a second surface; 2 is an annular metal layer; 3 is a first wiring; 31 is a first exposed portion; 4 is a second wiring; 5 is an external connection terminal; 6 is a through-hole conductor; 7 is a third wiring; 71 is a second exposed portion; 8 is a fourth wiring; 81 is a third exposed portion; 9 is an electrode pad; a is a dividing groove; X is a first direction; Y is a second direction; Z is a third direction. Detailed Implementation

[0036] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0037] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer" and other terms used in this utility model to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device and element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0038] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.

[0039] like Figures 1 to 13 As shown, a preferred embodiment of the present invention provides a packaging base comprising an insulating substrate 1, an annular metal layer 2, and a first wiring 3. For ease of explanation, the thickness direction of the insulating substrate 1 is defined as the first direction X, the length direction as the second direction Y, and the width direction as the third direction Z. The insulating substrate 1 includes a base 11 and a frame 12. The bottom of the base 11 has a first surface 111, and the top of the frame 12 has a second surface 121. The outer walls of the base 11 and the frame 12 are connected to form an outer surface 100. The base 11 has a plate-like structure, and the frame has an annular structure. The base 11 and the frame 12 together form a cavity 101 for placing electronic components. The first surface 111 and / or the second surface 121 are connected to the outer surface 100 via a dividing bevel 102. The annular metal layer 2 is located on the second surface 121 and surrounds the cavity 101.

[0040] In the package substrate assembly board, to ensure the continuity of the electroplated wiring structure between the package substrates, a first wiring 3 is disposed within the frame portion 12. One end of the first wiring 3 is connected to the annular metal layer 2, and the other end extends to the outer surface 100 to form a first exposed portion 31. The first exposed portion 31 is positioned away from the dividing slope 102. That is, the opposing first exposed portions 31 of adjacent package substrates are connected, making the annular metal layers 2 on multiple package substrates in the assembly board electrically connected, thereby achieving continuity of the electroplated wiring between multiple package substrates. The dividing slope 102 is part of the surface of the dividing groove a. The first exposed portion 31 of the first wiring 3 is positioned away from the dividing slope 102 to prevent adjacent package substrates from sticking together during the electroplating process, thus improving production efficiency. At the same time, the structure of the first wiring 3 is relatively simple, simplifying the electroplated wiring structure between package substrates and reducing production costs.

[0041] Furthermore, to facilitate the design of the structure of the first wiring 3 and improve its stress resistance, the first wiring 3 is a strip-shaped structure. The distance between the first wiring 3 and the annular metal layer 2 gradually increases in the first direction X from the end connected to the annular metal layer 2 to the first exposed portion 31. When the packaging base is subjected to external force, the stress transmitted to the first wiring 3 can be dispersed, avoiding stress concentration that could damage the first wiring 3 and improving the stability of the packaging base structure. Furthermore, to facilitate a smooth transition during the extension of the first wiring 3 and further improve the stability of the first wiring 3 structure, such as... Figure 6 As shown, the extension path of the first wiring 3 in the first direction X is a smooth arc.

[0042] Furthermore, in some embodiments, to facilitate the reasonable setting of the dimensions of the first wiring 3 and the insulating substrate 1, and to reduce the difficulty of fabricating the packaging base, in some embodiments, see [reference needed]. Figure 7 The length of the insulating substrate 1 in the first direction X is T, and the minimum distance between the first exposed portion 31 and the second surface 121 is D1, where 0.1 ≤ D1 / T ≤ 0.5. If D1 / T < 0.1, the distance between the first exposed portion 31 and the second surface 121 is small. In order to prevent the first wiring 3 from being exposed on the dividing slope 102, the depth of the dividing groove a needs to be reduced, which is not conducive to quickly dividing the packaging base assembly board into individual packaging bases. If D1 / T > 0.5, the distance between the first exposed portion 31 and the second surface 121 is large, the size of the first wiring 3 changes significantly, and the manufacturing difficulty of the packaging base increases. Therefore, in this embodiment, preferably, D1 / T = 0.3.

