An adjustable hardness polishing device

By introducing a heating plate and a semiconductor cooling chip into the grinding device to regulate the temperature of the grinding pad, and combining it with a hydraulic rod and a water trough structure, the problems of unadjustable hardness and weather influence in traditional grinding devices are solved, thereby improving processing efficiency and equipment lifespan.

CN224295562UActive Publication Date: 2026-05-29SHANGHAI BAOSH COMM EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI BAOSH COMM EQUIP CO LTD
Filing Date
2025-07-16
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Traditional grinding equipment has difficulty in dynamically adjusting the hardness of the grinding interface, resulting in low efficiency and easy scratches when processing high-hardness alloys or composite materials, and over-grinding damage when processing soft metals. Furthermore, the grinding quality is affected by weather changes.

Method used

The temperature of the grinding pad is regulated by a heating plate and a semiconductor cooling chip. The temperature of the grinding pad is controlled by a water pump that delivers heat exchange fluid. The height and angle of the grinding disc are adjusted by a hydraulic rod. Cooling or cleaning fluid is introduced through a water trough. The device is equipped with a protective structure and a control system.

Benefits of technology

It enables dynamic adjustment of the hardness of the grinding interface, improves processing efficiency, avoids grinding quality problems caused by weather changes, and extends equipment life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a hardness-adjustable grinding device and relates to the field of workshop grinding, which comprises a workbench, a cavity is formed in the inside of the workbench, a mounting plate is fixedly connected to the inside of the cavity, a rotating plate is fixedly connected to the inside of the mounting plate, an adjusting assembly is arranged on the top surface of the rotating plate, the adjusting assembly comprises a water storage tank arranged on the top surface of the rotating plate, and a heating plate is fixedly connected to the inner top surface of the water storage tank. The application cools and heats the heat exchange liquid in the water storage tank by means of semiconductor refrigeration pieces and the heating plate; the heat exchange liquid in the water storage tank is conveyed into the inside of a water channel through a water inlet pipe by means of a water pump, the heat exchange liquid flows in the inside of the water channel, and then returns to the inside of the water storage tank through a water outlet pipe; the heat exchange liquid flows in the inside of the water channel, so that the grinding pad can be heated or cooled, thereby solving the problem that the grinding pad is soft in summer and hard in winter.
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Description

Technical Field

[0001] This application relates to the field of..., and in particular to a grinding apparatus with adjustable hardness. Background Technology

[0002] In the field of machining, the uniformity of workpiece surface hardness directly affects its key properties such as wear resistance and fatigue strength. With the development of high-end manufacturing industries such as aerospace and precision molds, the demand for precise control of workpiece surface hardness is becoming increasingly urgent. Traditional grinding devices mostly use grinding discs or pads with fixed hardness, making it difficult to dynamically adjust the hardness of the grinding interface according to the processing requirements of different workpiece materials. This often leads to problems such as low grinding efficiency and deep surface scratches when processing high-hardness alloys or composite materials, while when processing soft metals, the excessively hard grinding interface can easily cause over-wearing damage to the workpiece surface.

[0003] The existing equipment can cause the grinding pads in the workshop to soften or harden under different weather conditions, such as summer or winter, which can affect the quality of workpiece grinding. Utility Model Content

[0004] To prevent the grinding pads in the workshop from softening or hardening under different weather conditions, such as summer or winter, which would affect the quality of workpiece grinding, this application provides a grinding device with adjustable hardness.

[0005] The adjustable hardness grinding device provided in this application adopts the following technical solution:

[0006] The device includes a workbench with an internal cavity. A mounting plate is fixedly connected inside the cavity, and a rotating plate is fixedly connected inside the mounting plate. An adjustment assembly is provided on the top surface of the rotating plate.

[0007] The regulating assembly includes a water tank disposed on the top surface of the rotating plate, a heating plate fixedly connected to the inner top surface of the water tank, a semiconductor cooling chip fixedly connected to one side of the water tank, a water pump connected to the side of the water tank via a flexible hose, an inlet pipe fixedly connected to the top surface of the water pump, and an outlet pipe fixedly connected to the top surface of the water tank.

[0008] By adopting the above technical solution, the heating plate and the semiconductor cooling chip can adjust the temperature of the heat exchange liquid inside them, and the water pump delivers the heat exchange liquid to the interior of the grinding pad for cooling or heat dissipation.

