A material collecting device of a track type IC carrier plate marking machine

Abstract

The application relates to the technical field of laser marking, and provides a material collecting device of a track type IC carrier plate marking machine, which comprises a material box and an IC carrier plate material collecting module; the material box is provided with a material cavity which is bidirectionally penetrated; IC carrier plate supporting structures are arranged in the material box in a manner of being sequentially and spacedly arranged from top to bottom; the IC carrier plate material collecting module comprises a material collecting linear track conveying mechanism and a material collecting transfer mechanism; the material collecting linear track conveying mechanism is provided with a material collecting transfer station; the material collecting transfer mechanism can transfer the IC carrier plate on the laser machine to the material collecting transfer station; the material collecting linear track conveying mechanism can convey the IC carrier plate on the material collecting transfer station into the material cavity of the material box on the IC carrier plate material collecting module; and the material collecting device can prevent the surface of the IC carrier plate from being abraded and the circuit from being damaged.

Description

Technical Field

[0001] This application relates to the field of laser marking technology, and more specifically, to a receiving device for a track-type IC carrier marking machine. Background Technology

[0002] An IC package substrate, also known as a packaging substrate, is a core component in the semiconductor packaging process. Its main functions include: 1. Signal connection: Connecting the bare die (DIE) and the PCB through internal precision circuitry, acting as a bridge between them. 2. Physical support and protection: Providing mechanical support for the chip and protecting it from external environmental factors such as humidity and vibration. 3. Heat dissipation and modular design: Optimizing heat dissipation paths through special materials (such as metal layers) and structural design, while supporting modular integration of components.

[0003] In the IC substrate manufacturing process, laser marking technology is widely used to engrave permanent markings on the substrate surface, including key information such as product model, batch number, and QR code. Specifically, laser marking technology is one of the largest applications of laser processing. Laser marking is a marking method that uses a high-energy-density laser to locally irradiate the workpiece, causing the surface material to vaporize or undergo a chemical reaction that changes color, thereby leaving a permanent mark. Laser marking can produce various texts, symbols, and patterns, which is of particular significance for product anti-counterfeiting. The advantages of laser marking technology are mainly: 1. Wide adaptability: It can process various metal and non-metal materials (copper, aluminum, iron, stainless steel, leather, plastic, etc.); 2. Non-contact processing: It causes no stress or deformation to the product. Laser processing uses a non-mechanical "tool," which does not produce mechanical compression or stress on the material. There is no "tool" wear, it is non-toxic, and causes very little environmental pollution; 3. High processing precision: The laser beam is very fine, resulting in minimal material consumption; 4. Simple operation: Using microcomputer numerical control technology, automated processing can be achieved. It can be used for high-efficiency processing of parts on the production line and can be used as part of a flexible processing system; 5. Environmentally friendly and pollution-free. In the IC substrate production process, the receiving device of the IC substrate marking machine is used to transport the IC substrates marked by the laser machine to the IC substrate storage station. However, in the existing technology, multiple layers of IC substrates are vertically stacked in the IC substrate storage station of the receiving device of the IC substrate marking machine, that is, the upper IC substrate is directly stacked on the surface of the lower IC substrate. In this stacked structure, when the carrier boards are picked up layer by layer by a robotic arm or conveyor, the direct contact surfaces of adjacent IC carrier boards will rub against each other during the movement, which will cause wear and damage to the IC carrier board surface and circuits, resulting in a decrease in product yield and an increase in production costs. Utility Model Content

[0004] In view of this, this application provides a receiving device for a track-type IC carrier marking machine to solve the technical problem that the receiving device of the existing IC carrier marking machine is prone to causing wear and damage to the surface of the IC carrier and the circuit.

[0005] This application provides a receiving device for a track-type IC carrier board marking machine, wherein the receiving device for the track-type IC carrier board marking machine includes a material box and an IC carrier board receiving module;

[0006] The material box has a bidirectional through-cavity, and the material box is provided with IC carrier board support structures arranged at intervals from top to bottom;

[0007] The IC carrier board receiving module includes a receiving linear track conveying mechanism and a receiving transfer mechanism. The receiving linear track conveying mechanism has a receiving transfer station. The receiving transfer mechanism can transfer the IC carrier board on the laser machine to the receiving transfer station. The receiving linear track conveying mechanism can transport the IC carrier board on the receiving transfer station to the material cavity of the material box located on the IC carrier board receiving module.