[0043] Furthermore, to ensure sufficient contact between the first wiring 3 and the annular metal layer 2, and to prevent cracking of the encapsulation base due to insufficient insulation volume between the first wiring 3 and the outer surface 100 or the inner wall of the cavity 101, in some embodiments, see [reference needed]. Figure 4 , Figure 6The frame portion 12 has a length of W in the second direction Y. The minimum distance between the end of the first wiring 3 connected to the annular metal layer 2 and the outer surface 100 is D2, where 0.5 ≤ D2 / W ≤ 0.8. Preferably, in this embodiment, D2 / W = 0.6, and the parameter value of D2 / W can be adaptively adjusted according to actual design requirements. Furthermore, in order to facilitate the conduction between the annular metal layer 2 and the conductive layer structure inside the insulating substrate 1, the packaging base of this utility model also includes a second wiring 4, wherein one end of the second wiring 4 is located in the frame portion 12 and connected to the annular metal layer 2, and the other end of the second wiring 4 extends to the base portion 11. Furthermore, one end of the first wiring 3 is connected to the annular metal layer 2, and the second wiring 4 is located at one end of the frame portion 12. When the first wiring 3 and the second wiring 4 are connected to the annular metal layer 2, two connection points are generated. However, increasing the number of connection points will lead to uneven resistance distribution of the electroplated wiring, which can easily result in poor plating uniformity during the electroplating process of the composite board. At the same time, parasitic capacitance may also be generated between the first wiring 3 and the second wiring 4, causing signal interference in the packaging base during actual application. Therefore, in this utility model, the end of the first wiring 3 connected to the annular metal layer 2 is connected to the end of the second wiring 4 connected to the annular metal layer 2, forming only one connection point. This reduces the number of connection points, improves the resistance uniformity of the electroplated wiring, improves the current uniformity, and thus ensures the thickness uniformity of the composite board during the electroplating process. At the same time, it avoids the generation of parasitic capacitance between the first wiring 3 and the second wiring 4, reducing signal interference generated in the actual application of the packaging base.

[0044] Furthermore, to facilitate the connection between the package base and external electronic devices, multiple external connection terminals 5 are also included, participating in... Figures 1 to 8 Multiple external connection terminals 5 are disposed on the first surface 111, and the second wiring 4 is located at one end of the base 11 and connected to an external terminal through a through-hole conductor 6. To facilitate connection between the external connection terminals 5 of adjacent package bases, a fourth wiring 8 is also included, see [reference]. Figure 2 , Figure 3One end of the fourth wiring 8 is located at the base 11 and electrically connected to the external connection terminal 5, while the other end extends to the outer surface 100 to form a third exposed portion 81. This allows for the electrical connection of fourth wiring 8 between adjacent package bases in the composite board composed of multiple package bases, thereby achieving electroplated conductive connection of the external connection terminals 5 on each package base in the composite board. In this embodiment, one external connection terminal 5 corresponds to two fourth wiring 8, and the third exposed portions 81 of the two fourth wiring 8 are exposed on adjacent outer surfaces 100, respectively. The number of fourth wiring 8 and the position of the third exposed portions 81 can be adjusted according to the actual design. Furthermore, to facilitate communication between the electronic components inside the cavity 101 and the external connection terminals, multiple electrode pads 9 are also included. Each electrode pad 9 is electrically connected to an external connection terminal 5 through a through-hole conductor 6.