[0009] Preferably, a support frame is fixedly connected to the top surface of the workbench, and a hydraulic rod is fixedly connected to the top surface of the support frame.

[0010] By adopting the above technical solution, the support frame supports the hydraulic rod, which allows the height of the grinding disc to be adjusted.

[0011] Preferably, one end of the hydraulic rod is connected to a connecting plate, and one end of the connecting plate is fixedly connected to a grinding disc.

[0012] By adopting the above technical solution, the height and angle of the grinding disc can be adjusted with multiple degrees of freedom.

[0013] Preferably, the surface of the workbench is provided with two sets of protective doors, each set of protective doors is provided with an observation window, and each set of protective doors is provided with a pull plate on one side.

[0014] By adopting the above technical solution, the protective door protects the items inside the cavity, the pull plate is used to open and close the protective door, and the observation window is used to observe the items inside the cavity.

[0015] Preferably, a placement frame is fixedly connected to the top surface of the workbench, a grinding pad is rotatably connected inside the placement frame, two sets of fixing plates are fixedly connected to the bottom surface of the grinding pad, and a water channel is opened inside the grinding pad.

[0016] By adopting the above technical solution, the placement frame provides a stable installation base for the grinding pad, allowing it to rotate flexibly within the placement frame. The water channel inside the grinding pad can guide the flow of coolant or cleaning fluid during grinding operations.

[0017] Preferably, a rotating motor is fixedly connected to the bottom surface of the rotating plate, a flow pipe is fixedly connected to the top surface of the water storage tank, and a sealing cap is fixedly connected to the top surface of the flow pipe.

[0018] By adopting the above technical solution, the rotating motor is fixedly connected to the bottom surface of the rotating plate, providing a stable rotational power source for the rotating plate. The rotational speed of the rotating plate can be precisely controlled. The water storage tank realizes the function of liquid transportation through the flow pipe on the top surface, so as to replenish the heat exchange liquid inside the water storage tank.

[0019] Preferably, a protective frame is fixedly connected to one side of the water storage tank, and a fan is fixedly connected to the surface of the protective frame.

[0020] By adopting the above technical solution, the protective frame is fixed to one side of the water tank, forming a physical barrier that effectively prevents workers' hands from touching the hot surface of the thermoelectric cooler, while the fan dissipates heat from the thermoelectric cooler.

[0021] Preferably, a number of heat dissipation windows are provided on one side of the workbench, and a control box is fixedly connected to the top surface of the workbench.

[0022] By adopting the above technical solution, several sets of heat dissipation windows opened on one side of the workbench form an effective air convection channel. When the equipment is running, the heat generated inside can be quickly dissipated through the heat dissipation windows, avoiding the accumulation of heat in the workbench that could cause aging or performance degradation of electrical components, thus extending the service life of the equipment. The control box fixedly connected to the top of the workbench serves as the operation center of the equipment, and various control buttons, displays and control systems are centrally arranged, making it convenient for operators to set parameters and monitor the equipment.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. A semiconductor cooling chip and a heating plate are used to cool and heat the heat exchange liquid inside the water storage tank;

[0025] 2. A water pump is used to transport the heat exchange liquid inside the water storage tank to the inside of the water flow tank through the inlet pipe. The heat exchange liquid flows inside the water flow tank and returns to the inside of the water storage tank through the outlet pipe.

[0026] 3. By circulating the heat exchange liquid inside the water tank, the grinding pad can be heated or cooled, thus solving the problem that the grinding pad is too soft in summer and too hard in winter. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of an adjustable hardness grinding device according to an embodiment of this application;

[0028] Figure 2 This is a schematic diagram illustrating the main structure of the mounting plate in the embodiments of this application;

[0029] Figure 3 This is a schematic diagram illustrating the main structure of the rotating motor in the embodiments of this application;

[0030] Figure 4 This is a schematic diagram illustrating the main structure of the adjustment component in the embodiments of this application;

[0031] Reference numerals: 1. Workbench; 2. Mounting plate; 3. Rotating plate; 4. Adjustment assembly; 401. Water tank; 402. Heating plate; 403. Semiconductor cooling chip; 404. Water pump; 405. Inlet pipe; 406. Outlet pipe; 5. Support frame; 6. Hydraulic rod; 7. Connecting plate; 8. Grinding disc; 9. Protective door; 10. Observation window; 11. Pull plate; 12. Placement frame; 13. Grinding pad; 14. Fixing plate; 15. Rotating motor; 16. Flow pipe; 17. Sealing cover; 18. Protective frame; 19. Fan; 20. Heat dissipation window; 21. Control box. Detailed Implementation

[0032] The following is in conjunction with the appendix Figures 1-4 This application will be described in further detail.