[0008] Furthermore, the material cavity extends bidirectionally through the material box along its length, and the IC carrier plate support structure includes support beams disposed on the inner sides of the two side walls in the width direction of the material box.

[0009] Furthermore, the support beam is fixed to the inner side of the two side walls in the width direction of the material box or is formed as an integral part with the material box.

[0010] Furthermore, the support beam is detachably connected to the inner side of the two side walls in the width direction of the material box.

[0011] Furthermore, the support beam is detachably connected to the inner side of the two side walls in the width direction of the material box by threaded fasteners.

[0012] Furthermore, slots are formed on the inner sides of the two side walls in the width direction of the material box, and the support beam is detachably engaged in the corresponding slots.

[0013] Furthermore, the receiving and transferring mechanism includes a receiving and transferring horizontal drive mechanism, a first receiving and lifting mechanism, a second receiving and lifting mechanism, a first receiving and extracting device, and a second receiving and extracting device. The first receiving and lifting mechanism and the second receiving and lifting mechanism are connected to the receiving and transferring horizontal drive mechanism and can be driven by the receiving and transferring horizontal drive mechanism. The first receiving and extracting device is connected to the first receiving and lifting mechanism, and the second receiving and extracting device is connected to the second receiving and lifting mechanism.

[0014] Furthermore, the IC carrier board receiving module includes a receiving three-axis mechanism. The receiving three-axis mechanism is located adjacent to the end of the receiving linear track conveying mechanism in the conveying direction. The receiving three-axis mechanism is connected to a receiving clamping mechanism, which is used to clamp the material box. The receiving three-axis mechanism can drive the receiving clamping mechanism to move up and down, move along a first receiving horizontal linear direction, and move along a second receiving horizontal linear direction. The first receiving horizontal linear direction and the second receiving horizontal linear direction are perpendicular to each other.

[0015] Furthermore, the IC carrier board receiving module includes an upper conveyor belt and a lower conveyor belt located below and parallel to the upper conveyor belt. The first end of the upper conveyor belt and the first end of the lower conveyor belt are both adjacent to the receiving three-axis mechanism. The conveying direction of the upper conveyor belt is from the first end of the upper conveyor belt toward the second end of the upper conveyor belt, and the conveying direction of the lower conveyor belt is from the second end of the lower conveyor belt toward the first end of the lower conveyor belt.

[0016] Furthermore, the IC carrier board receiving module includes an IC carrier board receiving and stacking station. The receiving and transfer mechanism can transfer and stack the IC carrier boards of the laser machine to the IC carrier board receiving and stacking station. The interval receiving bin has an upward opening. The interval receiving bin is provided with movable support structures arranged sequentially from top to bottom. The movable support structures extend horizontally into the interior of the interval receiving bin through an elastic mechanism to support the IC carrier boards. The IC carrier board receiving module includes a second receiving bin transfer execution device. The second receiving bin transfer execution device can move up and down and horizontally, and can transfer the IC carrier boards of the laser machine or the IC carrier boards on the receiving linear track conveyor mechanism to the interval receiving bin. A mechanical trigger is provided below the second receiving bin transfer execution device. When the second receiving bin transfer execution device moves downward into the interval receiving bin, the mechanical trigger can touch the movable support structure to make the movable support structure overcome the elastic force of the elastic mechanism and retract into the bin wall of the interval receiving bin.

[0017] The beneficial effects of the material receiving device for the track-type IC carrier marking machine provided by this utility model are as follows:

[0018] Compared to existing technologies, the receiving device of the track-type IC carrier marking machine provided by this utility model has IC carrier support structures arranged sequentially from top to bottom in the material box. Therefore, by placing one IC carrier in each IC carrier support structure, adjacent IC carriers are placed at intervals, thus preventing friction between adjacent IC carriers during IC carrier loading and unloading. This eliminates surface wear and circuit damage to the IC carriers, improves the product yield of IC carriers, and saves production costs. Furthermore, the IC carriers can be transported to the material cavity of the material box located on the IC carrier receiving module by the linear track conveyor mechanism, which greatly simplifies the operation of IC carrier receiving and improves the efficiency of IC carrier receiving.