[0045] Furthermore, to facilitate the rational arrangement of the wiring structure on the packaging substrate, and to ensure the stability of the conduction of the electroplated wiring structure of adjacent packaging substrates, in this embodiment, the insulating substrate 1 has a cuboid structure, see reference. Figure 1 , Figure 2 , Figure 4 The insulating substrate 1 includes a first corner region 103 and a third corner region 105 arranged diagonally, and a second corner region 104 and a fourth corner region 106 arranged diagonally. An edge region is formed between adjacent corner regions. A first wiring 3 is provided in the first corner region 103, and a third wiring 7 is provided in the second corner region 104. One end of the third wiring 7 is located inside the frame portion 12, and the other end extends to the outer surface 100 to form a second exposed portion 71. The second exposed portion 71 is disposed away from the inclined surface of the dividing groove a. The third wiring 7 is insulated from the annular metal layer 2. (See reference...) Figures 8 to 13 Since the first wiring 3 is located in the corner area of ​​the packaging base, the first wiring 3 of diagonally adjacent packaging bases are connected by a point or line, which has a large resistance. Therefore, by using the third wiring 7, the first wiring 3 of diagonally adjacent packaging bases can be electrically connected through the third wiring 7 of the side-adjacent packaging bases, which can reduce the resistance when the first wiring 3 of diagonally adjacent packaging bases are connected and improve the stability of the conduction of the electroplated wiring structure inside the packaging base assembly board.

[0046] To facilitate understanding, the definitions of diagonally adjacent and side-adjacent are explained below. Figure 10Diagonally adjacent means that the corner areas of two package bases are located on the same diagonal line when viewed from above. For example, package base A1 and package base A3 are diagonally adjacent, and package base A2 and package base A4 are also diagonally adjacent. Edge adjacent means that two package bases share a common edge in the length or width direction, and the dividing bevels of the edge-adjacent package bases can cooperate to form a dividing groove. For example, package bases A1 and A2, package base A2 and A3, package base A3 and A4, and package base A1 and A4 are all edge-adjacent. In this invention, the wiring structure refers to all conductive patterns within the package base, such as the first wiring 3, the second wiring 4, the third wiring 7, the fourth wiring 8, the annular metal layer 2, the through-hole conductor 6, the electrode pads 9, and the external connection terminals 5, etc.

[0047] In this embodiment, the first wiring 3 is arranged opposite to each other in the first corner region 103 and the third corner region 105. There are two first wirings 3, so that the conduction between diagonally adjacent packaging bases can be realized. In some other embodiments, the first wiring 3 can be arranged on the side regions spaced apart in the second direction Y and the third direction Z. When there are four first wirings 3 (not shown in the figure), the electroplating wiring of any two adjacent packaging bases can be connected.

[0048] This utility model also provides a packaging base assembly plate, see reference. Figure 8 The system comprises multiple encapsulation bases arranged in a grid pattern. Oppositely arranged beveled surfaces 102 on adjacent encapsulation bases cooperate to form intersecting beveled grooves a in the second direction Y and the third direction Z, with the second direction Y and the third direction Z intersecting perpendicularly. A first wiring 3 is provided on the edge region of the encapsulation base (the same as the edge region of the insulating substrate 1), and the first wiring 3 is electrically connected to adjacent encapsulation bases. Alternatively, the first corner region a and the third corner region c of the encapsulation base are provided with the first wiring 3, and the second corner region b of the encapsulation base is provided with a third wiring 7. The first wiring 3 of diagonally adjacent encapsulation bases are electrically connected through the third wiring 7 of edge-adjacent encapsulation bases. One end of the third wiring 7 is located inside the frame portion 12, and the other end extends to the outer surface 100 to form a second exposed portion 71. The second exposed portion 71 is disposed away from the beveled surface of the beveled groove a, and the third wiring 7 is insulated from the annular metal layer 2. Figures 8 to 13 In this configuration, there are four encapsulation bases, and the first wiring 3 of encapsulation base A1 is electrically connected to the first wiring 3 of the diagonally adjacent encapsulation base A3 through the third wiring 7 of the adjacent encapsulation base A2. The arrangement of the encapsulation base assembly board can be adjusted according to the setting position of the first wiring 3 in the corner or side area.

[0049] This utility model also provides an electronic device, including the packaging base of any of the above, and further including electronic components disposed in the cavity 101, and a cover plate (not shown in the figure) sealing the cavity 101.