[0033] This application discloses an adjustable hardness grinding device.

[0034] Example

[0035] Reference Figure 1 It includes a workbench 1, with a cavity inside the workbench 1. A mounting plate 2 is fixedly connected inside the cavity, and a rotating plate 3 is fixedly connected inside the mounting plate 2. An adjustment component 4 is provided on the top surface of the rotating plate 3.

[0036] The regulating component 4 includes a water tank 401 disposed on the top surface of the rotating plate 3. A heating plate 402 is fixedly connected to the inner top surface of the water tank 401. A semiconductor cooling chip 403 is fixedly connected to one side of the water tank 401. A water pump 404 is connected to the side of the water tank 401 via a hose. An inlet pipe 405 is fixedly connected to the top surface of the water pump 404. An outlet pipe 406 is fixedly connected to the top surface of the water tank 401.

[0037] The heating plate 402 and the semiconductor cooling chip 403 work together to precisely control the temperature of the internal heat exchange liquid, forming a temperature-controllable heat exchange medium. The water pump 404 serves as a power source, driving the heat exchange liquid to circulate in a closed-loop pipeline, continuously delivering the heat exchange liquid to the microchannel network inside the grinding pad 13. Through efficient heat exchange at the liquid-solid interface, the heat exchange liquid quickly removes the heat generated during the grinding process, achieving real-time temperature control of the grinding pad 13 and ensuring that the grinding area is maintained within the temperature range required by the process.

[0038] A support frame 5 is fixedly connected to the top surface of the workbench 1, and a hydraulic rod 6 is fixedly connected to the top surface of the support frame 5. The support frame 5 is welded from high-strength metal profiles, providing a stable mechanical support foundation for the hydraulic rod 6.

[0039] One end of the hydraulic rod 6 is connected to a connecting plate 7, and one end of the connecting plate 7 is fixedly connected to a grinding disc 8. Adjusting the hydraulic rod 6 is achieved by the pressure driven by the hydraulic pump station to realize the vertical extension and retraction of the piston rod, which in turn drives the connecting plate 7 and the grinding disc 8 at the top of the hydraulic rod 6 to adjust their height.

[0040] The surface of the workbench 1 is provided with two sets of protective doors 9, each set of protective doors 9 is provided with an observation window 10, and each set of protective doors 9 is provided with a pull plate 11 on one side of its surface.

[0041] The protective door 9 protects the items inside the cavity, the pull plate 11 is used to open and close the protective door 9, and the observation window 10 is used to observe the items inside the cavity.

[0042] The top surface of the workbench 1 is fixedly connected to a placement frame 12, and the inside of the placement frame 12 is rotatably connected to a grinding pad 13. The bottom surface of the grinding pad 13 is fixedly connected to two sets of fixing plates 14, and the inside of the grinding pad 13 is provided with a water channel.

[0043] The placement frame 12 provides a stable mounting base for the grinding pad 13, allowing it to rotate flexibly within the placement frame 12. The water channel inside the grinding pad 13 can guide the flow of coolant or cleaning fluid during the grinding operation.

[0044] A rotating motor 15 is fixedly connected to the bottom surface of the rotating plate 3, a flow pipe 16 is fixedly connected to the top surface of the water storage tank 401, and a sealing cover 17 is fixedly connected to the top surface of the flow pipe 16.

[0045] The rotating motor 15 is fixedly connected to the bottom surface of the rotating plate 3, providing a stable rotational power source for the rotating plate 3. The rotational speed of the rotating plate 3 can be precisely controlled. The water storage tank 401 realizes the function of liquid transportation through the flow pipe 16 on the top surface, so as to replenish the heat exchange liquid inside the water storage tank 401.