[0019] Other beneficial effects of this invention will be detailed below. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a partial perspective view of the material receiving device of a track-type IC carrier marking machine in cooperation with a laser machine, according to an embodiment of this application.

[0022] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0023] Figure 3 for Figure 1 Enlarged view of point B in the middle;

[0024] Figure 4 This is a schematic diagram of some components in the receiving device of a track-type IC carrier marking machine according to another embodiment of this application;

[0025] Figure 5 This is a perspective view of the material box in the receiving device of a track-type IC carrier marking machine according to an embodiment of this application;

[0026] Figure 6 This is another partial perspective view of the material receiving device of the track-type IC carrier marking machine in cooperation with the laser machine according to an embodiment of this application;

[0027] Figure 7 for Figure 6 Enlarged view of point C in the middle;

[0028] Figure 8This is a partial view of the receiving device of a track-type IC carrier marking machine according to an embodiment of this application, in conjunction with a laser machine;

[0029] Figure 9 This is a schematic diagram showing the cooperation between the mechanically triggered receiving bin transfer actuator and the interval receiving bin in the receiving device of the track-type IC carrier marking machine according to an embodiment of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1-IC carrier board; 2-Linear guide frame; 3-Conveying roller; 4-Suction cup; 12-Lower clamping arm; 13-Upper clamping arm; 14-Miniature electric guide rail; 15-Top block; 16-Spring; 18-Mechanically triggered receiving bin transfer actuator; 100-Laser machine; 101-Laser machine cabinet; 300-IC carrier board receiving module; 301-Receiving module cabinet; 302-Receiving linear track conveying mechanism; 303-First receiving transfer horizontal electric guide rail; 304-First receiving lifting mechanism; 305-Second receiving lifting mechanism; 306-First rotary drive mechanism; 307-Second rotary drive mechanism; 308-First body; 309-Second body; 310-Second receiving and transfer horizontal electric guide rail; 311-Receiving three-axis mechanism; 312-Upper conveyor belt; 313-Lower conveyor belt; 314-Receiving clamping mechanism; 315-IC carrier board receiving and stacking station; 317-Upper electrically controlled conveyor rail; 318-Lower electrically controlled conveyor rail; 319-Upper conveyor platform; 320-Lower conveyor platform; 400-Material box; 401-Material cavity; 402-Support beam; 500-Interval receiving bin; 501-Open opening; 502-Modible support structure. Detailed Implementation

[0032] To facilitate understanding of this application, a more comprehensive description will be provided below with reference to the accompanying drawings. One or at least three embodiments of this application are exemplarily shown in the drawings to provide a more accurate and thorough understanding of the technical solutions disclosed herein. However, it should be understood that this application can be implemented in many different forms and is not limited to the embodiments described below.

[0033] In the accompanying drawings of this application, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0034] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously.

[0035] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0036] See Figures 1 to 9 This application provides a receiving device for a track-type IC carrier board marking machine, wherein the receiving device for the track-type IC carrier board marking machine includes a material box 400 and an IC carrier board receiving module 300;

[0037] The material box 400 has a bidirectional through material cavity 401, and the material box 400 is provided with IC carrier board support structures arranged at intervals from top to bottom.

[0038] The IC carrier board receiving module 300 includes a receiving linear track conveying mechanism 302 and a receiving transfer mechanism. The receiving linear track conveying mechanism 302 has a receiving transfer station. The receiving transfer mechanism can transfer the IC carrier board 1 on the laser machine 100 to the receiving transfer station. The receiving linear track conveying mechanism 302 can transport the IC carrier board 1 on the receiving transfer station to the material cavity 401 of the material box 400 located on the IC carrier board receiving module 300. The IC carrier board receiving module 300 also includes a receiving module cabinet 301 for accommodating and supporting various equipment and mechanisms in the IC carrier board receiving module 300.