[0050] In summary, this utility model embodiment provides a packaging base, a combination board, and an electronic device. One end of the first wiring 3 is connected to the annular metal layer 2, and the other end extends to the outer surface 100 to form a first exposed portion 31. By setting the first exposed portion 31, the first wiring 3 is electrically connected between adjacent packaging bases in the combination board composed of multiple packaging bases, thereby realizing the electroplating conductive connection of the annular metal layer 2 on each packaging base in the combination board. In addition, the first exposed portion 31 is set away from the dividing slope 102, that is, the first wiring 3 is not exposed on the surface of the dividing groove a, avoiding the adhesion of the electroplated wiring of adjacent packaging bases during the electroplating process, facilitating the division of individual packaging bases, improving production efficiency. At the same time, the first wiring 3 has a simple structure, simplifying the electroplating wiring structure and reducing production costs.

[0051] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A package pedestal, characterized by: include An insulating substrate includes a base and a frame. The bottom of the base has a first surface, and the top of the frame has a second surface. The outer side wall of the base is connected to the outer side wall of the frame to form an outer side surface. The base is a plate-like structure, and the frame is an annular structure. The base and the frame together form a cavity. The first surface and / or the second surface are connected to the outer side surface by a dividing bevel. An annular metal layer is located on the second surface and surrounds the cavity; A first wiring is provided inside the frame portion. One end of the first wiring is connected to the annular metal layer, and the other end extends to the outer side to form a first exposed portion. The first exposed portion is disposed away from the dividing slope.

2. The packaging base as described in claim 1, characterized in that: The first wiring has a strip-like structure, extending from one end connected to the annular metal layer to the first exposed portion, and the distance between the first wiring and the annular metal layer gradually increases in a first direction.

3. The packaging base as described in claim 1, characterized in that: The length of the insulating substrate in the first direction is T, and the minimum distance between the first exposed portion and the second surface is... , 0.1≤ / T≤0.

5.

4. The packaging base as described in claim 1, characterized in that: The length of the frame portion in the second direction is W, and the minimum distance between the end of the first wiring connected to the annular metal layer and the outer side surface is [missing information]. , 0.5≤ / W≤0.

8.

5. The packaging base as described in claim 1, characterized in that: It also includes a second wiring, one end of which is located in the frame portion and connected to the annular metal layer, and the other end of which extends to the base portion.

6. The packaging base as described in claim 5, characterized in that: One end of the first wiring is connected to the annular metal layer and the other end of the second wiring located in the frame.

7. The packaging base as described in claim 5, characterized in that: It also includes a plurality of external connection terminals, which are disposed on the first surface, and the second wiring is connected to one of the external connection terminals at one end of the base through a through-hole conductor.

8. The packaging base as described in claim 1, characterized in that: The insulating substrate includes a first corner region and a third corner region arranged diagonally, as well as a second corner region and a fourth corner region arranged diagonally. The first corner region is provided with the first wiring, and the second corner region is provided with the third wiring. One end of the third wiring is located inside the frame portion, and the other end extends to the outer side to form a second exposed portion. The second exposed portion is disposed away from the dividing slope. The third wiring is insulated from the annular metal layer.

9. A packaging base assembly board, characterized in that, The package is composed of multiple packaging bases as described in any one of claims 1-8, wherein the dividing bevels disposed opposite to each other on adjacent packaging bases cooperate to form intersecting dividing grooves in a second direction and a third direction, wherein the second direction intersects the third direction perpendicularly; The first wiring is provided on the edge area of ​​the packaging base, and the first wiring is electrically connected to each other between adjacent edges of the packaging base; Alternatively, the first wiring is provided in the first corner region and the third corner region of the packaging base, and the third wiring is provided in the second corner region of the packaging base. The first wirings of the diagonally adjacent packaging bases are electrically connected through the third wirings of the side-adjacent packaging bases.

10. An electronic device comprising the packaging base according to any one of claims 1-8, characterized in that: It also includes electronic components disposed in the cavity, and a cover plate that seals the cavity.

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