[0046] A protective frame 18 is fixedly connected to one side of the water storage tank 401, and a fan 19 is fixedly connected to the surface of the protective frame 18.

[0047] The protective frame 18 is fixed to one side of the water tank 401 to form a physical barrier, effectively preventing workers' hands from touching the hot surface of the semiconductor cooling chip 403. The fan 19 dissipates heat from the semiconductor cooling chip 403.

[0048] Several sets of heat dissipation windows 20 are provided on one side of the workbench 1, and a control box 21 is fixedly connected to the top surface of the workbench 1.

[0049] Several sets of heat dissipation windows 20 opened on one side of the workbench 1 form an effective air convection channel. When the equipment is running, the heat generated inside can be quickly dissipated through the heat dissipation windows 20, avoiding the accumulation of heat in the workbench 1, which would cause the electrical components to age or degrade in performance, thus extending the service life of the equipment. The control box 21 fixedly connected to the top surface of the workbench 1 serves as the operation center of the equipment, and various control buttons, displays and control systems are centrally arranged, making it convenient for operators to set parameters and monitor the equipment.

[0050] The implementation principle of the adjustable hardness grinding device in this application embodiment is as follows: the heat exchange liquid inside the water storage tank 401 is cooled and heated by the semiconductor cooling chip 403 and the heating plate 402; the heat exchange liquid inside the water storage tank 401 is transported to the inside of the water flow tank through the water inlet pipe 405 by the water pump 404, the heat exchange liquid flows inside the water flow tank, and returns to the inside of the water storage tank 401 through the water outlet pipe 406; by the flow of the heat exchange liquid inside the water flow tank, the grinding pad 13 can be heated or cooled, thereby solving the problem that the grinding pad 13 is too soft in summer and too hard in winter.

[0051] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A grinding device with adjustable hardness, characterized in that: The device includes a workbench (1), the workbench (1) having an internal cavity, a mounting plate (2) fixedly connected inside the cavity, a rotating plate (3) fixedly connected inside the mounting plate (2), and an adjustment assembly (4) provided on the top surface of the rotating plate (3). The adjustment assembly (4) includes a water tank (401) disposed on the top surface of the rotating plate (3). A heating plate (402) is fixedly connected to the inner top surface of the water tank (401). A semiconductor cooling chip (403) is fixedly connected to one side of the water tank (401). A water pump (404) is connected to the side of the water tank (401) via a hose. An inlet pipe (405) is fixedly connected to the top surface of the water pump (404). An outlet pipe (406) is fixedly connected to the top surface of the water tank (401).

2. The adjustable hardness grinding device according to claim 1, characterized in that: The top surface of the workbench (1) is fixedly connected to a support frame (5), and the top surface of the support frame (5) is fixedly connected to a hydraulic rod (6).

3. The adjustable hardness grinding device according to claim 2, characterized in that: One end of the hydraulic rod (6) is connected to a connecting plate (7), and one end of the connecting plate (7) is fixedly connected to a grinding disc (8).

4. The adjustable hardness grinding device according to claim 1, characterized in that: The workbench (1) has two sets of protective doors (9) on its surface. Both sets of protective doors (9) have observation windows (10) on their surfaces. Both sets of protective doors (9) have pull plates (11) on one side of their surfaces.

5. The adjustable hardness grinding device according to claim 1, characterized in that: The top surface of the workbench (1) is fixedly connected to a placement frame (12), and a grinding pad (13) is rotatably connected inside the placement frame (12). Two sets of fixing plates (14) are fixedly connected to the bottom surface of the grinding pad (13), and a water channel is opened inside the grinding pad (13).

6. The adjustable hardness grinding device according to claim 1, characterized in that: A rotating motor (15) is fixedly connected to the bottom surface of the rotating plate (3), a flow pipe (16) is fixedly connected to the top surface of the water storage tank (401), and a sealing cap (17) is fixedly connected to the top surface of the flow pipe (16).

7. The adjustable hardness grinding device according to claim 1, characterized in that: A protective frame (18) is fixedly connected to one side of the water storage tank (401), and a fan (19) is fixedly connected to the surface of the protective frame (18).

8. The adjustable hardness grinding device according to claim 1, characterized in that: Several sets of heat dissipation windows (20) are provided on one side of the workbench (1), and a control box (21) is fixedly connected to the top surface of the workbench (1).