[0039] Because the receiving device of the track-type IC carrier marking machine provided by this utility model has IC carrier support structures arranged sequentially from top to bottom in the material box 400, one IC carrier 1 can be placed in each IC carrier support structure, so that adjacent IC carriers 1 are placed at intervals. This avoids the phenomenon of adjacent IC carriers 1 rubbing against each other when picking up and putting down IC carriers 1, eliminates surface wear and circuit damage of IC carriers 1, improves product yield of IC carriers 1, and saves production costs. Moreover, the IC carrier 1 can be transported to the material cavity 401 of the material box 400 located on the IC carrier receiving module 300 by the receiving linear track conveying mechanism 302, which greatly simplifies the operation of IC carrier 1 receiving process and improves the efficiency of IC carrier 1 receiving operation.

[0040] According to a specific embodiment of this application, the receiving linear track conveyor 302 is a roller conveyor, which includes a linear guide frame 2 and conveying rollers 3 disposed on the linear guide frame 2. Of course, the roller conveyor can also be replaced by a belt conveyor or a chain conveyor structure.

[0041] According to one embodiment of this application, the material cavity 401 extends bidirectionally through the material box 400 along its length direction. The IC carrier plate support structure includes support beams 402 disposed on the inner sides of the two side walls in the width direction of the material box 400. The lower ends of the two sides of one IC carrier plate 1 are respectively supported on two support beams 402 corresponding to the same IC carrier plate support structure.

[0042] According to one embodiment of this application, the support beam 402 is fixed to the inner side of the two side walls in the width direction of the material box 400 or is formed as an integral part with the material box 400.

[0043] According to one embodiment of this application, the support beam 402 is detachably connected to the inner sides of the two side walls in the width direction of the material box 400. Specifically, the support beam 402 is detachably connected to the inner sides of the two side walls in the width direction of the material box 400 by threaded fasteners. Alternatively, slots 403 are formed on the inner sides of the two side walls in the width direction of the material box 400, and the support beam 402 is detachably engaged in the corresponding slots 403. Of course, any other suitable detachable connection method not described herein can also be used.

[0044] According to one embodiment of this application, the receiving and transferring mechanism includes a receiving and transferring horizontal drive mechanism, a first receiving and lifting mechanism 304, a second receiving and lifting mechanism 305, a first receiving and extracting device, and a second receiving and extracting device. The first receiving and lifting mechanism 304 and the second receiving and lifting mechanism 305 are connected to the receiving and transferring horizontal drive mechanism and can be driven by the receiving and transferring horizontal drive mechanism. The first receiving and extracting device is connected to the first receiving and lifting mechanism 304, and the second receiving and extracting device is connected to the second receiving and lifting mechanism 305. Specifically, both the first receiving and extracting device and the second receiving and extracting device can be suction cup type extraction devices, having a suction cup 4 for adsorbing the IC carrier board 1.

[0045] According to one embodiment of this application, the first receiving and extraction device includes a first body 308 and a suction cup 4 disposed on the first body 308. The first body 308 is rotatably connected to the first receiving and lifting mechanism 304 via a first rotary drive mechanism 306. The second receiving and extraction device includes a second body 309 and a suction cup 4 disposed on the second body 309. The second body 309 is rotatably connected to the second receiving and lifting mechanism 305 via a second rotary drive mechanism 307. First, the suction cup 4 of the first receiving and extraction device adsorbs the original upper surface of the IC carrier plate 1. After the IC carrier plate 1 rotates 90°, the suction cup 4 of the second receiving and extraction device adsorbs the original lower surface of the IC carrier plate 1. After the second receiving and extraction device rotates 90°, the original lower surface of the IC carrier plate 1 becomes the new upper surface.

[0046] In other embodiments, there may be only one of the first receiving and extraction device and the second receiving and extraction device.

[0047] According to a specific embodiment of this application, the receiving and transfer horizontal drive mechanism includes a first receiving and transfer horizontal electric guide rail 303 and a second receiving and transfer horizontal electric guide rail 310. A first receiving and lifting mechanism 304 is installed on the slider portion of the first receiving and transfer horizontal electric guide rail 303, and a second receiving and lifting mechanism 305 is installed on the slider portion of the second receiving and transfer horizontal electric guide rail 310.

[0048] According to one embodiment of this application, the IC carrier board receiving module 300 includes a receiving three-axis mechanism 311. The receiving three-axis mechanism 311 is adjacent to the end of the conveying direction of the receiving linear track conveying mechanism 302. The receiving three-axis mechanism 311 is connected to a receiving clamping mechanism 314. The receiving clamping mechanism 314 is used to clamp the material box 400. The receiving three-axis mechanism 311 can drive the receiving clamping mechanism 314 to move up and down, move along a first receiving horizontal linear direction, and move along a second receiving horizontal linear direction. The first receiving horizontal linear direction and the second receiving horizontal linear direction are perpendicular to each other.

[0049] Specifically, the receiving clamping mechanism 314 may include a lower clamping arm 12 and an upper clamping arm 13 that is vertically and flexibly disposed above the lower clamping arm 12, and the material box 400 may be clamped between the lower clamping arm 12 and the upper clamping arm 13.

[0050] According to one embodiment of this application, the IC carrier board receiving module 300 includes an upper conveyor belt 312 and a lower conveyor belt 313 located below and parallel to the upper conveyor belt 312. The first ends of both the upper conveyor belt 312 and the lower conveyor belt 313 are adjacent to the receiving three-axis mechanism 311. The conveying direction of the upper conveyor belt 312 is from its first end toward its second end, and the conveying direction of the lower conveyor belt 313 is from its second end toward its first end. During the gradual descent driven by the receiving three-axis mechanism 311, the material box 400 receives IC carrier boards 1 output from the receiving linear track conveyor mechanism 302 in sequence from each layer of the IC carrier board support structure. The material box 400 is filled with IC carrier boards 1. After the IC carrier plate 1 is loaded, the receiving three-axis mechanism 311 drives the material box 400 to rise to the first end of the upper conveyor belt 312. Then, through the movement of the receiving three-axis mechanism 311 and the release operation of the receiving clamping mechanism 314, the material box 400 filled with IC carrier plate 1 falls to the first end of the upper conveyor belt 312 and is conveyed to the second end of the upper conveyor belt 312. After the worker takes the IC carrier plate 1 out of the material box 400, he places the empty material box 400 at the second end of the lower conveyor belt 313. The lower conveyor belt 313 conveys it to the first end of the lower conveyor belt 313. Then, the movement of the receiving three-axis mechanism 311 and the clamping operation of the receiving clamping mechanism 314 receive the IC carrier plate 1 output from the receiving linear track conveyor mechanism 302 again. This process is repeated to achieve continuous operation.

[0051] According to another embodiment of this application, the upper conveyor belt 312 and the lower conveyor belt 313 are eliminated. The IC carrier board receiving module 300 includes an upper electrically controlled conveyor rail 317 and a lower electrically controlled conveyor rail 318 located below and parallel to the upper electrically controlled conveyor rail 317. The first ends of the upper electrically controlled conveyor rail 317 and the lower electrically controlled conveyor rail 318 are both adjacent to the receiving three-axis mechanism 311. The conveying direction of the upper electrically controlled conveyor rail 317 is from the first end of the upper electrically controlled conveyor rail 317 toward the second end of the upper electrically controlled conveyor rail 317. The slider portion of the upper electrically controlled conveyor rail 317 is connected to the upper conveyor platform 319, and the slider portion of the upper electrically controlled conveyor rail 317 is connected to the lower conveyor platform 320. The conveying direction of the lower electrically controlled conveyor rail 318 is from the second end of the lower electrically controlled conveyor rail 318 toward the first end of the lower electrically controlled conveyor rail 318. During the gradual descent of the material box 400 driven by the receiving three-axis mechanism 311, the support structure of each layer of IC carrier board is sequentially connected to... After receiving the IC carrier board 1 from the receiving linear track conveyor mechanism 302, the material box 400 is filled with the IC carrier board 1. Then, the receiving three-axis mechanism 311 drives the material box 400 to rise to the first end of the upper electrically controlled conveyor rail 317. Then, through the movement of the receiving three-axis mechanism 311 and the release operation of the receiving clamping mechanism 314, the material box 400 filled with IC carrier board 1 falls to the upper conveyor table 319 and is conveyed to the second end of the upper electrically controlled conveyor rail 317. After the worker removes the IC carrier board 1 from the material box 400, the empty material box 400 is placed on the lower conveyor table 320 at the second end of the lower electrically controlled conveyor rail 318. The lower electrically controlled conveyor rail 318 drives the lower conveyor table 320 to convey it to the first end of the lower electrically controlled conveyor rail 318. Then, the movement of the receiving three-axis mechanism 311 and the clamping operation of the receiving clamping mechanism 314 receive the IC carrier board 1 from the receiving linear track conveyor mechanism 302 again. This process is repeated to achieve continuous operation.

[0052] According to one embodiment of this application, the IC carrier board receiving module 300 includes an IC carrier board receiving and stacking station 315, and the receiving and transfer mechanism is capable of transferring and stacking the IC carrier board 1 of the laser machine 100 to the IC carrier board receiving and stacking station 315.

[0053] According to the first embodiment of this application, the IC carrier board receiving and stacking station 315 does not have the function of separating adjacent IC carrier boards 1. The IC carrier boards 1 are stacked one by one in contact with each other on the IC carrier board receiving and stacking station 315.

[0054] In this embodiment, the IC carrier board receiving module 300 includes an extraction mechanism, such as a suction cup extraction device, capable of transferring the IC carrier board 1 from the output end of the laser machine 100 to the IC carrier board receiving and stacking station 315.

[0055] According to a second embodiment of this application, the interval receiving bin 500 has an upward opening 501. The interval receiving bin 500 is provided with movable support structures 502 (e.g., movable support plates) arranged sequentially from top to bottom. The movable support structures 502 extend horizontally into the interior of the interval receiving bin 500 via an elastic mechanism to support the IC carrier board 1. The IC carrier board receiving module 300 includes a second receiving bin transfer actuator, which is capable of lifting, lowering, and horizontal movement, and can transfer the laser machine... IC carrier 1 on the IC carrier board 1 or the IC carrier board 1 on the linear conveyor 302 is transferred to the intermittent receiving bin 500. A mechanical trigger is provided below the second receiving bin transfer actuator. The second receiving bin transfer actuator is a mechanical trigger receiving bin transfer actuator 18 at this time, and a suction cup 4 is provided below it. When the second receiving bin transfer actuator moves downward into the intermittent receiving bin 500, the mechanical trigger can touch the movable support structure 502 to make the movable support structure 502 retract against the elastic force of the elastic mechanism. The wall of the intermittent receiving hopper 500, more specifically, has a receiving cavity. The elastic mechanism is a spring 16 disposed within the receiving cavity. One end of the spring 16 is connected to the cavity wall, and the other end is connected to a movable support structure 502. The upper surface of the movable support structure 502 forms an inclined surface. Top blocks 15 (mechanical triggers) for pressing down the inclined surface are located below the first receiving hopper transfer actuator and on both sides below the second receiving hopper transfer actuator. The top blocks 15 abut against the intermittent receiving hopper 500. The side wall of the receiving cavity should be accommodated. When the top block 15 presses down on the inclined surface, the existence of the inclined surface generates a horizontal force that causes the movable support structure 502 to overcome the elastic force of the spring 16 and move towards the receiving cavity. The suction cup 4 used to pick up the IC carrier plate 1 is specifically set in the middle below the second receiving bin transfer actuator. The lower surface of the suction cup 4 is flush with the lower surface of the top block 15, ensuring that when the IC carrier plate 1 rises with the suction cup 4 of the second receiving bin transfer actuator, the movable support structure 502 above the IC carrier plate 1 will never interfere with the rise of the IC carrier plate 1.

[0056] It should be noted that the above embodiments only illustrate preferred embodiments of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting this application. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of this application, such as combining different features in various embodiments, and these should all fall within the protection scope of this application.

Claims

1. A receiving device for a track-type IC carrier board marking machine, characterized in that, The receiving device of the track-type IC carrier board marking machine includes a material box and an IC carrier board receiving module; The material box has a bidirectional through-cavity, and the material box is provided with IC carrier board support structures arranged at intervals from top to bottom; The IC carrier board receiving module includes a receiving linear track conveying mechanism and a receiving transfer mechanism. The receiving linear track conveying mechanism has a receiving transfer station. The receiving transfer mechanism can transfer the IC carrier board on the laser machine to the receiving transfer station. The receiving linear track conveying mechanism can transport the IC carrier board on the receiving transfer station to the material cavity of the material box located on the IC carrier board receiving module.

2. The receiving device of the track-type IC carrier board marking machine according to claim 1, characterized in that, The material cavity extends bidirectionally through the material box along its length, and the IC carrier plate support structure includes support beams disposed on the inner sides of the two side walls in the width direction of the material box.

3. The receiving device of the track-type IC carrier marking machine according to claim 2, characterized in that, The support beam is fixed to the inner side of the two side walls of the material box in the width direction or is formed as an integral part with the material box.

4. The receiving device of the track-type IC carrier marking machine according to claim 2, characterized in that, The support beam is detachably connected to the inner side of the two side walls in the width direction of the material box.

5. The receiving device of the track-type IC carrier board marking machine according to claim 4, characterized in that, The support beam is detachably connected to the inner side of the two side walls of the material box in the width direction by threaded fasteners.

6. The receiving device of the track-type IC carrier marking machine according to claim 4, characterized in that, The inner sides of the two side walls in the width direction of the material box are formed with slots, and the support beam is detachably snapped into the corresponding slots.

7. The receiving device of the track-type IC carrier board marking machine according to claim 3, characterized in that, The receiving and transferring mechanism includes a receiving and transferring horizontal drive mechanism, a first receiving and lifting mechanism, a second receiving and lifting mechanism, a first receiving and extracting device, and a second receiving and extracting device. The first receiving and lifting mechanism and the second receiving and lifting mechanism are connected to the receiving and transferring horizontal drive mechanism and can be driven by the receiving and transferring horizontal drive mechanism. The first receiving and extracting device is connected to the first receiving and lifting mechanism, and the second receiving and extracting device is connected to the second receiving and lifting mechanism.

8. The receiving device of the track-type IC carrier marking machine according to any one of claims 1 to 7, characterized in that, The IC carrier board receiving module includes a receiving three-axis mechanism. The receiving three-axis mechanism is located near the end of the receiving linear track conveying mechanism in the conveying direction. The receiving three-axis mechanism is connected to a receiving clamping mechanism, which is used to clamp the material box. The receiving three-axis mechanism can drive the receiving clamping mechanism to move up and down, move along a first receiving horizontal linear direction, and move along a second receiving horizontal linear direction. The first receiving horizontal linear direction and the second receiving horizontal linear direction are perpendicular to each other.

9. The receiving device of the track-type IC carrier board marking machine according to claim 8, characterized in that, The IC carrier board receiving module includes an upper conveyor belt and a lower conveyor belt located below and parallel to the upper conveyor belt. The first end of the upper conveyor belt and the first end of the lower conveyor belt are both adjacent to the receiving three-axis mechanism. The conveying direction of the upper conveyor belt is from the first end of the upper conveyor belt toward the second end of the upper conveyor belt, and the conveying direction of the lower conveyor belt is from the second end of the lower conveyor belt toward the first end of the lower conveyor belt.

10. The receiving device of the track-type IC carrier marking machine according to any one of claims 1 to 7, characterized in that, The receiving device of the track-type IC carrier marking machine includes an intermittent receiving bin, and the IC carrier receiving module includes an IC carrier receiving and stacking station. The receiving and transfer mechanism can transfer and stack the IC carriers of the laser machine to the IC carrier receiving and stacking station. The intermittent receiving bin has an upward opening, and the intermittent receiving bin is provided with movable support structures arranged sequentially from top to bottom. The movable support structures extend horizontally into the interior of the intermittent receiving bin through an elastic mechanism to support the IC carriers. The IC carrier receiving module includes a... The second receiving bin transfer actuator is capable of lifting, lowering, and moving horizontally, and can transfer the IC carrier plate of the laser machine or the IC carrier plate on the receiving linear track conveyor mechanism to the interval receiving bin. A mechanical trigger is provided below the second receiving bin transfer actuator. When the second receiving bin transfer actuator moves downward into the interval receiving bin, the mechanical trigger can touch the movable support structure so that the movable support structure overcomes the elastic force of the elastic mechanism and retracts into the bin wall of the interval receiving bin.

Images